Abstract: The present invention provides an apparatus and method for cleaning substrates such as semiconductor wafers by sinking the substrates into cleaning fluids such as cleaning chemicals or rinsing liquids and then drying the substrates. The substrate clean and dry apparatus of present invention includes a process chamber comprising a cleaning chamber that carries the cleaning fluid and discharges at bottom the cleaning fluid; and a drying chamber above the cleaning chamber. The process chamber further includes a discharge device for evacuating the gas from the drying chamber, the gas supplied into the drying chamber. The discharge device is located between the cleaning chamber and the drying chamber, and evacuates the gas by force such that the gas is driven down vertically in the drying chamber.

Abstract: A blower cover assembly of a dishwasher includes an attaching cap contacting a door liner, a guide sleeve extending frontward from the attaching cap, and a guide rib formed on an inner circumference to guide flow of washing water.

Abstract: A post-processing system is provided for cleaning and/or curing a part produced by solid freeform fabrication (SFF). The post-processing systems include a housing, a part retaining device to retain the part within the housing, and an actinic radiation source to cure the part with actinic radiation. The systems also include a fluid circulation device adapted to expose the part to cleaning fluid and/or to allow the cleaning fluid to absorb actinic radiation to permit filtration of removed build material to allow extended use of the cleaning fluid. Certain systems include a first rotating portion that can rotate the retained part about a first axis, and further systems include a second rotating portion that can rotate the retained part about a second axis. The systems also include additional features to provide safe and efficient cleaning and/or curing of parts produced by SFF.

Abstract: A wash booth (1) for containers comprises a platform (3) for supporting a container (2), a wall (4) equipped with a watertight door (5) and means for washing the inside walls of the container comprising infrared radiant elements (13).

Abstract: A device as well as method for removing the overcoat without developing an imagewise exposed lithographic printing plate is disclosed. The device comprises a structure for providing water or an aqueous solution and a transfer means for transporting said plate through said structure. The plate comprises a substrate, an ink and/or fountain solution developable photosensitive layer, and an overcoat. The exposed plate is transported through the structure to remove the overcoat by contacting with said water or aqueous solution, preferably under a brushing or rubbing action. The overcoat removal device is preferably connected to a laser imager so that the plate can be imaged on the laser imager and then directly transferred to the overcoat removal device to remove the overcoat. The overcoat-removed plate is further mounted on press to develop with ink and/or fountain solution to remove the non-hardened areas of the photosensitive layer.

Abstract: A cleaning method highly effectively cleans a surface of a semiconductor wafer by removing a dissolution product, produced when a surface of a semiconductor wafer is processed by a developing process that develops an exposed film formed on the semiconductor wafer by wetting the exposed film with a developer, from the surface of the semiconductor wafer. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto a central part of a rotating wafer processed by a developing process to spread the cleaning liquid in a film over the surface of the wafer. Then, the cleaning liquid pouring nozzle is shifted to create a dry area in a central part of the wafer and the wafer is rotated at 1500 rpm to expand the dry area.

Abstract: A system and method for preventing a pattern formed on a substrate from collapsing during a rinsing and drying phase of a fabrication operation includes determining a plurality of process parameters associated with a rinsing chemistry used during the rinsing operation. The process parameters define the characteristics of the rinsing chemistry and a substrate surface layer. A chemistry to reduce the surface tension of the rinsing chemistry (surface tension reducer) with at least one low surfactant chemical is identified based on the process parameters of the rinsing chemistry. The surface tension reducer is applied to the surface of the substrate such that the low surfactant chemical reduces the surface tension of the rinsing chemistry applied to the surface of the substrate thereby preventing the pattern from collapsing.

Abstract: Ultrasonic generating unit of a cleaning tank in a cleaning apparatus applies ultrasonic waves to cleaning fluid supplied into the cleaning tank from a supply port and fluid jetting unit having openings at locations corresponding to areas to be cleaned of an article to be cleaned jets the ultrasonic-applied cleaning fluid from the openings to the areas to be cleaned of the article to be cleaned.

Abstract: A cleaning and drying apparatus is provided for a substrate holder chuck equipped with a holding members 31 (32, 33) having a plurality of holding grooves 31a (32a, 33a) for holding a plurality of wafers W respectively. The apparatus includes a atomize nozzle 50 for spraying N2-gas and deionized water to the holding grooves 31a of the holding member 31 of the chuck 30, a cleaning-liquid nozzle 60 for spraying deionized water to a side face 31b of the holding member 31 and an air cylinder 300 for causing relative movement between the atomize nozzle 50/the cleaning-liquid nozzle 60 and the holding member 31 of the chuck 30, along the longitudinal direction of the holding member 31 and horizontally. Due to driving of the air cylinder 300, the atomize nozzle 50 is constructed so as to spray N2-gas and deionized water to the holding grooves 31a of the holding member 31 in advance of the cleaning-liquid nozzle 60.

