Abstract: A process produces a transparent conductive layer forming coating liquid by combining a colloidal dispersion of fine silver particles, a reducing agent and at least one of an alkali metal aurate solution and/or an alkali metal platinate solution to obtain a colloidal dispersion of noble-metal-coated fine silver particles coated with gold and/or platinum. A cation exchanger is added to the combination. The colloidal dispersion of noble-metal-coated fine silver particles is obtained while any impurity ions formed as a result of reduction are removed through the cation exchanger. This process enables the raw-material concentration to be set at a higher concentration than the conventional process to enable production of the transparent conductive layer forming coating liquid at a low cost and a good productivity.

Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.

Abstract: A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present invention include a ruthenium precursor compound and a solvent capable of solubilizing the ruthenium precursor compound. A method is further provided for making a vaporized ruthenium precursor for use in the chemical vapor deposition of ruthenium and ruthenium-containing materials onto substrates, wherein a ruthenium precursor formulation having a ruthenium-containing precursor compound and a solvent capable of solubilizing the ruthenium-containing precursor compound is vaporized.

Abstract: A paste for formation of ceramic capacitor electrode, composed of 10 to 14% by weight of an organic vehicle and 86 to 90% by weight of a platinum powder, wherein the platinum powder contains, in 100% by weight of the powder, 54 to 60% by weight of a spherical particle powder, 36 to 40% by weight of a flaky particle powder and 0 to 10% by weight of an indefinite particle powder. The electrode layer film of ceramic capacitor formed with the paste has a density, a surface roughness and an adhesion strength all of given values, can have improved adhesivity to the dielectric layer of the ceramic capacitor, and can make small the through holes generated in the electrode layer.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: An ammine solution which can be provided at low production cost, as compared with conventional ones. The ammine solution contains an ammine compound which contains at least one of platinum and palladium, and at least one kind of amine compound. By using the amine compound of which the boiling point is raised, as compared with that of ammonia, due to the substitution of substitution radicals for some of hydrogens in ammonia molecules, the volatilizing speed from the ammine solution can be restrained.

Abstract: The transparent conductive film of the present invention is formed to have a conductive layer containing at least ruthenium fine particles, gold fine particles and silver fine particles, the weight ratio of ruthenium fine particles and gold fine particles in the conductive layer being within the range of 40:60 to 99:1. As a result, this transparent conductive film and a display device having this transparent conductive film have superior electromagnetic wave shielding effects and anti-reflection effects, high chemical stability and superior visibility.

Abstract: A paste for formation of ceramic capacitor electrode, composed of 10 to 14% by weight of an organic vehicle and 86 to 90% by weight of a platinum powder, wherein the platinum powder contains, in 100% by weight of the powder, 54 to 60% by weight of a spherical particle powder, 36 to 40% by weight of a flaky particle powder and 0 to 10% by weight of an indefinite particle powder. The electrode layer film of ceramic capacitor formed with the paste has a density, a surface roughness and an adhesion strength all of given values, can have improved adhesivity to the dielectric layer of the ceramic capacitor, and can make small the through holes generated in the electrode layer.

Abstract: A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present invention include a ruthenium precursor compound and a solvent capable of solubilizing the ruthenium precursor compound. A method is further provided for making a vaporized ruthenium precursor for use in the chemical vapor deposition of ruthenium and ruthenium-containing materials onto substrates, wherein a ruthenium precursor formulation having a ruthenium-containing precursor compound and a solvent capable of solubilizing the ruthenium-containing precursor compound is vaporized.

Abstract: A process is provided for the preparation of a metallic oxide composite including mixing an aqueous solution of a water-soluble metal compound and colloidal silica, depositing the mixture upon a substrate, heating the mixture-coated substrates at temperatures from about 150° C. to about 300° C. for time sufficient to form a metallic oxide film, and, removing the silica from the metallic oxide film whereby a porous metal oxide structure is formed.

