Abstract: Example embodiments relate to an apparatus for drying a substrate. The apparatus may include a housing including first barrier walls having a first height, a rotary chuck that is disposed within the housing and configured to rotate the substrate, a nozzle system that is disposed above the rotary chuck and configured to supply a fluid onto the substrate, a cleaning liquid supply unit supplying a cleaning liquid for cleaning the substrate to the nozzle system, and a drying liquid supply unit supplying a drying liquid for drying the substrate to the nozzle system.

Abstract: Herein disclosed is a device and a method for liquid treatment of a disc-like article comprising rotating a disc-like article, dispensing liquid onto the disc-like article when rotated, collecting liquid, which is flung off the disc-like article when rotated, providing a plate arranged parallel to the disc-like article and facing the disc-like article when rotated, and directing gas parallel to the plate across the plate.

Abstract: An autoclave for the sterilization of clinical dental instruments is described, of the type comprising a sterilization chamber (1) equipped with a series of appliance fittings (4) for the inflow and outflow of fluids, and apt to contain a load of instruments onto which to carry through a sterilization cycle, characterized in that said appliance fittings (4) are gathered on at least one connection body or partition (3), with which a reducing container (7) is quickly able to be engaged and disengaged, which container has a volume apt to contain at least one instrument to be sterilized, the inner volume of such container (7) communicating with said appliance fittings (4) and said container (7) being apt to be entirely contained within said sterilization chamber (1). The small-volume container for said autoclave is further described, as well as a full treatment system employing said container.

Abstract: The present invention concerns an improved apparatus for cleaning the interior of a liquid handling probe to reduce the amount time and the volume of wash fluid required to clean the probe and minimize carryover of material between different samples. In addition to the probe, the apparatus includes one or more wash fluid reservoirs, a compressed gas supply, one or more pumps, two or more valve-controlled probe lines and a controller for opening and closing the valves and actuating the pump(s) at desired time intervals. The invention further concerns a method of cleaning a liquid handling probe using the claimed apparatus and comprising sequential steps of pumping wash fluid and compressed gas through the probe.

Abstract: After a rinse process on a wafer W is performed by feeding pure water to the surface of the wafer W at a predetermined flow rate while rotating the wafer W in an approximately horizontal state, a feed amount of the pure water to the wafer W is reduced, and a pure-water feed point is moved outward from the center of the wafer W. In this manner, the wafer W is subjected to a spin dry process while forming a liquid film in a substantially outer region of the pure-water feed point.

Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.

Abstract: A wash element for washing one or more reusable fluid manipulators is provided comprising at least one nozzle for connection to a fluid pump to generate a fluid jet and at least one deflector surface positioned to deflect the fluid jet towards a washing zone for receiving at least a portion of the fluid manipulator. The deflector surface is being shaped to broaden the fluid jet. The invention further relates to a wash station having a cavity provided with one or more wash elements. The invention yet further relates to an automated system for manipulating fluids comprising at least one wash station and a controller set up to control washing the fluid manipulator. In a process for washing the reusable fluid manipulator at least a portion of the fluid manipulator is moved in a washing zone, a fluid jet of washing fluid is generated and directed onto a deflector surface shaped to broaden and deflect the fluid jet towards the washing zone.

Abstract: There is an apparatus for cleaning a substrate (5) mounted on a moveable platen. In an example embodiment, the apparatus comprises a first chamber (20), the first chamber has solvent-dispensing nozzles (25); the solvent-dispensing nozzles wet the substrate surface (5) with a solvent (7) as the platen transports the substrate. The platen moves in a predetermined direction and at a predetermined scan velocity as it transports the substrate into a process chamber. The process chamber has a hot source (30) at a predetermined height (h) from the substrate surface (5); it provides heat energy directed toward the substrate surface, the heat energy evaporates the solvent (7) dispensed on the substrate surface; the solvent evaporation removes particulates (35) from the substrate surface, as the platen transports the substrate from the first chamber (20) into the process chamber. Substrates cleaned may include precision photo-masks, or wafers.

