Metallic Patents (Class 148/24)
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Publication number: 20140227550Abstract: A ternary magnetic braze alloy and method for applying the braze alloy in areas having limited access. The magnetic braze alloy is a nickel-based braze alloy from the perminvar region of the Ni, Fe, Co phase diagram. The braze alloy includes, by weight percent 8-45% Fe, 0-78% Co, 2.0-4.0% of an element selected from the group consisting of B and Si and combinations thereof, and the balance Ni. The nickel-based braze alloy is characterized by a brazing temperature in the range of 1850-2100° F. The nickel-based braze alloy is magnetic below its Curie temperature.Type: ApplicationFiled: February 12, 2013Publication date: August 14, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Yan CUI, Dechao LIN, Srikanth Chandrudu KOTTILINGAM, Brian Lee TOLLISON
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Publication number: 20140218886Abstract: An electronic device has a printed substrate having land electrodes and a chip-type electronic component having external electrodes formed on a surface of a component element body. The land electrodes and the external electrodes are bonded via a solder to form electrode bonding parts. A thermosetting resin is filed between the electrode bonding parts. The bonding material contains solder particles having a melting point T1, a thermosetting resin having a curing temperature T2 that is higher than the melting point T1, and an activating agent having an activation temperature T3 that is lower than the curing temperature T2. The viscosity of the contained components except the solder particles at the melting point T1 is 0.57 Pa·s or less, and the melting point T1 and the activation temperature T3 satisfy T1?T3<50° C.Type: ApplicationFiled: March 25, 2014Publication date: August 7, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro Nomura, Hidekiyo Takaoka
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Publication number: 20140199115Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.Type: ApplicationFiled: August 2, 2012Publication date: July 17, 2014Applicant: ALPHA METALS, INC.Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi
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Publication number: 20140182746Abstract: The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.Type: ApplicationFiled: March 6, 2014Publication date: July 3, 2014Applicant: Henkel IP & Holding GmbHInventors: Puwei Liu, Barry N. Burns, Matthew J. Holloway, Blake Olsen, Edward Ho, John Killoran
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Patent number: 8764913Abstract: Surface-coated metal nanoparticles comprising: metal nanoparticles having an average particle diameter of 1 to 100 nm, and an organic coating film provided on a surface of each of the metal nanoparticles, wherein the organic coating film comprises a fatty acid having 8 or more carbon atoms and an aliphatic amine having 8 or more carbon atoms, and a molar ratio of the aliphatic amine to the fatty acid is aliphatic amine/fatty acid from 0.001/1 to 0.2/1.Type: GrantFiled: August 17, 2011Date of Patent: July 1, 2014Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventor: Toshitaka Ishizaki
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Publication number: 20140175160Abstract: A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Rajen S. Sidhu, Mukul P. Renavikar, Ashay A. Dani, Martha A. Dudek
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Publication number: 20140174605Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.Type: ApplicationFiled: August 22, 2012Publication date: June 26, 2014Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Sho Nakagawa, Hiroki Muraoka, Kanji Kuba, Yousuke Kawamura
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Publication number: 20140158255Abstract: Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.Type: ApplicationFiled: November 5, 2013Publication date: June 12, 2014Applicant: BAKER HUGHES INCORPORATEDInventors: David Peter Gerrard, Sayantan Roy
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Publication number: 20140150929Abstract: Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.Type: ApplicationFiled: April 4, 2012Publication date: June 5, 2014Applicant: Micronic MyData ABInventor: Torbjorn Sandstrom
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Publication number: 20140153203Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.Type: ApplicationFiled: September 16, 2013Publication date: June 5, 2014Applicant: ALPHA METALS, INC.Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
