Abstract: A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position.

Abstract: In forming a resist film by supplying a resist liquid onto a surface of an LCD substrate loaded in a rotation cup, a coating liquid is coated on the surface of the substrate by spraying the resist liquid onto the surface thereof while not rotating the substrate to thus form the coating film on the overall surface of the substrate, then the substrate is sealed into the rotation cup by closing the processing vessel by a lid member, and then a film thickness of the coating film is regulated by rotating the rotation cup and the substrate.

Abstract: The method comprises a preheating step to heat a metal base 10 entirely, a pre-spraying step to for a glass pre-coating 13 by pre-spraying a glass material onto the surface of the preheated base, a main-spraying step to form a glass coating 14 by additionally heating the glass pre-coating formed in the previous step and main-spraying a like glass material onto the surface.

Abstract: A substrate treating apparatus for treating a substrate in a predetermined substrate treating region. Each holder arm is supported in a proximal end portion thereof by an arm support to be swingable about a pivotal axis. In time of substrate treatment, the arm support is raised by an air cylinder. With the ascent of the arm support, a cam follower attached to a proximal end of the holder arm is guided by a cam groove. The holder arm, while being raised, turns from a vertical standby posture to a horizontal posture for treating the substrate. As a result, a treating device attached to a distal end of the holder arm moves to a treating position. In the treating position, the treating device treats the substrate. The holder arms are maintained in the vertical standby posture when out of use in substrate treatment. Thus, the holder arms require a reduced standby space.

Abstract: It is difficult to efficiently fabricate optical lenses on which gradation coloring is finely implemented. Gradation coloring is implemented on optical lenses by using an optical lens coloring system having an optical lens holding device for holding an optical lens, a coloring agent discharging device provided with one or a plurality of nozzles for discharging coloring agent for coloring the optical lens, and a relative position control device for controlling a relative position of the optical lens holding device and the coloring agent discharging device. The relative position control device controls the relative position of the optical lens holding device and the coloring agent discharging device such that coloring agent discharged out of the coloring agent discharging device arrives at a predetermined plane substantially from a direction normal to a predetermined plane of an optical lens held by the optical lens holding device.

Abstract: This invention provides making a rotogravure printing medium which includes a member coated with a film that is selectively removable to produce ink-retaining cells. A series of adjacent strip or bead portions of a self leveling, curable plastic composition which is engraveable after curing is provided on the surface of the member. The adjacent strip or bead portions merge and self level at and after deposition to produce a uniform, continuous coating of the plastic composition.

Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.

Abstract: Apparatus and method for depositing fluids on both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel and that is operable to rotate the mandrel. The apparatus also includes means for dispensing a first volume of fluid on the semiconductor wafer and a second volume of fluid on the semiconductor wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel. The mandrel is rotated to spin the semiconductor wafer and a semiconductor processing fluid is sprayed on the first and second sides of the semiconductor wafer.

Abstract: A cleaning apparatus is used for cleaning a substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal panel with a cleaning member. The cleaning apparatus includes: a holding mechanism for holding a workpiece, an arm movable relative to the workpiece, a cleaning member mounted on the arm for cleaning the workpiece held by the holding mechanism, a moving mechanism for vertically moving the cleaning member with respect to the workpiece held by the holding mechanism, and a controller for controlling the moving mechanism to adjust the cleaning member to a setting height.

Abstract: A method of applying a pattern to a surface of a substrate includes forming mutually parallel pattern rows applied by at least two output channels. In order to produce a pattern without strip-like visible faults, provision is made for the output channels in each case to be displaced transversely in relation to the pattern rows such that pattern rows can optionally be applied by at least some of the output channels in order to obtain a complete pattern. The individual pattern rows are applied by different output channels and are mixed with one another.

Abstract: Method and apparatus for manufacturing a heater roller which includes a cylindrical electrically insulating substrate having an outer circumferential surface, and an electrically resistive heat generating layer formed on the substrate for heating a desired member in evenly pressing contact with that member, wherein an electrically resistive paste for forming the electrically resistive layer is delivered from a paste delivery tube of a paste delivery device onto the outer circumferential surface of the substrate, while the cylindrical substrate is rotated about its axis and while the paste delivery device and the electrically insulating substrate are fed relative to each other in the axial direction of the cylindrical substrate, such that the relative feeding speed is controlled in relation to the relative position of the paste delivery device and the substrate in the axial direction of the substrate, within a range that permits formation of a film of the electrically resistive paste on the substrate, which fi

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: An apparatus and method for controlling the opening of a solenoid actuated valve in a sealant dispensing gun are disclosed. A proximity sensor is provided adjacent a portion of the needle valve stem in order to sense when the needle valve has reached its open position. A dispense timer is initiated when the proximity sensor indicates that the needle valve has reached its open position. In this manner, the needle valve may be maintained in its open position for the desired dispense time only without regard to the response time of the solenoid device. Also disclosed is an apparatus and method for adjusting the valve open limit of a sealant dispensing device which incorporates a solenoid or motor actuated valve open limit device. A flow sensor is located in-line with the sealant supply path of a dispensing gun in order to monitor the dispense weight during each valve open cycle. A moving average of the dispense rates may then be calculated and compared to predetermined limits.