Abstract: Printing apparatus (10) comprises support means to support a roll (14) (specifically a fabric) to be printed on. The fabric inevitably has loose material and such parts will reduce the quality of the final print on the surface. Three parts may include lint and dirt. Surface cleaning apparatus (30) locates upstream of the printing means (10) and comprises an adhesive or tacky surface (32) of a roller (31). The adhesive surface collects the loose lint particles but this inevitably reduces the effectiveness of the adhesive surface. Accordingly, the cleaning apparatus (30) comprise adhesive surface cleaning means to continually clean the adhesive surface. This means that the printing process is continual and there is no need to stop the printing process.

Abstract: A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.

Abstract: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

Abstract: A method for treating a fine structure, includes supplying a liquid to a surface of the fine structure having protrusions on the surface thereof; and thereby treating the surface of the fine structure. The liquid has a smaller surface tension than that of water and is not substantially compatible with water.

Abstract: A liquid treating apparatus comprising a holding device (30) for holding wafers (W) in a substantially vertical attitude and a treating vessel (10) for accommodating the wafers held by the holding device. A treating liquid is supplied into the treating vessel by means of a treating liquid supply system. A rotational drive device (20) is provided for rotating the holding device (30) around a rotational axis passing approximately through the center of the wafers (W) in a state of non-contact with the treating vessel (10).

Abstract: An antigen exposure chamber for quickly performing cleaning and drying with high quality is provided. The antigen exposure chamber of the present invention includes: a cleaning water supply device for supplying cleaning water for cleaning the antigen exposure chamber; cleaning nozzles 23 and 24 for jetting the cleaning water supplied from the cleaning water supply device, into the antigen exposure chamber 1 and ducts 17 of fan units to clean the antigen exposure chamber 1 and the ducts 17; a floor surface 15 of the antigen exposure chamber; and an exhaust device provided below the floor surface to exhaust air from the floor surface of the antigen exposure chamber and collect and drain the cleaning water during cleaning. Further, the cleaning water supply device includes a water purifying device 19 for purifying tap water; a pure water tank 20 for storing the purified water; and a pure water supply pump 21 for pumping the pure water from the pure water tank into the cleaning nozzles.

Abstract: A proximity head including a head surface. The head surface including a first flat region and a plurality of first conduits. Each one of the plurality of first conduits being defined by corresponding one of a plurality of first discrete holes. The plurality of first discrete holes residing in the head surface and extending through the first flat region. The head surface also including a second flat region and a plurality of second conduits. The plurality of second conduits being defined by a corresponding plurality of second discrete holes that reside in the head surface and extend through the second flat region. The head surface also including a third flat region disposed between and adjacent to the first flat region and the second flat region and a plurality of third conduits. The plurality of third conduits being defined by a corresponding plurality of third discrete holes that reside in the head surface and extend through the third flat region.

Abstract: A chandelier cleaning apparatus includes a tent-like enclosure made of a transparent plastic. In a first embodiment, the enclosure includes a main body having a flat top panel and a flat, imperforate bottom panel. A central aperture is formed in the top panel and a zipper extends from the central aperture to an outer periphery of the top panel so that the central opening is enlarged when the zipper is open. The chandelier passes through the central aperture when the zipper is open and is enclosed within the enclosure when the zipper is closed. A mist of hot water is sprayed onto the chandelier with a wand that extends though a small opening in the enclosure. The time required to clean a typical chandelier drops from hours to minutes, no chemicals are used, and the chandelier is touched only by the hot mist.

Abstract: An apparatus and method are provided to treat for example a semiconductor wafer substrate wherein a delivery means for heat, a cryogen, and a fluid chemical reactant, is disposed in a chamber in which the substrate is disposed for at least one surface of the substrate to be cleaned in the chamber. The chamber may also consist of a plurality of stations for chemically treating, providing cryogen to the substrate to effect such cleaning and heating. Air is provided in the chamber in a laminar flow substantially parallel to the surface being treated to remove displaced material from the surface and prevent redeposition of the material on the substrate surface.

Abstract: A method of controlling a dishwasher having a water softening function performed by a water softener is disclosed. The method includes the steps of loading in the dishwasher an item to be washed, supplying washing water through the water softener, washing the loaded item using the supplied washing water, drying the washed item, and regenerating, during said drying step, the water softening function.

