Abstract: A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.

Abstract: In a dip soldering process, solder is pumped through a nozzle outlet. Leads of a component on a circuit board are dipped into the surface of the flowing solder to solder the leads to a track on the underside of the circuit board. To prevent solder bridging between the leads, a plate is provided below the solder surface, and passes between the leads. When withdrawing the leads from the solder, the solder surface is dropped to the level of the plate, so that excess solder is drawn away from the leads, preventing solder bridging between the leads. Member may be movable to rise through the solder surface as the circuit board is raised away from the surface.

Abstract: A method for forming a solder layer on the surface of a conductive circuit on a printed-wiring board includes discharging slurry containing solder powder onto the surface and heating the substrate. The slurry is discharged by dint of the pressure in a tank for the slurry. In a discharging device to be used in the method, the tank for storing the slurry is provided with a discharge pipe (2) for the slurry and a delivery pipe (1) for gas or solvent to be used for adjusting the pressure in the tank. In this device, one common pipe may be used both for discharging the slurry from the tank and delivering the slurry to the tank and one common pipe may be used for both delivering gas into the tank and sucking the gas from the tank.

Abstract: The disk lubricant tank of the present invention includes a lubricant bath cover device that resides on the lubricant bath surface to suppress surface waves. The bath cover includes a plurality of finger-like projecting members that define a plurality of disk passage slots therebetween. A plurality of disks are disposed upon a disk holding mandrel and are lowered into the lubricant bath. Each disk passes through a separate disk passage slot during the dipping process. The finger-like projections reside on the bath surface between the disk to suppress surface waves that would otherwise impinge upon side surfaces of the disk, leading to lubricant overcoat areas upon the side surfaces of the disk. Therefore, hard disks of the present invention are formed with a more uniform lubricant coating wherein unwanted lubricant overcoat areas formed by surface waves in the lubricant bath are suppressed.

Abstract: A package plating machine may be used to metal-plate yarn directly on the package. Similar devices and methods can be used for metal-plating other materials, including staple fiber or tow fiber in a basket and woven, nonwoven or knitted fabric on a beam.

Abstract: Disclosed are methods and devices for producing very fine particles which are then coated with protective polymers in another step of the process. The particles are produced using a method in which a liquid flow comprising a particle-free liquid 1 that contains the active substance in a dissolved form is combined with a second liquid flow comprising a liquid 2 in a high-energy zone or no sooner than two seconds before reaching the high-energy zone. Said two liquids can be mixed with each other while the active substance dissolved in liquid 1 is insoluble or more difficult to dissolve in liquid 2 than in liquid 1 and settles in the form of particles in the high-energy zone or within a maximum of 2 seconds before reaching the high-energy zone when the two liquids are mixed. The obtained particles are introduced into an aqueous outer phase which contains the coating materials in a dissolved form and are then subjected to a drying step such that said materials settle on the particles as a closed coating.

Abstract: A metal film-plating system including an unwinding process part configured to provide a film, a degreasing process part configured to remove impurities from the film, an etching process part configured to perform an etching process on the film, a neutralizing process part configured to perform a neutralizing process on the film, a coupling process part configured to couple the neutralized film with a coupling agent, a catalyst-adding process part configured to adsorb a catalyst onto the coupled film, an underplating process part configured to perform an underplating process on the film, and a plating process part configured to perform a plating process on the film. Further, at least one of the unwinding process part, the degreasing process part, the etching process part, the neutralizing process part, the coupling process part, the catalyst-adding process part, the underplating process part, and the plating process part includes a wetting apparatus configured to perform a wetting operation.

Abstract: An apparatus for coating medical devices at the point of care with a polymer and/or therapeutic agent comprising an environmentally controlled device coating chamber in which the device may be delivered by the manufacturer as the device packaging, or the device may be placed into the chamber at the point of care. The environmentally controlled chamber can provide a sterile enclosure in which the polymer and/or a therapeutic agent can be applied to an uncoated or previously coated device and converted to another form (such as a liquid to a film or gel) if desired, under controlled and reproducible conditions. The environmentally controlled chamber can accommodate and provide for coating the device by immersion, spray and other methods of covering the device surface with a liquid or powder. The chamber can provide for energy sources, both internally, such as heat produced by film heaters, and externally, such as UV light or microwave passing through the enclosure.