Abstract: A spray painting apparatus and methodology. A plurality of parts are loaded onto a carrier at circumferentially spaced locations about a central spin axis of the carrier whereafter the carrier is moved in indexing fashion to a spray station where drive means engage the carrier to spin the carrier about its spin axis while a spray gun assembly is moved up and down in reciprocal fashion parallel to the spin axis. The parts are mounted on the carrier in a fashion to simulate impellers which have the effect of sucking air into the center region of the carrier to augment painting of the interior surfaces of the parts. The carriers are preferably moved to the paint spray station by a power and free conveyor system wherein the carrier is disengaged from the power conveyor at the paint spray station and is reengaged with the power conveyor following spinning movement of the carrier and reciprocal movement of the spray gun assembly.

Abstract: A substrate treating method and apparatus for treating a substrate by supplying a developing solution thereto while spinning the substrate. A nozzle having a plurality of discharge openings for discharging the developer is disposed such that the discharge openings are at different distances from the spin center of the substrate. The developer is discharged from the nozzle while the latter is moved radially of the substrate. The discharge openings then describe loci not overlapping one another over the substrate. The developer is evenly supplied over the substrate to promote the uniformity of development on the substrate surface.

Abstract: An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.

Abstract: A method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.

Abstract: Apparatus for surface coating or for lacquering of a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate support 14 and can be driven or made to perform a rotating movement, wherein the medium to be applied or the lacquer fluid is applied to the substrate 2 via a feed device 6 which can be displaced in relation to the substrate 2 and/or can be driven. The substrate 2 or the substrate support 14 can be displaced by means of a guide device or in a connecting link guide 7 in such a way that in the area of the substrate 2 the feed device 6 for applying the fluid or the lacquer is conducted approximately parallel with the surface of the substrate 2 and can be stopped at any arbitrary point above the substrate 2 at an even height distance.

Abstract: A method for processing substrates, comprising the steps of (a) disposing a substrate on a supporting table, followed by preparing a nozzle and a contact adjusting member in a waiting position apart from the substrate disposed on the supporting table and further preparing removing means in a position intermediate between the waiting position and an operating position, (b) allowing a solvent to be attached to the contact adjusting member in the waiting position and moving the contact adjusting member relative to the nozzle so as to bring the process solution present in the solution discharge port of the nozzle into contact with the solvent attached to the contact adjusting member and, thus, to adjust the condition of the process solution present in the solution discharge port of the nozzle, (c) moving the nozzle from the waiting position to an operating position through the removing means so as to allow the process solution spurted from the nozzle to be moved into the removing means, and (d) moving the substra

Abstract: An ultra thin walled wire reinforced endotracheal tubing includes a thin walled tubing comprising a polymeric material having a spring material incorporated therewith. Utilization of the spring wire material in combination with polymeric material results in a reduced wall thickness which results in a significant decrease in resistance to air flow through the endotracheal tubing. The endotracheal tubing of the present invention is made by depositing a dissolvable polymeric material on a rotating mandrel in successive layers. A spring material is also applied around the mandrel to produce the ultra thin walled wire reinforced endotracheal tubing. By controlling the rate of deposition of polymeric material along the length of the mandrel, different wall thicknesses of tubing may be achieved.

Abstract: A fluid application apparatus of the present invention includes a rotatable substrate holding mechanism (4), a photoresist liquid supply portion (5) and a motor mechanism (26). The photoresist liquid supply portion (5) supplies resist fluid to a region smaller than the entire region of the substrate surface while moving in the horizontal direction relative to the substrate holding mechanism (4). The motor mechanism (26) rotates the substrate holding mechanism (4) to diffuse the resist fluid over the entire surface of the substrate and form a resist layer having a predetermined thickness.

