Abstract: A slurry tank autocleaner for cleaning an empty slurry tank. A first pipe is inserted in the interior of the slurry tank, where the first pipe has an open end located inside the slurry tank. A first nozzle is disposed on the open end of the first pipe. A cover is used to cover the slurry tank, where the cover has a plurality of second nozzles targeting the slurry tank. A second pipe is connected to the second nozzles. A controller is used to control chemical, pure water or dry gas to spurt from the first nozzle and the second nozzles through the first pipe and the second pipe. Thus, the slurry tank can be automatically cleaned.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: A substrate processing apparatus is provided with an IPA spouting nozzle in opposition to an objective surface of a substrate supported by a support part. A nozzle swinging mechanism swingably supports the IPA spouting nozzle through an arm. An IPA supply pipe and a nitrogen gas supply pipe are connected to the IPA spouting nozzle. IPA and nitrogen gas supplied from these supply pipes are mixed with each other in the IPA spouting nozzle for forming IPA droplets. The formed IPA droplets are spouted toward the objective surface of the substrate. Consequently, the objective surface of the substrate can be cleaned with IPA. Thus provided is the substrate processing apparatus cleaning the substrate hard to clean with deionized water.

Abstract: An apparatus and a method for drying washed objects being capable of drying the objects in a reduced period of time, effectively preventing contamination of the objects, and preventing energy loss are provided. The apparatus for drying washed objects includes a drying tank having an opening on the upper portion thereof so that the washed objects can be placed or taken out from above, and a rinsing tank formed integrally with the drying tank, and is capable of being sealed hermetically by closing the openable and closable lid. The drying tank includes a mist-straightening vane for supplying organic solvent mist at normal temperatures to the washed objects, so that the washed objects are dried by organic solvent mist emitted from the mist-straightening vane.

Abstract: An edge bead removal system and method is provided that employs a nozzle for applying edge bead removal solvent to an edge bead of a photoresist material layer disposed on a wafer. The nozzle includes a liquid chamber that can be connected to a supply of edge bead removal and an air supply chamber that can be connected to a supply of air. The supply of air is isolated from the liquid supply chamber during application of the edge bead removal solvent and communicates via the air supply chamber to the liquid supply chamber after application of the edge bead removal solvent thus removing any droplets of edge bead removal solvent remaining in the nozzle tip. A system is also provided that includes an absorbent material that moves from a rest position, during application of the edge bead removal solvent, to an absorbing position that removes or catches any droplets of edge bead removal solvent remaining on the nozzle tip after application of the edge bead removal solvent is completed.

Abstract: A substrate cleaning apparatus includes a chamber having a substrate support capable of supporting and rotating a substrate in the chamber. A cleaning solution injector is provided to inject a cleaning solution onto the substrate in the chamber. A portion of the cleaning solution is thrown off the rotating substrate to form a cleaning solution mist in the chamber. A cleaning gas inlet introduces a cleaning gas into the chamber and an outlet exhausts the cleaning solution mist and cleaning gas from the chamber. This reduces the formation of residues from the cleaning solution mist on the substrate.

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.

Abstract: A cleaning method is provided for cleaning a semiconductor wafer. In this method, after removing adhering substances from the wafer by using a chemical liquid of organic amine type, there is carried out a pure-water cleaning capable of prevention of electrostatic destruction and alkaline corrosion on the wafer. In detail, it is executed to make a processing chamber have an atmosphere of carbon dioxide and subsequently introduce steam into the chamber to dissolve CO2-gas into the steam. Next, spray the pure water to the wafer. Then, the steam in which CO2-gas is dissolved dissolves in the pure water, so that the pure wafer becomes weak acid, accomplishing the reduction of resistivity of the pure water. Additionally, alkaline substances is neutralized by carbonated water to prevent an alkaline corrosion on a wiring layer on the wafer's surface.

Abstract: A system for reprocessing and sterilizing a previously used endoscope having at least one lumen is disclosed. The reprocessing system includes a reaction chamber into which individual chemical components of a sterilant are transferred by pneumatic force. The system includes a central processor which controls the asynchronous reprocessing and sterilization of at least two endoscopes. A novel sterilant is also disclosed. Also disclosed is a combination of the sterilization device and the sterilant and methods of using the same.

Abstract: An apparatus for chemically treating a metal part which includes an immersion tank containing a liquid chemical treatment solution, a conveyor conveying parts over the immersion tank, immersing and removing the part and at least one spray nozzle assembly located above the immersion tank which is supported on a track extending to a side wall of the tank and permitting maintenance of the spray nozzle assembly without draining the tank.

