Abstract: EL The present invention provides a system for electrodepositing a plurality of electrolytes onto a substrate in a single deposition chamber to form an article, in which the system comprises a removable substrate; a deposition chamber containing the substrate in which the chamber has an inlet and an outlet and in which the chamber comprises at least one anode with connection to a source of electrical current; a plurality of electrolyte reservoirs for an electrolyte solution connected to the deposition chamber through the inlet; and a rinse medium reservoir connected to the deposition chamber through the inlet. Also provided is a system comprising a cradle to form an article, methods using the systems of the invention, and composite materials and devices prepared by the methods of the invention.

Abstract: A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.

Abstract: A method for depositing an electrically conductive metal onto at least one portion of the inner surface (3) of an internal cavity (2) of a waveguide (1) includes: preparing a suspension containing at least one liquid and at least one precursor of the electrically conductive metal in suspension in said at least one liquid; coating at least one portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) with the suspension, and heat-treating at least said portion of the inner surface (3) of the internal cavity (2) of the waveguide (1) coated with the suspension. A method for manufacturing a metallized waveguide can implement this deposition method.

Abstract: Exemplary methods of producing a semiconductor substrate may include characterizing a substrate pattern to identify a zonal distribution of a plurality of vias and a height and a radius of each via of the plurality of vias. The methods may include determining a fill rate for each via within the zonal distribution of the plurality of vias. The methods may include modifying a die pattern to adjust via fill rates between two zones of vias. The methods may also include producing a substrate according to the die pattern.

Abstract: A titanium foil or a titanium sheet is produced by electrodeposition from molten salt using constant current pulse, the method comprising: forming an electrodeposited titanium film on a surface of a cathode electrode made of glassy carbon, graphite, Mo, and Ni, and separating thereafter the electrodeposited titanium film from the cathode electrode by performing one or both of applying an external force to the electrodeposited titanium film and removing the cathode electrode. This enables the electrodeposited titanium film electrodeposited on the cathode electrode to be peeled from the cathode electrode simply and at low cost.

Abstract: A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.

Abstract: Embodiments of the present disclosure provide an apparatus comprising a printed circuit board (PCB) with a connector to electrically connect the PCB with another apparatus. In embodiments, the apparatus may include a PCB having a via that begins on a first surface of the PCB and ends inside the PCB. The apparatus may further include a connector to electrically connect the PCB with another apparatus or another portion of the apparatus. The connector may include a pin to provide connectivity between the PCB and the connector. The pin may be inserted into the via in response to an attachment of the connector to the PCB. The PCB may include a space that extends from an end of the via inside the PCB to a second surface of the PCB opposite the first surface, to accommodate layers for signal routing inside the PCB. Other embodiments may be described and/or claimed.

Abstract: A vinylidene fluoride resin film is produced by using a film composition containing at least a vinylidene fluoride resin and organic particles. The vinylidene fluoride resin film includes a plurality of protrusions on at least one surface thereof. Among the plurality of protrusions, the number of protrusions greater than 0.10 ?m in height from a flat surface at which the protrusions are not present is from 40 to 400, per 0.10 mm2 of the vinylidene fluoride resin film.

Abstract: An electromagnetic wave transmission board includes a composite board and a plated metal layer. The composite board has a plurality of inner walls surroundingly defining an elongated channel in an interior of the composite board. The plated metal layer is formed on at least part of the inner walls so as to jointly form an inner channel structure in the channel. The inner channel structure surroundingly defines a predetermined space filled with air, and the inner channel structure has two entrances in air communication with the predetermined space. The predetermined space of the inner channel structure is configured to receive and output an electromagnetic wave signal through the two entrances, respectively, and the electromagnetic wave transmission board is configured to transmit the electromagnetic wave signal by using the air in the predetermined space of the inner channel structure as a conductive medium.

Abstract: A method for producing a metal foil comprising depositing metal onto an oxidizable substrate to form a metal film on the substrate; oxidizing the substrate at an interface between the metal film and the substrate; and removing the metal film from the substrate to yield a metal foil. A method for forming a thin metal film comprising pre-polarizing a single-crystal Si substrate by application of a potential which is negative of a potential at which Si oxidizes, which pre-polarization occurs in the presence of metal ions to form metal growth nucleation sites on the substrate, followed by application of a potential at which both oxidation of Si and electrodeposition of the metal occur to grow the metal film and oxidize the Si to SiOx, which potential is more positive than the potential applied in the pre-polarization step.