Abstract: The present invention provides a washer for washing articles. The washer is comprised of a housing defining a chamber. The housing has side walls and a top wall. A partition divides the chamber into an upper compartment and a lower compartment that is dimensioned to receive articles to be washed. The partition has an outer peripheral edge that generally conforms to the side walls of the housing. The partition is dimensioned such that a gap is formed between the edge of the partition and the side walls of the housing. An external air inlet line fluidly communicates with the upper compartment. A blower assembly is disposed in the upper compartment. The blower assembly is comprised of a housing having a first air inlet, a second air inlet and an air outlet. The first air inlet fluidly communicates with the lower compartment. The second air inlet fluidly communicates with the external air inlet line. The outlet fluidly communicates with the upper chamber. An impeller is disposed in the housing.

Abstract: The present invention provides a substrate processing system in which a processing liquid is supplied to a substrate W from a processing nozzle 50a situated above the substrate W so as to process the substrate W, and which makes it possible to prevent unintended dripping of the processing liquid from the processing nozzle. A substrate processing system 20 comprises a processing nozzle 50a capable of supplying a processing liquid to a substrate to be processed, an arm 54 supporting the processing nozzle, and droplet removing nozzles 60, 62 capable of blowing a gas to the processing nozzle. The arm is movable between a processing position and a waiting position, the processing nozzle being above a substrate when the arm is in the waiting position and being outside a substrate when the arm is in the processing position. The droplet removing nozzles are so situated that they are in the vicinity of the processing nozzle when the arm is in the waiting position.

Abstract: A first proximity head is configured to define a meniscus of a photoresist developer solution on a substrate. The meniscus is to be defined between a bottom of the first proximity head and the substrate. A second proximity head is configured to define a rinsing meniscus on the substrate and remove the rinsing meniscus from the substrate. The second proximity head is positioned to follow the first proximity head relative to a traversal direction of the first and second proximity heads over the substrate. Exposure of the substrate to the meniscus of photoresist developer solution causes previously irradiated photoresist material on the substrate to be developed to render a patterned photoresist layer. The first and second proximity heads enable precise control of a residence time of the photoresist developer solution on the substrate during the development process.

Abstract: A cleaning device and a cleaning method for a container capable of continuously performing a cleaning treatment, and a tank. The cleaning device includes a jetting member which jets a fluid in the container; a movement unit which relatively moves the jetting member along an axial direction of the container with respect to the container so that the jetting member is inserted into the container from a mouth part of the container; and a switching unit which switches the jetting member from one function to another function. The switching unit switches a nozzle for a cleaning liquid, a nozzle for blowing and a nozzle for drying in order.

Abstract: A dish washer/dryer includes a washing tub for accommodating an object to be washed, a washing section for washing the object to be washed, a heater for heating washing water, an exhaust port for discharging moisture inside the washing tub, an air blower for blowing outside-air, a mixing section disposed at an upstream side of the exhaust port and mixing the outside-air with washing-tub-inside-air, and an air volume distribution section for changing the feeding ratio of outside-air into the washing tub and the mixing section. This configuration provides a dish washer/dryer, in which a sufficient amount of outside-air is mixed with exhaust air in the washing tub so as to promote the temperature reduction of the exhaust air and the reduction of the moisture content in the exhaust air during drying operation, thereby enhancing the comfort of the exhaust air.

Abstract: An apparatus for processing a substrate with a fluid meniscus to be applied to a surface of the substrate is provided which includes a docking surface configured to be placed adjacent to an edge of the substrate where the docking surface is in the same plane as the substrate. The docking surface provides a transition interface to allow the fluid meniscus to enter and exit the surface of the substrate.

Abstract: The present invention relates to a box cleaner including an ultrasonic cleaning bath having a receiving space to be filled with DIW and an ultrasonic wave generator arranged at a bottom thereof; a tray for loading a wafer shipping box thereon; a lift for providing a driving force to put the tray into the ultrasonic cleaning bath and take the tray out of the ultrasonic cleaning bath; and a drying system for drying the cleaned shipping box, wherein a gas sprayer is installed in the ultrasonic cleaning bath for spraying gas into the cleaned shipping box to push the DIW out of the shipping box, thereby draining the DIW.

Abstract: Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates. One embodiment provides an end effector comprising a body having a contact tip for contacting an edge area of a substrate, wherein the end effector is configured to support the substrate while the substrate is in a rinsing bath and while the substrate is being dried from the rinsing bath, and the contact tip comprises a hydrophilic material.

