Abstract: A coating composition for the attenuation of the reflection electromagnetic radiation and particularly electromagnetic radiation have a wavelength of greater than 800 nm including the near infrared is described. The composition comprises a chromophore capable of absorbing up to about 95% of the electromagnetic radiation having a wavelength greater than 800 nm. Optionally, the composition may comprise microbeads that serve the purpose of also scattering the electromagnetic radiation.

Abstract: A stable, crystallizing solution of magnesium silicofluoride and oxalic acid is disclosed which can be incorporated into a complete maintenance system covering daily and weekly maintenance along with the periodic maintenance process of crystallization for preserving the appearance of polished marble flooring, terrazzo limestone, etc. The results which can be achieved through the use of this system are determined via an initial pretest with performance quantified using a glossmeter. Final performance results, the visible results of crystallization, are quantified via the glossmeter.

Abstract: Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.

Abstract: A cationic silicone compound which can be employed in a variety of environments, such as a fiber lubricant, textile fabric softener, hair conditioner, and skin conditioner is formed from an aminosilicone compound which has the following Formula (I): ##STR1## wherein a, b, and c are 0-300;d is 0-4, preferably 1 or 2;R.sub.1 comprises hydrogen, an alkyl, aryl, alkynyl, alkenyl, alkyloxyalkylene group which may be unsubstituted or substituted with P,N, or S moieties;R.sub.2 is defined the same as R.sub.1 and can also be a carboxylic acid residue preferably a fatty acid residues, with the proviso that where R.sub.2 is a carboxylic acid residue, the R.sub.1 attached to the terminal N is hydrogen;R.sub.3 is defined the same as R.sub.2 and can also be alkoxy, aryloxy or oxyalkylene groups;R.sub.4 is defined the same as R.sub.3 and can also be an amino-substituted alkyl group;Z.sub.1 and Z.sub.

Abstract: This invention provides a lap capable of reducing the pole recession produced between the substrate and the magnetic film when the air-bearing surface of a thin-film magnetic head is lapped, a lapping liquor used for such lapping, and a thin-film magnetic head having its air-bearing surface lapped by using them. Lapping is carried out by using a lap made of a material having both a phase of tin and a phase of brass with a greater rigidity in supporting the abrasive grains than tin, and a lapping liquor prepared by mixing an anionic surfactant (15) and an ampholytic surfactant (16). According to the present invention, it is possible to reduce the pole recession in the thin-film magnetic heads and to accordingly shorten the recording bit length of the magnetic discs.

Abstract: This invention relates to an abrasive-containing surface-finish composition, comprising: an effective amount of abrasive particulates to enhance the non-slip characteristics of said composition, said abrasive particulates having an average particle size of up to about 100 microns. The surface finish-composition can be water-based or oil-based. In one embodiment the surface-finish composition further comprises water, at least one acrylic polymer and at least one synthetic wax. Optional ingredients include one or more alkali-soluble resins, leveling agents, water-soluble solvents, plasticizers, defoaming agents, fragrance enhancers, biocides, and the like. These compositions are useful as anti-slip floor finishes.

Abstract: A polishing compound for plastic surfaces. The compound contains by weight approximately 4 to 17 parts at least one petroleum distillate lubricant, 1 to 6 parts mineral spirits, 2.5 to 15 parts abrasive particles, and 2.5 to 10 parts water. The abrasive is tripoli or a similar material that contains fine particles silica. Preferably, most of the abrasive particles are less than approximately 10 microns, more preferably less than approximately 5 microns in size. The compound is used on PLEXIGLAS.TM., LEXAN.TM., LUCITE.TM., polyvinyl chloride (PVC) and similar plastic materials whenever a smooth, clear polished surface is desired.

Abstract: An aqueous polymer preservative and protectant composition containing a silicone emulsion, an aminofunctional silicone emulsion, a film forming thickening agent and a polyol.

Abstract: A composition which comprises approximately by weight 1 to 8 percent of a hydrocarbon solvent; 1 to 4 percent of a silicone; 1 to 5.5 percent of at least one nonionic surfactant; 0.5 to 3 percent of an alkali metal neutralized tall oil fatty acid and 0.25 to 2.5 percent of an unneutralized tall oil fatty acid.

Abstract: The invention is a process for preparing chemically active solid oxide particles useful for polishing, composed primarily of CeO.sub.2, or CeO.sub.2 together with other oxides, comprising: (a) forming an aqueous solution comprised of a water soluble trivalent cerium salt and an oxidizing agent and (b) aging said mixture in the liquid state for a time not less than 4 hours.