Abstract: A substrate rotates, and a liquid nozzle of a gas/liquid supply nozzle moves to a position above the center of the rotating substrate. In this state, a rinse liquid is discharged from the liquid nozzle onto the rotating substrate. The gas/liquid supply nozzle moves toward a position outside the substrate. A gas nozzle reaches the position above the center of the rotating substrate, so that the gas/liquid supply nozzle temporarily stops. With the gas/liquid supply nozzle stopping, an inert gas is discharged onto the center of the rotating substrate for a given period of time. After that, the gas/liquid supply nozzle again moves toward the position outside the substrate.

Abstract: In a substrate processing method according to the present invention, a substrate is first processed using a chemical liquid. Next, the substrate is rinsed by supplying a rinsing liquid thereto while the substrate is being rotated. Thereafter, the substrate is dried while the substrate is being rotated. The drying of the substrate includes reducing a rotating speed of the substrate to a first rotating speed lower than that of the substrate during the rinsing of the substrate, while supplying the rinsing liquid to a central portion of the substrate; moving, from the central portion of the substrate toward a peripheral edge portion thereof, a rinsing liquid supply position to which the rinsing liquid is supplied, after the rotating speed of the substrate has been reduced to the first rotating speed; and supplying a drying liquid to the substrate, after the rinsing liquid supply position has been moved.

Abstract: A laparoscopic lens cleaner which is suitable for maintaining the lens of a laparoscope in a clean, dry condition during a laparoscopic surgical procedure is disclosed. An illustrative embodiment of the laparoscopic lens cleaner includes an elongated cleaner sheath having a sheath interior, a fluid conduit provided in the cleaner sheath, a fluid discharge nozzle provided in the sheath interior and communicating with the fluid conduit, a gas conduit provided in the cleaner sheath and a gas discharge nozzle provided in the sheath interior and communicating with the gas conduit.

Abstract: In a washing machine, a glass sheet arranged on a resting plane is washed and then dried by means of at least one upper drying blowing unit, which is arranged over the sheet, is movable from and to the resting plane, and is connected by means of a tube f variable length to a ventilating unit arranged either over or under the same resting plane.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: Disclosed is a substrate processing apparatus capable of drying a substrate to be processed while suppressing a pattern collapse or occurrence of contamination. In a processing vessel, a substrate is immersed in a liquid in the longitudinal direction, and the liquid is pushed out by a substitution fluid of a supercritical state to be discharged from the processing vessel. Thereafter, the substitution fluid subjected to the substitution with the liquid is discharged from the processing vessel to depressurize the processing vessel, and the substitution fluid is changed from the supercritical state to a gaseous state to dry the substrate.

Abstract: A method of web cleaning, particularly relatively soft polymeric webs, without using dipping baths or ultrasonic energy. The method includes conveying the web against a backup roller and spraying the web with a high pressure liquid while the web is supported by the backup roller. Thereafter, residual fluid from the high pressure stream is stripped from the web by a gas curtain while the web is supported by the backup roller. In many convenient embodiments, the web is contacted with a cleaning roller while the web is in contact with the backup roller.

Abstract: Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

Abstract: A laparoscopic lens cleaner which is suitable for maintaining the lens of a laparoscope in a clean, dry condition during a laparoscopic surgical procedure is disclosed. An illustrative embodiment of the laparoscopic lens cleaner includes an elongated cleaner sheath having a sheath interior, a fluid conduit provided in the cleaner sheath, a fluid discharge nozzle provided in the sheath interior and communicating with the fluid conduit, a gas conduit provided in the cleaner sheath and a gas discharge nozzle provided in the sheath interior and communicating with the gas conduit.

Abstract: A system for processing a substrate is described. The system includes a proximity head, a mechanism, and a liquid supply. The proximity head is configured to generate a controlled meniscus. Specifically, the proximity head has a plurality of dispensing nozzles formed on a face of the proximity head. The dispensing nozzles are configured to supply a liquid to the meniscus and the suction holes are added to remove a used liquid from the meniscus. The mechanism moves the proximity head or the substrate with respect to each other while maintaining contact between the meniscus and a surface of the substrate. The movement causes a thin layer of the liquid to remain on the surface after being contacted by the meniscus.