Abstract: In one aspect, an apparatus is provided. The apparatus comprises a chamber; a plurality of rollers adapted to support a wafer in a vertical orientation within a chamber; a pair of brushes adapted to scrub a first and a second side of the wafer respectively; a first spray bar adapted to spray a liquid on the wafer to form a meniscus on the wafer as the wafer is lifted out of the chamber; and a second spray bar adapted to direct a vapor to the meniscus, the vapor being adapted to lower a surface tension of the liquid at the meniscus to perform Marangoni drying of the wafer as the wafer is lifted out of the chamber. Numerous other aspects are provided.

Abstract: A substrate treating apparatus for drying substrates by moving the substrates out of a treating liquid into a solvent atmosphere.

Abstract: A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

Abstract: A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Abstract: The present invention relates to a liquid disinfection apparatus for cleaning of objects, such as health care objects, which disinfection apparatus comprises; a chamber (3) which is arranged to receive said objects for cleaning, a stand-by tank (5) adapted to receive liquid to be used in said chamber for cleaning, a spray system (17) comprising nozzles for distributing liquid in said chamber, wherein said stand-by tank (5) is liquid flow connected with said chamber (3) via a rapid transfer port (6) so as to constitute an immediate supply of a predetermined liquid volume from the stand-by tank (5) to said chamber (3) without passing said nozzles, wherein the spray system (17) is arranged to subsequently distribute said predetermined volume, being received in the chamber (3), for the cleaning of said objects. The present invention also relates to a method for liquid transfer at said disinfection apparatus.

Abstract: In one aspect, a substrate processing apparatus is provided. The apparatus comprises a mechanism for forming a meniscus on a surface of a substrate by moving the substrate through a fluid; an air knife apparatus positioned to apply an air knife to shorten the meniscus formed on the surface of the substrate; and a drying vapor nozzle positioned to direct a drying vapor to the meniscus shortened by the air knife. Numerous other aspects are provided.

Abstract: A single-chamber type cleaning-drying apparatus for flat objects, such as semiconductor wafers, wherein cleaning is carried out by impinging both sides of the wafer, which rotates at a relatively low speed, with jets of a washing liquid and wherein subsequent drying is carried out in the same chamber by increasing the rotation speed of the wafer and supplying isopropyl-alcohol (IPA) mist onto the wafer from the top of the chamber. After the IPA forms a solution with the residue of water on the wafer, the drying process is accelerated by supplying gaseous nitrogen through nozzles arranged on both sides of the wafer he coaxially with the wafer center. As a result, the IPA-water solution quickly evaporates without leaving traces of water drops on the dried surface.

Abstract: Washing apparatus is provided for handheld baskets, particularly shopping baskets, wherein a washing tunnel has an entrance end and an exit end and conveyor means for supporting baskets and conveying them from the entrance end to the exit end. A series of spray nozzles are arranged within the tunnel and connected to a source of cleaning liquid that is operatively under pressure. The conveyor means comprises a pair of laterally spaced conveyors arranged to move in unison whilst operatively supporting two opposite peripheral edges of a shopping basket in an inverted orientation as the basket is conveyed from the entrance end to the exit end. Retaining means such as a longitudinally extending skid or the like are provided over at least a part of the length of the tunnel to inhibit lifting of shopping baskets off the conveyors.

Abstract: There is provided a method of efficiently cleaning substrates without damaging a fine pattern formed thereon. It is a method of cleaning one or more substrates in a system processing one or more substrates as one batch by dipping one or more substrates as one batch, including the steps of: immersing one or more substrates as one batch in a wet etching solution; ultrasonically cleaning one or more substrates as one batch; and drying one or more substrates as one batch. The step of ultrasonically cleaning employs a cleaning solution having a gas dissolved therein to have a degree of saturation of 60% to 100% at an atmospheric pressure, and an ultrasonic wave having a frequency of at least 500 kHz and an energy of 0.02 W/cm2 to 0.5 W/cm2.

Abstract: Herein disclosed is a device and a method for liquid treatment of a disc-like article comprising rotating a disc-like article, dispensing liquid onto the disc-like article when rotated, collecting liquid, which is flung off the disc-like article when rotated, providing a plate arranged parallel to the disc-like article and facing the disc-like article when rotated, and directing gas parallel to the plate across the plate.

Abstract: This invention provides a substrate processing method including a step of covering in advance the surface of a substrate W with water (28), a step of holding the substrate W generally horizontally with the surface facing upward and rotating it in a horizontal plane (10), and a step of blowing to the substrate top surface drying gas flow that is thin in area in comparison with the substrate W surface (30, 40), in which the water is removed from the substrate top surface by the rotation in the horizontal plane while blowing the drying gas flow, a substrate processing apparatus for implementing the above method, and a control program for use with the above method and apparatus. With this invention, it is possible to dry a cleaned substrate without locally leaving water droplets.

