Retaining ring for substrate
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Description
1. Retaining ring for substrate
This article is used to hold a substrate in a ring and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view.
Claims
The ornamental design for a retainer ring for substrate, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D981459
Type: Grant
Filed: Jun 16, 2021
Date of Patent: Mar 21, 2023
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenichi Akazawa (Tokyo), Osamu Nabeya (Tokyo)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 35/513,172
Type: Grant
Filed: Jun 16, 2021
Date of Patent: Mar 21, 2023
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenichi Akazawa (Tokyo), Osamu Nabeya (Tokyo)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 35/513,172
Classifications