Abstract: Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves to fill recessed areas present on a surface of the wafer. A planar member is positioned over and proximate to a top surface of the wafer. Positioning of the planar member serves to entrap electroless plating solution between the planar member and the wafer surface. Radiant energy is applied to the wafer surface to cause a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase in turn causes plating reactions to occur at the wafer surface. Material deposited through the plating reactions forms a planarizing layer that conforms to a planarity of the planar member.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: A system for prevention of stirred up dross in continuous hot-dip plating bath of a metal sheet characterized by placing flow regulating members partially separated from each other under a sink roll at the two side wall surfaces of a hot-dip plating bath which axial ends of the sink roll face so that said members contact the wall surfaces and thereby suppressing the flow of hot dip metal ascending or descending along the wall surfaces.

Abstract: An apparatus for dip coating lenses comprises a tank for containing a coating liquid, a coating chamber for receiving one or more ophthalmic lenses. The tank is in fluid communication with the coating chamber for permitting the flow of coating liquid between the tank and the coating chamber. The apparatus has a first position where the coating chamber is located above the tank and second position where the tank is located above the coating chamber.

Abstract: A system and method for coating an implantable medical device, such as a stent, are provided.

Abstract: A Dewar vessel (1) for automated cryosubstitution or low-temperature substitution is disclosed. The invention further discloses an apparatus (10) for automated liquid transfer for cryosubstitution or low-temperature substitution. The apparatus (10) encompasses a container (50) that encompasses at least one specimen holder (2) and at least one reservoir holder (20); and wherein a movable transfer container (35) for automated exchange of at least one liquid (42) between the at least one specimen holder (2) and the at least one reservoir holder (20) is provided.

Abstract: An apparatus for single-sided bilayer formation includes a first fluid chamber including a sidewall and a second fluid chamber extending through the sidewall. A barrier wall separates the first and second fluid chambers and includes a nanopore therein across which a planar lipid bilayer (PLB) is formed. In use, an electrolyte is added to the first and second fluid chambers and a lipid/organic solvent mixture is added to the first fluid chamber to form a lipid/organic solvent layer. The electrolyte level within the first fluid chamber is adjusted such that the lipid layer is raised above the barrier wall and a PLB is formed. Electrolyte levels may be adjusted manually or utilizing a fluid level regulator with or without feedback control. Optionally, the apparatus may be in the form of a nanopore array. The apparatus may be incorporated into an ion channel sensing system wherein an electrical current through each PLB is separately recorded.

Abstract: A transport system for circuit boards (12) in treatment devices (11) which runs the circuit boards (12) between pairs of rollers (20, 21). The pairs of rollers are arranged in roller tracks (17, 18) running parallel to the edge of the circuit board (12) in a narrowly defined boundary region (16). The rollers are arranged with the axes (22) and shafts (23) thereof arranged at an angle (?) relative to the transport direction (14) or the perpendicular (35) thereof, such as to exert a tensile force on the circuit boards in the transverse direction thereof and thus stiffening the same. Transport through treatment, for example galvanization, etching, cleaning etc., without contact with the useful region (15) of the circuit board (12) is thus possible.

Abstract: The present invention is directed to a method and apparatus of producing a dual-phase galvanized steel strip with improved formability while maintaining a high tensile strength. The present invention comprises a step of cooling and a step of reheating. In the cooling step, the galvanized steel strip has a temperature reduction of from about 300° C. to about 150° C.-250° C. This step of cooling should cool to a maximum extent of about 150° C. different between the initial temperature and the final temperature. This cooling may be accomplished by a hot water quench, or the use of a cooling tower, or other means. The step of reheating should follow the step of cooling. The step of reheating should heat the galvanized steel strip to a temperature of about 340°-390° C. This reheating causes the martensite in the galvanized steel strip to be tempered at a relatively low temperature, which reduces the Fe—Zn phase formation in the GI-coating.

Abstract: A heat treatment or heat soak furnace for use in both galvannealing and galvanizing processes including a heating apparatus configured to supply heat and remove heat. The heating apparatus may draw hot air from the exhaust of a direct fire strip annealing furnace, gas burners or electric heat exchangers as necessary. The furnace also may include a plurality of cooling mechanisms in order to ensure heat is removed and the temperature within the furnace regulated. In addition, the furnace may include baffles configured to allow portions of the interior of the furnace to be separated into different temperature zones.