Abstract: A passive radiofrequency device includes a core formed by the gluing of multiple parts in direct contact against one another. At least one of the parts includes a housing for glue. At least some of the parts are manufactured individually by additive manufacturing. A conductive metal jacket surrounds the core without separating the parts from one another.

Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Abstract: A printed circuit board includes a substrate having a top surface and a bottom surface. First non-ground nets and a ground net are disposed within a specific region on the top surface. A second non-ground net and a split ground net are disposed on the bottom surface. The second non-ground net is electrically connected to one of the first non-ground nets through a first via hole in the substrate. The second non-ground net is isolated from the split ground net by a gap. An outermost insulating layer on the bottom surface of the substrate covers the second non-ground net and the split ground net. A conductive layer is disposed on the outermost insulating layer corresponding to the specific region of the substrate in which the first non-ground nets and the ground net are arranged, such that the conductive layer overlaps with the first non-ground nets.

Abstract: A manufacturing method for an aluminum nonwoven fiber material includes: a block forming procedure where molten aluminum is extruded into a space through micropores (42a) and, moreover, aluminum fibers formed by extrusion are maked fall on a predetermined support surface (43), thereby forming an aluminum fiber block on the support surface (43); a short fiber removing procedure in which removing treatment on aluminum short fibers shorter than a predetermined length from the aluminum fiber block is performed; and a pressurization procedure in which the aluminum fiber block subjected to the short fiber removing procedure is pressurized to form the aluminum nonwoven fiber material.

Abstract: Exemplary embodiments provide a system and method for measuring the temperature of an object, but without requiring a direct measurement of the object to determine the point at which the object has reached a desired temperature. The exemplary embodiments provide a process where the object can be heated or cooled to a desired temperature without the requirements of temperature probes into the object. The exemplary embodiments allow the process operator to be informed when the heating process has completed, without regard to the size, shape, weight, density, or amount of materials to be prepared. The energy required to maintain the temperature of a medium is compared to the energy required to maintain the temperature once an object has been placed within the medium.

Abstract: Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

Abstract: A circuit carrier and a manufacturing method thereof are provided. The circuit carrier includes at least one flexible structure and a circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern disposed thereon. The circuit structure is disposed on the flexible structure and electrically connected to the conductive pattern. The circuit structure includes a second dielectric layer and a circuit layer. The second dielectric layer is disposed on the flexible structure and has a Young's modulus different from that of the first dielectric layer. The circuit layer is disposed on and extends into the second dielectric layer to be in contact with the conductive pattern of the flexible structure. The flexible structure is interposed in the circuit structure. A portion of the first dielectric layer and a portion of the conductive pattern of the flexible structure are extended out from an edge of the circuit structure.

Abstract: A micro multi-array heater and a micro multi-array sensor provided with the micro multi-array heater are provided. The micro multi-array heater includes a substrate and a heater electrode formed on the substrate. The heater electrode includes a first heater electrode having a first heat generation pattern and a second heater electrode having a second heat generation pattern. The first heat generation pattern and the second heat generation pattern are formed to have different heat generation amounts.

Abstract: A fan blade of a gas turbine engine is disclosed which is composed of an airfoil having a leading edge and a trailing edge, and a root with a platform and a blade fixing for engaging a fan hub. The fan blade is composed of a core substrate selected from the group consisting of composites and polymers, and an entirety of the airfoil and the root of the fan blade has a nanocrystalline metal outer layer thereon which forms an outer surface fully enveloping the fan blade. The nanocrystalline metal layer formed of a nanocrystalline metal coating has an average grain size of between 10 nm and 500 nm, and the nanocrystalline metal outer layer forms a structural element of the fan blade.

Abstract: The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

Abstract: A method of manufacturing a display apparatus includes forming a plurality of display units including bending areas on a mother substrate. Each of the plurality of display units include a bending area configured to be bent about a bending axis. A protection film is attached to a lower surface of the mother substrate. The protection film includes a protection film base and an adhesive layer. An opening or a groove is formed corresponding to the bending area of each of the plurality of display units by removing at least a portion of the protection film. The mother substrate and the protection film are cut to separate the plurality of display units from each other. The mother substrate is bent about the bending axis. The removing of the at least a portion of the protection film is performed by a laser beam.

Abstract: A printed circuit board includes a first substrate including a first insulation layer and a first circuit layer including a bonding pad, the bonding pad disposed on the first insulation layer, a second substrate disposed on the first substrate and having a cavity exposing the bonding pad to an outside, and a dam disposed between the bonding pad and an inner wall of the cavity.

Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.