Abstract: A coating nozzle includes an elongate nozzle body having a coating solution reservoir defined longitudinally therein for being supplied with a coating solution from an external coating solution supply. The elongate nozzle body also has a coating solution holder defined therein and opening away from the coating solution reservoir, for holding a coating solution against falling off as droplets under surface tension of the coating solution. A plurality of passages are defined in the elongate nozzle body and held in communication with the coating solution reservoir and the coating solution holder, for supplying the coating solution from the coating solution reservoir to the coating solution holder. The arrangement of the reservoir, the solution holder and the passages in the elongate nozzle body assures that a uniform layer of coating solution is deposited by the nozzle on a surface of a planar substrate.

Abstract: An apparatus for surface coating or for lacquering a substrate, such as a disk-shaped substrate 2, which can be placed on a substrate carrier 14 and can be driven or given a rotating movement by means of a drive device, wherein the material or the lacquer fluid 5 to be applied is placed on the substrate 2 from a feed device 6. The fluid medium or the lacquer 4 released by the substrate support 14 is delivered at least to a first collecting reservoir 17 which is connected with at least one filter 28, from where the fluid is indirectly or directly conducted via a pump 29 to the first collecting reservoir 27, wherein an underpressure can be set between a first flow-off line 33 of the first collecting reservoir 27 and the pump 29.

Abstract: Also disclosed is an appliance for introducing sealing compound into lug caps, the appliance containing a turntable for accommodating the cap, and an injection unit, the injection unit containing a nozzle block, which has annularly arranged injection nozzles, and a delivery device for the sealing compound, the turntable and the nozzle block being arranged so as to be centered and the nozzle block being rotatable in the same direction as the turntable.The invention also relates to a process for introducing sealing compound into lug caps and to the use of the appliance for injecting sealing compound into lug caps.

Abstract: A supporting plate is disposed above a rotating stage to drive rotatively a semiconductor wafer mounted thereon, and a nozzle fitting rotating disk is secured to the supporting plate rotatively. The rotating center of the nozzle fitting rotating disk is disposed at a position eccentric from a central axis line of the rotating stage. At least one nozzle group in rows composed of a plurality of nozzles for ejecting a photoresist on the semiconductor wafer is fitted to the nozzle fitting rotating disk at intervals in a radial direction of the disk. At least one fitting position of the plurality of nozzles composing nozzle groups is adjustable.

Abstract: A apparatus of resist-processing a rectangular substrate including a resist coating step of supplying resist solution to the substrate, while rotating it, to form resist film at least on one surface of it and a resist removing step of jetting removing liquid, which can solve resist, to both surfaces of it at its side peripheral portions to remove the resist film from them.

Abstract: A process for spraying a coating product composed of: mounting a sprayer on a movable support member of a spraying machine; providing an object having a plurality of surfaces which surfaces include first and second surfaces which are oriented at least approximately vertically during spraying and are angled relative to one another, and a third surface which is oriented at least approximately horizontally during spraying; in a first spraying step, spraying the product onto at least the first surface from a sprayer while displacing the sprayer past the first one of the surfaces and while the first surface is oriented at least approximately vertically; rotating the object about a vertical axis after the first spraying step; and, in a second spraying step, after the rotating step, spraying the product onto at least the second surface from the sprayer while displacing the sprayer past the second one of the surfaces and while the second surface is oriented at least approximately vertically, wherein the product is sp

Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

Abstract: A device is described for externally coating bodies of revolution which comprises means for mounting and rotatably driving the body to be coated, at least one coating compound application nozzle which is stationary relative to the rotational movement of the body, and drive means for the relative movement of the nozzle and body of revolution in the axial direction of the body. The nozzle is secured on the horizontal leg of an elbow disposed transversely to the nozzle axis, wherein the elbow is guided towards a restoring device in a horizontally displaceable manner by means of a vertically movable horizontal support arm. In operation the horizontal leg and support arm rest on the body of revolution and the other leg of the elbow laterally abutting the body.

Abstract: A system for coating a photoresist on a semiconductor wafer includes a loading/unloading unit and a process unit. A convey path is arranged in the process unit, and an adhesion process section, a pre-bake section, a cooling section, a resist coating section, and a cover film coating section are arranged along the convey path. The adhesion process section, the pre-bake section, and the cover film coating section are arranged in individual process chambers, while the cooling section and the resist coating section are arranged in a common main process chamber. A convey robot is disposed to be movable along the convey path, and a substrate is conveyed among the process chambers by the convey robot. A convey member is arranged in and dedicated to the main process chamber, and the substrate is conveyed from the cooling section to the-resist coating section by the convey member.