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Patent number: 8740041Abstract: A brazing ring with integrated fluxing product and methods for production thereof is described. The brazing ring has a c-shaped body with a plurality of channels extending the thickness of the ring and disposed about the circumference thereof. The channels are separated by radially extending flanges with enlarged distal ends that extend into the channels. The enlarged ends at least partially enclose the channels to aid in retention of a fluxing product disposed in therein. The c-shape may enable flexure of the ring for installation on a pipe or fitting and a friction fit to maintain an installed position. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and compressing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicularly to its length to produce a plurality of the brazing rings.Type: GrantFiled: July 3, 2012Date of Patent: June 3, 2014Assignee: Flux Brazing Schweiss-Und Lotstoffe USA, LLCInventors: Jasper G. J. Visser, Jacobus C. B. Kotzé
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Publication number: 20140141273Abstract: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.Type: ApplicationFiled: March 23, 2012Publication date: May 22, 2014Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Masato Shimamura, Tsukasa Ohnishi, Mitsuhiro Kosai, Kazuyori Takagi, Tomoko Nonaka, Masayuki Suzuki, Toru Hayashida, Seiko Ishibashi, Shunsaku Yoshikawa, Yoshie Yamanaka
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Publication number: 20140137988Abstract: To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. In the flux which is mixed with solder powder to produce the solder paste, an amount of phosphoric acid ester, which is adsorbed to a surface of a soldered portion during the soldering to form a film having hydrophobic quality is contained. It is preferable that an addition amount of phosphoric acid ester is not less than 1 mass % through less than 30 mass %. Further, it is preferable that the phosphoric acid ester is any one of (2-ethylhexyl) phosphate, monoisodecyl phosphate, monobutyl phosphate, dibutyl phosphate, monolauryl phosphate, monostearyl phosphate, monooleyl phosphate, tetracosyl phosphate or bis(2-ethylhexyl) phosphate.Type: ApplicationFiled: February 28, 2012Publication date: May 22, 2014Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Daisuke Minakuchi, Tatsuya Sugiura
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Publication number: 20140130940Abstract: To provide solder paste that can be filled in minute apertures. The solder paste that is printed on a substrate through a mask member in which apertures are formed is supplied to the apertures of the mask member under decompression pressure and has a viscosity so that the solder paste is filled in the apertures under atmospheric pressure. It is preferable that the solder paste has a viscosity of 50 through 150 Pa·s and a thixotropic ratio of 0.3 through 0.5. Further, the solder paste is obtained by mixing a flux containing solvent having a boiling point such that volatilization thereof is suppressed under the decompression pressure and solder powders. It is preferable that in the flux, the solvent having the boiling point of 240° C. or more is used and the solvent is octanediol.Type: ApplicationFiled: June 8, 2012Publication date: May 15, 2014Applicant: SENJU METAL INDUSTRY CO., LTD.Inventor: Sakie Okada
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Brazing product comprising a mixture of brazing flux and filler metal, and production method thereof
Patent number: 8696829Abstract: A brazing product includes a compacted solid and rigid material formed of a brazing flux and a filler metal as a mixture, which has mechanical strength sufficient to make it extrudable under a press with a flux mass proportion from 3 to 20%. The invention also provides a method for manufacturing a brazing product by mixing particles of filler metal and brazing powder in order to form metal particles coated with the flux, and compacting filler metal particles coated with the brazing flux.Type: GrantFiled: November 16, 2009Date of Patent: April 15, 2014Assignee: FP SoudageInventors: Philippe Schmitt, Boris Bosi -
Patent number: 8692159Abstract: A self-shielding welding electrode and a method of making the same are provided. The self-shielding welding electrode contains lithium aluminate in either the flux or the electrode portion of the electrode.Type: GrantFiled: April 29, 2013Date of Patent: April 8, 2014Assignee: Lincoln Global, Inc.Inventor: James M. Keegan