Abstract: Radioactive coating solutions and sol-gels, and corresponding methods for making a substrate radioactive by the application of the radioactive coating solutions and sol-gels thereto. The radioactive coating solution comprises at least one carrier metal and a radioisotope, which may be soluble or insoluble, and may further comprise a reducing agent. The radioactive sol-gel comprises at least one metal alkoxide and a radioisotope, which may be soluble or insoluble. Methods of making a substrate radioactive by coating with radioactive coating solutions or sol-gels are also disclosed, including electrodeposition, electroless deposition, spin coating and dip coating. In a particular embodiment, the radioactive coating formed by the method is a composite coating. Radioactive substrates are also disclosed, comprising a substrate and one or more radioactive coatings, which coatings may be the same or different.

Abstract: An ammine solution which can be provided at low production cost, as compared with conventional ones. The ammine solution contains an ammine compound which contains at least one of platinum and palladium, and at lease one kind of amine compound. By using the amine compound of which the boiling point is raised, as compared with that of ammonia, due to the substitution of substitution radicals for some of hydrogens in ammonia molecules, the volatilizing speed from the ammine solution can be restrained.

Abstract: Polymer-stabilized metal colloid solutions, process for preparing them and their use as catalysts for fuel cells. Process for preparing metal colloid solutions by reacting a platinum compound and, if desired, one or more compounds of Rh, Ru, Ir or Pd with a reducing agent. At least one cation-exchange polymer is used for stabilizing the metal colloid solution.

Abstract: An composition for electroless plating of rhodium onto a substrate, a process for plating a uniform coating of rhodium onto various substrates using an electroless plating composition, and a rhodium plated article formed therefrom. The plating composition is an aqueous solution of triamminetris(nitrito-N,N,N)rhodium(III); ammonium hydroxide; and hydrazine hydrate.

Abstract: Disclosed is a method of forming a nickel metal thin film, comprising the steps of coating a substrate with a solution for forming a nickel metal thin film, the solution being formed of an alcohol solution containing nickel ions and a reducible chelate type ligand having a hydrazone unit so as to form a gel film, and subjecting the resultant gel film to a heat treatment under an inert gas atmosphere.

Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.

Abstract: This invention relates to electroless autocatalytic plating of platinum onto a substrate, an aqueous platinum plating bath, a process for plating a uniform coating of platinum onto various substrates using an electroless autocatalytic plating composition, and a platinum plated article formed therefrom. The plating bath of this invention allows direct autocatalytic plating of platinum on catalytically active and inactive, conductive and non-conductive substrates, avoiding the extra costs of activating a catalytically inactive substrate.

Abstract: A method is provided for forming a film of ruthenium or ruthenium oxide to the surface of a substrate by employing the techniques of chemical vapor deposition to decompose ruthenium precursor formulations. The ruthenium precursor formulations of the present invention include a ruthenium precursor compound and a solvent capable of solubilizing the ruthenium precursor compound. A method is further provided for making a vaporized ruthenium precursor for use in the chemical vapor deposition of ruthenium and ruthenium-containing materials onto substrates, wherein a ruthenium precursor formulation having a ruthenium-containing precursor compound and a solvent capable of solubilizing the ruthenium-containing precursor compound is vaporized.

Abstract: A process for chemical vapor deposition includes depositing a film using a metal &bgr;-diketonate complex and an &agr;, &bgr;-unsaturated alcohol. The metal &bgr;-diketonate complex and the &agr;, &bgr;-unsaturated alcohol is contacted on the substrate at the same time, at different times or alternately.

Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (TOM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The patterns can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: A method to make volumetric additions of dilute aqueous acid solutions to a colloidal catalyst bath that will retard the salt crystallization. The process includes the steps of measuring the volumetric loss of water by physical measurements and adding dilute aqueous acid solution to the bath in the amount of the loss or by measuring the density or specific gravity of the solution and adding dilute aqueous acid solutions to maintain the specific gravity in the desired range.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.

Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.