Abstract: The present invention relates to a solution treatment unit for supplying a treatment solution to a substrate to treat the substrate within a treatment container, and an inner container surrounding an outer periphery of the horizontally held substrate with its upper and lower faces open is provided in the treatment container. An exhaust pipe for exhausting an atmosphere in the treatment container is provided in a bottom portion of the treatment container and inside the inner container. An exhaust port of the exhaust pipe is open at a position higher than the bottom portion. A drain port for draining the treatment solution in the treatment container is provided in the bottom portion. According to the present invention, the drain of a solution and the exhaust of an atmosphere can be performed separately without being mixed, and hence pressure loss of a fan on the factory side which performs an exhaust operation can be reduced, resulting in a reduction in excess power consumption.

Abstract: A system for equalizing pressure in a washing chamber in response to changes in pressure inside washing chamber. Gate elements are operable between open and closed positions to regulate pressure conditions inside the washing chamber.

Abstract: The present invention relates to a dishwasher, and more particularly to a dishwasher having multiple wash zones. The dishwasher has an interior tub configured to provide an interior wash chamber for washing dishes. It also has a spray arm assembly configured to rotate within the tub and to spray a first flow of wash liquid over a portion of the interior tub thereby providing a first wash zone. A spray manifold fixed adjacent a lower dish rack, the manifold configured to provide a second flow of wash liquid toward the lower dish rack thereby providing a second wash zone.

Abstract: An apparatus and method for the improved combined edge bead removal and backside wash of spin coated semiconductor wafers is disclosed. This is preferably accomplished by providing a nozzle having a plurality of outlets adapted for the ejection of a cleaning fluid onto the backside of a semiconductor wafer. This cleaning fluid can be EEP or a similar EBR type of solvent. This dual outlet nozzle can be mounted to a stationary EBR arm, and preferably comprises two outlets located on a beveled top surface that are separated at a predetermined angle. The angle of this beveled top surface with respect to a horizontal plane of the processed wafer is preferably about 45 degrees, while the angle of each nozzle outlet with respect to a primary axis of the stationary EBR arm is also preferably about 45 degrees. Other angles are also possible in order to maximize solvent jet efficiency.

Abstract: A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.

Abstract: An efficient residential dishwasher is disclosed. The residential dishwasher comprises a washing chamber, a rack within the washing chamber for holding dishes, a water tank for holding hot water to be used to clean dishes located on the rack, and at least one spray head within the washing chamber for cleaning dishes on the rack. After hot water has been delivered from the water tank to the washing chamber, the spray head sprays hot water to the dishes on the rack for the purpose of cleaning. The water tank will be filled with water from a fresh water line in response to a cooking apparatus being turned on.

Abstract: A cleaning system that includes a cleaning device, a pipeline having a first end, a valve connected between the cleaning device and a second end of the pipeline to enable water flow from the pipeline to the cleaning device when the valve is held at an open position, a limit switch connected to the valve for providing a signal in response to a position of the valve, a controller electrically coupled to the limit switch to receive the signal, and a monitor electrically connected to the controller and operating in response to the signal.

Abstract: Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. An ozone gas feed system 40 for feeding ozone gas 2 into a processing vessel 10 holding wafers W, and a steam feed means 30 for feeding steam 1 into the processing vessel 10 are provided. An on-off valve 49 inserted in the ozone gas feed pipe 42, an on-off valve 36 inserted in the steam feed pipe 34 and a switch 48 and an on-off valve 49 of ozone gas generator 41 are connected to CPU 100 which is control means and are controlled by the CPU 100. Ozone gas 2 is fed into the processing vessel 10 to pressurize the atmosphere surrounding the wafers W, and then steam 1 is fed into the processing vessel 10 while ozone gas 2 is fed into the processing vessel 10, whereby a resist of the wafers W can be removed with the steam 1 and the ozone 2 while metal corrosion, etc. can be prevented.

Abstract: The inventive device for cleaning substrates, especially semiconductor wafers, comprises a treatment basin for receiving at least one substrate, a cover for sealing said treatment basin, a first feeding device for controllably feeding in a reactive gas, a second feeding device for controllably feeding in at least one moist fluid for promoting a reaction between the reactive gas and a deposit to be removed from the substrate and a control device for controlling the concentration of moisture in the treatment basin.