Abstract: A system and method for preventing a pattern formed on a substrate from collapsing during a rinsing and drying phase of a fabrication operation includes determining a plurality of process parameters associated with a rinsing chemistry used during the rinsing operation. The process parameters define the characteristics of the rinsing chemistry and a substrate surface layer. A chemistry to reduce the surface tension of the rinsing chemistry (surface tension reducer) with at least one low surfactant chemical is identified based on the process parameters of the rinsing chemistry. The surface tension reducer is applied to the surface of the substrate such that the low surfactant chemical reduces the surface tension of the rinsing chemistry applied to the surface of the substrate thereby preventing the pattern from collapsing.

Abstract: A parts immersion system and method includes a trough through which a conveyor belt carries the parts. A chemical solution is introduced into the trough through an opening in the bottom of the trough, from above the trough, and/or from the sides of the trough. The parts on the conveyor belt in the trough have a tendency to retard liquid movement out of the open ends of the trough thereby allowing the chemical solution to accumulate in the trough resulting in a greater immersion of the parts in the chemical solution. A gate may be provided near one or both ends of the trough to further enhance the accumulation of the chemical solution in the trough. Flights may extend upwardly from the conveyor belt to further enhance liquid retention in the trough between the flights. Flexible seals at the ends of the flights may contact sidewalls of the trough. One or more vibrators may be provided to enhance drainage of the chemical solution from the parts as the parts exit the trough.

Abstract: A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes.

Abstract: A cleaning system that utilizes an organic cleaning solvent and pressurized fluid solvent is disclosed. The system has no conventional evaporative hot air drying cycle. Instead, the system utilizes the solubility of the organic solvent in pressurized fluid solvent as well as the physical properties of pressurized fluid solvent. After an organic solvent cleaning cycle, the solvent is extracted from the textiles at high speed in a rotating drum in the same way conventional solvents are extracted from textiles in conventional evaporative hot air dry cleaning machines. Instead of proceeding to a conventional drying cycle, the extracted textiles are then immersed in pressurized fluid solvent to extract the residual organic solvent from the textiles. This is possible because the organic solvent is soluble in pressurized fluid solvent. After the textiles are immersed in pressurized fluid solvent, pressurized fluid solvent is pumped from the drum.

Abstract: An apparatus for cleaning an article comprises: a solution receptacle (12) for storing cleaning solution (100); a cleaning chamber (16) for receiving an article (P) to clean; a material transporting conduit including a solution conduit (14) connected between the solution receptacle and the cleaning chamber for transporting the cleaning solution from the solution receptacle to the cleaning chamber to apply to the article received in the cleaning chamber, the material transporting conduit further including an air conduit (44) connected to a high-pressure air source (42) for transporting the high-pressure air there-through and to apply to the article; and a heating device (30) coupled with the solution conduit (14) and the air conduit (44) for heating both the cleaning solution in the solution conduit and the high-pressure air in the air conduit concurrently and to a heated temperature prior to applying to the article.

Abstract: Disclosed are an apparatus for etching or stripping a substrate of a liquid crystal display device and a method thereof. The present invention includes carrying out an etching or stripping process on substrates using an etchant in a first etchant tank, counting a number of the substrates etched or stripped using the etchant in the first etchant tank, checking readiness of a second etchant tank at a predetermined point in time before the counted number reaches a maximum substrate number set up previously for the etchant tanks, and carrying out the etching or stripping process on the substrates using an etchant in the second etchant tank when the second etchant tank is in readiness for use and the counted number reaches the maximum substrate number.