Abstract: The invention is an automatic no contact machine for cleaning and drying tips, air caps, retainers and cups on spray apparatus when changing liquid or when the apparatus will be idle, or to remove build up of paint on applicators that cause spits and drips on surfaces and electrostatic arcing to spray apparatus while containing and recovering cleaning effluents to an environmental standard.

Abstract: A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process windowl. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.

Abstract: A dishwasher includes a washing container, devices for washing dishes by means of rinsing liquor, and a sorption drying device which is connected in an air-conducting manner to the washing container via an outlet of the washing container and an inlet of the washing container. The sorption drying device is provided with a sorption column encompassing reversibly dehydratable material. The outlet and the inlet of the washing container are connected to the sorption drying device without mounting an air duct there between.

Abstract: A commercial dishwasher (2) has a spray chamber (4) for holding items (6) to be washed and is designed for loading and unloading batches of items (6) to be washed into and from a region (12) for items to be washed. The dishwasher (2) has a fan (18) for producing an air stream (20) which passes from an air inlet (14) below the region (12) for items to be washed, through the spray chamber (4), to an air outlet (16), with the air stream (20) in the spray chamber (4) being passed through the region (12) for items to be washed in order to dry the items (6) which have been washed. A deflector arrangement (22) acts on the air stream (20) entering the spray chamber (4) through the air inlet (14) in order for the air stream (20) to enter the region (12) for items to be washed in a uniformly distributed manner from below.

Abstract: A vent system for a dishwasher provides a mixing chamber receiving high humidity air from a downdraft dishwasher vent system or the like and mixes this air with dry air before discharging it from the dishwasher to reduce the humidity of the discharged air moderating condensation problems

Abstract: The present invention provides a spin cleaning and drying apparatus of single-wafer processing type which cleans a substrate with a cleaning liquid from a rinse nozzle while rotating the substrate and dries the substrate after cleaning while rotating the substrate, comprising: a spin chuck which holds and rotates the substrates; a cup which has an opening on an upper side, a water discharge port and an exhaust gas port in a bottom portion, and encloses the spin chuck; a flow regulating plate which has a gas injection port in a middle and is provided so as to be able to move backward and forward to a position opposed to the substrate and spaced therefrom at a prescribed distance and to an upward or sideward retracted position; and an exhaust cover, having multiple slit holes each with a hood which opens to an upper surface, is provided below the spin chuck.

Abstract: An aqueous washing system and method of operation for washing of articles such as engineering components, including curing of resin impregnated porous metal components, comprising placing the articles into a process chamber (10) and supplying from a supply tank (11) an aqueous washing fluid at a temperature at or above 100° C. A head of pressure is established above the fluid in tank (11) whereby the fluid may be transferred by a pump (P1) to the process chamber (10). After a washing cycle the articles are rinsed by clean water and then vacuum dried before removal from the process chamber (10).

Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.

Abstract: Apparatus to clean silicon electrode assembly surfaces which controls or eliminates possible chemical attack of electrode assembly bonding materials, and eliminates direct handling contact with the parts to be cleaned during acid treatment, spray rinse, blow dry, bake and bagging. Aspects of the apparatus include a kit including an electrode carrier to hold an electrode assembly, a treatment stand to allow access to the electrode assembly, a spider plate to clamp the electrode assembly in the electrode carrier, a nitrogen purge plate to supply nitrogen gas to the backside of the electrode assembly during acid cleaning of the electrode, a water rinse plate to supply water to the electrode face, a blow dry plate to supply nitrogen to dry the electrode assembly and a bake stand to support the electrode assembly during a bake before placing the clean electrode assembly in a bag.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: A shopping cart washer and sanitizer includes an enclosure fitted with components that facilitate the entry and exit of rolling shopping carts. Within the apparatus, the carts are washed, rinsed, disinfected and dried. The apparatus is primarily for use inside retail establishments and is intended to provide each shopper a clean and sanitary shopping cart. A shopping basket washer is also disclosed.

Abstract: A system for processing a workpiece includes a dry process chamber, such as a plasma etching chamber, and a wet process chamber, such as a spin/spray chamber. Gas supply lines supply gases to the dry process chamber, and to a chemical solution generator. A liquid supply line supplies a liquid, such as de-ionized water, to the chemical solution generator. The chemical solution generator manufactures liquid chemical solutions in situ, for point of use in the wet process chamber. The system allows for both wet and dry processing with few or no separate liquid chemical supply lines.