Abstract: A method of forming a liquid film characterized by dropping a liquid on a substrate from a dropping unit while rotating the substrate, moving the dropping unit in the radial direction from the inner periphery of the substrate to the outer periphery of the substrate so that the move pitch of the dropping unit in the radial direction occurring in every revolution of the substrate may change slightly, and forming a liquid film on the substrate by adjusting the feed speed of the liquid to the substrate from the dropping unit, while lowering the rotational frequency of the substrate gradually, so that the liquid on the substrate may not move due to centrifugal force by rotation of the substrate, along with the move of the dropping unit in the radial direction of the substrate.

Abstract: The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has an inkjet unit that can dispose a liquid material on a substrate, and a preparatory dryer to blow a gas heated at a predetermined temperature to the substrate.

Abstract: Dislocation of processing liquid pouring nozzles is prevented, smooth carrying of the processing liquid pouring nozzles is achieved, and the positional accuracy of the processing liquid pouring nozzles, processing accuracy and yield are improved. A substrate processing apparatus includes a spin chuck (50) for holding and rotating a wafer (W), a plurality of processing liquid pouring nozzles (60) for pouring processing liquids on a surface of the wafer (W), a solvent bath (70) for holding the processing liquid pouring nozzles at their home positions, and a nozzle-carrying arm (80) for detachably gripping desired one of the processing liquid pouring nozzles (60) held on the solvent bath (70) and carrying the desired processing liquid pouring nozzle (60) to a working position above the wafer (W).

Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: A coating apparatus for coating a rollable device including a device rotator having a pair of rollers and spray nozzle is described. The spray nozzle produces a spray of coating material that is directed towards a gap that is between the rollers of the pair. The majority of any spray not deposited on the rollable device during a coating process passes through the gap between the rollers.

Abstract: The machine is an index spraying machine. The machine has five different stations. The first station is the load/unload station. At this station, work pieces are unloaded after they have been sprayed and new work pieces to be sprayed are loaded on. New pieces then move into the pre-heat station tunnel. A third station is the spraying area. In this area, the work pieces are sprayed. After being sprayed, the work pieces move in the area where they are heated to flash off the volatile fumes. Then they move to the fifth work station where they are cooled and finally they move back into the load/unload station. The spraying area in this machine is sealed to meet NEMA 7 standards. The air capture system cascades the air, thus lowering the air volume that passes through the thermal oxidizer.

Abstract: Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.

Abstract: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

Abstract: Apparatus and method for treating medical implants are provided. The apparatus may include a vessel having a treatment chamber with an inside surface, an outside surface, an entrance, a plurality of fluid passages passing from the outside surface to the inside surface, and a compressible fluid supply line coupled to at least one of the fluid passages. In this embodiment, passages may be positioned and sized to create a buffer zone of compressible fluids between the inside surface of the treatment chamber and a medical implant placed therein. The method may include placing a first medical implant into a treatment chamber having inside surfaces, retarding the first medical implant from contacting the inside surfaces of the treatment chamber by injecting compressible fluid into the treatment chamber, injecting a therapeutic into the treatment chamber, and removing the first medical implant.

Abstract: A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the mid-stream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.

Abstract: An apparatus of the invention has a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber contains a substrate holder that can be rotated around a vertical axis, and an edge-grip mechanism inside the substrate holder. The deposition chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus is also provided with reservoirs and tanks for processing liquids and gases, as well as with a solution heater and a control system for controlling temperature and pressure in the chamber. The heater can be located outside the working chamber or built into the substrate holder, or both heaters can be used simultaneously. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution.

Abstract: A rotatable vacuum chamber receives an optical connector having an output face on which an optical gel is applied substantially without entrapped air. Opposite the output face is placed a gel dispenser with its opened nozzle pointing towards the output face. Uncured gel components contained in the dispenser are outgased prior to application of the gel on the output face while a vacuum is maintained in the chamber. Outgasing takes place at a first chamber orientation with the nozzle pointing upwards through which the outgasing air ventilates. The gel is applied at a second chamber orientation where the output face is horizontal and upwards pointing. Immediately following the gel application, the vacuum is unmade to prevent cooking of the mixed and uncured gel. A glass plate is then pressed against the applied fluid gel.

Abstract: A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

Abstract: The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.

