Abstract: The production of a potassium fluoroaluminate having a low melting point, which can be used as a flux when soldering aluminum. The potassium fluoroaluminate is prepared in an aqueous medium from aluminum hydroxide, hydrogen fluoride and potassium hydroxide in a molar ratio of aluminum:fluorine:potassium of approximately 1:5:2. After drying at 80.degree. C. under vacuum, the resulting potassium fluoroaluminate has a differential scanning calorimetry melting point of about 548.degree. C.

Abstract: A flux which contains irreversibly dehydrated K.sub.2 AlF.sub.5, for soldering light metal materials, in particular aluminum. The flux has the advantages of forming a very uniform flux coating on the workpiece or workpieces to be soldered and exhibiting outstanding flow of the solder. An appropriate soldering process, an aqueous flux suspension and preparation processes for the flux are also disclosed.

Abstract: A method for the preparation of potassium salts of complex aluminum fluorides which can be used in particular as a flux in particular for soldering lightweight metallic materials. In the method a potassium compound is added to aqueous fluoroaluminic acid, and potassium cryolite or a substance mixture which contains potassium cryolite is added to the resulting suspension. The resulting product is then dried and can be used as a flux for soldering lightweight metallic materials, especially aluminum.

Abstract: The invention relates to an aluminothermic mixture consisting of a finely particulate base portion of iron oxides and aluminum as well as metallic additives, wherein a master alloy, namely a ferrochromium alloy consisting of (in % by weight)C: 0.1 to 20Si: 2 to 40Cr: 5 to 80and iron with impurities resulting from manufacture and, if appropriate, other alloying elements, is added in a quantity of from 5 to 50% by weight, relative to the base portion, as metallic additive.

Abstract: A mixture of a dye including one or more water soluble fluorescent dyes and a water soluble solder flux provides simple optical inspection under ultraviolet illumination with simple apparatus. The optical inspection is thus made highly sensitive to the presence of residual water soluble flux after washing and highly specific to the water soluble flux with which the dye is mixed. Thus, optical inspection can assure that all water soluble flux is removed to avoid subsequent corrosion while providing the possibility of leaving so-called "no clean" fluxes in place.

Abstract: A method of manufacturing an electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 60-99% Sn, 0-40% Pb and 0-10% Ag. The additive powder metal is selected from the metal group comprising Sn, Pb, Ni, Cu, Ag, and Bi and mixtures thereof.

Abstract: Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

Abstract: A flux cored wire for gas shielded arc welding with a mixed gas comprising argon and carbon dioxide which comprises:a seam-welded steel sheath; and a core filled in the steel sheath and comprising, all in weight percent:a slag and arc stabilizer comprising 4.0 to 6.0% TiO.sub.2, 0.2 to 0.8% SiO.sub.2, 0.4 to 0.8% ZrO.sub.2, 0.2 to 0.8% Al.sub.2 O.sub.3, 0.06 to 0.25% Na.sub.2 O+K.sub.2 O, and 0.1 to 0.4% metal fluoride;an alloying agent and metal deoxidizer comprising 0.03 to 0.06% C, 0.20 to 0.80% Si, 1.50 to 2.20% Mn, and 0.30 to 0.60% Mg; andnot less than 2% Fe;in which the difference between the percentages of iron or a combination of Na and K segregated in any two quartered cross section of the wire that are defined by equations (1) and (2) in the specification are not more than 10% and not more than 0.15%, respectively.

Abstract: The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.

Abstract: A metal-core weld wire usable for gas shielded arc welding gapless joints on low carbon and low alloy galvanized and galvanealed steels. The metal-core weld wire includes a low carbon steel sheath surrounding a core composition. In one embodiment, the low carbon steel sheath includes, by total weight of the metal-core weld wire, between approximately 0.01-0.03% C, and the core composition includes, by total weight of the metal-core weld wire, between approximately 0.05-0.20% Ti, between approximately 0.05-1.00% Nb, Fe powder, and Mn to the extent that the metal-core weld wire includes between approximately 0.1-1.0% Mn wherein the metal-core weld wire includes between approximately 0.1-1.0% Si. The core composition is, by total weight of the metal-core weld wire, between approximately 0.001-12.0%. The metal-core weld wire provides, at weld rates up to 150 cm/min, reduced arc ionization potential and spatter, and improved arc stability and shielding.