Abstract: A method of suppressing deposition of radionuclides on components of a nuclear power plant comprises forming a ferrite film by contacting a first chemical including iron (II) ions, a second chemical for oxidizing the iron (II) ions to iron (III) ions, and a third chemical for adjusting the pH of a processing solution containing a mixture of the first and second chemicals to be 5.5 to 9.0 with the metal member surface in a time period from a finishing stage in decontamination step of removing contaminants formed on the surface of metal member composing the nuclear power plant, and suppressing deposition of radionuclides on the metal member by the ferrite film.

Abstract: Embodiments of the invention generally provide a fluid processing chamber, sensors and a controller and method for using the same. The fluid processing chamber includes an inlet region, a processing region and an outlet region. The inlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid at the inlet to the processing region. The outlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid leaving the processing region of the chamber. In one embodiment the processing region contains one or more sensors and an external controller to monitor the characteristics of the processing fluid in the processing region. The sensors may include, for example, an ORP probe, a temperature sensor, a conductivity sensor, a dissolved hydrogen sensor, a dissolved oxygen sensor, and a pH sensor.

Abstract: A slit coater including an apparatus for supplying coating solution by a coating method using a slit nozzle, which is configured to minimize contamination of coating solution, utilizing a filtering function, and supplying a controlled amount of photosensitive solution to a slit nozzle. The slit coater further includes a table on which an object to be processed is mounted, a slit nozzle unit that applies coating solution onto a surface of the object to be processed, and a coating solution supply apparatus including a storage tank that stores the coating solution, a pump that supplies the coating solution stored in the storage tank to the slit nozzle unit, and a buffer tank that is in fluid communication with the pump and the storage tank.

Abstract: The invention relates to a flooding chamber for coating installations, with which shorter flooding times, and therewith shorter clock cycles, can be attained. Two flooding means are therein utilized, between which a substrate is disposed symmetrically. The flooding means direct a gas jet directly onto the substrate. Hereby the substrate is fixed between the flooding means.

Abstract: A molten metal submergence device includes a submergence chamber, an inlet pipe, and a vortex breaker. The submergence chamber is defined by a side wall and includes an inlet in communication with an associated molten metal bath and an outlet in communication with the associated molten metal bath. The inlet is positioned in relation to the side wall such that material passing through the inlet is introduced at least substantially tangentially to the side wall. The inlet pipe is in communication with the inlet of the submergence chamber. The inlet pipe is configured to depend from a wall of the submergence chamber within the confines of the side wall. The vortex breaker is disposed in the submergence chamber between the inlet and the outlet.

Abstract: A method and an apparatus for producing an adhesive tape are disclosed in which an adhesive tape is produced while a liquid reservoir is almost hermetically sealed by bringing a blade into contact with an upper laminate roller, and supplement of adhesive to the liquid reservoir is controlled so that the liquid surface of the adhesive reserved in the liquid reservoir comes into contact with the back face of the blade.

Abstract: Systems and methods for processing semiconductor devices are disclosed. A preferred embodiment comprises a processing method that includes providing a processing system including a first container and a second container fluidly coupled to the first container, the second container being adapted to receive and retain an overflow amount of a fluid from the first container, and disposing the fluid in the first container and a portion of the second container. The method includes providing at least one semiconductor device, disposing the at least one semiconductor device in the first container, and maintaining the fluid in the second container substantially to a first level while processing the at least one semiconductor device with the fluid.

Abstract: Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves to fill recessed areas present on a surface of the wafer. A planar member is positioned over and proximate to a top surface of the wafer. Positioning of the planar member serves to entrap electroless plating solution between the planar member and the wafer surface. Radiant energy is applied to the wafer surface to cause a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase in turn causes plating reactions to occur at the wafer surface. Material deposited through the plating reactions forms a planarizing layer that conforms to a planarity of the planar member.

Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

Abstract: The present invention provides a liquid tank which has a compact construction comprising a process bath, an agitation service bath, an agitation room, a liquid supply tunnel, and a liquid supply outlet.