Abstract: A film coating apparatus has a nozzle body and a coating material spreading element having an injection hole communicated with the inside of the nozzle body, and formed integrally with the nozzle body. The apparatus further has a rotation support element and a fixing element for rotatably supporting both ends of a piston for a fixed displacement swash plate type compressor and a pair of first coating material applying elements moveably installed above the rotation support element. The first coating material applying elements have a pair of first nozzles which apply coating material in uniform thickness to circumferential outer surfaces of both head parts of the piston. A second coating material applying element is installed above the fixing element such that it can be moved upward and downward and slid laterally to apply coating material in uniform thickness to a bridge part of the piston.

Abstract: A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the midstream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.

Abstract: When a coating film is formed on a substrate, the inplane uniformity of the thickness of the coating film is enhanced to improve through put. Above the substrate, there are provided main and auxiliary nozzles separately movable, and monitoring means for monitoring the state of the surface of the substrate to detect the occurrence of an uncoated region on the surface of the substrate. On the basis of previously prepared coating data, a coating liquid is spirally applied on the substrate by the main nozzle. Then, if the monitoring means detects the occurrence of the uncoated region in a coated region in which the coating liquid has been applied by the main nozzle, a control part detects whether it is required to supply the coating liquid to the uncoated region. If it is required, the coating liquid is supplied to the uncoated region by the auxiliary nozzle. On the other hand, the portion of occurrence of the uncoated region has been grasped by the control part.

Abstract: In a PECVD (plasma enhanced chemical vapor deposition) apparatus including a reaction chamber; plural susceptors installed inside the reaction chamber and horizontally mounted with a wafer respectively; a heating means for heating the susceptors; a power supply unit installed outside of the reaction chamber; a plasma electrode receiving RF power from the power supply unit, generating and maintaining plasma inside the reaction chamber; and a rotation jet spray having two spray injectors horizontally rotating and supplying gas inside the reaction chamber, a thin film is deposited by supplying BTMSM vapor and oxygen retaining gas through the spray injector, supplying hydrogen retaining gas through the other spray injector and horizontally rotating the spray injectors in the supply. Herein, a pressure in the reaction chamber is in the range of 0.1 Torr˜1 Torr, the wafer is heated at 25° C.˜400° C., and RF power in the range of 100 W˜2000 W is applied.

Abstract: Methods and apparatus for controllably dispensing fluids within wafer track modules using rotatable liquid dispense arms and nozzles. The fluid dispense apparatus may be specifically selected for developing a photoresist-coated substrate. A series of one or more rotatable arms can be mounted adjacent to a mounted substrate within a develop module, wherein each arm supports a dispense nozzle that is connected to a fluid source. The dispense nozzle may be formed with a plurality of nozzle tips for dispensing selected developer and rinse fluids. Each rotatable arm can be configured to rotate about its longitudinal axis to selectively position the dispense nozzle between various dispense positions and non-dispense positions to reduce risk of dripping solution onto the substrate. Methods for developing photoresist-coated semiconductor wafers are also provided herein using developer and rinse fluid dispense apparatus with a dispense arm that is rotatable about its longitudinal axis.

Abstract: The installation for coating a workpiece with powder in accordance with the invention comprises a powder spray device and a guide arm, the powder spray device being supported in such a manner as to be rotatable with respect to the guide arm around a rotation axis and giving rise to a principal powder spraying direction that differs from the rotation axis.

Abstract: The invention concerns a method which consists in maintaining the two ends (2, 4) of the bar (1) on the end supports (3, 5) of a frame (10), one of the ends (2) being maintained fixed, and in driving the bar in rotation. The invention is characterised in that it consists further in drawing the bar (1) while spraying a coat on the bar, the drawing of the bar corresponding to an elongation of about 0.2 to 0.001%.

Abstract: A coating area of wafer W is divided into, for example, three regions. The wafer W and/or a supply nozzle are driven in a predetermined coating direction and/or a coating direction such that coating start positions of the adjacent divided regions are not next to each other and/or the coating is not continuously performed in order of a coating end position and a coating start position when the coating end position of one region of the adjacent divided regions and the coating start position of the other region are adjacent to each other, whereby forming a liquid film of a resist liquid for each divided region of the surface of wafer W. As a result, a phenomenon, in which the resist liquid is drawn to the coating start position, so as to increase the film thickness of this portion, occurs in only the corresponding region. Resultantly, uniformity of an inner surface of the film thickness can be improved.