Abstract: A polish composition for pharmaceutical tablets, food products and confectionery pieces comprises beeswax, carnauba wax, water and emulsifier. A polish composition for pharmaceutical tablet, food products and confectionery pieces comprises wax, water and an emulsifier with an HLB value of about 16 to about 17.

Abstract: Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.

Abstract: The invention is directed to the creation of a material which does not have the hazardous properties of prior art materials containing quartz. In the material according to the invention, quartz is replaced with a quartz-free magmatic rock, especially nepheline syenite. Surprisingly, the magmatic rock in powdered form attains nearly the same treatment results as conventional materials which contain quartz. The material according to the invention is particularly suitable for polishing and blasting dental parts, especially those parts which are made of plastic material.

Abstract: The invention provides a tire polishing and protective composition including, as dissolved or dispersed in an organic solvent, 2 to 25% by weight of a silicone varnish, 0.1 to 4% by weight of a rubber type polymer and 0.1 to 10% by weight of a tackifier.

Abstract: This invention discloses a polishing method for flattening an inter-level insulating film or polycrystalline silicon inside a device isolation ditch in a semiconductor fabrication process.To this end, the present invention grinds and flattens an insulating film having a step on the surface thereof by using a polishing solution containing an alkali solution and a grain, wherein a cation concentration in the alkali solution is higher than an OH.sup.- ion concentration in the alkali solution.

Abstract: The present invention relates to a polishing composition comprising water, alumina, and a chelating agent. It may optionally be incorporated with an aluminum salt and/or boehmite. The present composition permits efficient polishing and gives a polished surface having superior surface properties. The composition is suitable for polishing a memory hard disk.

Abstract: A final polishing composition for polishing a silicon wafer used as a substrate crystal in electrical integrated circuits comprises water, colloidal silica, a water-soluble polymeric compound, and a water-soluble salt.

Abstract: Novel slurries for the chemical mechanical polishing of thin films used in integrated circuit manufacturing. A tungsten slurry of the present invention comprises an oxidizing agent, such as potassium ferricyanide, an abrasive such as silica, and has a pH between two and four. The tungsten slurry of the present invention can be used in a chemical mechanical planarization process to polish back a blanket deposited tungsten film to form plugs or vias. The tungsten slurry can also be used to polish copper, tungsten silicide, and titanium nitride. A second slurry, which is a 9:1 dilution of the tungsten slurry is ideal for chemical mechanical polishing of titanium nitride films. A third slurry of the present invention comprises a fluoride salt, an abrasive such as silica and has a pH.ltoreq.8. The third slurry can be used to polish titanium films.

Abstract: A multi-component polish composition and polishing process for a surface. The polish composition comprises a multi-component mixture which when applied to a surface, e.g., the painted surface of a vehicle, under effective drying conditions forms a substantially dry hydrophilic wax-containing film which may be substantially removed from the surface by water rinsing of the surface whereby a hydrophobic protective layer is provided to the surface.

Abstract: An automobile surface protectant composition containing volatile silicone which when applied to a wet surface displaces water and imparts gloss and water repellency. Preferably, the composition includes a volatile silicone fluid, an amino-functional silicone fluid, and an organopolysiloxane fluid.

Abstract: Chemical-mechanical polishing methods are disclosed for removing insulating inorganic metal oxide materials from semiconductor wafers. Such utilize aqueous acids or base slurries having a pK ionization constant of less than or equal to 5.0. Alternately, aqueous slurries having an oxidizing agent with an E.degree. reduction potential of greater than or equal to 1.0 volt are utilized. Further alternatively, non-aqueous slurries having a liquid halogenated or pseudohalogenated reactant are utilized. Further, slurries having an organic ligand precursor are utilized.

Abstract: An abrasive tape comprises a flexible substrate and an abrasive layer, which is overlaid on the flexible substrate and contains abrasive grains and a binder. The abrasive grains comprise first abrasive grains, which have a mean grain diameter falling within the range of 0.07 .mu.m to 0.40 .mu.m and a Molls hardness falling within the range of 5 to 7, second abrasive grains, which have a mean grain diameter falling within the range of 0.20 .mu.m to 0.60 .mu.m and a Molls hardness not lower than 8.5, and fine diamond grains, which have a mean grain diameter falling within the range of 0.5 .mu.m to 3.0 .mu.m. The proportion of the fine diamond grains is not lower than 4% by weight with respect to the total weight of the first and second abrasive grains. The proportion of the fine diamond grains having grain sizes not larger than 33% of the mean grain diameter is not higher than 6% by volume with respect to the whole volume of the fine diamond grains.

