HEAT DISSIPATION DEVICE
A heat dissipation device includes a plurality of fins connected to each other. Each fin includes a plate and a pair of flanges extending from the plate. Each flange includes a first section extending perpendicularly away from the plate, a third section extending perpendicularly towards the plate and a second section interconnecting the first section and the third section. The first section is parallel to the third section and the second section is parallel to the plate. Three channels are defined by the first flange, the second flange and the plate for allowing airflow to flow through the fins.
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1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device having large heat dissipation areas.
2. Description of Related Art
Electronic components generate a large amount of heat in operation thereof. Therefore, heat dissipation, often in a form of device, is required for the electronic components. As shown in
However, the heat dissipation areas of the typical heat dissipation device 90 are limited, and cannot meet heat dissipation requirement of high power electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the limitations described above.
Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
Referring to
Also referring to
The upper flange 210 encloses an upper channel 41 together with the plate 30, the lower flange 220 encloses a lower channel 42 together with the plate 30, and the third sections 213, 223 of the upper flange 210 and the lower flange 220 define a middle channel 43 together with the plate 30. The upper channel 41 has an inner size smaller than that of the lower channel 42 so that more airflow can flow through the lower channel 42. The upper channel 41, the middle channel 43 and the lower channel 42 provide different pathways for the airflow flowing through the fins 20. The upper channel 41 and the lower channel 42 has a right opening flush with the right side 315 of the plate 30, and a left opening spaced a distance from the inclined side 310 and the left side 314 of the plate 30, respectively. That is to say, the upper channel 41 and the lower channel 42 are terminated within a periphery range of the plate 30. Therefore, the airflow flowing out of the left openings of the upper channel 41 and the lower channel 42 can disturb with the airflow flowing through the middle channel 43 at a left area of the plate 30, thereby increasing heat exchange with the plate 30.
According to the foresaid embodiments, the flanges 210, 210a, 210b of the fins 20, 20a, 20b each have a plurality of parts non-coplanar with each other. So, the fins 20, 20a, 20b of the heat dissipation device 10 have large areas by increasing the areas of the flanges 210, 210a, 210b, 220, 220a, 220b, 230b, whereby the heat dissipation capacity of the heat dissipation device 10 is enhanced.
It is believed that the present embodiments will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the present disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.
Claims
1. A heat dissipation device comprising:
- a plurality of fins, each of the fins comprising: a plate; and a first flange comprising a first section extending from the plate along a direction away from the plate, a third section extending along a direction towards the plate, and a second section interconnecting the first section and the second section, the first section, the second section and the third section are non-coplanar with each other.
2. The heat dissipation device of claim 1, wherein the first section is perpendicular to the plate.
3. The heat dissipation device of claim 2, wherein the second section is parallel to the plate.
4. The heat dissipation device of claim 2, wherein the third section is parallel to the first section.
5. The heat dissipation device of claim 1, wherein the each of the fins further comprises a second flange extending from the plate, the second flange comprising a first section extending away from the plate, a third section extending towards the plate and a second section interconnecting the first section and the second section.
6. The heat dissipation device of claim 5, wherein the first section of the second flange is parallel to the first section of the first flange, the second section of the second flange is parallel to the second section of the first flange, and the third section of the second flange is parallel to the third section of the first flange.
7. The heat dissipation device of claim 5, wherein the first flange is extended from a top side of the plate, and the second flange is extended from a bottom side of the plate.
8. The heat dissipation device of claim 7, wherein the first flange and the plate enclose a first channel, the second flange and the plate enclose a second channel, and the third sections of the first flange and the second flange and the plate cooperatively define a third channel.
9. The heat dissipation device of claim 8, wherein the third channel is located between the first channel and the second channel.
10. The heat dissipation device of claim 8, wherein the second channel has a length more than that of the first channel.
11. The heat dissipation device of claim 8, wherein the second channel has a width more than that of the first channel.
12. The heat dissipation device of claim 8, wherein the third sections of the first flange and the second flange are directly connected to the plate so that the first channel, the second channel and the third channel are separated from each other along the length thereof.
13. The heat dissipation device of claim 8, wherein the third sections of the first flange, the second flange are spaced gaps from the plate so that the first channel, the second channel and the third channel communicate with each other along length thereof.
14. The heat dissipation device of claim 8, wherein the first channel and the second channel are terminated within a periphery range of the plate so that airflow flowing out of the first channel and the second channel disturb with airflow flowing through the third channel at a place within the periphery range of the plate.
15. The heat dissipation device of claim 14, wherein the first channel and the second channel have first openings flush with a lateral side of the plate, and second openings spaced intervals from an opposite lateral side of the plate.
16. The heat dissipation device of claim 1, wherein each of the fins further comprises a second flange and a third flange, the second flange and the third flange are respectively located at a top side and a bottom side of the plate and the first flange is located at a middle of the plate.
17. The heat dissipation device of claim 16, wherein each of the second flange and the third flange comprises a first section parallel to the first section of the first flange.
18. The heat dissipation device of claim 17, wherein the first sections of the first flange and the second flange and the plate cooperatively define a first channel, the first section of the third flange and the third section of the first flange and the plate cooperatively define a second channel, and the first flange and the plate cooperatively enclose a third channel.
19. The heat dissipation device of claim 18, wherein first channel, the second channel and the third channel are separated from each other along the length thereof.
20. The heat dissipation device of claim 18, wherein the third channel is located between the first channel and the second channel.
Type: Application
Filed: Aug 23, 2011
Publication Date: Nov 8, 2012
Applicant: FOXCONN TECHNOLOGY CO., LTD. (Tu-Cheng)
Inventor: WEI-HANG HSU (Tu-Cheng)
Application Number: 13/215,243