Abstract: A work washing apparatus including a transfer unit for controlling forward and rearward movements of a work, a table moved by the transfer unit, carrying out the washing of the work from upper and lower surfaces thereof and provided with water/air pipes, an upper surface washing unit provided on an upper surface of the transfer unit and having upper surface washing nozzles which make planetary movements by utilizing rational movements of the nozzles on their own axes and an orbital movement of the washing unit, side surface washing units provided on both side surfaces of the transfer unit and having side surface nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the upper surface washing unit, a lower washing unit provided on a lower surface of the transfer unit and having lower surface washing nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the

Abstract: A cleaning apparatus cleaning a chuck is provided with a cleaning tank, an injection nozzle, a discharge nozzle, a liquid supply mechanism and a gas supply mechanism. The liquid supply mechanism has a supply tank, a heater and a liquid distribution mechanism so that the heater heats pure water supplied from the supply tank under the room temperature for forming warm water, reduced in electrical resistance, heated to a temperature higher than the room temperature. The liquid supply mechanism supplies the formed warm water to the cleaning tank through the liquid distribution mechanism. A vertical moving mechanism moves down a transport arm thereby dipping the chuck in the warm water and cleaning the chuck. Thus, the throughput of the cleaning apparatus cleaning the chuck is improved, the quantity of consumed gas is reduced and cleaning performance is improved.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: Methods of and apparatus for washing an array of sites in high-density microplates or similar assay plates wherein the microplates or assay plates are washed in an inverted or nearly inverted position, rather than in an upright position. Preferably, the wash liquid is dispensed upwardly in the form of a sheet from a nozzle mounted on a spray bar as the spray bar moves relative to the microplate or assay plate. After washing, the microplate or assay plate is dried with a stream of gas such as air, also preferably blown upwardly in the form of a sheet.

Abstract: In a procedure for cleaning floors by hand with the help of flat cleaning mops, mops provided with a certain quantity of cleaning solution are used. In this case, at least one mop is removed from a storage container (1), and saturated with solution before or during removal; the solution is applied onto the surface of the mop; the mops are stored as is after use in a holding container (2) up to their disposal for purposes of regeneration. A device for fitting and preparing a larger number of flat cleaning mops consists of a storage container, which has a removal opening (5) for removing mops, and is provided inside with a feeding device (11) for prior saturating the removed mops with cleaning solution.

Abstract: The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. In a specific embodiment, the process is performed for removing a silicon oxide film formed on a silicon wafer. The process includes three subsequently performed steps, in which (1) diluted hydrofluoric acid (DHF), (2) DHF and de-ionized water (DIW), (3) DIW are supplied, respectively, onto a rotating wafer. Transition from step (1) to step (2) is done immediately before the hydrophilic silicon oxide film is dissolved to expose the underlying hydrophobic silicon layer.

Abstract: A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

Abstract: There is provided a system in which transportation, assembly and maintenance can be easily carried out. The system comprises: a case carrying unit for carrying in/out a case accommodating therein the substrate; a liquid-processing unit and the processing liquid being supplied to process the substrate with the processing liquid; a substrate conveying unit for conveying the substrate between the case carrying unit and the liquid-processing unit; a processing liquid storing unit for storing, feeding and recovering the processing liquid which is supplied to the liquid-processing unit; and a plurality of frames each supporting one or more of the case carrying unit, the liquid-processing unit, the substrate conveying unit and the processing liquid storing unit, wherein the at least two of the plurality of frames are capable of being connected to and separated from each other.

Abstract: An apparatus and a method for drying washed objects being capable of drying the objects in a reduced period of time, effectively preventing contamination of the objects, and preventing energy loss are provided. The apparatus for drying washed objects includes a drying tank having an opening on the upper portion thereof so that the washed objects can be placed or taken out from above, and a rinsing tank formed integrally with the drying tank, and is capable of being sealed hermetically by closing the openable and closable lid. The drying tank includes a mist-straightening vane for supplying organic solvent mist at normal temperatures to the washed objects, so that the washed objects are dried by organic solvent mist emitted from the mist-straightening vane.

Abstract: The present invention provides a processing liquid tank and a processing system which take smaller spaces for the tank and the heat exchanger and can be realized at low costs. The processing liquid tank 100 for storing a prescribed processing liquid comprises an inner cylinder 130 in the processing liquid tank 100. The processing liquid is stored outer of the inner cylinder 130. The pipes 160a, 160b, 160c for passing a heat medium are disposed in the processing liquid. The flow of the heat medium passing through the pipes 160a, 160b, 160c is opposite to the flow of the heat medium. The processing device comprises a processing liquid tank 100, a processing unit for processing objects-to-be-processed and a processing liquid supply line for supplying a processing liquid from the process liquid tank to the processing unit.

