Abstract: A copper alloy with excellent punchability, comprising 0.2 to 0.35 wt % of Cr, 0.1 to 0.5 wt % of Sn, and 0.1 to 0.5 wt % of Zn, the balance being made of Cu and unavoidable impurities, wherein, in a Cu matrix, a precipitation phase A of Cr or a Cr compound of 0.1 to 10 &mgr;m in maximum diameter, is provided, at a density in number of 1×103 to 3×105/mm2, and a precipitation phase B of Cr or a Cr compound of 0.001 to 0.030 &mgr;m in maximum diameter, is provided, at a density in number that is 10 times or more of that of the precipitation phase A.

Abstract: The method is used to fabricate pure copper sputter targets. It includes first heating a copper billet to a temperature of at least 500° C. The copper billet has a purity of at least 99.99 percent. Then warm working the copper billet applies at least 40 percent strain. Cold rolling the warm worked copper billet then applies at least 40 percent strain and forms a copper plate. Finally, annealing the copper plate at a temperature above about 250° C. forms a target blank. The target blank has equiaxed grains having an average grain size of less than 40 &mgr;m. The grains of the target blank have (111), (200), (220) and (311) orientations with the amount of the grains having each of the orientations being less than 50 percent.

Abstract: A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling being performed under conditions that enable the annealed recrystallized grains to have a mean grain diameter of not greater than 20 &mgr;m, the reduction ration of the final cold rolling being beyond 90.0%, whereby excellent flex fatigue property and adequate softening property are achieved.

Abstract: A brass for forging which has an apparent Zn content of 37 to 50 wt % and contains 0.5 to 7 wt % Sn. The brass has a microstructure of at least an &agr; phase and a &ggr; phase at a temperature of 300 to 550° C. and has crystal grain sizes which are made fine. A process for preparing brass involving making the crystal grain size of brass material fine and plastic working the brass material at 300 to 550° C.

Abstract: The present invention relates to copper base alloys containing tin, phosphorous, iron, and zinc and having phosphide particles uniformly distributed through the alloy matrix, which phosphide particles include fine and coarse phosphide particles. The alloy is produced using a process which comprises casting a copper base alloy consisting essentially of tin in an amount greater than about 1.5 wt. % up to 4.0 wt. %, phosphorous from 0.01 to 0.20 wt. %, iron from 0.01 to 0.80 wt. %, zinc in an amount greater than 1.0 wt. % up to 8.0 wt. %, and the balance essentially copper; homogenizing at least once for at least one hour at from 1000° F. to 1450° F.; rolling to final gauge including at least one process anneal for at least one hour at 650° F. to 1200° F. followed by slow cooling, preferably at a rate in the range of 20° F. to 200° F. per hour; and stress relief annealing at final gauge for at least one hour at 300° F. to 600° F.

Abstract: The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the balance of Zn and inevitable impurities; having a texture uniformly fragmented to acquire excellent corrosion resistance and hot working property; having undergone a given drawing work and heat treatment to acquire excellent mechanical properties including tensile strength, proof strength and elongation; and having internal stress thoroughly removed to excel in stress-corrosion cracking resistance.

Abstract: The present invention provides a copper-based alloy characterized by: having a composition of 58.0 to 63.0% by weight of Cu, 0.5 to 4.5% by weight of Pb, 0.05 to 0.25% by weight of P, 0.5 to 3.0% by weight of Sn, 0.05 to 0.30% by weight of Ni, and the balance of Zn and inevitable impurities; having a texture uniformly fragmented to acquire excellent corrosion resistance and hot working property; having undergone a given drawing work and heat treatment to be exalted in mechanical properties including tensile strength, proof strength and elongation; and having internal stress thoroughly removed to excel in stress-corrosion cracking resistance.

Abstract: A copper alloy with excellent punchability, comprising 0.2 to 0.35 wt % of Cr, 0.1 to 0.5 wt % of Sn, and 0.1 to 0.5 wt % of Zn, the balance being made of Cu and unavoidable impurities, wherein, in a Cu matrix, a precipitation phase A of Cr or a Cr compound of 0.1 to 10 &mgr;m in maximum diameter, is provided, at a density in number of 1×103 to 3×105/mm2, and a precipitation phase B of Cr or a Cr compound of 0.001 to 0.030 &mgr;m in maximum diameter, is provided, at a density in number that is 10 times or more of that of the precipitation phase A.

Abstract: A process for producing a fcc metal consisting of copper having random orientations comprising cross rolling which is performed to achieve a total draft of at least 20% with the rolling axis being offset at 15° or more in each pass to a total offset of at least 90°, and subsequent full annealing which is accompanied by recrystallization, the fcc metal satisfying the following relationships: I(200)/I(111)≦2.3 and I(220)/I(111)≦1.0, where I(111), I(200) and I(220) are the integral intensities of the (111), (200) and (220) faces, respectively, of crystal faces as measured by X-ray diffractiometry.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A copper alloy which is adapted for use as terminals and connectors, which comprises from 0.1 wt % to less than 0.5 wt % of Ni, from larger than 1.0 wt % to less than 2.5 wt % of Sn, from larger than 1.0 wt % to 15 wt % of Zn, and further comprises from at least one element selected between from 0.0001 wt % to less than 0.05 wt % of P and from 0.0001 wt % to 0.005 wt % of Si, and the balance being Cu and inevitable impurities The alloy has an electrical conductivity of 90% or below relative to a maximum electrical conductivity of an annealed copper alloy and an area ratio of insoluble matters such as precipitates is 5% or below.