Abstract: A coating apparatus for coating a rollable device including a device rotator having a pair of rollers and spray nozzle is described. The spray nozzle produces a spray of coating material that is directed towards a gap that is between the rollers of the pair. The majority of any spray not deposited on the rollable device during a coating process passes through the gap between the rollers.

Abstract: The present invention relates to a method of supplying a developing solution to a surface of a substrate to perform developing treatment for the substrate, comprising a first step of supplying the developing solution to the surface of the substrate while a developing solution supply nozzle is moving relative to the substrate and a second step of developing the substrate for a first predetermined period of time, and the second step has the step of stirring the developing solution on the surface of the substrate after a second predetermined period of time from the completion of the first step. Because of stirring, the concentration of the developing solution on the substrate is made uniform, resulting in a rise in the uniformity of developing treatment.

Abstract: Methods and apparatus for delivering a variety of processing fluids onto a semiconductor wafer substrate with a multi-port nozzle: The nozzle is formed with plurality of longitudinal liquid manifolds and gas manifolds. Each manifold is positioned within the nozzle body so they are in fluid communication with a separate corresponding inlet formed in the body of the nozzle. Fluid inlets may be connected to external sources for receiving processing fluids to be dispensed. In addition, the nozzle includes a plurality of nozzle tips for directing dispensed liquids onto the wafer substrate. At least some portion of each tip extends beyond the bottom surface of the nozzle, and at the same time, at least some portion of the tip extends into a liquid manifold within the nozzle body to form an interior reservoir. Furthermore, the bottom nozzle surface includes a network of trenches formed in between the nozzle tips in a grid-like pattern and may further include a plurality of gas orifices therein.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: In a method and apparatus for forming a plurality of films on the surface of a substrate, at least two liquid samples are deposited by a deposition device onto the substrate surface. The substrate is moved so that the liquid samples on the substrate are subjected to a non-contact spreading force sufficient to cause the samples to spread over the surface to form a respective film thereon. At least a portion of each film is discrete from one or more other films formed on each substrate surface. In another embodiment, liquid samples of different compositions are deposited on an array of substrates. The liquid samples on at least two of the substrates are subjected to non-contact spreading forces during overlapping durations of time whereby the spreading forces are sufficient to cause the samples to spread over respective surfaces of the substrates to form films thereon.

Abstract: A developer supply nozzle moves from the side of a first edge of a substrate to the side of a second edge thereof opposite from the first edge to apply a developer across a major surface of the substrate. After a lapse of required development process time, a rinsing solution supply nozzle moves from the side of the first edge of the substrate to the side of the second edge thereof to apply a rinsing solution across the major surface of the substrate. Making the moving speed of the rinsing solution supply nozzle higher than the moving speed of the developer supply nozzle shortens actual developing time at a site (downstream relative to a scanning direction) where a development reaction is apt to accelerate under the influence of fluctuations of the developer caused by dropping of the rinsing solution.

Abstract: A robot arm with a coating gun mounted on a distal end thereof houses therein a first color changing valve mechanism for supplying a base compound, an electropneumatic transducer, and a second color changing valve mechanism for supplying a hardener, which are successively arranged in the order named toward the coating gun. The base compound and the hardener supplied from these mechanisms controlled by the electropneumatic transducer can be mixed highly accurately at a desired mixing ratio, and applied to coat a workpiece with a high-quality coating layer.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: A treatment solution supply apparatus according to the present invention is a treatment solution supply apparatus for supplying a treatment solution onto a substrate which is disposed in a predetermined processing position on a mounting portion, comprising a treatment solution supply nozzle for supplying the treatment solution onto the substrate and a nozzle holder for releasably holding the treatment solution supply nozzle. The treatment solution supply nozzle is disposed in a predetermined stand-by position and the nozzle holder is movable in three dimensions. The movability of the nozzle holder in three dimensions makes it possible to finely adjust the position of the treatment solution supply nozzle and thereby, supply the treatment solution accurately to an appropriate position on the substrate.

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe are disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract: A sealant dispensing system is disclosed which is capable of applying sealant material to irregularly shaped, i.e., non-circular, closure members. To accomplish this, the closure member is loaded onto a rotary chuck in a conventional manner. The sealant applying gun, however, is moveable relative to the end. In this manner, through a combination of rotation of the closure member and movement of the gun, the gun is able to follow the outline of a closure member of any shape. In order to allow non-circular closure members to be loaded onto a chuck, the chuck must first be stopped. After the closure member is loaded, chuck rotation is then initiated. In order to allow this selective chuck rotation, the chuck may be attached to a servo motor. An electromagnet may be located in proximity to each chuck of the sealant dispensing system.