Abstract: An automatic vehicle washing system is described. The vehicle washing system incorporates an elongated overhead cleaning platform for cleaning the front, top and rear surfaces of a vehicle. The overhead cleaning platform is attached to a single lift mechanism at a first end and is suspended from a belt at a second end, wherein the belt is also operatively connected to the first end. Accordingly, vertical movement of the lift actuator causes both ends of the platform to uniformly rise or descend. The platform further comprises a pivotal boom with fluid nozzles attached thereto, and a reciprocating pivotal actuator. The reciprocating pivotal actuator is capable of pivotal movement to any number of angular orientations within its operative range of motion. Advantageously, the pivotal and vertical positions of the nozzles can be independently varied, permitting the location of the overhead cleaning nozzles to be optimized for various vehicle profiles.

Abstract: An apparatus for drying a generally flat substrate that has been cleaned has a rotatable support for supporting the substrate, a substrate drying assembly, and a controller. The substrate drying assembly includes a substrate drying assembly support arm, an outlet for applying liquid to an upper surface of the substrate, and an outlet for applying a drying vapor to the upper surface of the substrate. The substrate drying assembly is configured to position the liquid applying outlet and to position the vapor applying outlet above a portion of the substrate. The controller causes the substrate drying assembly to be retracted over the upper surface of the substrate at a faster rate near a center of the substrate than near a periphery of the substrate.

Abstract: A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

Abstract: An apparatus continuously supplies an acid solution to a central portion of a surface of a substrate while the substrate is rotating, and also supplies an oxidizing agent solution continuously or intermittently to a periphery of the substrate. In addition, the apparatus supplies an oxidizing agent solution and an acid solution either simultaneously or alternately to a reverse side of the substrate.

Abstract: Disclosed is a dishwasher having an improved inlet valve assembly. The present invention includes a housing, a tub in the housing to hold tableware, an injector assembly for injecting water on the tableware in the tub, and an inlet valve assembly. And, the inlet valve assembly includes a case installed at an inlet passage for supplying the water to the tub, the case having an inlet opening via which the water flows in and an outlet opening via which the water is discharged, a first valve provided to the case to selectively open/close a passage in the case, and a second valve closing the passage in the case in case that the water leaks.

Abstract: Disclosed is a dishwasher having an improved water softener. The present invention includes a housing, a tub in the housing to hold tableware, an injector assembly for injecting water on the tableware in the tub, and a water softener softening the water supplied to the injector assembly, the water softener including a first container holding an ion-exchange resin for removing heavy metal and metal ions from the water, a second container holding a predetermined amount of salt and salt water to supply the salt water to the first container to recycle the ion-exchange resin that is saturated, a float installed in the second container, and a sensor provided to the second container to sense a concentration of the salt water according to a distance from the float.

Abstract: A cleaning apparatus for a lens defining opposed top and bottom surfaces and a peripheral edge. The cleaning apparatus comprises a rotatable base having a plurality of arms pivotally connected thereto and rotatable therewith. The arms are configured to releasably engage the peripheral edge of the lens. The cleaning apparatus further comprises a means for propelling a heated medium towards at least one of the top and bottom surfaces of the lens while the lens is being spun by the rotation of the base and the arms.

Abstract: A combination fluid and air washing apparatus for washing a vehicle's viewing surface. The apparatus includes a housing, where the housing is of a predetermined shape and size, a nozzle assembly, the nozzle assembly includes at least one fluid nozzle, an air nozzle to complement each of the fluid nozzles, and a shaft, the shaft being pivotally attached to the housing by a pivot means, the fluid and air nozzles are adjacently attached to the shaft and pointed towards the vehicle viewing surface, wherein the air nozzle is pointed lower on the vehicle viewing surface than the fluid nozzle. The apparatus also includes at least one fluid reservoir attached to the housing, wherein the fluid reservoir provides fluid to the fluid nozzle through a fluid feed, and an air compressor connected to the fluid reservoir and the air nozzle by a line, wherein said air compressor provides pressured air to the washing apparatus through the line.