Abstract: High strength, high conductivity copper alloy wire and a cable therefrom and method for manufacturing same, wherein the copper alloy contains chromium from 0.15-1.30%, zirconium from 0.01-0.15% and the balance essentially copper. The alloy wire is heat treated, cold worked to an intermediate gage, heat treated, cold worked to final gage, and finally heat treated.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be) +(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[(0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.

Abstract: A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.

Abstract: In the present invention, in order to minimize the amount of deformation due to heat treatment, the content of Be is lowered than the conventional ones, and the decrease in strength accompanied by decreasing Be, is compensated by dissolving strengthening of Si and Al, and precipitation strengthening of intermetallic compounds NiBe and CoBe. Further, by precipitating such intermetallic compounds, workability and heat resistance are also improved simultaneously and aging treatment conditions are also made flexible. Thus, according to the present invention, a beryllium-copper alloy having excellent strength, workability and heat resistance, can be provided economically, and particularly as for aging materials, users' burden can be markedly decreased.

Abstract: High-strength, high-electroconductivity copper alloys are produced by preparing an ingot of a copper alloy containing 0.05-0.40 wt % Fe, 0.05-0.40 wt % Ni, 0.01-0.30 wt % P, and optionally a total of 0.03-0.50 wt % of either Sn or Zn or both and a total of 0.05-0.50 wt % of at least one element of Ag, B, Mn, Cr, Si, Ti or Zr, with the balance being Cu and incidental impurities, heating the ingot to 800.degree. to 950.degree. C. and hot working it by a reduction ratio of 50% or more, quenching the hot worked material from 600.degree. C. or above to 300.degree. C. or below at a cooling rate of at least 1.degree. C./sec, heat treating the quenched material at 380.degree. to 520.degree. C. for 60 to 600 minutes without performing cold working, and cold working and heat treating it at 450.degree. C. or below, to precipitate an Fe--Ni--P system intermetallic compound in the Cu matrix as uniform and fine grains not larger than 50 nanometers.

Abstract: A method for producing copper alloy materials for molds for continuous steel casting and molds as produced by the method. The molds are highly resistant to thermal fatigue and are hardly cracked. To produce the materials, cast ingots of a copper-based chromium-zirconium alloy comprising from 0.2 to 1.5% by weight of Cr and from 0.02 to 0.2% by weight of Zr are heated at between 900.degree. C. and 1000.degree. C. for 30 minutes or longer and then rolled, while hot, at a reduction ratio of 60% or more to be at 850.degree. C. or higher at which the hot rolling is finished , and immediately after the hot rolling, these are rapidly cooled to 400.degree. C. or lower at a cooling rate of 10.degree.C./sec or more, and then aged at between 400.degree. C. and 520.degree. C. for from 1 hour to 5 hours.

Abstract: A high strength steel composition comprising ferrite and martensite/banite phases, the ferrite phase having primarily vanadium and mobium carbide or carbonitride precipitates, is prepared by a first rolling above the austenite recrystallization temperature; a second rolling below the anstenite recrystallization temperature; a third rolling between the Ar.sub.3 and Ar.sub.1 transformation points, and water cooling to below about 400.degree. C.

Abstract: A wire for electric railways comprises a copper alloy which consists essentially, by weight percent, of 0.1 to 1.0% Cr, 0.01 to 0.3% Zr, and 10 ppm or less O, and if required, further contains at least one element selected from the group consisting of 0.01 to 0.1% Si and 0.001 to 0.05% Mg, with the balance being Cu and inevitable impurities. The wire is manufactured by hot working a copper alloy billet having the above composition, immediately quenching the hot worked billet to prepare an element wire, cold working the element wire at least once, and subjecting the cold worked element wire to aging treatment.

Abstract: A process for producing the beryllium-copper alloy comprises the steps of casing a beryllium-copper alloy composed essentially of 1.00 to 2.00% by weight of Be, 0.18 to 0.35% by weight of Co, and the balance being Cu, rolling the cast beryllium-copper alloy, annealing the alloy at 500.degree. to 800.degree. C. for 2 to 10 hours, then cold rolling the annealed alloy at a reduction rate of not less than 40%, annealing the cold rolled alloy again at 500.degree. to 800.degree. C. for 2 to 10 hours, thereafter cold rolling the alloy to a desired thickness, and subjecting the annealed alloy to a final solid solution treatment. The beryllium-copper alloy obtained by this producing process is also disclosed, in which an average grain size is not more than 20 .mu.m, and a natural logarithm of a coefficient of variation of the grain size is not more than 0.25.

Abstract: A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and annealing, in which process an ingot is prepared by melting and casting an alloy containing 1.0-3.0 wt % Ni, 0.02-0.15 wt % P. 0.5-2.0 wt. % Sn and, as an optional component, 0.01-2.0 wt % Zn, with the balance being Cu and incidental impurities, and with the ratio of weight percentages of Ni to P being within the range of 10-50%.

Abstract: A cooper base alloy and process having high electrical conductivity. An alloy consists of from 0.005 to 0.15% by weight Niobium, about 0.005 to 0.15% by weight Iron, 0.01 to 0.05% by weight phosphorus, and the balance copper.