Abstract: Embodiments of the invention generally provide methods and an apparatus for processing and qualifying a formed photovoltaic device to assure that the formed photovoltaic device meets desired quality and industry electrical standards. Embodiments of the present invention may also provide a photovoltaic device, or solar cell device, production line that is adapted to form a thin film solar cell device by accepting an unprocessed substrate and performing multiple deposition, material removal, cleaning, bonding, and testing steps to form a complete functional and tested solar cell device. The solar cell device production line, or system, is generally an arrangement of processing modules and automation equipment used to form solar cell devices that are interconnected by automated material handling system.

Abstract: A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Abstract: A device for wet treating a peripheral area of a wafer-shaped article includes holding elements for holding and rotating the wafer-shaped article at its edge, a first and a second liquid treatment units for supplying liquid towards the peripheral area. The holding elements include rollers for driving the wafer-shaped article at its edge. The first liquid treatment unit includes a first liquid carrier for providing a first liquid to wet a first section of the peripheral area, a first liquid supply nozzle for supplying liquid to the first liquid carrier, and a first liquid discharging channel for removing liquid from the first liquid carrier.

Abstract: An apparatus capable of cleaning a material includes pipes arranged in a first barrel; and through holes defined in a second barrel. The second barrel is received in the first barrel. The apparatus Further includes a driver comprising a drive shaft, the drive shaft extending through the first barrel and being connected to the second barrel. A fluid container is included store fluid, an air controller is provided air-dry the material. Before washing the material, the second barrel is driven by the driver to cause each of the through holes to disengage from a corresponding pipe. After washing the material, the second barrel is driven by the driver to cause each of the through holes to engage with the corresponding pipe.

Abstract: Disclosed is a liquid processing apparatus which can more securely prevent convex portions from collapsing and also can increase the processing efficiency of a substrate. The liquid processing apparatus processes the substrate having a main body part, and a plurality of convex portions provided on the main body part. The liquid processing apparatus includes a supporting part to support the main body part of the substrate, a chemical liquid supply mechanism to supply a chemical liquid to the substrate supported by the supporting part, and a rinsing liquid supply mechanism to supply a rinsing liquid to the substrate to which the chemical liquid has been supplied by the chemical liquid supply mechanism. Also, the liquid processing apparatus includes a hydrophobicizing gas supply mechanism to inject and supply a hydrophobicizing gas to the substrate to which the rinsing liquid has been supplied by the rinsing liquid supply mechanism.

Abstract: A method for fabricating semiconductors is provided that includes an oxide chemical mechanical polish (CMP) step. Prior to performing the CMP of an integrated circuit semiconductor silicon wafer, a number of steps are performed. The silicon wafer is scrubbed with a brush using a liquid cleaner. The silicon wafer is rinsed with deionized water (DIW). Finally, the silicon wafer is dried.

Abstract: A substrate support for holding a substrate during fluid preparation is provided. The substrate support includes a support member defined from a resistive material. The support member is coupled to a first electrode and a second electrode to enable current heating of the resistive material of the support member. The support member is configured to support the substrate at a point. The current heating assists in evaporating fluid at the point during fluid preparation of the substrate.

Abstract: A substrate treating apparatus includes a substrate support unit with a chuck on which a substrate is loaded; a bottom chamber having an open top and configured to surround the circumference of the chuck; a top chamber configured to open or close the top of the bottom chamber such that the substrate is dried while the top chamber is sealed from the outside; and a direct injection nozzle member installed at the top chamber to inject fluid directly to the substrate while the top of the bottom chamber is closed. According to the substrate treating apparatus, drying efficiency of an entire substrate is enhanced, external contaminants are blocked, and generation of an oxide layer is suppressed.

Abstract: A device for cleaning optic gauges (6), which have an eye surface contact area, and in particular applanation tonometer gauges or ophthalmic contact lenses for diagnostic purposes or laser treatment is described. The device comprises: a liquid filling and emptying top-opening cleaning unit (11); one or more liquid reservoirs (1,2), connectable to the cleaning unit (11) so that fluids contained in the liquid reservoirs (1,2) can be dispensed into the cleaning unit (11); a waste water repository (3), connectable to the cleaning unit (11) so that liquid can be drained from the cleaning unit (11) into the waste water repository (3); a receptacle (5) to hold at least one optic gauge (6), that is either in a fixed position or positionable, so that an optic gauge (6) inserted into the receptacle (5) from above, eye surface contact area first, at least partially extends into the cleaning unit (11).

