Abstract: The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions each usable to both make up an original bath and to replenishment of the original bath.

Abstract: The present invention is directed to compositions for electroless plating baths and their use, and more particularly to different solutions or concentrates each usable to both make up an original bath and to replenishment of the original bath.

Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.

Abstract: A heat treatment method according to the present invention includes a preliminary-state-generating step of heat-treating an alloy that undergoes multiple-step transformation with temperature by bringing the alloy in contact with a contact-type heating element for 0.01 sec or more and 3.0 sec or less, the contact-type heating element being adjusted to a particular temperature within a preliminary-state-generating temperature region determined on the basis of a first temperature related to a particular first transformation of the alloy and a second temperature, which is higher than the first temperature, related to a particular second transformation of the alloy so as to generate a preliminary state in the alloy.

Abstract: A copper wire includes a copper wire rod including 5 to 55 mass ppm of Ti, 3 to 12 mass ppm of sulfur, and 2 to 30 mass ppm of oxygen with the balance copper and inevitable impurities, a first crystal including a [111] crystal orientation and at least one twin crystal therein, and a second crystal that includes one or more crystals adjacent to the first crystal, a [111] crystal orientation with a different rotation angle on an atomic plane from the first crystal, and at least one twin crystal therein.

Abstract: A method of producing a brass is disclosed. The alloy contains trace amounts of iron, manganese or aluminum. Phosphorous is added to a zinc, copper melt and combined with the iron, manganese and aluminum to form intermetallics. Additional phosphorous is added so the melt contains between about 0.08 to 0.15% phosphorous. A low lead brass alloy is provided. The alloy has tin in the range of 0.15% to 0.35%.

Abstract: Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5?[Cu]+1.2×[Ni]?70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of ? phases dispersed in an ?-phase matrix is 0% to 0.9%.

Abstract: The present invention provides a method for manufacturing a metal material. The method comprises a temperature increasing step of increasing the temperature of a silver material having undergone final plastic working to 700° C. or more and less than a melting point of the silver material in a vacuum or a helium gas atmosphere, a heating step of maintaining the silver material at 700° C. or more and less than the melting point, and a cooling step of cooling the silver material to room temperature in a vacuum or a helium gas atmosphere. For a part of the period of the heating step, the silver material is heated in a mixed atmosphere in which hydrogen gas is mixed with helium gas.

Abstract: A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.

Abstract: A copper base rolled alloy has a copper base alloy composition containing 0.05 percent by mass or more, and 10 percent by mass or less of at least one type of element selected from Be, Mg, Al, Si, P, Ti, Cr, Mn, Fe, Co, Ni, Zr and Sn, wherein the X-ray diffraction intensity ratio I(111)/I(200) where I(hkl) is the X-ray diffraction intensity from (hkl)plane measured with respect to a rolled surface is 2.0 or more.

Abstract: The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 ?m for improving sputter uniformity and reducing sputter target arcing.

Abstract: This invention discloses novel nanocomposite material structures which are strong, highly conductive, and fatigue-resistant. It also discloses novel fabrication techniques to obtain such structures. The new nanocomposite materials comprise a high-conductivity base metal, such as copper, incorporating high-conductivity dispersoid particles that simultaneously minimize field enhancements, maintain good thermal conductivity, and enhance mechanical strength. The use of metal nanoparticles with electrical conductivity comparable to that of the base automatically removes the regions of higher RF field and enhanced current density. Additionally, conductive nanoparticles will reduce the surface's sensitivity to arc or sputtering damage. If the surface is sputtered away to uncover the nanoparticles, their properties will not be dramatically different from the base surface.

Abstract: The present invention provides a method for producing a half Heuslar alloy including quench-solidifying a molten alloy at a cooling rate of 1×102 to 1×103° C./sec to produce a half Heuslar alloy represented by the formula: ABC (wherein A and B each is at least one member selected from transition metals such as Fe, Co, Ni, Ti, V, Cr, Zr, Hf, Nb, Mo, Ta and W, and C is at least one member selected from Group 13 or 14 element such as Al, Ga, In, Si, Ge and Sn), and a high-performance thermoelectric power generating device using the thermoelectric semiconductor alloy.

