Abstract: An aqueous solution of alkali hexahydroxo platinate is produced. As a alkali hexahydroxo platinate, sodium hexahydroxoplatinate or potassium hexahydroxoplatinate is used. The aqueous solution of alkali hexahydroxo platinate is passed through a hydrogen form cation exchange resin layer in a cation exchange resin tower. The aqueous solution of alkali hexahydroxo platinate makes contact with the hydrogen form cation exchange resin of the hydrogen form cation exchange resin layer, thus a suspension of hexahydroxo platinic is generated. If gamma rays are irradiated to the suspension, a platinum oxide colloidal solution in which colloidal particles including a platinum dioxide, a platinum monoxide, and a platinum hydroxide exist is generated. In a platinum oxide colloidal solution, the content of impurities is little and a noble metal compound is dispersed stably in water.

Abstract: Provided are a binder composition for an electrode for a capacitive deionization device including a first polymer including a first structural unit including a zwitterionic functional group and a second structural unit including a cross-linkable functional group, a cross-linking agent, and ionic functional group, an electrode for a capacitive deionization device including the composition, a capacitive deionization device including the electrode, and a method of removing ions from a fluid using the device.

Abstract: [Object] To provide a cell, a cell stack, an electrochemical module and an electrochemical apparatus that can suppress decrease in output power. [Solution] A cell includes a solid oxide electrolyte layer 9, a fuel electrode layer 8 on one of the main surfaces of the electrolyte layer 9, and an oxygen electrode layer 10 on the other. The oxygen electrode layer 10 contains a plurality of pores, and the pore size distribution observed at a section of the oxygen electrode layer has at least three peaks (a first peak p1, a second peak p2 and a third peak p3). This structure leads to a cell, a cell stack, an electrochemical module and an electrochemical apparatus that can suppress decrease in output power.

Abstract: The innovative systems and methods described herein use a high-resolution imaging microscope for capturing images of marine microorganisms and particles in situ in an aquatic environment. Using darkfield illumination, high-resolution images may be obtained, capturing features of the microorganism or particle as small as 10 ?m in remarkable clarity. Utilizing an open flow-through approach in sample imaging, the delicate structures of the plankton and particles may be imaged completely intact without damage and in their natural orientation. The images can be classified at high accuracy based on physiological and morphological information captured in the image including features as fine as 1 ?m. The disclosed classification method utilizes adaptable training sets of taxonomic categories and a novel method of discerning in-focus targets, providing a highly accurate identification system.

Abstract: A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-?(I), M1M2pOq (II), 0.05??<1.8, where, M1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table, M2 is at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table, 0<p?2, and 0<q<4.

Abstract: According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.

Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Abstract: A process for preparing a palladium nanoparticle ink comprises reacting a reaction mixture comprising a palladium salt, a stabilizer, a reducing agent, and an optional solvent to directly form the palladium nanoparticle ink. During the formation of the palladium nanoparticle ink, the palladium nanoparticles are not isolated from the reaction mixture.

Abstract: A palladium first composition is disclosed, including a palladium salt and an unsaturated carboxylic acid, wherein the composition is substantially free of water, and wherein the first composition forms a second composition including stable palladium nanoparticles and a palladium unsaturated carboxylate. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: A palladium first composition is disclosed, including a palladium salt and an unsaturated organoamine, wherein the composition is substantially free of water, and wherein the first composition forms a second composition including stable palladium nanoparticles and a palladium unsaturated organoamine. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: One aspect of the present invention is a deposition solution to deposit metals and metal alloys such as for fabrication of electronic devices. According to one embodiment, the deposition solution comprises metal ions and a pH adjustor. The pH adjustor comprises a functional group having a general formula (R1R2N)(R3R4N)C?N—R5 where: N is nitrogen; C is carbon; and R1, R2, R3, R4, and R5 are the same or different and represent hydrogen, alkyl group, aryl group, or alkylaryl group. Another aspect of the presented invention is a method of preparing deposition solutions. Still another aspect of the present invention is a method of fabricating electronic devices.

Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.

Abstract: Compositions and methods for depositing elemental metal M(0) films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing a metal precursor, an excess amount of neutral labile ligands, and a supercritical solvent; exposing the metal precursor to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; reducing the metal precursor to the elemental metal M(0) by using the reducing agent and/or the thermal energy; and depositing the elemental metal M(0) film while minimizing formation of metal oxides.

Abstract: A palladium precursor composition includes at least one palladium salt and at least one fluorinated component, wherein if the fluorinated component is not a fluorinated organoamine, the composition further includes an organoamine, and if the fluorinated component is a fluorinated organoamine, the composition may optionally further include one or more additional fluorinated components. Further disclosed is a substantially pinhole-free palladium layer formed from the precursor composition.

Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

Abstract: A palladium first composition is disclosed, including a palladium salt and an unsaturated carboxylic acid, wherein the composition is substantially free of water, and wherein the first composition forms a second composition including stable palladium nanoparticles and a palladium unsaturated carboxylate. The composition permits the use of solution processing methods to form a palladium layer on a wide variety of substrates, including in a pattern to form circuitry or pathways for electronic devices.

Abstract: Methods of vapor depositing metal-containing films using certain organometallic compounds containing a carbonyl-containing ligand are disclosed.

Abstract: A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.

Abstract: A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 ?m, and the glass powder is a Bi2O3—SiO2—B2O3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise ruthenium, rhenium, or a combination thereof, a Group 4 metal (e.g., hafnium, zirconium, titanium), and can further include silicon and/or germanium, where the composition results in improved aluminum diffusion properties. Also disclosed herein are articles comprising the composition.

Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.

Abstract: The present invention provides a noble metal particle with an improved methanol-oxidation property. This noble metal particle has a platinum particle and ruthenium particles deposited on only part of the surface of the platinum particle. This noble metal particle suitably can be produced by precipitating the ruthenium particles out of the solution so that the ruthenium particles are deposited on only part of the surface of the platinum particle by further adding a ruthenium salt into the solution and reducing the ruthenium salt after the reduction of the platinum salt in the solution essentially is completed. This noble metal particle is suitable as a catalyst to be supported on an electrode of a polymer electrolyte fuel cell typified by a direct methanol fuel cell.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise palladium, platinum, rhodium, or combinations thereof, hafnium, titanium, zirconium, or combinations thereof; and can further include silicon, germanium, or combinations thereof, wherein the composition results in improved Al retention properties. Also disclosed herein are articles comprising the coatings.

Abstract: A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 ?m, and the glass powder is a Bi2O3—SiO2—B2O3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.

Abstract: Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.

Abstract: A bimodal metal nanoparticle composition includes first metal nanoparticles having an average diameter of from about 50 nm to about 1000 nm, and second stabilized metal nanoparticles having an average diameter of from about 0.5 nm to about 20 nm, the second stabilized metal nanoparticles including metal cores having a stabilizer attached to the surfaces thereof, wherein the stabilizer is a substituted dithiocarbonate.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.

Abstract: Printable metal formulations, methods of making the formulations, and methods of coating or printing thin films from metal ink precursors are disclosed. The metal formulation generally includes one or more Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal salts or metal complexes, one or more solvents adapted to facilitate coating and/or printing of the formulation, and one or more optional additives that form (only) gaseous or volatile byproducts upon reduction of the metal salt or metal complex to an elemental metal and/or alloy thereof. The formulation may be made by combining the metal salt(s) or metal complex(es) and the solvent(s), and dissolving the metal salt(s) or metal complex(es) in the solvent(s) to form the formulation. Thin films may be made by coating or printing the metal formulation on a substrate; removing the solvents to form a metal-containing precursor film; and reducing the metal-containing precursor film.