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Publication number: 20140083567Abstract: The present invention relates to a soldering paste flux, and the soldering paste flux includes (A) a thermosetting prepolymer, (B) a polyfunctional epoxy monomer or oligomer having three or more functional groups in a molecule, (C) a carboxylic acid having a melting point of 80 to 170° C., and (D) a cyanate ester having two or more cyanato groups in a molecule.Type: ApplicationFiled: October 7, 2011Publication date: March 27, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Teruyoshi Hamagawa, Youichi Kukimoto, Taku Hasegawa, Hitoshi Sakurai
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Patent number: 8678269Abstract: A method for joining, assembling, at least two parts made of silicon carbide-based materials by non-reactive brazing is provided. According to the method, the parts are contacted with a non-reactive brazing composition, the assembly formed by the parts and the brazing composition is heated to a brazing temperature sufficient to melt the brazing composition totally or at least partly, and the parts and brazing composition are cooled to that, after solidification of the brazing composition, a moderately refractory joint is formed; wherein the non-reactive brazing composition is an alloy comprising, in atomic percentages, 45% to 65% silicon, 28% to 45% nickel and 5% to 15% aluminum. A brazing composition as defined above is provided. A brazing paste, suspension comprising a powder of said brazing composition and an organic binder as well as a joint and assembly obtained the foregoing method are also provided.Type: GrantFiled: March 11, 2011Date of Patent: March 25, 2014Assignee: Commissariat a l'Energie Atomique et aux Energies AlternativesInventors: Valérie Chaumat, Jean-Francois Henne, Nadia Miloud-Ali
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Publication number: 20140079472Abstract: The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.Type: ApplicationFiled: February 28, 2012Publication date: March 20, 2014Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FOEDERUNG DER ANGEWANDTEN FORSCHUNG E.V.Inventors: Hermann Oppermann, Matthias Hutter, Christian Ehrhardt
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Patent number: 8663548Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.Type: GrantFiled: December 22, 2011Date of Patent: March 4, 2014Assignee: Lockheed Martin CorporationInventor: Alfred A. Zinn
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Publication number: 20140053954Abstract: The present invention is a flux for soldering, containing a base resin and an activating agent, in which the base resin contains a thermoplastic acrylic resin obtained by polymerizing a monomer component containing a long chain alkyl(meth)acrylate, the long chain alkyl moiety of the long chain alkyl(meth)acrylate has a branched structure having 12 to 23 carbon atoms, and the acrylic resin has a weight average molecular weight of 30000 or less. A solder paste composition of the present invention improves wettability, storage stability and crack resistance in residue portions, and printability for fine portions without adhering to a squeegee when printed.Type: ApplicationFiled: July 11, 2011Publication date: February 27, 2014Applicant: HARIMA CHEMICALS, INC.Inventors: Kousuke Inoue, Tetsuyuki Shigesada, Takumi Shiomi, Masao Murata
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Publication number: 20140048587Abstract: Disclosed is a brazing alloy composition. The composition comprises, by weight, about 94% copper, about 4% zinc, and about 2% iron. Further disclosed is a brazing process utilizing the brazing alloy, a method for the brazing alloy's preparation and a work piece having members joined by the brazing alloy providing stronger bonding as demonstrated by braze joints having increased shear strength.Type: ApplicationFiled: February 7, 2013Publication date: February 20, 2014Inventors: Paul Rivest, Robert Biersteker, Joseph Sarazin
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Patent number: 8652269Abstract: Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.Type: GrantFiled: September 25, 2009Date of Patent: February 18, 2014Assignee: Nihon Superior Co., Ltd.Inventors: Tetsuro Nishimura, Mitsuhiro Kawahara, Masuml Asakawa, Toshimi Shimizu
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Publication number: 20140044479Abstract: A Sn—Sb—Ag—Cu based high-temperature lead-free solder alloy which has excellent connection reliability and which does not form a low melting point phase even when solidified by slow cooling is provided. It has an alloy composition consisting essentially of, in mass percent, Sb: 35-40%, Ag: 13-18%, Cu: 6-8%, and a remainder of Sn.Type: ApplicationFiled: August 8, 2012Publication date: February 13, 2014Inventors: Minoru Ueshima, Rei Fujimaki