Abstract: Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.

Abstract: A workpiece is processed uniformly, e.g., a uniform plated film is formed on a workpiece, by a processing liquid, e.g., a plating solution, which is maintained in an optimum state while minimizing the amount of the processing liquid to be used. An apparatus for processing the workpiece has a plurality of solution supply tanks 50a, 50b for individually holding a plurality of solutions, respectively, to be mixed into a processing liquid 54 while managing the temperatures of the solutions, a plurality of mixing tanks 52a, 52b for mixing the solutions individually supplied from the solution supply tanks 50a, 50b into the processing liquid 54 while managing the temperatures of the solutions, and a processing bath 56 for introducing the processing liquid 54 therein and processing the workpiece, e.g., a substrate W, by bringing the workpiece into contact with the processing liquid 54 while managing the temperature of the processing liquid 54.

Abstract: There is provided a plating apparatus and method which can control the temperature of a plating solution during plating more uniformly and easily form a uniform plated film on the to-be-plated surface of a workpiece, and which can simplify the device and decrease the footprint. The plating apparatus includes a plating bath having a double bath structure including an inner bath for holding a plating solution and carrying out plating, and an outer bath which surrounds the inner bath and is in fluid communication therewith. A heating device is disposed in the outer bath. The plating apparatus may further include means for circulating or stirring the plating solution in the plating bath.

Abstract: Apparatus for coating a support such as a monolithic catalyst support (5) comprises a dispenser (1) for dispensing a predetermined quantity of coating liquid, a containment (2) for the liquid and a source of vacuum (8, 9) which can be actuated to draw the entire quantity of coating liquid into the support (5). The apparatus and method are particularly useful for coating car catalysts without wastage and with increased design options.

Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.

Abstract: There is provided a plating apparatus which can keep a plating solution always in its optimal condition while minimizing the amount of plating solution used, and which can easily form a uniform plated film on the plating surface of a workpiece. The plating apparatus includes: a plating solution supply system (70) for constantly circulating a plating solution while heating the plating solution in a circulation tank (80) provided with a heating apparatus (78a), and supplying a predetermined amount of plating solution to a plating treatment section (24) when carrying out plating treatment; a plating solution recovery system (72) for recovering the plating solution after the plating treatment in the plating treatment section (24), heating the plating solution and returning the heated plating solution to the circulation tank (80); and a plating solution replenishment system (74) for replenishing the circulation tank (80) with a fresh plating solution or a plating solution component.

Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.

Abstract: A substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain the performance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution.

Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method suitable for processing a substrate with a plurality of liquids.

Abstract: This invention provides a method for efficiently applying a coating to each of a plurality of objects selected from the group consisting of ophthalmic lenses, molds for making ophthalmic lenses, and other medical devices, the method comprising dipping the plurality of objects into a coating bath containing a coating solution having a coating material; and creating with a means a convective current flow and thereby forcing a coating solution flowing over and under each of the plurality of ophthalmic lenses. In a preferred embodiment, the plurality of objects are held in baskets which are pre-conditioned to have a first layer of polyelectrolytes and a second layer of aqueous solution or have a mixed layer of polyelectrolytes and aqueous solution on the surfaces of the baskets.

Abstract: A method and apparatus for automatically transferring a pattern to a surface of a steering wheel, automating a series of hydraulic pressure transfer steps, such as steering wheel supply, hydraulic pressure transfer, drying, and cleaning. Since a series of hydraulic pressure transfer processes, such as steering wheel supply, first transfer to the front surface portion of a rim of a steering wheel, removing of foreign material, drying, second transfer to the rear surface portion of a rim of a steering wheel, first cleaning, and second cleaning, are automated, processing time is saved and labor costs are reduced, improving productivity.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: A workpiece processing station is disclosed. The workpiece processing station has particular applicability in an electroplating process for semiconductor wafers. The apparatus includes a work processing bowl having an outer bowl and an inner cup positioned at a location slightly below the upper rim of the bowl. An annular space is provided between the sides of the processing bowl and the fluid cup. Fluid is provided to the fluid cup through an opening in the bottom of the fluid cup. The fluid overflows the fluid cup and drains down the open annular space between the process bowl and the fluid cup and passes through the opening in the bottom of the process bowl and into a fluid reservoir. A reservoir is preferably used as both the supply and the return for the process fluid.