Abstract: A metallic colloidal solution (a) includes a water-based dispersion medium that is easy in handling with regard to safety and environment and metallic particles having a uniform particle diameter and being excellent in properties such as conductivity and (b) has properties suitable for various printing methods and ink-applying methods. In addition, an inkjet-use metallic ink incorporating the metallic colloidal solution has properties suitable for the inkjet printing method. The metallic particles are deposited by reducing metallic ions in water and have a primary-particle diameter of at most 200 nm. The dispersion medium is made of a mixed solvent of water and a water-soluble organic solvent. The metallic particles are dispersed in the dispersion medium under the presence of a dispersant having a molecular weight of 200 to 30,000.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise ruthenium, rhenium, or a combination thereof, a Group 4 metal (e.g., hafnium, zirconium, titanium), and can further include silicon and/or germanium, where the composition results in improved aluminum diffusion properties. Also disclosed herein are articles comprising the composition.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is Nickel, or Nickel in combination with cobalt and/or iron. The compositions further comprise a lanthanide, a group 4 metal selected from hafnium, zirconium, titanium, or a combination of these, and optionally, a group 14 element selected from silicon and/or germanium. The combination results in improved Al retention properties. Also disclosed herein are articles comprising the coatings.

Abstract: Improved compositions are described for the protection of gas turbine parts at elevated temperatures. The compositions are of the MCrAlY type, wherein M is selected from nickel, or a combination of nickel with cobalt, iron, or combinations thereof. The compositions further comprise palladium, platinum, rhodium, or combinations thereof, hafnium, titanium, zirconium, or combinations thereof, and can further include silicon, germanium, or combinations thereof, wherein the composition results in improved Al retention properties. Also disclosed herein are articles comprising the coatings.

Abstract: A method for depositing a platinum-group-containing layer on a substrate includes furnishing the substrate, and preparing a water-base paint containing metallic platinum-group powder, water, and a binder. The method further includes spraying the water-base paint overlying the substrate to form a platinum-group-containing layer, and thereafter heating the platinum-group-containing layer to interdiffuse the platinum-group-containing layer.

Abstract: The various embodiments of the present invention generally relate to the deposition of a seedlayer for a magnetic recording medium used for perpendicular magnetic recording (PMR) applications, where the seedlayer provides for grain size refinement and reduced lattice mis-fit for a subsequently deposited underlayer or granular magnetic layer, and where the seedlayer is deposited using a nickel (Ni) alloy based sputter target. The nickel (Ni) alloy can be binary (Ni—X; Ni—Y) or ternary (Ni—X—Y). In addition, the binary (Ni—X; Ni—Y) or ternary (Ni—X—Y) nickel (Ni) based alloys can be further alloyed with metal oxides, thus forming seedlayer thin films with a granular microstructure containing metallic grains, surrounded by an oxygen rich grain boundary. The nickel-based alloys (with or without metal oxides) of the various exemplary embodiments can be made by powder metallurgical technique or by melt-casting techniques, with or without thermo-mechanical working.

Abstract: A method is provided for manufacturing a high-precision mold whereby a feature matching a desired feature design is carved into a hard mold material (41) using, for example, a diamond grinding wheel and/or a diamond turning point. Inherent imprecision and errors (49) introduced by the use of the grinding wheel/turning point are measured to determine deviations from the desired feature design. An ultrafast shortpulse laser is then activated to desirably ablate the deviations, thereby correcting the errors and conforming the feature to the desired shape. Furthermore, a thin film (1602) may be formed over the feature either prior to or after the laser ablation process, where the error measurement and laser ablation processes detects and ablates errors on the surface of the thin film, respectively. Additionally, the laser ablation process may be applied directly to, for example, an optical lens (1400) formed from an imprecise mold to remove any errors and imperfections thereon.