Abstract: This invention describes improved apparatus and methods for spin-on deposition of semiconductor thin films. The improved apparatus provides for controlled temperature, pressure and gas compositions within the deposition chamber. The improved methods comprise dispensing of solutions containing thin film precursor via a moveable dispensing device and the careful regulation of the pattern of deposition of the precursor solution onto the wafer. The invention also comprises the careful regulation of deposition variables including dispensation time, wafer rpm, stop time and rates of wafer rotation. In one embodiment, the precursor solution is dispensed from the outer edge of the wafer toward the center. In alternative embodiments, processors regulate the movement of the dispensing arm and the precursor pump to provide an evenly dispensed layer of precursor solution. The invention also describes improved methods for evaporating solvents and curing thin films.

Abstract: A painting apparatus including a rack assembly mounted on a carriage and adapted to be moved on the carriage between a load station, a paint application station, and an unload station. The rack assembly includes a main rack assembly mounted for rotation about a central axis and a plurality of rack subassemblies carried by the main rack assembly and mounted for respective rotation about a plurality of subassembly axes spaced circumferentially about and parallel to the central axis. As the main rack assembly undergoes rotation about the central axis at the paint application station, the rack subassemblies simultaneously rotate about their subassembly axes so that the parts carried by the subassemblies undergo a compound rotation with the result that even intricate interior surfaces on the parts are given a uniform coating of paint.

Abstract: Disclosed is a method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: A film forming apparatus comprising: a spin chuck; a cup; a lid; a first circular/tubular nozzle for supplying a resist solution to a first portion corresponding to the rotation center portion of a rectangular substrate; a plurality of second circular/tubular nozzles that supply the resist solution to a plurality of second portions of the rectangular substrate to which supply of the resist solution by centrifugal force is difficult, the distances between the rotation center portion and each of the second portions being greater than a half of a shorter side of the rectangular substrate; a rectangular nozzle holder that holds the first nozzle and the second nozzles; a mechanism that positions the nozzle holder; a controller that controls an amount of the resist solution from the first and second nozzles, attaches the lid to the cup, and rotates the substrate with the spin chuck; a resist solution tank; a supply tube provided between the resist solution tank and the first and second nozzles; a bellows pump for s

Abstract: The system comprises a multistage spin unit having a plurality of compartments stacked vertically in a multistage, a main arm mechanism comprising a wafer holder and driving means for causing the wafer holder to advance and retreat longitudinally, moving the wafer holder up and down along a vertical shaft and turning the wafer holder around the vertical shaft, a spin chuck provided on each of the compartments for holding and spin-rotating the wafer delivered by the main arm mechanism, a cup for surrounding the spin chuck to receive and discharge a treatment solution separated from the substrate by centrifugal force, a shared nozzle for supplying the treatment solution toward the substrate held by the spin chuck in the compartment, a nozzle moving passageway provided along the multistage spin unit for communicating with each compartment to move the shared nozzle therethrough, and a nozzle moving mechanism for moving the shared nozzle.

Abstract: An apparatus for applying a coating solution to a surface of a substrate to form a coating film of desired thickness thereon. The apparatus includes a rotary supporting device for supporting and spinning the substrate in horizontal posture, a solvent spraying device for spraying a solvent to the substrate, a coating solution supplying device for supplying the coating solution to the substrate, a storage device for storing a processing program stipulating varied points and periods of time, a timer acting as a reference for each point or period of time stored in the storage, and a controller operable to perform controls based on the points and periods of time and with reference to the timer.

Abstract: A treatment jet or beam, e.g. from a high velocity oxygen-liquid fuel (HVOF) spray gun, has an axis intersecting the surface of a rotor at a given point. The rotor has a profile which progresses helically along it. The point is traversed along the rotor while keeping the point at the same position on the rotor profile. In particular the jet axis is moved parallel to the rotor axis while the rotor is rotated in synchronism.

Abstract: A film forming apparatus comprising a substrate holding section for holding a substrate to be processed, a nozzle unit arranged and opposing the substrate holding section, having a discharge hole for continuously applying film-forming solution, in the form of a slender stream, to a surface of a substrate held by the substrate holding section, and a drive mechanism for driving the substrate and the nozzle unit relative to each other, thereby to coat the surface of the substrate with the solution, while the nozzle unit is applying the solution, in the form of a slender stream, to the surface of the substrate.