Abstract: There is described a spin coating apparatus for applying a liquid material to a semiconductor wafer, or the like, that has a spin head for supporting a wafer on the top surface, a motor to rotate the spin head, and a nozzle located over the spin head for dispensing liquid on the wafer mounted on the spin head. A liquid well is provided having a bottom outlet opening, a bottom inlet opening, a top vent opening, and a heat exchange jacket on at least the well side walls. A shut-off valve is located between the nozzle and well, with the inlet of the valve communicating with the bottom outlet of the well, and the inlet of the valve communicating with the nozzle. A liquid supply source provides liquid to the well through the inlet opening of the well. A multi-stage vent and purge system is provided to vent and selectively introduce either gas or liquid cleaning medium into the well through the top vent opening. The distance between the nozzle and the spin head is controlled with a nozzle support.

Abstract: A support structure supports and rotates a tire in an upright position. An open ended spray chamber is movable to receive a portion of a tire. Spray nozzles in the spray chamber spray conditioning liquid onto the tire as the latter is rotated on the support structure. The spray chamber is movable away from the tire to give free access to the tire. A blower associated with the spray chamber draws air into the open end of the chamber to prevent sprayed liquid from exiting the chamber.

Abstract: There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

Abstract: A plurality of nozzles and treating liquid supplying tubes are supported by rigid support arms forming part of temperature control piping for contacting the tubes to maintain treating liquids in the tubes to a constant temperature. The support arms are pivotable about a pivot axis located sideways from a substrate, such that the nozzles are movable between a dispensing position and a standby position displaced from above the substrate. A drive arm engages and swings a selected one of the support arms to move the nozzle attached to the selected support arm, between the dispensing position and standby position. With this construction, a nozzle selected from the plurality of nozzles is reliably moved in a predetermined posture to a predetermined position, while allowing sufficient temperature control of treating liquids by the temperature controlling piping, and avoiding inadvertent dripping of the treating liquids due to deformations of the treating liquid supplying tubes.

Abstract: A device for applying a lacquer coating to a disc-shaped registration carrier. The device includes a rotary table, to be rotated about an axis of rotation at different speeds, for supporting the registration carrier, as well as with an arm which is pivotable about a pivot axis. The arm has a lacquer supply nozzle at one end and the arm is pivotable between a first position near the axis of rotation of the rotary table and a second position beside the rotary table. The arm is mounted and arranged to be pivotable about an upwardly sloping pivot axis so that the pivot axis of the arm and the axis of rotation of the rotary table intersect or cross at a pint higher than the rotary table.

Abstract: The invention relates to a device for processing disc-shaped registration carriers, provided with a number of processing stations in which the disc-shaped registration carriers are supported, and with a transport assembly by which said disc-shaped registration carriers can be moved from one processing station to another processing station. The transport assembly is fitted with interconnected, jointly driven holders for simultaneously taking hold of and moving the registration carriers between the processing stations. The processing stations are at least partially fitted with readily exchangeable processing units.

Abstract: A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir.

Abstract: An apparatus for coating an internally threaded fastener includes a support having a support aperture in axial alignment with an aperture in the fastener, a nozzle for applying a coating onto the internal threads located on the fastener aperture, means for reciprocally moving the nozzle through said support aperture and into said fastener aperture to align with the fastener threads, and means for maintaining the spray head in a stationary position within the fastener aperture while said reciprocally moving means continues through its reciprocal cycle.

Abstract: Surface treating apparatus employing at least two linear motors driving a multiple linkage system for positioning the outlet of treatment apparatus such as a radiation head or a sprayer for coating objects and especially large objects. A combination of different motions such as linear, rotational and a combination thereof are achieved through varying relative speeds and/or selective movements of the linear motors used to drive the multiple linkage system. Treatment of the entire surface area of the item being treated is accomplished through with the number of reduced number of components of simplified design. One dimensional and two dimensional linear motors may be employed in the system. A second embodiment has a plurality of spray assemblies. Each assembly has a single arm and linear motor which moves along two perpendicular axes.

Abstract: Material is uniformly applied to the entire outer peripheral surface of a rotating object by using a robot. The material is discharged toward the rotating object from a nozzle (2) of a material discharging device mounted on the distal end of a robot arm, with the nozzle moved along the outer peripheral surface of the object, e.g., a truncated cone (1), rotating at a predetermined speed. A robot control device periodically calculates coordinates (x, R, 0) in a work coordinate system (P5-XwYwZw), including a target moving position (x) of the nozzle in the direction of the rotation axis and a corresponding target nozzle moving position (R) in the radial direction which are individually expressed as a function of the time elapsed after the start of the material applying process (S12). These coordinates are converted to a robot-base coordinate system (OB-XBYBZB) (S14) and converts the result to data for respective robot axes (S15).