Abstract: A mixture of a dye including one or more water soluble fluorescent dyes and a water soluble solder flux provides simple optical inspection under ultraviolet illumination with simple apparatus. The optical inspection is thus made highly sensitive to the presence of residual water soluble flux after washing and highly specific to the water soluble flux with which the dye is mixed. Thus, optical inspection can assure that all water soluble flux is removed to avoid subsequent corrosion while providing the possibility of leaving so-called "no clean" fluxes in place.

Abstract: A method for the production of zinc ammonium chloride complex salts for use as galvanizing fluxes by heating waste materials captured from industrial processes containing zinc in a reducing atmosphere, leaching the resultant captured waste materials in an ammonium chloride solution resulting in a first product solution and a first undissolved materials, adding zinc metal to the first product solution resulting in a second product solution and a second undissolved materials, and adding additional ammonium chloride and/or hydrochloric acid to the second product solution resulting in the production of zinc ammonium chloride complex salts for use as galvanizing fluxes.

Abstract: An easy to apply flux for increasing the penetration of gas tungsten arc welding of stainless steel substantially independent of flux thickness and variations in composition from heat to heat of stainless steel includes a flux consisting of reagent or laboratory grade TiO or TiO.sub.2 (about 50%), Cr.sub.2 O.sub.3 (about 40%), and SiO.sub.2 (about 10%) in a liquid carrier, preferably of methyl ethyl ketone. The flux is easy to apply, increases penetration of the weld, decreases bead width, and increases weld cross sectional area.

Abstract: A composition of matter suitable for use as a protective flux in the production of magnesium metal and magnesium-containing alloys is disclosed. The composition comprises 70 to 80 percent by weight KCl, and 20 to 30 percent by weight MgCl.sub.2 and up to 0.5 percent by weight CaF.sub.2.

Abstract: A non-zinc chloride type flux applied for use in plating a substrate metal member with molten tin, containing at least one chemical compound selected from the group of stannous chloride, sodium chloride, potassium chloride and ammonium chloride and excluding zinc chloride therefrom. The flux is floated on the surface of molten tin in the plating process or used in a condition of solution before the substrate metal member is plated with molten tin.

Abstract: Brazing fluxes comprising a combination of a fluoroaluminate complex and selected metal fluorosilicates, including their method of manufacture and use, are disclosed.

Abstract: The present invention relates to a highly efficient aluminum covering flux and a process for its preparation. The said covering flux comprises potassium chloride, sodium chloride, lithium chloride, potassium fluoride and sodium hydrosulfate, wherein the composition of the mentioned covering flux is: potassium chloride, 20-65 parts by weight; sodium chloride, 20-65 parts by weight; lithium chloride, 1-20 parts by weight; potassium fluoride, 0.3-5 parts by weight, sodium hydrosulfate, 0.2-3 parts by weight. The said covering flux can effectively prevent the oxidization of aluminum in the process of smelting aluminum and can increase the yield of aluminum.

Abstract: A method of manufacturing a multiple layer circuit board with stacked vias of fine dimension and pitch. A base laminate with conductive pattern is coated with a dielectric which is photolithographically processed to create holes exposing selected regions of the underlying conductive pattern. The holes through the dielectric are plated to form via connections between the surface and the conductive pattern on the base laminate. The recess created by the via is filled with a conductive and plateable polymer which upon curing forms a conductive plug. A second dielectric layer is deposited on the board structure and in succession photolithographically processed to expose the underlying plated via and plug. The hole in the second dielectric is plated and filled with conductive polymer so as to create a second via vertically aligned with and electrically connected to the underlying first via.