Abstract: A method and apparatus for washing articles includes a washing compartment and a plurality of fluid outlets. A tray for retaining the articles is positionable in the washing compartment. The tray has at least one fluid directing nozzle which is alignable with the fluid outlets in the washing compartment to permit fluid to flow from the nozzles through the tray and to direct the fluid into contact with the articles.

Abstract: An automotive vehicle washing system includes a frame comprising a bridge member end opposed and support sections mounted for linear reciprocating movement on spaced apart support rails. Pivoting washing nozzle support arms are mounted on the bridge section and are interconnected by a drive motor and drive pulleys to move in opposite directions to wash the sides and opposite ends of a vehicle. Each arm includes movable arm sections supporting spaced apart nozzle assemblies which may move toward each other or away from each other to size a vehicle according to its width. Each arm includes opposed elongated beam members which also provide fluid conducting passages for conducting washing fluids to the nozzle assemblies. Certain ones of the nozzle assemblies are drivenly connected to an oscillating servomotor. The servomotor is also used to position the pivoting arm sections through a lost motion coupling and a gear drive unit.

Abstract: A method of removing a photoresist layer on a semiconductor wafer starts with placing the semiconductor wafer into a dry strip chamber. A dry stripping process is performed to remove the photoresist layer on the semiconductor wafer. The semiconductor wafer is then placed on a rotator of a wet clean chamber and horizontally rotated. A first cleaning process is performed to remove polymers and organic components on a surface of the semiconductor wafer. Then a second cleaning process is performed as well to remove polymers and particles on the surface of the semiconductor wafer. By performing a third cleaning process, a first cleaning solution employed in the first cleaning process and a second cleaning solution employed in the second cleaning process are removed from the surface of the semiconductor wafer. Finally, the semiconductor wafer is spun dry at the end of the method.

Abstract: An improved dishwashing machine is proposed which has a dish-cleaning compartment, a dish-rack rotating mechanism, a re-circulating fluid spraying system, a non re-circulating fluid spraying system, a drainage mechanism, a waste filter tank and a controlling means. The dish-cleaning compartment includes a cover and a casing, which includes a re-circulating fluid spray arm and a non re-circulating fluid spray arm. Automatic chemical dispenser, hot air dish-drying system and ultraviolet light sterilizer are included as optional features. Dish-cleaning operation starts with a flush cycle and then follows by a wash cycle and a rinse cycle. A dish-drying operation is introduced at the end of the rinse cycle, to dry as well as to sanitize dishes.

Abstract: The present invention is a method and apparatus for treating a substrate using an impingement cryogenic or steam spray jet whereas a substrate is first encased in a prophylactic device whereupon the substrate is continuously bathed in a counterflowing stream of ULPA-filtered, inert, dry, heated and ionized gas which bathes both the posterior and anterior regions of the critical substrate surface to be treated—precluding the intrusion of contaminating atmospheres onto critical surfaces. This creates an in-situ microenvironment within which the substrate surface is treated with said impinging treatment spray. The treated surface is thus isolated and protected from the ambient atmosphere and contaminants contained therein prior to, during and following application of a treatment spray without causing a direct impingement of a protective atmosphere upon a critical surface.

Abstract: A self-service car wash provided with coin-operated time-controlled wash and rinse spray capability includes an integrated manually operable, air drying spray nozzle and associated pressurized air supply controlled by the coin-operated controller.

Abstract: A pressure washer includes a chassis as well as a liquid pump, a pump-driving prime mover, plural chemical product containers and a product selecting valve, all supported by the chassis. Each of the containers is attached to a separate valve conduit extending to the valve and the valve is connected to a device conduit extending to the mixing device. A distributor is mounted for movement with respect to the valve body and has a channel for selectively connecting one of the valve conduits to the device conduit. The user may thereby use the pressure washer to dispense any one of plural solutions. A fresh water container facilitates “wash out” of the valve and device conduit before switching to another chemical product.

Abstract: A cleaning apparatus includes upper and lower nozzle assemblies supplying a cleaning liquid to edge and bottom sections of a semiconductor substrate. The upper nozzle assembly has a first nozzle supplying the cleaning liquid onto the edge section, and second and third nozzles supplying a nitrogen gas for preventing the cleaning liquid from moving into a center portion of the semiconductor substrate. The cleaning liquid supplied to the edge section flows from the edge section towards a side section of the semiconductor substrate due to the rotation of the semiconductor substrate. An ultrasonic wave generator is provided above the edge section for generating ultrasonic waves. The ultrasonic waves are applied to the cleaning liquid supplied onto the edge and bottom sections, thereby improving the cleaning efficiency. The cleaning apparatus has a guide to guide the cleaning liquid supplied to the edge section toward the side section.