Abstract: The present invention provides a lead-free free-cutting aluminum brass alloy and its manufacturing method. The alloy comprises: 57.0˜63.0 wt % Cu, 0.3˜0.7 wt % Al, 0.1˜0.5 wt % Bi, 0.2˜0.4 wt % Sn, 0.1˜0.5 wt % Si, 0.01˜0.15 wt % P, at least two elements selected from the group of 0.01-0.15 wt % Mg, 0.0016-0.0020 wt % B, and 0.001-0.05 wt % rare earth elements and the balance being Zn and unavoidable impurities. The inventive alloy has excellent castability, weldability, cuttability and corrosion resistance. It is suitable for low pressure die casting, gravity casting, horizontal continuous casting, forging and extrusion. Its metal material cost is lower than bismuth brass. It is particularly applicable for components used in drinking water supply systems and other structural components. It is a new environmentally-friendly free-cutting aluminum brass alloy.

Abstract: An electrolytic copper foil for a lithium rechargeable (secondary) battery, wherein the 0.2% proof stress is 18 to 25 kgf/mm2 and the elongation rate is 10% or more; and a process for producing an electrolytic copper foil for a lithium rechargeable battery, wherein an electrolytic copper foil whose 0.2% proof stress is 18 to 25 kgf/mm2 and elongation rate is 10% or more is manufactured by subjecting the electrolytic copper foil to an annealing treatment at a temperature within the range of 175° C. to 300° C. The present invention provides such an electrolytic copper foil used for a lithium rechargeable battery that has good proof stress and elongation rate and will not be easily broken due to electrode breakage caused by charge and discharge of the lithium rechargeable battery; and the invention also provides a process for producing such an electrolytic copper foil.

Abstract: In a method for the coating of a surface of at least one substrate with zinc in which the at least one substrate to be coated is heat treated together with zinc as the coating agent at a temperature between 200 and 500° C., wherein, before the start of the heat treatment in the reaction space in which the substrate to be coated is heat treated, the oxygen content in the atmosphere contained in the reaction space is set to less than/equal to 5 volume percent and the heat treatment is then started in the atmosphere obtained in this manner in the reaction space and the heat treatment is carried out in the reaction space, with no gas being supplied into the reaction space during the heat treatment or with no gas containing oxygen being supplied or with gas being supplied which has been pretreated so that it has an oxygen content of a maximum of 100 ppm.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10?6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract: Method for producing platinum/copper alloys which envisages the steps of melting platinum and copper parts and/or powders in a predetermined ratio in a controlled atmosphere, keeping the fusion product at the melting temperature for a given time period and subjecting the fusion product thus obtained to heat treatment so as to produce a platinum/copper alloy which is devoid of phase separation products and can be easily worked in the manner of a gold alloy.

Abstract: Oxidation resistant and burn resistant copper metal matrix composites are described. The copper metal matrix composites include matrix alloys which contain about 2.5 to about 6 weight percent aluminum, about 3 to about 30 weight percent of nickel or zinc, or a combination of about 30 to about 50 weight percent of nickel and zinc, with the balance being copper. Additionally, minor amounts of silicon, chromium, and titanium may also be present in the matrix alloy. The copper alloy matrix is optionally reinforced with about 15 to about 70 volume percent of ceramic particulates, whiskers or fibers.

Abstract: The present invention provides a method of modifying conductivity- and strength-related properties of a Cu—Ag alloy plate produced by predetermined annealing and cold rolling, composed of 4 to 32% by atom of Ag and Cu accounting for the balance, wherein the plate rolled at any reduction ratio is heated at different temperature levels, and strength and conductivity of the plate after the annealing are measured for each annealing temperature so as to establish the conductivity-annealing temperature curve and strength-annealing temperature curve as the correlations between annealing temperature and strength and between annealing temperature and conductivity, then, an optimum annealing temperature required to provide a desired conductivity or strength is determined by extrapolating the above-described conductivity-annealing temperature curve or strength-annealing temperature curve at the desired conductivity or strength, and the plate prepared at any reduction ratio is annealed at the optimum annealing temp

Abstract: A method using of a magnetic field to affect residual stress relief or phase transformations in a metallic material is disclosed. In a first aspect of the method, residual stress relief of a material is achieved at ambient temperatures by placing the material in a magnetic field. In a second aspect of the method, retained austenite stabilization is reversed in a ferrous alloy by applying a magnetic field to the alloy at ambient temperatures.