Abstract: A polish is provided for cleaning metallic and fiberglass surfaces, such as an automobile, truck and boat bodies, and for providing a protective film on the surface. The polish comprises water in an amount between about 40.0 to about 75.0 percent, a solvent in an amount between about 12.0 to about 35.0 percent, a rheological additive in an amount between about 0.30 to about 1.0 percent, an ultraviolet absorber in an amount between about 0.05 to about 0.50 percent, a dye in an amount between about 0.0005 to about 3.0 percent, a first silicate in an amount between about 5.0 to about 15.0 percent, dimethylpolysiloxane in an amount between about 0.50 to about 6.0 percent, a silicone resin solution in an amount between about 0.10 to about 3.0 percent, oleic diethanol amide in an amount between about 0.50 to about 2.0 percent, a second silicate in an amount between about 0.10 to about 3.0 percent, and a bactericide in an amount between about 0.05 to about 0.20 percent, by weight of the total polish.

Abstract: A composition for buffing metal parts comprising from 2% to 12% by weight of a fatty acid or fatty ester, 0.5% to 10% by weight of a nonionic water soluble surfactant, 10% to 50% by weight of an abrasive grit, 40% to 70% by weight of water, a sufficient amount of an alkaline to provide the composition with a pH in the range of 6.5 to 9.0, and 0.3% to 3.0% by weight of an acrylic copolymer which provides a paste-like consistency for the composition. The composition is water washable from the metal part after buffing.

Abstract: An abrasive composition for use in polishing or planarizing the surface of a work piece is provided comprising about 30 to 50 percent of cerium oxide; about 8 to about 20 percent of fumed silica and about 15 to about 45 percent of precipitated silica. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

Abstract: Detergent resistant compositions comprising an aqueous emulsion of hydrocarbonoxy end-blocked branched organopolysiloxanes containing from 10 to 99 mol percent of R.sub.2 SiO units and from 90 to 1 mol percent of R.sub.3 SiO.sub.3/2 units and/or SiO.sub.4/2 units, where R is a monovalent hydrocarbon radical. Other silicone fluids such as aminofunctional, silicone fluids, organoalkoxysilanes, silicone resins, organopolysiloxane fluids and silicone gums as well as abrasive materials, surfactants and organic solvents may be incorporated in the aqueous emulsions.

Abstract: Polishes for hard surfaces that are essentially free of organic solvent comprising organopolysiloxanes which are solid at room temperature.

Abstract: A polish formulation containing as components thereof at least one member selected from the group consisting of waxes, solvents, surfactants, film formers, abrasives and other ingredients normally used in making polishes. The improvement resides in incorporating into the polish formulation as a film former a silylated polycycloaliphatic amine or epoxide.

Abstract: A polishing composition for memory hard discs used to obtain polished surfaces of a high precision and a high quality with a high stock removal rate. The composition consists of water, alumina polishing agent, and polishing accelerator, and polishes surfaces of alumite, aluminum, and non-electrolytically nickel plated memory hard discs. The polishing accelerator is one kind selected from the group of molybdate of ammonium molybdate, lithium molybdate, sodium molybdate and potassium molybdate, or a kind selected from the group of molybdate and aluminum salt such as aluminum nitrate or aluminum oxalate, or another one kind selected from the group of molybdate and nickel sulfate, nickel nitrate, nickel sulfamate, and nickel acetate. The addition quantity of the substance above is 0.1 to 20%, the weight ratio of the polishing agent is 2 to 30%, and the mean particle diameter is 0.3 to 10 .mu.m.

Abstract: A method is provided for preventing agglomeration of a colloidal silica comprising trialkylsilyating part of silanol groups on the surface of silica particles of the colloidal silica with a trialkylhalosilane or a hexaalkyldisilazane in an amount from about 0.1-10 mole % based on the silanol groups on the surface of the silica particles.

Abstract: An improved fibrous composite structure for use in grinding, cutting and/or polishing operations, normally with abrasives. Webs of fibrous materials, preferably blends of fibers having different deniers are fed to a needling apparatus and are needled, starting with at least two such webs. The needles force fibers from the webs along the path of needle travel and withdraw generally clean, leaving voids that define pores. Further individual layers are needled in like fashion to alternating opposite sides of the structure. Needles pass through an amount greater than fifty percent of the then thickness of the structure adequate to produce a unitary composite, though, and most preferably entirely through the thickness. The process for producing the composite products and embodiments of the products are also disclosed and claimed.