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Patent number: 8624211Abstract: In one embodiment, a neutron shielding material is formed of boron-adding stainless steel of either austenite-ferrite two-phase stainless steel or ferritic stainless steel, the austenite-ferrite two-phase stainless steel containing, in mass %, B: 0.5% to 2.0%, Ni: 3.0 to 10.0%, and Cr: 21.00 to 32.00%, the ferritic stainless steel containing, in mass %, B: 0.5% to 2.0%, Ni: 4.0% or less, and Cr: 11.00 to 32.00%, and the boron-adding stainless steel being well in ductility and thermal conduction property.Type: GrantFiled: June 12, 2013Date of Patent: January 7, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Masanori Kibata, Yuuji Saito, Motoji Tsubota, Yoshitaka Doken, Makoto Sato, Shunichi Hatano, Masanori Ishiga, Go Ono
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Publication number: 20130341379Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.Type: ApplicationFiled: December 23, 2011Publication date: December 26, 2013Inventors: Rajen S. Sidhu, Martha A. Dudek, James C. Matayabas, Michelle S. Phen, Wei Tan
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Publication number: 20130327444Abstract: A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.Type: ApplicationFiled: May 30, 2013Publication date: December 12, 2013Applicant: Nihon Almit Co., Ltd.Inventors: Tadashi Sawamura, Takeo Igarashi, Yukio Maeda, Kazuhiko Kaneko
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Publication number: 20130323529Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.Type: ApplicationFiled: May 13, 2011Publication date: December 5, 2013Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama
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Publication number: 20130313309Abstract: A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal.Type: ApplicationFiled: March 28, 2013Publication date: November 28, 2013Inventors: Masayuki KITAJIMA, Takatoyo YAMAKAMI, Takashi KUBOTA, Kuniko ISHIKAWA
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Publication number: 20130299564Abstract: Pre-flux coating for the manufacturing of components by brazing, in particular manufacturing of heat exchangers of aluminium components including one or more fluxes and filler materials. The coating is composed of fluxes in the form of potassium aluminum fluoride K1-3AIF4-6, potassium trifluoro zincate, KZnF3, lithium aluminum fluoride Li3AIF6, filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K2SiF6, and solvent and binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on methacrylate homopolymer or methacrylate copolymer. The potassium aluminium fluoride, K1-3AIF4-6 is a flux including KAIF4, K2AIF5, K3AIF6 or a combination of these fluxes.Type: ApplicationFiled: August 22, 2011Publication date: November 14, 2013Inventors: Dagmar Steiner, Jan Halvor Nordlien, Jeffrey L. Insalaco
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Publication number: 20130292168Abstract: The invention relates to a starter material for a sintering compound, said starter material comprising particles which at least proportionally contain an organic metal compound and/or a precious metal oxide, the organic metal compound and/or the precious metal oxide being converted during heat treatment of the starter material into the elemental metal and/or precious metal. The invention is characterized in that the particles have a coating containing a reducing agent by means of which the organic metal compound and/or precious metal oxide is reduced to the elemental metal and/or precious metal at a temperature below the sintering temperature of the elemental metal and/or precious metal.Type: ApplicationFiled: September 23, 2011Publication date: November 7, 2013Applicant: ROBERT BOSCH GMBHInventors: Daniel Wolde-Giorgis, Andrea Feiock
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Publication number: 20130276937Abstract: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).Type: ApplicationFiled: December 16, 2011Publication date: October 24, 2013Applicant: Arakawa Chemical Industries, Ltd.Inventors: Natsuki Kubo, Eiji Iwamura
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Patent number: 8557055Abstract: The aim of the invention is to provide a fluxing agent for soldering components, which creates one or more specific surface characteristics during the soldering process itself, thus obviating the need for the surface treatment process that is conventionally carried out after the soldering process. To achieve this, nanoparticles are added to a base substance.Type: GrantFiled: April 7, 2011Date of Patent: October 15, 2013Assignee: BEHR GmbH & Co. KGInventors: Snjezana Boger, Peter Englert, Matthias Pfitzer, Sabine Sedlmeir, Ingo Trautwein