Abstract: To provide a coating apparatus which is capable of making short a lag time up to action of a valve and making operate a discharging pump and a valve with the best timing. By employing electric-air regulators ER1 and ER2 of small size and high response speed as a speed controller for controlling a switching speed of a switching valve AV or a suck-back valve SV, total flowing course is made short, thereby a time lag up to operation of a valve is made short. Further, by detecting the pressure of a resist liquid being discharged from a discharging pump 120 by a pressure sensor 123, and by controlling the operation of each device of a discharging pump 120, a switching valve AV, and a suck-back valve SV through a controller 180, a discharging pump 120, a switching valve AV, and a suck-back valve SV can be operated with the best timings, and generation of particles due to dripping of a resist liquid at a tip end of a resist nozzle 60 is prevented from occurring.

Abstract: A sealant dispensing system is disclosed which is capable of applying sealant material to irregularly shaped, i.e., non-circular, closure members. To accomplish this, the closure member is loaded onto a rotary chuck in a conventional manner. The sealant applying gun, however, is moveable relative to the end. In this manner, through a combination of rotation of the closure member and movement of the gun, the gun is able to follow the outline of a closure member of any shape. In order to allow non-circular closure members to be loaded onto a chuck, the chuck must first be stopped. After the closure member is loaded, chuck rotation is then initiated. In order to allow this selective chuck rotation, the chuck may be attached to a servo motor. An electromagnet may be located in proximity to each chuck of the sealant dispensing system.

Abstract: A rotogravure printing medium includes a member coated with a film that is selectively removable to produce ink retaining cells. The film is formed by a series of adjacent strip of bead portions of a self-leveling, curable plastic composition which is engravable after curing. The adjacent strip or bead portions merge and self-level after deposition to produce a uniform continuous coating of the plastic composition.

Abstract: A coating device for carrying out a die coating method, which is capable of rapidly and assuredly eliminating an undesirable streak occurring in a coating layer during the coating operation. The coating device includes a coating head spaced from a back-up roll, and a shifting mechanism for shifting the coating head close to and remote from the back-up roll. The shifting mechanism includes a reciprocation carriage mounted onto a stationary frame to be linearly reciprocatedly movable thereon, a drive section for reciprocating the reciprocation carriage on the stationary frame, and a stop section for selectively hindering the linear motion of the reciprocation carriage caused by the drive section at a desired position. The shifting mechanism operates to instantaneously reciprocate the coating head at a small distance so that a distance between the outer surface of the back-up roll now carrying out the coating operation and the coating face of the coating head temporarily increases.

Abstract: A spreading state of an outline of the outer periphery of a coating solution is detected by a detecting sensor, and the rotation speed or the like of a wafer as a substrate is controlled so that a spreading speed of the outline becomes not more than a predetermined speed with no danger of producing a scratchpad. Alternatively, the width in the radius direction of a scratchpad is measured, and the rotation speed or the like of the wafer is controlled so that the width in the radius direction becomes not more than a predetermined value. Thereby, occurrence of the scratchpad is prevented or the degree thereof is decreased, thereby avoiding uncoating of the coating solution on the substrate and reducing the amount of the coating solution used.

Abstract: After a thin liquid agent film is formed by supplying a liquid agent onto a plate-like developer holder, this liquid agent film and the surface of a substrate are opposed. The liquid agent film and the substrate are brought into contact with each other at a point by declining the substrate and moving it close to the liquid agent film, or by curving the substrate toward the liquid agent film. Then, the substrate is made parallel to the liquid agent film, and the liquid agent is supplied such that the contact area of the liquid agent film spreads over the entire surface by the interfacial tension between the liquid agent film and the substrate. Since a thin liquid agent film can be uniformly formed below the substrate, processing can be performed with a small consumption amount. Additionally, the liquid agent can be supplied to the substrate without holding air.

Abstract: A photoresist coater has a rotatable chuck to support a substrate, a source of photoresist, a pivotable dispensing arm extendable over the chuck, and a nozzle at the end of the dispensing arm. The nozzle has an aperture with a dimension sufficiently small that photoresist directed therethrough forms an aerosol which is directed onto the substrate.