Abstract: The present invention relates to the discovery of particular water-based emulsion formulations that comprise an environmentally acceptable integrated floor care maintenance system. In particular, the present invention provides a low zinc, low phosphate, acrylic-based, integrated floor care maintenance system that includes a low zinc acrylic floor finish having a zinc content of less than 100 ppm and a phosphate content measured as percent phosphorus of less than 0.4% by weight and a floor finish stripper having no added zinc, no added phosphate and containing from about 0.01 to 5% by weight of an ammonium perfluoroalkylsulfonate wetting and emulsifying agent, such as CAS number 67906-42-7, CAS number 17202-41-4 or a mixture of these. Additionally, this invention provides for a low zinc acrylate floor sealer having a zinc content of less than 100 ppm and a phosphate content measured as percent phosphorus of less than 0.

Abstract: A polish formulation containing as components thereof at least one member selected from the group consisting of waxes, solvents, surfactants, thickening agents, abrasives, dyes, odorants and other ingredients normally used in making polishes. The improvement resides in incorporating into the polish formulation a derivatized amine functional organosilicon compound.

Abstract: A polish formulation containing as components thereof at least one member selected from the group consisting of waxes, solvents, surfactants, thickening agents, abrasives, dyes, odorants and other ingredients normally used in making polishes. The improvement resides in incorporating into the polish formulation a novel reactive amine functional silicone polymer.

Abstract: A process for superpolishing hard ceramic substrates, and super polished substrates having surface finishes below about 20 angstroms RMS. The process comprises applying a pitch to a lap tool and forming channels in the pitch. The pitch is wetted with a polishing compound comprising colloidal alumina and powder of a substance harder than that being polished. The substrate is brought into contact with the wetted pitch, and a relative motion is applied thereto to polish the substrate.

Abstract: A buffing composition for imparting very fine finishes to automobile surfaces. The buffing composition contains non silicone-containing materials and comprises alumina abrasive and a synthetic wax dispersed in a liquid medium. The liquid medium can be a solvent, water, a hydrocarbon oil, or mixtures thereof. The buffing composition can optionally contain other additives or modifiers such as wetting agents, thickeners, stabilizers, preservatives, emulsifiers, dyes, pigments and perfumes.

Abstract: A semiconductor wafer polishing slurry that does not contaminate a wafer processing area utilizes an aqueous organic base to suspend the slurry's fine abrasive particles. The organic base has large cations (13,16,19) that do not diffuse into semiconductor wafers. Therefore ionic contamination from the polishing slurry is substantially eliminated.

Abstract: A nail cleansing composition useful for removing stains from human nails, nail stain removing kits, and a method for removing stains from nails using the composition of the invention.

Abstract: A method of cleaning and polishing a variety of porous and non-porous materials including porcelains, plastics, marble, glass, and finished wood. The polishing compound is comprised of an abrasive powder, an hydroflouric acid, and an organic solvent. The polishing compound is applied with a cloth and scouring of the surface to be cleaned and polished is accomplished with a soft cloth or with a polishing machine. The invention effectively removes scratches, stains, and blemishes from the surface to be polished and after scouring the result is a blemish free and polished surface.

Abstract: A marble, granite and stone gel-type polishing composition and method. The polishing composition includes a polishing constituent mixture and a gel-type carrier agent. The gel-type carrier agent at least temporarily maintains the polishing constituent mixture in suspension prior to and during application to the work surface.

Abstract: Photographic processing devices such as stainless steel racks and tanks are cleaned to remove contaminants such as silver by contacting the devices with a cleaning solution comprising water, a mineral acid such as nitric acid, a soluble cerium (IV) salt such as ceric ammonium nitrate, and acetic acid. The cleaning solutions have a pH no greater than 1. The acetic acid inhibits the formation of a brown stain on the stainless steel.

Abstract: A polishing composition for metallic materials, which comprises water, an alumina polishing agent, and a polishing accelerator, wherein the polishing accelerator is at least one selected from the group consisting of chromium(III) nitrate, lanthanum nitrate, ammonium cerium(III) nitrate, and neodymium nitrate. The polishing composition has a high polishing efficiency and provides a good surface smoothness.