Abstract: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

Abstract: Disclosed is a copper alloy having high electrical conductivity of at least 70% IACS and a broad solid-liquid two-phase region, capable of being easily subjected to a semi-solid forming process even at various temperatures. The copper alloy is suitable for use in a rotor of small- and medium-sized electric motors. In addition, the prevent invention provides a method of manufacturing the copper alloy for semi-solid forming, including the step of melting a copper-calcium alloy having 0.1-1.5 wt % of calcium and the balance of copper at 1100-1150° C. to form a molten copper-calcium alloy, which is then maintained at 1100-1150° C. for a predetermined time period. Then, the molten copper-calcium alloy is poured into a mold preheated to 100-150° C. and cast to a copper alloy ingot.

Abstract: A continuously cast copper ingot is made by a procedure in which turbulence is imparted to the metal/solid interface during the casting operation. The ingot is then hot worked to form a billet having a smaller average grain size and a larger diameter than possible in the past. The billet is especially useful for making electroplating anodes used in the damascene process for making copper interconnects in silicon wafers.

Abstract: A damascene copper electroplating process with low-pressure pre-processing for fabricating interconnect structures on wafers comprising the following steps: a. closing two control valves to stop circulation of a plating solution; b. conveying a wafer to be plated on a predetermined location in a hallow container; c. venting the hallow container until the pressure inside the hallow container reaching a pre-determined low pressure and then dipping the wafer into the plating solution; d. introducing external air until the pressure inside the hallow container reaching standard value; e. opening the two control valves to re-circulate the plating solution; f. repeating steps a to e for next wafer. The new process can reduce void defects and gap defects on wafers.

Abstract: A process for treating a conductor winding component of a dynamoelectric device incorporates a cryogenic cycle having a ramp down phase during which the conductor winding component is ramped down from at least about −100° F. in a dry cryogenic environment to about −300° F. over several hours, preferably greater than five (5) hours and including seven (7) hours or more, followed by a cryogenic hold phase during which the conductor winding component is held at about −300° F. over an additional several hours, preferably greater than twenty-four (24) hours and including thirty-six (36) hours or more, followed by a cryogenic ramp up phase during which the conductor winding component is ramped up to about −200° F. over another several hours, preferably greater than twelve (12) hours and including eighteen (18) hours or more.

Abstract: An anode for use in electroplating semiconductor wafers, comprising a metal plate formed from a generally continuous casting process that is essentially free of voids or cracks, the casting being thermo-mechanically worked until the anode has an average grain size of less than 100 &mgr;m.

Abstract: Sputtering targets and methods of making sputtering targets are described. The method includes the steps of: providing a sputtering metal workpiece made of a valve metal; transverse cold-rolling the sputtering metal workpiece to obtain a rolled workpiece; and cold-working the rolled workpiece to obtain a shaped workpiece. The sputtering targets exhibits a substantially consistent grain structure and/or texture on at least the sidewalls.

Abstract: A copper alloy sliding material which can bring about superior resistance to fatigue as well as good anti-seizure property without containing any Pb. The copper alloy sliding material is made to have the structure in which both of the hard copper alloy phase and the soft copper alloy phase coexist in a mixture state. On the surface of the sliding material, the soft copper alloy phase comes to have a shape more concave than that of the hard copper alloy phase when receiving a load or when being in a sliding wear relation, in which concave portions is retained lubricant with the result that the anti-seizure property is enhanced. Further, since the soft phase and the hard phase are made of the same copper alloy, the wettability thereof becomes good, and Ni and etc. contained in the hard copper alloy phase are diffused into the soft copper alloy phase, so that the hardness of the boundary portion defined between the phases come to be gradually varied.

Abstract: A method of forming extruded structures from a polycrystalline material and structures formed thereby. The method generally entails forming a structure that comprises a polycrystalline material constrained by a second material in all but one direction, with the polycrystalline material having a patterned surface that is normal to the one direction. The polycrystalline material is then selectively heated, during which the second material restricts thermal expansion of the polycrystalline material in all but the one direction normal to the surface of the polycrystalline material. As a result, stresses are induced in the polycrystalline material that cause grain growth from the surface of the polycrystalline material in the one direction. The growth of an individual grain produces an extruded structure that projects above the surface of the polycrystalline material.

