Retaining ring for substrate

- EBARA CORPORATION
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Description

1. Retaining ring for substrate

1.1 : Perspective

1.2 : Perspective

1.3 : Bottom

1.4 : Top

1.5 : Front

1.6 : Cross sectional

1.7 : Cross sectional

1.8 : Cross sectional

This article is used to hold a substrate in a ring and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view.

Claims

The ornamental design for a retainer ring for substrate, as shown and described.

Referenced Cited
U.S. Patent Documents
D638951 May 31, 2011 Bedingham
D667561 September 18, 2012 Bedingham
D699200 February 11, 2014 Nagakubo
D703160 April 22, 2014 Tanimura
D709536 July 22, 2014 Yoshimura
D766849 September 20, 2016 Fukushima
D770992 November 8, 2016 Tauchi
D793976 August 8, 2017 Fukushima
D794585 August 15, 2017 Nabeya
D799437 October 10, 2017 Nabeya
D845568 April 9, 2019 Ishii
D876504 February 25, 2020 Lee
D922229 June 15, 2021 Jun
D940670 January 11, 2022 Kim
D943539 February 15, 2022 Perry
11390945 July 19, 2022 Jun
11396082 July 26, 2022 Nishida
Foreign Patent Documents
1494712 April 2017 JP
Patent History
Patent number: D981459
Type: Grant
Filed: Jun 16, 2021
Date of Patent: Mar 21, 2023
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenichi Akazawa (Tokyo), Osamu Nabeya (Tokyo)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 35/513,172