Support for a wafer for fabricating a semiconductor
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Description
Claims
The ornamental design for a support for a wafer for fabricating a semiconductor, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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Patent History
Patent number: D926715
Type: Grant
Filed: Nov 12, 2019
Date of Patent: Aug 3, 2021
Assignee: EPICREW CORPORATION (Nagasaki)
Inventors: Akira Okabe (Nagasaki), Yukio Takenaga (Nagasaki)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/712,911
Type: Grant
Filed: Nov 12, 2019
Date of Patent: Aug 3, 2021
Assignee: EPICREW CORPORATION (Nagasaki)
Inventors: Akira Okabe (Nagasaki), Yukio Takenaga (Nagasaki)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/712,911
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)