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Publication number: 20130266796Abstract: A material is for thermal bonding by metal fine particle sintering mediated by a metal sintered film, such that shorts do not occur readily between bonded sections, and bonding strength is higher than that achieved by plating or sputtering. The material is obtained by dispersing metal fine particles in an organic compound dispersion medium that melts or softens through heating at a temperature higher than 30° C., and is interposed between metal members, semiconductor members or ceramic members. The material includes 60 wt % or more of the organic compound dispersion medium containing one or more types of a polyol having a melting point or softening point of 30° C. or higher and having two or more hydroxyl groups in the molecule, and 80 wt % or more of the metal fine particles that have an average particle size of primary particles ranging from 5 to 200 nm.Type: ApplicationFiled: December 15, 2011Publication date: October 10, 2013Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Toshiaki Asada, Hidemichi Fujiwara
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Publication number: 20130199673Abstract: The invention is directed to a process to prepare metal nanoparticles or metal oxide nanoparticles by applying a cathodic potential as an alternating current (ac) voltage to a solid starting metal object which solid metal object is in contact with a liquid electrolyte comprising a stabilising cation. The invention is also directed to the use of the nanoparticles as a catalyst.Type: ApplicationFiled: July 14, 2011Publication date: August 8, 2013Applicants: STICHTING VOOR FUNDAMENTEEL ONDERZOEK DER MATERIE, UNIVERSITEIT LEIDENInventors: Alexei Yanson, Marcus Koper, Paramaconi Rodriguez, Nuria Garcia-Araez
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Publication number: 20130193194Abstract: A superior braze material, along with a method of producing the braze material and a method of sealing, joining or bonding materials through brazing is disclosed. The braze material is based on a metal oxide-noble metal mixture, typically Ag—CuO, with the addition of a small amount of metal oxide and/or metal such as TiO2, Al2O3, YSZ, Al, and Pd that will further improve wettability and joint strength. Braze filer materials, typically either in the form of paste or thin foil, may be prepared by a high-energy cryogenic ball milling process. This process allows the braze material to form at a finer size, thereby allowing more evenly dispersed braze particles in the resultant braze layer between on the surface of the ceramic substrate and metallic parts.Type: ApplicationFiled: April 19, 2010Publication date: August 1, 2013Applicant: Aegis Technology Inc.Inventors: Quan Yang, Chunhu Tan, Zhigang Lin
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Publication number: 20130186519Abstract: The object of the present invention is to provide a solder paste that enables to form a surface mounting structure for electronic components that exhibits crack resistance in a solder joint section even in 100 heat-shock cycles at ?40° C. to 150° C. as required for use in the vicinity of engines for vehicular applications. A flux including an amine halogen salt and a dicarboxylic acid is kneaded with a Sn—Ag—Bi—In alloy powder. As a result, a solder paste exhibiting long continuous printability, little occurrence of solder balls, and excellent joining ability with no cracking in 100 heat-shock cycles at ?40° C. to 150° C. is obtained.Type: ApplicationFiled: March 9, 2011Publication date: July 25, 2013Applicants: PANASONIC CORPORATION, KOKI COMPANY LIMITEDInventors: Atsushi Irisawa, Masashi Kashiwabara, Kenji Kondo, Masahito Hidaka
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Patent number: 8481986Abstract: In one embodiment, a neutron shielding material is formed of boron-adding stainless steel of either austenite-ferrite two-phase stainless steel or ferritic stainless steel, the austenite-ferrite two-phase stainless steel containing, in mass %, B: 0.5% to 2.0%, Ni: 3.0 to 10.0%, and Cr: 21.00 to 32.00%, the ferritic stainless steel containing, in mass %, B: 0.5% to 2.0%, Ni: 4.0% or less, and Cr: 11.00 to 32.00%, and the boron-adding stainless steel being well in ductility and thermal conduction property.Type: GrantFiled: January 27, 2012Date of Patent: July 9, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Masanori Kibata, Yuuji Saito, Motoji Tsubota, Yoshitaka Doken, Makoto Sato, Shunichi Hatano, Masanori Ishiga, Go Ono