Abstract: The present invention relates to a method of infusing coloration in solder to facilitate inspection of soldered portions in the production of electronic machinery, equipment and apparatus, and further, a method of forming a colored membrane on the surface of the soldered portions by employing colored solder materials. Physically and chemically stable colored powders composed of rare earth compounds or metallic fluoride compounds, having properties of specific gravity lighter than that of solder and further being indecomposable even at a temperature higher than that of the melting points of solders, are mixed into flux. After soldering by employing solder cream containing the mixture, a colored membrane or layer may be formed on the surface of soldered portions by deposition of the colored powder compounds.

Abstract: In a process for soldering on large-area plates of aluminum or aluminum alloys on to a workpiece comprising an iron-base alloy, use is made of a soldering paste comprising a flux with about 50% potassium fluoride and about 50% aluminum fluoride, a solder powder with about 80 to 90% aluminum and 20 to 10% silicon and a binder on a polymethacrylate base. In addition the respective proportions of the flux are between 40 and 60% by weight, the solder powder between 60 and 40% by weight and the binder between 0.2 and 2% by weight.

Abstract: The present invention relates to a method of infusing coloration in solder to facilitate inspection of soldered portions in the production of electronic machinery, equipment and apparatus, and further, a method of forming a colored membrane on the surface of the soldered portions by employing colored solder materials.Physically and chemically stable colored powders composed of rare earth compounds or metallic fluoride compounds, having properties of specific gravity lighter than that of solder and further being indecomposable even at a temperature higher than that of the melting points of solders, are mixed into flux. After soldering by employing solder cream containing the mixture, a colored membrane or layer may be formed on the surface of soldered portions by deposition of the colored powder compounds.

Abstract: A flux applied in soldering to a substrate metal formed thereon with a firmly oxidized layer, the flux containing at least stannous chloride, non-oxidation acid and a viscous agent and excluding zinc chloride therefrom.

Abstract: A mold flux for the continuous casting of steel (including ultra low carbon steel) comprises refractory metal oxide, at least one fluxing agent, a binder, and expandable graphite in the amount of 0.3-1.0% by weight, the expandable graphite having a size less than about 80 mesh, and the flux in the form of spherical granules 200-500 microns in diameter. The binder typically comprises between about 8-14% weight soda ash, or between about 4-7% by weight lithium carbonate, or a combination of soda ash and lithium carbonate wherein double the percentage of lithium carbonate plus the percentage of soda ash is between about 8-14%. The flux may additionally include--especially where ultra low carbon steel is being continuously cast--starch and MnO.sub.2 to reduce slag rim, improve thermal insulation, and reduce carbon pickup.

Abstract: A granular mould flux for use in the continuous casting of steel comprises refractory metal oxide, one or more fluxing agents, a binder and 0.1% to 3% by weight based on the weight of the flux of an expanding agent such as expandable perlite, expandable vermiculite or expandable graphite.

Abstract: A novel flux is provided for use in the low-temperature brazing aluminum materials of varied compositions, the flux being composed of a KCl--NaCl--BaCl.sub.2 base and 0.5-5.0 wt. % of LiF and/or 1.0-10.0 wt. % of ZnCl.sub.2 added to the base. A method of flux brazing a low-melting aluminum material is also provided, and the method is carried out by applying such a novel flux as well as a low-melting brazing agent to the aluminum material portions to be adjoined. The brazing agent is composed of an Al--Si--Zn alloy which contains 3-12% by weight of Si and 15-70% by weight of Zn.

Abstract: Penetration Enhancing Compounds for use in welding is characterized as comprising select alkali metals and alkali earth metals and halogens.

Abstract: The thermal resistance of a zinc chloride/ammonium chloride galvanizing preflux is improved by incorporating therein boric acid, other alkali metal chlorides and an aliphatic amino derivative. An improved zinc chloride/ammonium chloride galvanizing, top-flux includes a deoxidizer such as graphite or charcoal, other alkali metal chlorides and a foaming agent. Both compositions, the preflux and the top-flux, can be used to advantage in galvanizing steel with low lead or no lead zinc.