Abstract: A furniture polish concentrate is disclosed. Also disclosed is a furniture polish composition formulated from such a concentrate. The furniture polish concentrate comprises dimethyl silicone and a poly-(dimethyl)-copoly(methyl, oxygen-containing) siloxane copolymer, structurally depicted as ##STR1## wherein "A.sub.1 " is Si--(--CH.sub.3).sub.3 ; wherein "A.sub.2 " is O--Si--(--CH.sub.3).sub.3 ; wherein "B" is (CH.sub.2).sub.i (M).sub.j (L)(CH.sub.2 CH.sub.2 O).sub.n R; wherein "i" is either 0 or an integer value of 3 to 8 inclusive; wherein "j" is either 1 when "i" is 0 or is 0 when "i" is 3 to 8 inclusive; wherein "M" is ##STR2## wherein "L" is either --O-- or is --COO--; wherein "n" is either 0 or is an integer value of 1 to 3 inclusive; wherein "R" is either --H, CH.sub.3, or --C.sub.2 H.sub.5 ; wherein "y" is about 18 to about 60 mole percent; and wherein the sum of "A.sub.1 ", "A.sub.2 ", "y" and "z" is 100 mole percent.

Abstract: An optical glass fiber polishing apparatus and method utilizing a slurry prised of water, CeO, glycerin and where needed, a base such as NaOh, to realize transmission loss in the fiber as it is polished towards the fiber core. The intensity of light introduced at one end of the fiber is measured at the opposite end, continuously and without interruption of the polishing, to determine polishing progress through the cladding towards the core.

Abstract: A polishing method and abrasive pads used to polish of abrade, for example, lenses. The pad is manufactured with an abrasives such as grains of the mean diameter: 0.5-10 .mu.m of alumina, zirconium oxide, tin oxide, and cerium oxide, a kind of water-soluble cellulose ether selected from the group of hydroxypropylmethyl and the like, and a kind of insolubilizing agent such as glyoxal, citric acid, and the like. The substances above are blended and coated on a sheet-like substrate. In polishing process, only water is poured between the rotating abrasives pad and goods to be polished.

Abstract: A buffing composition for imparting very fine finishes to automobile surfaces. The buffing composition contains no silicone-containing materials and comprises alumina abrasive and a synthetic wax dispersed in a liquid medium. The liquid medium can be a solvent, water, a hydrocarbon oil, or mixtures thereof. The buffing composition can optionally contain other additives or modifiers such as wetting agents, thickeners, stabilizers, preservatives, emulsifiers, dyes, pigments and perfumes.

Abstract: A polishing agent comprising a composition prepared by mixing(I) a polymerization product obtained by addition polymerization of a particular organohydrogenpolysiloxane and a particular organopolysiloxane having silicon-bonded aliphatic unsaturated bonds, in the presence of from 10 to 200 parts by weight of a low-viscosity silicone oil per 100 parts by weight of the total amount of said organohydrogenpolysiloxane and said organopolysiloxane; and(II) a low-viscosity oil with a viscosity of not more than 10 cSt at 25.degree. C. This polishing agent has good durable water-resistance as well as has good workability in coating operation, and therefore is suited to cars, furniture and so forth.

Abstract: An improved polish having improved rub-out characteristics results when a silylated polyether film former is incorporated into a conventional polish formulation. The silylated polyether contains at least one polyoxyalkylene block selected from the group consisting of polyoxyethylene and polyoxypropylene in its molecule wherein the polyoxyalkylene block is attached through an organic connecting group to a silicon atom bearing at least one hydrolyzable group. A preferred water-in-oil emulsion embodiment of the polish is particularly suitable for automotive or marine applications.

Abstract: An essentially wax-free cleaner-polisher composition that cleans while maintaining excellent gloss and superior protection against water and a mixture of alcohol and water damage in a one-step application is described. The composition comprises about, a) 30% to 90% water, b) 1 to 4% by weight acrylate polymer, c) 4% to 12% co-solvent and/or 0.5% to 6% surface active agents, d) 4-40 silicone oil and/or mineral oil and optically, e) 0 to 3 percent by weight of fluoroalkyl polymer, f) 0 to 0.5% a fragrance, and g) 0 to 5 percent by weight of a wax emulsion.

Abstract: The invention relates to a system and apparatus and a method for finishing and polishing a dental composite restorative material in a tooth. The system of the invention uses an elastomeric polymer disc which is impregnated with an abrasive for reducing of the composite, and a felt, suede, or elastomeric polymer foam element for polishing the composite. A method of using the above apparatus in a finishing/polishing system is also provided.