Abstract: A system, apparatus and method for processing flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system for processing flat articles comprising: a first dispenser for applying a liquid to a first surface of a flat article; a second dispenser for applying liquid to a second surface of a flat article; a first transducer assembly positioned so as to transmit acoustical energy to the first surface of the flat article; and a second transducer assembly positioned so as to transmit acoustical energy to the second surface of the flat article.

Abstract: A method for removing liquid from a surface of a disc includes, rotating the disc article about an axis perpendicular to the disc's main surface, supplying liquid from a supply port, moved across the substrate towards the edge of the disc, onto the rotated disc, supplying a first gas flow through a first gas supply port onto the disc article to an area whose centre has a distance to the centre of rotational movement of not more than 20 mm, the area being covered with a liquid layer thereby opening the liquid layer at a discrete area, and supplying a second gas flow through a second gas supply port moved across the substrate towards the edge of the substrate onto the rotated disc wherein the distance of the second gas supply port to the centre is lower than the distance of the liquid supply port to the centre.

Abstract: There is provided a substrate processing method with the use of plural kinds of liquids, capable of, after a process to a substrate by using a process liquid, rapidly and more reliably substituting the process liquid remaining on the substrate with a liquid to be subsequently used. The substrate processing method comprises: processing a substrate W by a process liquid; and supplying a substitute liquid onto the substrate and substituting the process liquid remaining on the substrate with the substitute liquid. The substitute liquid used in the substituting step has a surface tension that is smaller than a surface tension of the water, and a density that is equal to a density of the process liquid.

Abstract: A method and apparatus for efficiently exhausting harmful vapors and fumes from a substrate processing chamber is described. The processing chamber includes a lower volume configured as a liquid atmosphere, and an upper volume configured as a gaseous atmosphere to at least partially contain vapors or fumes above the liquid. The apparatus includes a lid member configured to seal the processing chamber and a lid assembly adapted to provide processing liquids while exhausting the vapors or fumes from the processing chamber. Switchable valves and/or a variable source of negative pressure may be coupled to the lid assembly to provide a controlled exhaust. A method of preventing or minimizing the escape of fumes or vapors is also described.

Abstract: Apparatus to clean silicon electrode assembly surfaces which controls or eliminates possible chemical attack of electrode assembly bonding materials, and eliminates direct handling contact with the parts to be cleaned during acid treatment, spray rinse, blow dry, bake and bagging. Aspects of the apparatus include a kit including an electrode carrier to hold an electrode assembly, a treatment stand to allow access to the electrode assembly, a spider plate to clamp the electrode assembly in the electrode carrier, a nitrogen purge plate to supply nitrogen gas to the backside of the electrode assembly during acid cleaning of the electrode, a water rinse plate to supply water to the electrode face, a blow dry plate to supply nitrogen to dry the electrode assembly and a bake stand to support the electrode assembly during a bake before placing the clean electrode assembly in a bag.

Abstract: A fluid inlet for a dishwasher configured to help manage acoustic emissions is provided. The fluid inlet includes a nozzle that defines a plurality of relatively small-diameter orifices and a plurality of relatively large-diameter orifices. The large diameter orifices may define a diverging cross-section. The relatively small-diameter orifices may be interspersed in a plurality of clusters between the relative larger diameter orifices. The fluid inlet may further include an enclosure defining a vertically descending channel from the nozzle toward a bottom of a tub of the dishwasher and one or more dampers within the enclosure such that the water exiting the nozzle cascades down onto and over the dampers and out of the enclosures through one or more outlets of the enclosure to the bottom of the tub.

Abstract: A cause of deteriorating the hydrogen termination on the surface of a wafer is found to be water adsorbed on the surface. By exposing the wafer to an inert gas atmosphere containing an H2 gas so as to suppress the oxidation reaction due to the water, it is possible to improve the hydrogen termination on the wafer surface.