Abstract: A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The film is heated in a temperature range of 70-100° C. for at least five minutes, wherein the fine-grained microstructure is converted into a stable large-grained microstructure. In another embodiment, the plated film is stored, after the step of depositing, at a temperature not greater than −20° C., wherein the fine-grained microstructure is stabilized without grain growth for the entire storage period.

Abstract: The invention includes methods of reducing grain sizes of materials, and methods of forming sputtering targets. The invention includes a method for producing a sputtering target material in which a metallic material is subjected to plastic working at a processing percentage of at least 5% and a processing rate of at least 100%/second. In particular applications the metallic material comprises one or more of aluminum, copper and titanium.

Abstract: A heat sink substrate comprises a Cu—Mo composite substrate composed of a molybdenum (Mo) green compact with which Copper (Cu) of 20-60 wt % is impregnated. It is preferable that the heat sink substrate is a rolled plate obtained by repeatedly warm rolling or cold rolling the Cu—Mo composite substrate and that the rolled plate does not include any fine void and unevenly impregnated copper, that is, copper and molybdenum are uniformly distributed therein.

Abstract: A cermet composite material is made by treating at an elevated temperature a mixture comprising a compound of iron and a compound of at least one other metal, together with an alloy or mixture of copper and a noble metal. The alloy or mixture preferably comprises particles having an interior portion containing more copper than noble metal and an exterior portion containing more noble metal than copper. The noble metal is preferably silver. The cermet composite material preferably includes alloy phase portions and a ceramic phase portion. At least part of the ceramic phase portion preferably has a spinel structure.

Abstract: Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.

Abstract: A probe card treatment method, which is applicable on a probe card comprising multiple probe needles, is described. A thermal treatment is conducted on the probe card by placing the probe card in a closed heating device, wherein the temperature of the thermal treatment is enough to restore the elasticity and the planarity of the probe needles without softening the probe card. The probe card and the probe needles thereon are then rapidly cooled by cool air such that the elasticity of the probe needles is retained and the lifetime of the probe needles is extended.

Abstract: A process for controlling grain growth in the microstructure of thin metal films (e.g., copper or gold) deposited onto a substrate. In one embodiment, the metal film is deposited onto the substrate to form a film having a fine-grained microstructure. The film is heated in a temperature range of 70-100.degree. C. for at least five minutes, wherein the fine-grained microstructure is converted into a stable large-grained microstructure. In another embodiment, the plated film is stored, after the step of depositing, at a temperature not greater than -20.degree. C., wherein the fine-grained microstructure is stabilized without grain growth for the entire storage period.

Abstract: A contact material for a vacuum valve including, a conductive constituent including at least copper, an arc-proof constituent including at least chromium and an auxiliary constituent including at least one selected from the group consisting of tungsten, molybdenum, tantalum and niobium. The contact material is manufactured by quench solidification of a composite body of the conductive constituent, the arc-proof constituent and the anxiliary constituent.

Abstract: Copper wire coated with a layer of zinc is heated to a temperature (T.sub.1) sufficient for the formation of a brass phase .beta., and the temperature is maintained until complete diffusion of the zinc. The thickness of the zinc covering can be chosen in such a way that once the zinc is completely diffused, the wire consists of a brass phase .beta. in its periphery and of copper in its central part. The wire is then heated to a temperature (T.sub.2) necessary for the formation of brass phase .alpha., and the central copper part of the wire is transformed into brass phase .alpha..

Abstract: A process for producing coherent twin, incoherent twin, low angle tilt, high angle tilt or CSL grain boundaries in materials is described. A planar material or a planar substrate coated with the polycrystalline material is heated in selected areas so as to provide a temperature gradient in the substrate. The temperature gradient is sufficiently large and maintained for a sufficient time so that preferential nucleation occurs and recrystallization in the plane of the polycrystalline material takes place such that coherent twin, incoherent twin, low angle tilt, high angle tilt or CSL boundaries between chains of grains growing along lines of equal temperature are produced.