Abstract: Disclosed is a flux cored wire for low alloy steels and high alloy steels which is excellent in arc stability and moisture absorption resistance of fume/slag. In this flux-cored wire, the flux components and the flux ratio are specified within the following ranges: namely, Na compound (Na.sub.2 O equivalent amount)+K compound (K.sub.2 O equivalent amount) (flux wt %): 1.5-6.0%; soluble Na compound (Na.sub.2 O equivalent amount) (flux wt %): 1.5% or less; soluble K compound (K.sub.2 O equivalent amount) (flux wt %): 0.8% or less; SiO.sub.2 (flux wt %): 5-30%; TiO.sub.2 +ZrO.sub.2 +Al.sub.2 O.sub.3 (flux wt %): 5-40%; flux ratio (wire wt %): 10-30%. Further, the flux components satisfy the formula of {soluble Na compound (Na.sub.2 O equivalent amount)+0.1.times.soluble K compound (K.sub.2 O equivalent amount)}/{SiO.sub.2 +0.5.times.(TiO.sub.2 +ZrO.sub.2 +Al.sub.2 O.sub.3)}: 40.times.10.sup.-3 or less. In addition, one or more kinds of a Li compound (Li.sub.2 O equivalent amount) and a Cs compound (Cs.sub.

Abstract: A novel anisotropically conductive solder paste and a method of use thereof to join metallic parts in electronic manufacturing processes, in particular surface-mount electronic manufacturing processes. The solder paste is fluxless and reflowable for purposes of repair and achieves electrical anisotropy by soldering component leads to circuit board pads, while maintaining electrical insulation properties between adjacent joints.

Abstract: The surface of a fatigue-resistant eutectic or near-eutectic lead/tin solder containing at least one doping element of cadmium, indium, and antimony is treated with an aqueous solution of an acidic chloride or acidic nitrate. The surface treatment method of the present invention removes, or substantially reduces, the presence of any cadmium, indium, and/or antimony, as well as the oxides of tin and lead, leaving a surface that is substantially tin and lead. The resulting treatment renders the solder compatible with mildly reducing fluxes of low activity and improves the wettability of the solder.

Abstract: An organic vehicle for electronic paste compositions is provided. The organic vehicle contains organo-soluble hydroxyalkyl substituted polysaccharide, a solvent for the polysaccharide, two hydrogen bonding components and inorganic oxide particulates having a surface area of at least 50 m.sup.2 /g.

Abstract: The invention provides an electroslag welding flux that is especially useful for welding copper-nickel alloys. The electroslag flux contains by weight percent 50 to 95 fluoride compound, 0 to 45 oxide compound, 1 to 25 rare earth-containing material, 1 to 45 potassium-containing material and 0 to 25 metallic. Advantageously, the flux contains by weight percent 60 to 90 fluoride compound, 5 to 40 oxide compound, 2 to 20 rare earth material, 1 to 20 metallic, 2 to 35 potassium-containing material, 0 to 15 carbonate and 0 to 35 binder. Most advantageously, the flux contains by weight percent 65 to 90 fluoride compound, 5 to 35 oxide compound, 2 to 15 rare earth-containing material, 1 to 15 metallic, 3 to 35 potassium-containing material, 0 to 5 carbonate and 1 to 35 binder.

Abstract: The invention provides a welding material for welding iron containing low CTE alloys. The filler metal contains 25-55% nickel, 0-30% cobalt, 0.05-0.5% carbon, 0.25-5% niobium and balance iron with incidental impurities. The welding material also is operable with fluxes for submerged arc welding. In addition, the welding material may be configured to function as a flux coated or flux-cored electrode.

Abstract: A coating composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and aluminum powder. The bonding solution advantageously contains a relatively small but essential amount of vanadium pentoxide and, preferably, magnesium. A process for forming the bonding solution component of the coating slurry includes equilibrating an aqueous phosphate solution with a small but controlled and necessary amount of solute aluminum prior to adding aluminum powder to form the slurry. The present invention overcomes the problem of bonding solutions which require environmentally disadvantageous chromates or molybdates.