Abstract: A method and an apparatus for removing a liquid, i.e a wet processing liquid, from a surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter besides the liquid also a gaseous substance can be supplied thereby creating at least locally a sharply defined liquid-vapor boundary. The gaseous substance and the liquid can be selected such that the gaseous substance is miscible with the liquid and when mixed with the liquid yields a mixture having a surface tension lower than that of the liquid. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-vapor boundary over said substrate thereby removing said liquid from said substrate.

Abstract: The present invention relates to a system and method for cleaning and/or treating a surface, preferably surfaces such as ceramic, steel, plastic, glass and/or painted surfaces such as the exterior surface of a vehicle. The system and method utilize a cleaning composition that contains at least one water-soluble or water dispersible copolymer. The method may also include a step of applying to the surface a treating composition which contains non-photoactive nanoparticles.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters in the form of mist toward the center side of a wafer W, a rinsing liquid is supplied from a rinse nozzle 35 to form a water film 51 on the wafer W. Owing to the presence of the water film 51, the surface of the wafer W is protected from adhesion of particles contained in the mist. It is possible to prevent the particles in the mist from adhering to the wafer W and also possible to prevent a bad influence on the wafer W.

Abstract: The present invention relates to a device at washing apparatus for washing objects, preferably spray guns, with a washing liquid, preferably a solvent. The washing apparatus (1, 2, 3 or 3A) has at least one wash chamber (5) in which the object (4) is located for washing and at least one first container (B1) for collecting impure washing liquid from the wash chamber (5). The washing apparatus (1, 2, 3 or 3A) further comprises a distilling device (8) for distillation of impure washing liquid and obtaining pure washing liquid. This distilling device (8) includes a third container (B3) in which impure washing liquid is vaporized. Means are provided to see to that the volume (V1) of impure washing liquid which at the most or as a maximum can be brought to flow from said first container (B1) to said third container (B3) is equal to or less than the volume (V3) for washing liquid in said third container (B3) in order to prevent said third container (B3) from located overfull (FIG. 1).

Abstract: Apparatus and method for cleaning substrates. A substrate is held and rotated by a chuck and an atmospheric pressure plasma jet places a plasma onto predetermined areas of the substrate. Subsequently liquid rinse is sprayed onto the predetermined areas. In one embodiment, a nozzle sprays a gas onto the predetermined areas to assist in drying the predetermined areas when needed.

Abstract: An eyewear cleaning apparatus for removing particles from the lenses of eyewear includes a housing having a bottom wall, and an outer wall including a first end wall, a second end wall, a first side wall and a second side wall. A compartment is positioned in the housing adjacent to the first end wall. A pump is positioned in the compartment. A container is positioned in the compartment and is fluidly coupled to the pump. A delivery pipe is fluidly coupled, to the pump and extends around the interior of the housing. A first pair of nozzles is in communication with the delivery pipe and extend toward the second end wall. A second pair of nozzles is in communication with the delivery pipe and extend toward the first end wall. A first mount is positioned in the housing and is adapted for receiving a bridge portion of eyewear.

Abstract: A method of cleaning a semipermeable membrane, the semipermeable membrane being configured for carrying a fiber web, includes the steps of providing a cleaning fluid and applying the cleaning fluid on the semipermeable membrane. Further, an air press configured for carrying the semipermeable membrane therethrough is provided, and the air press has pressurized air therein. The semipermeable membrane is conveyed through the air press and is subjected to the pressurized air within the air press. The pressurized air thereby flushes the cleaning fluid through the semipermeable membrane.

Abstract: A back-surface cleaning system first removes contaminants such as copper that adhere to the back surface of a silicon wafer by means of a first cleaning with an acidic solution and then removes compounds that would be produced on the back surface of the silicon wafer while cleaning with the acidic solution by cleaning with pure water into which ozone has been mixed, whereby the back surface of a silicon wafer having integrated circuits formed of copper on its front surface can be effectively cleaned.

Abstract: An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction.

Abstract: A substrate treating apparatus and a substrate treating method for treating a to-be-treated substrate such as a semiconductor wafer, in which chemical fluids can spread uniformly over the substrate without substantially decomposing and changing their compositions, so that production of mists or volatilization of the chemical fluids over the surface of the substrate can be restrained. A multi-nozzle structure, such as a double-nozzle structure, includes an outer tube nozzle, through which at least a chemical fluid or a combination of a chemical fluid and a gas is discharged onto a semiconductor wafer, and an inner tube nozzle, through which at least a chemical fluid or a combination of a chemical fluid and a gas can be discharged into the outer tube nozzle. The distal end of the outer tube nozzle has a top structure that extends parallel to the semiconductor wafer in a non-contact manner.