Abstract: The invention concerns a sanitary device comprising:

Abstract: [Object] To reduce the amounts of cleaning liquids and rinse liquid used, as well as the energy consumption.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: An apparatus and method are disclosed that can process a substrate such as a wafer while keeping high cleanliness. The apparatus comprises a center port 100, which is stationarily arranged in the center and on the surface of which at least one blow-off outlet is provided for blowing off fluid, and a rotating housing portion 200 which is capable of rotating about the center port 100. The rotating housing portion 200 comprises a top plate 210 comprising a main surface S2 that opposes a wafer W, and a lower housing being connected to the top plate 210 and rotatably driven by a rotation-driving member. When the surface S1 comprising blow-off outlets 151a and 153a of the center port 100 is offset from the main surface S2 of the top plate 210 and fluid is blown off from the blow-off outlet 151a, the substrate W is contactlessly held above the main surface S2 of the top plate 210 and the surface S1 of the center port 100.

Abstract: Dishwashing machine with a distribution valve (5) which is arranged on the delivery-side section of the washing liquor circulation pump and is provided with at least two outlets (51, 52, 53) connected via associated conduits (61, 62, 63) to rotating spray arms, as well as at least a shutter means (8). The shutter means (8) is not only adapted to be alternately displaced from a position in which it enables liquor to be delivered to at least a rotating spray arm to a position in which it enables a second rotating spray arm to be supplied with liquor, in accordance with a programmed stop time (D1) of the pump, but is also adapted to be displaced into a further position in which it enables liquor to be delivered to at least two rotating spray arms at the same time, in accordance with a second stop time (D2) of the same pump.

Abstract: A hard floor surface cleaning apparatus includes an aerator, a rotating scrub medium engaging the hard floor surface, a fluid conveyor, and a fluid recovery device. The aerator is configured to produce a foam-like aerated cleaning liquid from a cleaning liquid. The fluid conveyor is coupled to the aerator and is configured to deliver the aerated cleaning liquid onto the scrub medium. The fluid recovery device is configured to remove soiled solution from the hard floor surface.

Abstract: A cleaner cleans an implement in a controlled environment by performing a two-fold process. A preferred cleaner performs at least two treatments on the implement using one or more fluids. The fluids can include water, steam, gas, as well as detergents and sterilizing agents. A preferred cleaner includes a chamber, a boiler for generating steam, and a sprayer adapted to convey the steam from the boiler onto the implement. Another preferred cleaner includes a chamber, a fluid processor adapted to convey a fluid to the chamber, a sprayer for directing the fluid onto the implement, and a sterilizer for reducing the level of biological contaminants on the implement. The fluid processor may be an electrically driven centrifugal pump that receives a washing liquid.

Abstract: A substrate cleaning apparatus and method for a liquid crystal display panel capable of removing foreign substances attached to the lower and upper surfaces of a substrate as well as onto the side surface thereof. The apparatus includes upper and lower cleaning modules arranged in such a manner as to contact the upper and lower surfaces of the substrate. Also, a side-cleaning module is arranged at the side surfaces of the substrate.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: Apparatus for cleaning and doping a pin (2) of a tubular (3) during the making or breaking of a string on a well platform. The apparatus comprises a housing (4) having first and second opposed ends (6, 7) and arranged in used to be secured at its first end (7) to the well platform or to a moveable arm. The second end (6) has an opening therein for receiving the pin (2) to be cleaned and doped. A nozzle array (16) is mounted within the housing (4) for rotation about a longitudinal axis of the housing (4) and is coupled to a source of lubricant. A washing and drying unit (10) is also mounted within the housing (4), axially displaced from said nozzle array (16) and coupled to a source of cleaning liquid and a source of drying gas.

Abstract: An apparatus for cleaning a wafer includes a plurality of holders for contacting and securing peripheral portions of a wafer, and for rotating the wafer, a first plate disposed to face a first surface of the wafer, the first plate having a plurality of first nozzles for spraying a first cleaning solution onto the first surface of the wafer, and a second plate disposed to face a second surface of the wafer that is opposite to the first surface, the second plate having a plurality of second nozzles for spraying a second cleaning solution onto the second surface of the wafer. In operation, the first and second plates and the wafer are rotated in opposite directions. The opposite rotation causes the cleaning solutions to flow abruptly thereby increasing a frictional force between the surfaces on the wafer and the cleaning solutions to improve the efficiency of the cleaning process.

Abstract: An apparatus for cleaning a substrate includes a bearing assembly, a tubular shaft, a substrate support, a process bowl, and a dispenser. The tubular shaft has an upper end and a lower end. The lower end is rotatably mounted to the bearing assembly. The shaft provides an area through which cleaning liquid can be directed. The substrate support has a lower region connected to the tubular shaft and an upper region that supports the substrate. The process bowl surrounds and is spaced outwardly from the substrate support. The process bowl has a slot in an outer wall that receives a robot arm that positions the substrate on the substrate support and that withdraws the substrate from the substrate support. The dispenser has an outlet that directs liquid through the area, toward the upper region. The dispenser is positioned beneath the upper region.