Abstract: Disclosed is a liquid processing method. The liquid processing method can completely clean an inside of a multi-valve for a short time and process a wafer with high throughput. The liquid processing method supply a chemical liquid and a rinsing liquid to the substrate so as to process the substrate through a multi-valve and a cleaning-liquid supply pipe connected to the multi-valve. The multi-valve includes a chemical-liquid supply valve, a rinsing-liquid supply valve, and a discharge valve. The cleaning-liquid supply pipe guides the chemical liquid and rinsing liquid from the multi-valve toward the substrate.

Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. The invention includes spraying a line of fluid to a substrate, thereby creating an air/fluid interface line on the substrate; supplying a line of drying vapors to the air/fluid interface line, thereby creating a Marangoni drying effect along the air/fluid interface line; and moving the substrate relative to the air/fluid line. Numerous other aspects are provided.

Abstract: A proximity head for generating and maintaining a meniscus for processing a substrate is described. The proximity head includes a plurality of meniscus nozzles formed on a face of the proximity head, the nozzles being configured to supply liquid to the meniscus, a plurality of vacuum ports formed on the face of the proximity head, the vacuum ports being arranged to completely surround the plurality of meniscus nozzles, and a plurality of gas nozzles formed on the face of the proximity head, the gas nozzles at least partially surrounding the vacuum ports. The proximity head further includes means for reducing a size and frequency of entrance and/or exit marks at a leading edge and a trailing edge on the substrate by aiding and encouraging liquid from the meniscus to evacuate a gap between the substrate and the carrier.

Abstract: The present invention describes a drying system for a dishwasher having a washing tub (2). The drying system comprises: a first fan (3) for propelling a first air stream through the washing tub (2) to an air transporting space (9) situated in the dishwasher outside the washing tub (2), wherein the first air stream is propelled in such a way that humidity in the washing tub (2) is absorbed by the first air stream and propelled to the air transporting space (9); and a second fan (4) for propelling a second air stream received from an area outside the dishwasher to the air transporting space (9). The drying system is further arranged such that the first and the second air streams are mixed in the air transporting space (9), and in that the mixed air stream is propelled to an exhaust opening (10) leading out from the dishwasher. Thereby, an efficient drying process can be achieved wherein air leaving the dishwasher has an appropriate temperature and humidity.

Abstract: Drying a microelectronic topography. At least some of the illustrative embodiments are methods that include placing a microelectronic topography inside a process chamber, providing a non-aqueous liquid to the process chamber until at least 90% of the volume of the process chamber contains the non-aqueous liquid, pressurizing the process chamber by way of a fluid different than the non-aqueous liquid, ceasing activity with respect to the process chamber until the non-aqueous liquid and fluid form a mixture that is substantially homogenous, venting the process chamber while simultaneously providing the fluid to the process chamber, and venting the process chamber in a manner which prevents formation of liquid in the process chamber.

Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter replacement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.

Abstract: The present invention relates to a processing apparatus for fluid-processing a process target body. The processing apparatus is configured to have: supply means for supplying a fluid; process target body processing means for processing the process target body by causing a fluid supplied from the supply means to come into contact with a process target body while preventing the fluid from being scattered; recovery means for recovering the fluid supplied to the process target body processing means; and support means for supporting the process target body processing means so as to not come into contact with the process target body.

Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

Abstract: In a dishwasher (GS) with at least one washing compartment (SB) and at least one drying device (TE) for drying cleaned dishes, which has at least one sorption container (SOR) for holding reversibly dehydratable sorption material, especially zeolite (ZEO), and with at least one connecting air duct (VK) for conducting air being connected to the washing compartment (SB) for creating an exchange of air between the washing compartment (SB) and the sorption container (BEH), reversibly dehydratable sorption material for absorbing an amount of moisture transported by the exchange of air is provided in the sorption container (BEH). The sorption container (BEH) is accommodated in an underfloor module (BG) below the floor of the washing compartment (SB).

Abstract: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.