Abstract: A seal coat composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and iron oxide (Fe.sub.2 O.sub.3) powder. The bonding solution advantageously contains a relatively small but essential amount of vanadium pentoxide and, preferably, magnesium. A process for forming the bonding solution component of the coating slurry includes equilibrating an aqueous phosphate solution with a small but controlled and necessary amount of solute aluminum prior to adding iron oxide powder to form the slurry. The present invention overcomes the problem of bonding solutions which require environmentally disadvantageous chromates or molybdates to neutralize the bonding solution prior to formation of the slurry.

Abstract: A braze paste is disclosed for brazing superalloys together which includes an organic binding system, a major amount of a nickel, cobalt, gold, silver, copper or palladium based braze alloy and ground polytetrafluoroethylene. The braze paste can be used to braze superalloys together without prior nickel treatment. In the brazing step, the polytetrafluoroethylene decomposes and forms fluoride ions which in turn acts on any oxide that may form during the brazing step to remove the oxide and permit a good braze between the metal objects.

Abstract: A method is provided to braze aluminum materials to each other, the method comprising a step of producing a fluoride gas-containing atmosphere within a brazing oven. The method further comprises a step of brazing the aluminum materials, by heating said materials within said atmosphere melts. The fluoride gas-containing atmosphere is produced in the soldering oven: by introducing an inert gas and the fluoride gas through different passages; by introducing into the oven a mixture of the inert gas and the fluoride gas; or by heating a fluoride in a receptacle which is placed in the oven so as to gasify the fluoride within the oven.

Abstract: A novel fluoride flux with Li ions which is extermely insoluble to water and thus noncorrosive, and which is excellent especially for use with the brazing of articles made of aluminum alloys containing Mg. A novel method for preparing such fluoride flux by a dry process is also described.

Abstract: A brazing paste for aluminum or aluminum alloy parts. The paste consists essentially of, by weight, between about 8 and 72 percent potassium tetrafluoroaluminate having a purity of at least about 96 percent, between about 15 and 75 percent aluminum-silicon alloy, and between about 2.5 and 50 percent organic carrier having a vaporization temperature which is below the melting temperature of the aluminum-silicon alloy, and the melting temperature of the potassium tetrafluoroaluminate being below the melting temperature of the aluminum-silicon alloy. The high purity potassium tetrafluoroaluminate has a lower melting temperature so that a greater number of aluminum-silicon alloys may be used therewith and does not have corrosive substances so that the braze can be of high quality and not require additional steps of washing and drying the brazed part for overall cost savings.

Abstract: A novel method is described for joining aluminum to metal surfaces by brazing. The method comprises (a) applying as a coating to at least one of the metal surfaces to be joined a mixture of a metal (e.g. Si, Cu or Ge) and a brazing flux, the metal of the mixture being adapted to form a brazable eutectic with one or both of the surface metals, (b) heating the surfaces and the coating in juxtaposed relation to a temperature above the brazing alloy melting point to thereby dissolve oxide film on the surfaces to be joined, cause the metal of the coating to dissolve into the oxide-free aluminum surface and form therewith a brazing alloy layer and form a brazed assembly and (c) cooling the brazed assembly to form a solidified joint between the surfaces. This has the advantage of providing for the joining of metal surfaces, such as aluminum, to aluminium, cooper, brass or steel surfaces, by brazing without the prior formation of a brazing alloy cladding on the surfaces to be brazed.

Abstract: Fluxes for aluminium brazing or welding may be produced by grinding the slag by-product of aluminium boron master alloy production. The grinding is preferably to below 75 microns size but particularly preferably to below 30 microns size. The fluxes may be mixed into water to produce a stable, mobile slurry which may be spray-applied to an aluminium work-piece.

