Semiconductor substrate transfer apparatus
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The broken lines illustrate portions of the semiconductor substrate transfer apparatus that form no part of the claimed design. The hatching shown in
Claims
The ornamental design for a semiconductor substrate transfer apparatus, as shown and described.
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- U.S. Appl. No. 29/789,677, filed Oct. 13, 2021.
- U.S. Appl. No. 29/789,674, filed Oct. 13, 2021.
- United States Notice of Allowance issued in U.S. Appl. No. 29/789,677 dated Mar. 8, 2023 (nine (9) pages).
- United States Notice of Allowance issued in U.S. Appl. No. 29/789,674 dated Mar. 8, 2023 (nine (9) pages).
Type: Grant
Filed: Oct 13, 2021
Date of Patent: Jun 20, 2023
Assignee: Hitachi High-Tech Corporation (Tokyo)
Inventors: Masayuki Arakawa (Tokyo), Junpei Hokari (Tokyo), Akira Kojima (Tokyo), Masaki Mizuochi (Tokyo), Tomokazu Kobayashi (Tokyo), Takaaki Kikuchi (Tokyo)
Primary Examiner: Patricia A Palasik
Application Number: 29/789,675