Abstract: An apparatus for treating a wafer preferably includes a rotating chuck for rotating the wafer and a treating fluid supplying part for supplying the wafer with one or more treating fluids. The treating fluid(s) can be used to clean and/or dry the wafer. The treating fluid supplying part preferably includes a receiving portion for receiving a treating fluid, and a slit communicating with the receiving portion for applying the treating fluid to a surface of the wafer. An ultrasonic oscillating part can be installed in the receiving portion and can apply ultrasonic oscillation to the treating fluid. The treating fluid for applying the ultrasonic oscillation is preferably provided uniformly across the treated surface of the wafer. The effectiveness of the cleaning process can thereby be improved, and damage to patterns formed on the wafer can be reduced.

Abstract: Equipment of pretreatment before painting for a composite vehicle body comprises a treatment tank, an aluminum chemical conversion unit, and a rinse unit. The treatment tank is filled with a degreasing and chemical conversion solution containing a mixed solution of a polar organic solvent and water, any of sodium ion and lithium ion, phosphate ion, zinc ion, nickel ion, manganese ion, and any of nitrate ion and nitrite ion. The mixed solution has a weight ratio of the polar organic solution to the water in a range of 2.8:7.2 to 3.8:6.2. The aluminum chemical conversion unit treats the composite vehicle body with a chemical conversion solution for aluminum. The rinse unit washes the composite vehicle body with a washing solution.

Abstract: An apparatus for cleaning semiconductor wafers includes a chamber, a bubbler having a vapor generating part for generating alcohol vapor and a spray pipe for spraying the alcohol vapor into the chamber, a gas supply nozzle for spraying gas into the chamber to dry the wafers, a liquid supply nozzle for supplying cleaning liquid into the chamber and a discharge system. The spray pipe of the bubbler has a liquid retention portion that keeps condensate of the alcohol vapor from issuing into the chamber. The gas supply nozzle has a spray outlet configured to spray the same amount of the drying gas onto all of the wafers in the chamber. The liquid supply nozzle has liquid supply openings only in a side portion thereof so that liquid alcohol will not become trapped therein.

Abstract: A to-be-cleaned substrate is cleaned by use of an acid liquid agent in a cleaning cup, the remaining acid liquid agent is washed out by use of pure water, then an alkaline liquid agent is emitted to the surface of the to-be-cleaned substrate in the same cleaning cup to remove the acid liquid agent remaining on the to-be-cleaned substrate. A neutralization reaction between the acid and alkali is caused by emitting the alkaline liquid agent to the surface of the to-be-cleaned substrate so as to efficiently remove the acid liquid agent remaining on the surface of the to-be-cleaned substrate.

Abstract: Purge bars for blowing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: An automated kitchenware washing tank has a pump system with a pump and fluid conduits to couple the pump between an intake opening through one of the walls and discharge openings in the wall of the tank. At least some of the discharge openings are preferably formed in at least one angled portion of the tank wall that faces downwardly into the tank, and, more preferably, on two opposed angled portions that face downwardly into the tank. A control system may be coupled to the pump for controlling the speed with which the pump supplies cleaning fluid to the discharge openings. The control system comprises a speed selector that is adapted to allow a user to activate the speed selector to select between at least two different speeds for pumping the cleaning fluid to the discharge openings. In operation, the automated washing tank pumps cleaning fluid from within the tank through the intake outlet through the fluid conduits and out of the discharge openings into the tank to create turbulence within the tank.

Abstract: A water supply apparatus and a method thereof have a high capability of peeling-off and removing unnecessary objects such as a resist film, and parameters for setting efficient water supply conditions. The water supply apparatus and the method are designed to supply water for cleaning, peeling-off, or treating a target article. On a surface of the target article to be processed, a nozzle device is provided for spraying a mixture of water vapor and water mist. At least the following parameters are respectively set as water supply conditions to proper values so as to supply water to the target article, and these parameters include (1) a weight ratio of water vapor to water mist on the surface to be processed, (2) a temperature of the surface to be processed, and (3) a distance between a (water) blowing port of the nozzle device and the surface to be processed.

Abstract: A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.

Abstract: A self-service car wash provided with coin-operated time-controlled wash and rinse spray capability includes an integrated exit air drying apparatus controlled by the coin-operated controller.

Abstract: A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.