Abstract: The invention provides a brazing flux for brazing metal and a method of using the same. More particularly, the invention provides a brazing flux for use in joining pieces of aluminum or aluminum alloys. The brazing flux comprises from about 62 percent by weight to about 74 percent by weight hydrated potassium cryolite and from about 26 percent by weight to about 38 percent by weight AlF.sub.3. The hydrated potassium cryolite comprises K.sub.3 AlF.sub.6 and K.sub.2 AlF.sub.5.H.sub.2 O. Preferably, the brazing flux is substantially free of KAlF.sub.4 and unreacted KF. More particularly, the brazing flux contains no KAlF.sub.4 and no unreacted KF. The brazing flux is capable of displaying a melting temperature as low as 560.degree. C. (1040.degree. F.).

Abstract: A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.

Abstract: The composition of the present invention includes a water-soluble soldering flux requiring no thermal energy to place the water-soluble flux in an active state. The water-soluble soldering flux contains (1) from about 1 percent to about 5 percent by weight, based on the weight of the water-soluble soldering flux, of an inorganic acid which, in solution, forms anions of the acid having a low propensity for forming metal complexes; (2) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of an anionic surfactant; and (3) from about 30 percent to about 70 percent by weight, based on the total weight of the water-soluble soldering flux, of a diluent. The composition of the present invention may contain a fourth component, a viscosity modifier from about 5 percent to about 40 percent by weight, based on total weight of the water-soluble soldering flux.

Abstract: The present invention relates to solder flux and solder paste compositions which do not require cleaning after the soldering operation.

Abstract: A process for soldering a substrate surface which allows low ionic contamination without a cleaning operation which comprises (a) applying a stannous fluoride or eutectic mixture thereof to the substrate surface and (b) applying solder to the flux applied in (a). The stannous fluoride which is relatively inactive below its melting temperature can be applied to the substrate surface and the so treated substrate held for an extended period of time prior to soldering without any harmful effect on the substrate. The process is useful in electronic assembly that would include attachment of components to circuit boards, tinning of circuit boards, pretinning of component leads, connectors etc.

Abstract: A new and improved solder tinning paste composition suitable for use as an underlay for metallic solder when solder filling base metal braze joints to facilitate formation of the solder joint between the base metals. The paste composition comprises substantially pure tin powder, suspending agent, inorganic based flux and solvent. Optionally, the paste composition may comprise a deoxidizing agent, a soil removing agent and a surfactant.The solder tinning paste exhibits enhanced flowing and wetting characteristics and a lower melting point. In another aspect thereof, the present invention provides a process for formulating the foregoing solder paste composition.

Abstract: A ceramic flux for welding low-alloy steels contains calcined magnesite, synthetic slag containing two thirds of CaF.sub.2 and one third of Al.sub.2 O.sub.3, a component containing at least 95% of Al.sub.2 O.sub.3 in the alpha form, wollastonite, marble, barium fluoride, ferrotitanium, ferroboron, sodium silicate.The ratio of the total content of calcined magnesite, two thirds of synthetic slag and one half of wollastonite to the total content of the component containing at least 95% of Al.sub.2 O.sub.3 in the alpha form, one third of synthetic slag, one half of woolastonite and two thirds of sodium silicate ranging from 1.30 to 1.43 and the ratio of titanium to boron ranging from 11.2 to 30.1.

Abstract: An improved solder paste composition suitable for screen or stencil printing with a capability for low ionic contamination after soldering comprising a metal or metal alloy powder, a carrier, and stannous fluoride.

Abstract: A solder stop composition and a method of preventing a melt condition in a meltable metal alloy on a substrate, such as a circuit board, wherein the composition applied on the alloy contains a water soluble binder, a viscosity control agent, a thermal insulator filler, a water soluble moisturizer extender control agent and water. The dried composition is non-tacky and can be removed from the substrate with water. A typical composition capable of being cured to a dry state on a substrate contains water, glycerin, amorphous silica, glass microballoons filled with inert gas and ethylene glycol.