Abstract: Objects of the present invention is to provide a zinc-based alloy electroplated film having a high corrosion resistance comparable to Zn—Cr alloy plating without containing chromium which gives a heavy environmental load, and a plated metal material using the same. The present invention relates to a zinc-based alloy electroplated film excellent in corrosion resistance containing (A) 30 to 96% by weight of zinc, (B) 2 to 20% by weight of an iron-group metal, and (C) 2 to 50% by weight of tungsten.

Abstract: Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit having a composition containing a Bi2O3—B2O3—SiO2—Al2O3 or Bi2O3—B2O3—SiO2—Al2O3—ZnO primary component and about 0.5 to 5% by weight of NiO as a secondary component, and an organic vehicle. The conductive paste is applied on a glass substrate and then baked to form a conductor film. A glass circuit structure formed by using the conductor film can be advantageously used as a defogging glass for an automobile window.

Abstract: The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, as well as methods of making, and methods of using such compositions and electrodes. An exemplary ink material comprises a metal catalyst (e.g., platinum black and/or platinum-on-carbon), graphite as a conducting material, a polymer binding material, and an organic solvent. In one aspect, the polymer binding material comprises a polymer binder blend comprising first and second polymers, wherein the first polymer has a glass transition temperature higher than the second polymer. In a second aspect, the polymer binding material comprises a hydrophilic acrylic polymer, copolymer, or terpolymer. The conductive polymer compositions of the present invention may be used, for example, to make electrochemical sensors. Such sensors may be used, for example, in a variety of devices to monitor analyte amount or concentrations in subjects.

Abstract: The invention is directed to conductive polymer compositions, catalytic ink compositions (e.g., for use in screen-printing), electrodes produced by deposition of an ink composition, methods of making, and methods of using thereof. An exemplary ink material comprises platinum black and/or platinum-on-carbon as the catalyst, graphite as a conducting material, a polymer binding material, and an organic solvent. The polymer binding material is typically a copolymer of hydrophilic and hydrophobic monomers. The conductive polymer compositions of the present invention can be used, for example, to make electrochemical sensors. Such sensors can be used in a variety of analyte monitoring devices to monitor analyte amount or concentrations in subjects, for example, glucose monitoring devices to monitor glucose levels in subjects with diabetes.

Abstract: The present invention provides an organic compound for CVD raw material prepared by mixing a first organometallic compound and at least one second organometallic compound, said first organometallic compound having a central metal atom and at least one ligand coordinated thereto and said second organic compound having the same central metal as that of the first organometallic compound and at least one different ligand coordinated thereto from the ligand of the first organometallic compound, wherein the first and second organometallic compounds differ in decomposition behavior. In particular, a CVD raw material having both easy handling and good adhesiveness to thin film, which have not been so far sufficiently compatible with each other, can be obtained by mixing a cyclopentadienyl complex or a derivative thereof as the first organometallic compound, and a ?-diketonato compound as the second organometallic compound.

Abstract: Additionally, a coating composition comprising gelatine, water and a metal and/or ceramic powder is used to form coating layers on selected materials.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present invention include a ruthenium precursor compound and a solvent capable of solubilizing the ruthenium precursor compound. A method is further provided for making a vaporized ruthenium precursor for use in the chemical vapor deposition of ruthenium and ruthenium-containing materials onto substrates, wherein a ruthenium precursor formulation having a ruthenium-containing precursor compound and a solvent capable of solubilizing the ruthenium-containing precursor compound is vaporized.

Abstract: A surface of copper is brought into contact with an aqueous solution for forming a bonding layer for bonding resin comprising: (a) at least one type of acid selected from inorganic acid and organic acid; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper.

Abstract: The present invention provides a palladium plating solution comprising at least 1 to 60 g/L, in terms of the amount of palladium, of a soluble palladium salt and 0.1 to 300 g/L of a sulfamic acid or its salt, the palladium plating solution being substantially free from a brightening agent. This plating solution can be used to form, on a substrate, a palladium plating having on its surface an acicular crystal, and, thus, a plating having excellent adhesion to resin can be provided on the surface of a substrate.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.