Abstract: A process for applying a pattern in a contrasting color to textile articles such as socks consists of entering the textile article onto an expandable article support (29), bringing a perforated pattern (38) over the article on the support, causing the support (29) to expand to press the textile article against the interior of the pattern (38), and applying typically by spraying a coloring agent onto the article through the pattern. The support (29) is subsequently contracted and the pattern (38) and then the textile article which a corresponding design has been printed, removed. Apparatus for applying a single color or multicolor pattern to articles such as socks has a carousel (23) carrying a multiple number of article supports (29). The carousel (23) rotates with a stepped movement between printing stations (54).

Abstract: A developer-supply apparatus has a developer-liquid supply nozzle, a spin chuck for supporting a wafer, and a holder for allowing the supply nozzle to wait there. The supply nozzle is transferred between a position above the chuck and a waiting position on the holder. The supply nozzle has a nozzle tip with a plurality of through holes communicating with a space containing a developer liquid. A U-shaped conduit extending along the line of the through holes is provided in the holder, for removing drops of the developer liquid hanging from the nozzle tip. The conduit has a bottom provided with a plurality of through holes for exhausting the developer liquid.

Abstract: A coating apparatus includes two spin chucks located in a single casing to support and rotate wafers. A waiting trench is located between the spin chucks to discharge that part of coating liquid which has been hardened at the tip of a nozzle. The wafers are loaded and unloaded to and from the spin chucks by a single carrying member located outside the casing. A coating liquid supply mechanism includes the single nozzle for dispensing coating liquid onto the wafers supported by the spin chucks. The nozzle is moved between the spin chucks by a moving arm. Processing cycles relative to the spin chucks are set for a same processing time and the processing cycle relative to one of the spin chucks is shifted from that relative to the other by a half cycle. The nozzle is rested on the waiting trench at the time when it does not dispense the coating liquid onto the wafers supported by the spin chucks.

Abstract: The invention is used in a labeling machine for applying liquid to the surface of the bottles after the labels are applied for the purpose of rendering scratches, abrasions, chipping and chafing of the bottle surfaces invisible. To minimize the space taken by the combination of the labeling machine and the new liquid applicator device, the device is associated with the outfeed starwheel of the labeling machine. The liquid applicator device includes a fixed arcuate friction and applicator surface on which the bottles roll by reason of being orbited in the outfeed starwheel and, while rolling, the bottles receive their coating of liquid from the applicator surface. The applicator surface is spongy and maintains a coating of the liquid on it which is applied to the surface by means of spray nozzles which are timed to spray the applicator surface by projecting a fanshaped spray through the space between successive bottles as the bottles are moving orbitally by the rotating outfeed starwheel.

Abstract: The invention is a method and a master machine of carrying out the method, for balancing and correct a workpiece at a single station. The correction apparatus is a material applicator and ultraviolet light source which is controlled by a microprocessor to supply metered amounts of viscous material to a workpiece at a desired location to cure an unbalance. The ultraviolet light source cures the viscous material into a solid deposit.

Abstract: Apparatus for rapidly forming a porous glass preform is provided in which an array of burners is oscillated along a path parallel to the longitudinal axis of the preform. The oscillation amplitude is limited so that each burner deposits soot on only a portion of the preform, e.g., 20% of the preform. By controlling inter-burner variability and the air flow in the burner-array/preform region, preforms having substantially uniform diameter and axial properties are obtained.

Abstract: Apparatus for applying a conductive coating of DAG material to the inner surface of a cathode ray tube (CRT) funnel includes a stationary DAG spray gun and a movable DAG rotating slinger. The CRT funnel is rotated to allow the stationary spray gun to deposit a first DAG coating on an intermediate flared portion of the inner surface of the funnel, including the location of its anode button. The DAG slinger, which includes a rotating disc for radially discharging the DAG, is then displaced through the neck portion of the CRT funnel toward the open, enlarged end of the funnel to deposit a second DAG coating which overlaps the first DAG coating. The apparatus includes a variable DAG flow control arrangement for depositing a DAG coating of uniform thickness over the inner surface of the CRT funnel, as well as a DAG cleaning and recovery arrangement for preventing DAG not deposited on the CRT funnel from escaping to the environment and for recovering this DAG for re-use.

Abstract: An apparatus and method is disclosed for applying a uniform layer of a fluid material such as photoresist onto the surface of a rotating workpiece such as a semiconductor wafer. A dispensing nozzle is provided with a rectangular or oblong shaped opening for painting a broad swath of the fluid material onto the surface of the workpiece while the nozzle moves along a radial path inwardly from the peripheral edge of the workpiece. The use of a rectangular or oblong shaped nozzle opening minimizes the amount of fluid material being consumed while providing a uniform thin film coating on the workpiece surface.

Abstract: Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.