Abstract: Provided are a porous silicone resin and a light-weight flexible flame-retardant composite material, belonging to the technical field of nano-porous materials. The porous silicon resin is prepared from a porous silicon resin precursor solution by means of curing and drying processes. The porous silicone resin precursor solution includes a flame retardant, a surfactant, a siloxane monomer, a catalyst, an auxiliary agent and a solvent. The porous silicone resin precursor solution is obtained by firstly dissolving the flame retardant and the surfactant in the solvent, and then adding the siloxane monomer, the catalyst and the auxiliary agent and mixing them uniformly. The porous silicone resin and the light-weight flexible flame-retardant composite material prepared therefrom have the excellent properties of high porosity, high flame retardancy, high elasticity and high strain.

Abstract: A grafted polypropylene resin is prepared by a grafting reaction of a polar monomer capable of absorbing microwave so as to raise its temperature in a microwave field to more than 200° C. and a solid polypropylene resin using microwave irradiation without adding an initiator. The polar grafted polypropylene resin that does not contain initiator residues and does not have a significant reduction in molecular mass compared with a resin before grafting is obtained.

Abstract: A continuous operation method is employed for the microwave high-temperature pyrolysis of a solid material containing an organic matter. The method includes the steps of mixing a solid material containing an organic matter with a liquid organic medium; transferring the obtained mixture to a microwave field; and in the microwave field, continuously contacting the mixture with a strong wave absorption material in an inert atmosphere or in vacuum. The strong wave absorption material continuously generates a high temperature under a microwave such that the solid material containing an organic matter and the liquid organic medium are continuously pyrolyzed to implement a continuous operation.

Abstract: The present disclosure relates to methods, apparatuses and systems for displaying an alarm file and belongs to the field of communications. One of the method includes: through a persistent connection with a service end, receiving a data packet corresponding to the alarm file sent by the service end, wherein the service end releases a storage resource occupied by the alarm file after sending the alarm file; obtaining the alarm file by parsing the data packet corresponding to the alarm file; generating a uniform resource locator (URL) of the alarm file; displaying the alarm file based on the URL of the alarm file. The present disclosure can reduce wastes of the storage resource of the service end.

Abstract: Provided is a reaction cup, comprising cup walls and a cup bottom. The cup walls are provided with clamping portions, the clamping portions can allow a membrane strip to stand upright in the reaction cup, and the connecting area of the two opposite clamping portions forms an upright placement position for the membrane strip. The present invention further provides a molecular hybridization instrument used with the reaction cup, and an analyte testing method. The reaction cup can allow the membrane strip to stand upright therein, and can be opened for operation, thereby reducing the area occupied by the reaction cup on the molecular hybridization instrument, and reducing the area of the molecular hybridization instrument. A plurality of reaction cups can be placed on the molecular hybridization instrument at the same time, which increases the number of tests and improves the utilization and working efficiency of the molecular hybridization instrument.

Abstract: Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer.

Abstract: Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.

Abstract: Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter.

Abstract: A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is configured to filter light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to the photodetector. A glass substrate is positioned over the substrate and includes a diffuser. The diffuser is configured to diffuse light incident on the diffuser and to pass the diffused light to the at least one color filter for further filtering.

Abstract: Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

Abstract: The present invention discloses a method and system for obtaining access information in a Multimedia Broadcast/Multicast Service (MBMS). The method includes the following steps: during an eMBMS session, a broadcast/multicast service center (BM-SC) configures access information in one or more MBMS session signaling, and sends the MBMS session signaling to an MBMS gateway within a service area of the BM-SC; wherein the access information at least includes radio access technology type information. The present invention also discloses a method and system for charging in an MBMS. The methods and systems of the present invention can take the access information including the radio access technology type as the basis of charging, supply communication operators with a charging manner of distinguishing radio access technology types, and adopt different rates corresponding to the MBMS service areas of different radio access technology types, and thus charging can be further detailed.

Abstract: A method and a system for acquiring information of Machine Type Communication (MTC) user equipment (UE) are provided. The method comprises the steps of: an MTC GateWay (MTC GW) acquiring the information of the MTC UE which currently requests to attach to a network or has attached to a network from a mobility management network element; the MTC GW sending the information of the MTC UE acquired from the mobility management network element to an MTC Server. The method and the system can control the MTC UE in real time and intelligently.

Abstract: The present application discloses a method and a system for implementing domain selection during a terminated call, in which an application server (AS) sends, according to a received call request message, a query request message to a home subscriber server (HSS); the HSS queries, according to the query request message, a packet switching (PS) domain mobility management network element to obtain information of a called terminal and/or a network accessed by the called terminal in the call request message; the HSS feeds back the obtained information of the called terminal and/or the network accessed by the called terminal to the AS; and the AS selects a domain to which a call message is to be routed according to the information of the called terminal and/or the network accessed by the called terminal.

Abstract: A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is configured to filter light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to the photodetector. A glass substrate is positioned over the substrate and includes a diffuser. The diffuser is configured to diffuse light incident on the diffuser and to pass the diffused light to the at least one color filter for further filtering.

Abstract: Techniques are described to furnish a light sensor that includes a patterned IR interference filter integrated with a patterned color pass filter. In one or more implementations, the light sensor includes a substrate having a surface. An IR interference filter configured to block infrared light is disposed over the surface of the substrate. The light sensor also includes one or more color pass filters placed above or below the IR interference filter. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors.

Abstract: Techniques are described to furnish an IR suppression filter, or any other interference based filter, that is formed on a transparent substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate. The photodetectors are configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a transparent substrate. The light sensor may also include a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer.

Abstract: A light sensor is described that includes an IR interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are disposed proximate to the surface of the substrate. An IR interference filter is disposed over the photodetectors. The IR interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors.

Abstract: Techniques are described to furnish an IR suppression filter that is formed on a glass substrate to a light sensor. In one or more implementations, a light sensor includes a substrate having a surface. One or more photodetectors are formed in the substrate and configured to detect light and provide a signal in response thereto. An IR suppression filter configured to block infrared light from reaching the surface is formed on a glass substrate. The light sensor also includes a plurality of color pass filters disposed over the surface. The color pass filters are configured to filter visible light to pass light in a limited spectrum of wavelengths to the one or more photodetectors. A buffer layer is disposed over the surface and configured to encapsulate the plurality of color pass filters and adhesion layer. The light sensor further includes through-silicon vias to provide electrical interconnections between different conductive layers.

Abstract: Light sensor devices are described that have a glass substrate, which includes a lens to focus light over a wide variety of angles, bonded to the light sensor device. In one or more implementations, the light sensor devices include a substrate having a photodetector formed therein. The photodetector is capable of detecting light and providing a signal in response thereto. The sensors also include one or more color filters disposed over the photodetector. The color filters are configured to pass light in a limited spectrum of wavelengths to the photodetector. A glass substrate is disposed over the substrate and includes a lens that is configured to collimate light incident on the lens and to pass the collimated light to the color filter.

Abstract: A light sensor is described that includes a glass substrate having a diffuser formed therein and at least one color filter integrated on-chip (i.e., integrated on the die of the light sensor). In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a semiconductor substrate. At least one photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. The color filter is configured to filter light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to the photodetector. A glass substrate is positioned over the substrate and includes a diffuser. The diffuser is configured to diffuse light incident on the diffuser and to pass the diffused light to the at least one color filter for further filtering.