Cover of seal cap for reaction chamber for semiconductor
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Description
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.
Claims
We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D616390 | May 25, 2010 | Sato |
D654883 | February 28, 2012 | Honma |
D654884 | February 28, 2012 | Honma |
D797067 | September 12, 2017 | Zhang |
D813181 | March 20, 2018 | Okajima |
D855027 | July 30, 2019 | Okajima |
D872037 | January 7, 2020 | Okajima |
1579504 | June 2017 | JP |
1598442 | February 2018 | JP |
Patent History
Patent number: D916037
Type: Grant
Filed: Nov 16, 2018
Date of Patent: Apr 13, 2021
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Shuhei Saido (Toyama), Hidenari Yoshida (Toyama), Takafumi Sasaki (Toyama)
Primary Examiner: Gino Colan
Application Number: 29/670,537
Type: Grant
Filed: Nov 16, 2018
Date of Patent: Apr 13, 2021
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Shuhei Saido (Toyama), Hidenari Yoshida (Toyama), Takafumi Sasaki (Toyama)
Primary Examiner: Gino Colan
Application Number: 29/670,537
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)