Abstract: This invention relates to a catalytic fuel composition capable of reducing pollutants in the combustion gasses generated upon combustion of the same. A catalytic material is combined with a liquid, petroleum-based fuel, mixed and solid particles are separated out to give the catalytic fuel product. The catalytic material predominantly comprises a plagioclase feldspar belonging mainly to the albiteanorthite series, and contains small amount of mica, kaolinite and serpentine, and optionally contains magnetite. An alloy material is also disclosed, comprising a mixture of the above-described catalytic material and a metal. The alloy material exhibits unique properties relative to the metal component alone, such as increased tensile strength, improved heat resistance, improved acid resistance, improved corrosion resistance, as well as exhibiting unusual conductive properties.

Abstract: A dispersion strengthened copper alloy and a method for producing the alloy are provided. The alloy preferably comprises aluminum, titanium and hafnium as alloying elements that are internally oxidized under controlled conditions to produce a dispersion strengthened copper material having good hardness and high conductivity. A method for reducing the adverse effects of hydrogen on such materials is also provided. The dispersion strengthened material can be useful in many applications, including welding electrodes and electrical contacts.

Abstract: A process is disclosed for fabricating an extrusion die including providing hard brass stock, machining the stock to form a thick rigid machined die end dam having a sharp corner, annealing the machined die end dam, providing a die body having at least one open end and an extrusion exit slot, and securing the machined end dam to the open end of the die to form an extrusion die assembly, the sharp corner being adjacent one end of the exit slot. This die assembly is employed to form a coating on a surface of a substrate by establishing relative motion between the surface of the substrate and the extrusion die assembly and extruding a ribbon-like stream of coating composition from the die through the extrusion exit slot onto the surface of the substrate to form a coating layer.

Abstract: A wire-mesh gasket fashioned from heat-treatable materials such as beryllium copper alloy wire is knitted or braided into a tubular structure. Plural wires may be used. Various cross-sectional configurations such as circular, teardrop, double lobed, and finned with and without cores are available. Cores may be air, elastomeric, or wire mesh. The formed tubular structure is heat-treated after forming using appropriate time-temperature cycles to strengthen and/or stress relieve the material.

Abstract: Mill annealed commercial insulated copper wire 20 used to fabricate high Residual Resistivity Ratio (RRR) windings 12 is unwound from a supply spool 22 and wound onto an annealing spool 24, annealed on the annealing spool 24, and unwound from the annealing spool 24 and wound onto an actuator bobbin 18. The annealing spool 24 is selected to have the same outside diameter as the actuator bobbin 18. The temperature of a single layer of wire 32 on the annealing spool 24 is raised in an incremental fashion to an annealing temperature in a vacuum furnace. The annealing spool 24 is held at the annealing temperature for a period of time at least equal to the annealing time required for the single layer of wire 32 and not longer than the survival time of an insulative coating on the single layer of wire 32. After annealing, the annealing spool 24 is cooled naturally to room temperature partially under vacuum and partially in an inert gas atmosphere.

Abstract: Process for the preparation of a substantially homogeneous alpha phase copper-nickel-tin alloy comprising copper and 4-18% by weight of nickel and 3-13% by weight of tin, comprising atomizing a molten alloy having the before-indicated composition and collecting atomized particles on a collecting surface in such a way that solid collected material is obtained having a temperature, of at least 700.degree. C., followed by quick cooling of the collected material to a temperature below 300.degree. C.The alloy thus obtained may be hardened, preferably after shaping, by spinodal decomposition.

Abstract: A method is disclosed for manufacturing a finished product which consists at least partially of a copper nickel and tin based alloy which has undergone spinodal decomposition. A liquid bath of the Cu Ni Sn based alloy is prepared containing also titanium and possibly lead. A semi-finished product is formed by spray-deposition of this alloy onto a backing then transformed with an annealing stage followed by rapid tempering. The product obtained after transformation of the semi-finished product is subjected to a heat annealing treatment in order to carry out spinodal decomposition of the part of the said product which is constituted by Cu Ni Sn based alloy, to obtain a finished product. A semi-finished product or product is obtained by this method. Connectors and machinable products based on Cu Ni Sn and of high and homogeneous hardness are manufactured.