Abstract: This invention provides a coating apparatus and methods for coating a device, such as an industrially or medically applicable device. The apparatus is suitable for providing a coating using a photoactivatable compound and a polymerizable compound. In another aspect, the apparatus and methods are useful for coating a device wherein the surface of the device has small pores or apertures. The apparatus includes of containers suitable for holding the object to be coated and the coating solution, a gas supply source for supplying gas to solution, an irradiation station for providing light used in the coating process, and a conveyor mechanism to direct the containers to and from the irradiation station.

Abstract: A container with a quantity of coating liquid includes a luminescent pigment and a paint base. An impeller is in proximity to the bottom of the container to keep the pigment in suspension in the paint base. The container also has a linear inlet slot and a linear outlet slot. A feeding assembly includes a supply roll, a take up roll and a plurality of idler rolls to move a plurality of nylon straps from the supply roll, across the take up rolls and through the container and liquid therein and to the take up roll. A drying assembly is provided for nylon straps moving between the outlet slot and the take up roll. Also provided is a method and material.

Abstract: A process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part of which is immersed in the liquid metal bath (12), in order to define with the surface of the bath a liquid seal (14). In the region where the strip (1) leaves the liquid metal bath (12), the liquid metal is isolated from the surface of the bath in an isolating enclosure (20), and the metal oxide particles and intermetallic compound particles are recovered by the liquid metal flowing from this region into the enclosure (20), and the particles are extracted from this enclosure (20). Also, a plant for implementing the process.

Abstract: A tissue processor is disclosed for processing biological tissue, for example, for mounting on microscope slides. The tissue processor has a valve arrangement in the bottom of a tissue processing chamber, whereby a selected one of a plurality of fluid ports formed in a base of the tissue processing chamber may be connected with the interior of the chamber for supply of processing fluid thereto or discharge of fluid from the chamber. In this way different processing fluids may be passed into and removed from the processing chamber in succession, for processing of tissue samples contained in baskets within the chamber. The valve arrangement comprises a rotary disc at the bottom of the chamber and in sealing engagement with a valve surface on the base of said chamber, the valve surface being provided with a plurality of ports connected with respective said fluid inlets.

Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

Abstract: Disclosed is a venting assembly for a dip coating system, a dip coating system utilizing such venting assembly, and related method for dip coating. These aspects are particularly directed for the production of organic photoconductor layers in imaging devices, and more particularly to drum photoreceptors. The venting assembly eliminates or significantly reduces coating defects otherwise occurring in the production of drum photoreceptors. Also disclosed are the drum photoreceptors produced by this assembly, apparatus and coating process.

Abstract: A process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the bath a liquid seal (14). A natural flow of the liquid metal from the surface of the liquid seal (14) is set up in two overflow compartments (25, 29) made in the duct (13) and each having an internal wall which extends the duct (13) in its lower part, and the level of liquid metal in the compartments is maintained at a level below the surface of the liquid seal (14). A plant for implementing the process.

Abstract: A process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a seal (14). A natural flow of the liquid metal from the surface of the liquid seal is set up in an overflow compartment (25) made in the duct (13) and having an internal wall which extends the duct (13) in its lower part, and the level of liquid metal in the compartment (25) is maintained at a level below the surface of the liquid seal (14). Also, a plant for implementing the process.

Abstract: The invention relates to a device for hot dip coating metal strand (1), particularly strip steel, in which the metal strand (1) can be vertically guided through a reservoir (3), which accommodates the molten coating metal (2), and though a guide channel (4) connected upstream therefrom. An electromagnetic inductor (5) is mounted in the area of the guide channel (4) and in order to retain the coating metal (2) inside the reservoir (3), can induce induction currents in the coating metal (2) by an electromagnetic traveling field. While interacting with the electromagnetic traveling field, the induction currents exert an electromagnetic force. The inductor (5) has at least two main coils (6) that are arranged in succession in movement direction (X) of the metal strand (1), and has at least two correction coils (7) for controlling the position of the metal strand (1) inside the guide channel (4) in direction (N), which is normal to the surface of the metal strand (1).