Abstract: A single wafer type wet-cleaning technique for effectively preventing chemical fluids from flowing to the back face of a wafer when the back face thereof is wet-cleaned by chemical fluids, wherein purified water is injected and supplied to the back face of the wafer while a plurality of chemical fluids is sequentially supplied vertically from above to the wafer, which is rotatably supported, so that the purified water cleans the back face of the wafer and effectively prevents the chemical fluids from flowing to the back face of the wafer.

Abstract: An inverted pressure vessel system for conducting automated industrial processes requiring elevated pressure and temperatures has a vertically movable pedestal for opening and closing the underside loading port, with pedestal drive system and locking mechanism located below the pedestal top and isolated from the chamber opening. The chamber is connectible to a pressure control and process fluid supply system, and has heat exchangers connected to an external source for temperature control. Process fluids are distributed across a central process cavity through divergent inflow and convergent outflow process fluid channels.

Abstract: A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . ,, which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

Abstract: A centrifuge for a semiconductor wafer has a centrifuge plate for holding a semiconductor wafer, has a drive for setting the centrifuge plate in rotation, and has a device for supplying a medium to a front side and a rear side of the semiconductor wafer. The centrifuge has a housing which separates a centrifuging area and the semiconductor wafer from the environment, and a device for generating a laminar gas flow in the housing. A method for centrifuging a semiconductor wafer has the semiconductor wafer being centrifuged in a laminar gas flow.

Abstract: An automatic vehicle washing system is described. The vehicle washing system incorporates an elongated overhead cleaning platform for cleaning the front, top and rear surfaces of a vehicle. The overhead cleaning platform is attached to a single lift mechanism at a first end and is suspended from a belt at a second end, wherein the belt is also operatively connected to the first end. Accordingly, vertical movement of the lift actuator causes both ends of the platform to uniformly rise or descend. The platform further comprises a pivotal boom with fluid nozzles attached thereto, and a reciprocating pivotal actuator. The reciprocating pivotal actuator is capable of pivotal movement to any number of angular orientations within its operative range of motion. Advantageously, the pivotal and vertical positions of the nozzles can be independently varied, permitting the location of the overhead cleaning nozzles to be optimized for various vehicle profiles.

Abstract: The present invention includes a method and system for cleaning, disinfecting, or sterilizing objects, such as medical or dental instruments or devices. The system of the invention includes an energy source, such as a sonicator, adapted and configured to impact the object with energy, such as ultrasonic energy; a liquid transporter adapted and configured to circulate around, through, and/or into the object a wash composition, an antimicrobial composition, a rinse composition, or a plurality of these compositions; and a dryer adapted and configured to dry the object, preferably, in the presence of a sterilant. The method of the invention includes contacting the object with a wash composition and energy, such as ultrasonic energy; treating the object with an antimicrobial composition; rinsing the object with a rinse composition; and drying the object, preferably in the presence of a sterilant.

Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. A jet of high velocity heated liquid is directed against the workpiece, to physically dislodge or remove a contaminant from the workpiece. The jet penetrates through the boundary layer at the point of impact. The boundary layer otherwise remains largely undisturbed. Preferably, the liquid includes water, and may also include a chemical. Steam may also be jetted onto the workpiece, with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. The workpiece and the jet of liquid are moved relative to each other, so that substantially all areas of the workpiece surface facing the jet are exposed at least momentarily to the jet.

Abstract: An arrangement for wet-etching a semiconductor wafer simultaneously subjects the reverse side to a water rinse. A semiconductor wafer is placed face down on top of a cylindrical tower, and an etchant such as hydrofluoric acid is sprayed up against that face through a nozzle at the base of the tower. On the upper side of the wafer another water jet flows deionized water onto the wafer to shield the upper surface from any vapors that may escape around the seal. An exhaust vent arrangement surrounding the tower pulls air containing any stray etchant vapors radially outward from the vicinity of the wafer.

Abstract: Detergent cleaning is combined with ozone disinfection in a single, preferably mobile sanitizing unit. A detergent cleaning solution, preferably under pressure, is directed onto a surface to be cleaned. Subsequently, an aqueous ozone rinse is applied to the surface following removal of soils by the detergent. Because the ozone rinse functions to sanitize the target and remove residual detergent, and works best when delivered without substantial pressure, construction and ozone generation are simplified.