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Publication number: 20130160895Abstract: A solder paste includes alloy powder, conductive adhesive, and flux. The mass ratio of the alloy powder to the conductive adhesive is in the range of about 3:1 to 5:1. The mass ratio of the alloy powder to the flux is in the range of about 8:1 to 10:1. The alloy powder includes tin. The weight percentage of the tin in the alloy powder is in the range of about 37.8%˜46.2%.Type: ApplicationFiled: May 24, 2012Publication date: June 27, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.Inventors: YAN-ZHENG LIANG, QIN XU
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Patent number: 8450649Abstract: A self-shielding welding electrode and a method of making the same are provided. The self-shielding welding electrode contains lithium aluminate in either the flux or the electrode portion of the electrode.Type: GrantFiled: November 7, 2008Date of Patent: May 28, 2013Assignee: Lincoln Global, Inc.Inventor: James M Keegan
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Patent number: 8434667Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: May 7, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Mark R. Winkle, Avin V. Dhoble, Kim S. Ho, Michael K. Gallagher, Xiang-Qian Liu, David Fleming
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Patent number: 8434666Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: May 7, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Kim S. Ho, Michael K. Gallagher, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
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Publication number: 20130105980Abstract: Disclosed is a sinterable bonding material which is a liquid or a paste containing copper nanoparticles having a particle diameter of 1,000 nm or less, in which the copper nanoparticles have one or more particle diameter peaks of a number-based grain size distribution within a class of particle diameter of 1 to 35 nm and within a class of particle diameter of more than 35 nm and 1,000 nm or less respectively, and in which the copper nanoparticles include individual particles (primary particles) and secondary particles, each of the secondary particles being a fused body of the primary particles. Thus, oxidation resistance and bondability are made compatible in a sinterable bonding material using copper nanoparticles, and ion migration is suppressed in a bonded portion of a semiconductor device, etc. manufactured by using the sinterable bonding material.Type: ApplicationFiled: October 24, 2012Publication date: May 2, 2013Applicant: HITACHI, LTD.Inventor: Hitachi, Ltd.
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Patent number: 8430293Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Avin V. Dhoble, Mark R. Winkle, Michael K. Gallagher, Kim S. Ho, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
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Patent number: 8430294Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Kim S. Ho, Mark R. Winkle, Avin V. Dhoble, Michael K. Gallagher, Xiang-Qian Liu, Asghar A. Peera, Glenn N. Robinson, Ian A. Tomlinson, David Fleming
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Patent number: 8430295Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.Type: GrantFiled: September 30, 2011Date of Patent: April 30, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Michael K. Gallagher, Kim S. Ho, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming
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Publication number: 20130098506Abstract: As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy.Type: ApplicationFiled: June 1, 2010Publication date: April 25, 2013Inventors: Yoshitaka Toyoda, Fumihiro Imai
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Patent number: 8418910Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.Type: GrantFiled: February 7, 2012Date of Patent: April 16, 2013Assignee: Fujitsu LimitedInventors: Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa, Masayuki Kitajima
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Publication number: 20130087605Abstract: A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.Type: ApplicationFiled: August 28, 2012Publication date: April 11, 2013Applicant: FUJITSU LIMITEDInventors: Takashi KUBOTA, Masayuki KITAJIMA, Takatoyo YAMAKAMI, Kuniko ISHIKAWA
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Publication number: 20130082095Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.Type: ApplicationFiled: September 30, 2011Publication date: April 4, 2013Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLCInventors: Kim S. Ho, Michael K. Gallagher, Avin V. Dhoble, Mark R. Winkle, Xiang-Qian Liu, David Fleming