Abstract: The present invention provides a method of cleaning a plurality of machine frames including the steps of positioning a plurality of directional nozzles near and oriented toward the surface of the machine frames at selected heights relative thereto and simultaneously and continuously spraying a cleaning solution from the directional nozzles onto the machine frames. The present invention further includes rinsing the machine frames by spraying water from the directional nozzles onto the machine frames, and allowing the machine frames to dry. In the preferred embodiment of the present invention, the cleaning solution and water are heated, and sprayed onto the machine frames at a varying flow rate and spray pattern to allow for a more complete application of the cleaning solution and water onto the machine frames.

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: Methods and apparatus are provided for precisely and repeatably positioning spray bar. In accordance with a first aspect, an apparatus is provided that includes (1) a spray bar having an alignment mark and one or more openings, the spray bar configured to output a fluid spray from the one or more openings; (2) a mounting device having an alignment mark, the mounting device configured to support the spray bar; and (3) a substrate support configured to support a substrate. The alignment mark of the spray bar and the alignment mark of the mounting device may be aligned so as to position a fluid spray output by the spray bar toward a substrate supported by the substrate support. Numerous other methods and apparatus also are provided.

Abstract: An engine decarbonizing system comprises a manifold with one central and four lateral bores. Pressurized air and decarbonizing fluid in separate containers are adapted to be co-mingled and fed to and through the manifold. A tube assembly has an output tube and two parallel input tubes operatively coupled. The output tube is coupled to the central bore and the two parallel input tubes are coupled to the containers for dispensing pressurized decarbonizing fluid. Four short tubes are coupled to the lateral bores and second ends have a rigid cylindrical nozzle selectively positionable within a spark plug for the delivery of a spray of pressurized decarbonizing fluid. Four switches are coupled to the manifold adjacent to the interface between a short tube and a short bore for selectively allowing or precluding the flow of decarbonizing fluid.

Abstract: A semiconductor wafer cleaning apparatus includes a gas spraying unit, having a gas injection tube and a gas guard extending therearound, for spraying cleaning gas into a water layer formed on a wafer. The gas guard forms a small chamber just above the water layer, so that the partial pressure of gas injected from the gas injection tube is increased in the small chamber, whereupon the cleaning gas readily dissolves in the water layer. As a result, a cleaning solution having a high concentration of cleaning gas is produced, whereby the cleaning efficacy of the solution is high. Subsequently, a drying gas, such as isopropyl alcohol, for drying the wafer can be ejected onto the water layer using the gas spraying unit. Thus, the semiconductor wafer cleaning apparatus has a simple structure.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A machine for cleaning containers such as flat media carriers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor in a chamber. The cleaning solution, a mixture of water and a detergent or surfactant, is prepared by drawing out surfactant directly from a surfactant bulk storage vessel by means of a metering pump. The flow rate of the water is measured by a flow meter and in combination with the metering pump, a proper amount of surfactant is injected into the water line to produce a mixture with a desired surfactant concentration for removing contaminants. The mixture is injected into the water line at a mixing control valve to ensure that the water and surfactant are thoroughly mixed before being injected into the media carrier.

Abstract: A substrate processing apparatus 8 for feeding a processing liquid and processing a substrate W with the processing liquid comprises holding member 22 for holding the substrate W, and a lower side member 42 which is moved relatively with respect to the back surface of the substrate W held by the holding member 22 between a processing position A near the substrate undersurface and a retreat position B remote from the substrate undersurface. The processing liquid is fed between a gap between the lower side member 42 moved to the processing position A and the back surface of the substrate held by the holding member 22, and the substrate undersurface is processed.

Abstract: In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.

Abstract: An apparatus for processing a semi-conductor wafer or similar workpiece has one or more liquid outlets for applying a heated process liquid to the wafer within a process chamber. Ozone gas is provided into the chamber directly, or via the processed liquid. Sonic energy is introduced to the workpiece through a layer of liquid. In an alternative design, the wafers are immersed in heated process liquid, and an ozone atmosphere is provided above the liquid. The wafers are then lifted out of the liquid, or the liquid is alternatively drained off. The ozone gas/liquid interface passes down across the surfaces of the wafers.

Abstract: The present invention is directed to a manifold which includes a foam generating zone having means for receiving a foamable solution and air therethrough to produce a foam, a streaming discharge zone wherein the streaming discharge zone includes a first plurality of aperture surfaces of a first diameter and a second plurality of aperture surfaces of a second diameter larger than said first diameter and a buffer zone operably communicably associated with the foam generating zone and streaming discharge zone with means for impeding flow of the foam therebetween.