Abstract: A copper foil for a current collector of a lithium secondary battery has a crystalline structure, in which a ratio of the sum of texture coefficients of a (111) surface and a (200) surface to the total sum of texture coefficients of the (111), (200) and (220) surfaces is 60 to 85%, a ratio of the texture coefficient of the (111) surface to the total sum of texture coefficients of the (111), (200) and (220) is 18 to 38%, a ratio of the texture coefficient of the (200) surface thereto is 28 to 62%, and a ratio of the texture coefficient of the (220) surface thereto is 15 to 40%. The copper foil has surface roughness (Rz-JIS) of 2 mum or less, weight deviation of 3% or less, tensile strength of 30 to 40 kgf/mm2, elongation of 3 to 20%, and thickness of 1 to 35 mum.

Abstract: A touch sensor device includes first touch electrodes and second touch electrodes disposed on a substrate, and a polymer layer including a polymer material disposed on the first and second touch electrodes and on a substantially entire area of the substrate, in which the polymer layer includes conductive and non-conductive regions.

Abstract: Embodiments described herein generally relate to a wave guide and a method of creating a wave guide. In one embodiment, a method of forming a wave guide is disclosed herein. An inverse master substrate having a plurality of projections extending therefrom is formed. A high refractive index material is formed on a top surface of the inverse master substrate. A glass layer is positioned on a top surface of the high refractive index material. The inverse master substrate is removed from the high refractive index material.

Abstract: An example method may involve forming, in a first metal layer, a first half of waveguide channels including an input waveguide channel, a plurality of wave-dividing channels, and a plurality of wave-radiating channels. The input waveguide channel may include an input port for receiving electromagnetic waves into the waveguide channels, and the first half of the plurality of wave-radiating channels may include wave-directing members configured to propagate sub-portions of waves from the first metal layer to another metal layer. The method may also involve forming, in a second metal layer, a second half of the waveguide channels. The second half of the wave-radiating channels may include pairs of output ports configured to radiate the sub-portions of waves out of the second metal layer. The method may further involve fastening the first metal layer to the second metal layer so as to substantially align the halves of the waveguide channels.

Abstract: Methods of manufacturing a structure having at least one plated region and at least one unplated region. The method includes plating a metal on a polymer structure having a first region accepting the metal and a second region unreceptive to the metal plating. The first region may include fully-cured polymer optical waveguides and the second region may include partially-cured polymer optical waveguides. The first region may include a first polymer composition and the second region may include a second polymer composition different than the first polymer composition.

Abstract: The radar system include a plurality of radiating elements arranged in a linear array configured to radiate electromagnetic energy. The radar system also includes a waveguide configured to guide electromagnetic energy between (i) each of the plurality of radiating elements and (ii) a waveguide feed. The radiating elements are coupled to a first side of the waveguide. The radar system additionally includes a waveguide feed configured to couple the electromagnetic energy between the waveguide and a component external to the waveguide. The waveguide feed is coupled to the second side of the waveguide at a position between two of the radiating elements. Further, the radar system includes a power dividing network defined by the waveguide and configured to divide the electromagnetic energy injected by the waveguide feed based on a taper profile.

Abstract: A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film.

Abstract: A carrier film of thermoplastic polyester has releasable metal adhesive properties suitable for a metal transfer in which the polyester film is metalized and the metal layer is subsequently transferred to a permanent adhesive-coated substrate. The metal layer is in direct contact with the polyester carrier film and no intermediate release layer is present. Desired metal adhesion is provided by dispersing an suitable surfactant, and optionally, a hydrocarbon wax, uniformly into the polyester film. Surfactant on the outer surface of the carrier film modifies metal adhesion to the polyester such that the metal can be removed in a metal transfer operation.

Abstract: The present disclosure includes roof shingle systems. One roof shingle system includes at least two shingles, a shingle clip, a drip edge, and a power collection unit. Each shingle has a semiconductive layer configured to deliver power, electrical current/voltage, and/or control signals to the power collection unit. The shingle clip continues a conductive path between the two shingles. The drip edge is at least partially insulated and partially conductive, and the conductive portion continues the path from the shingle semiconductive layer to the power unit where energy is collected. One method of installing a shingle system includes the steps of positioning a shingle having a transducer in the form of a semiconductive layer, and positioning a shingle clip to engage the semiconductive layer of the shingle.

Abstract: A fan rotor blade includes a blade body made from a composite material of a resin and fibers, and having a pressure surface and a suction surface. A dovetail capable of being fitted into a fitting groove in a fan disk is provided in a base end of the blade body. The blade body is provided with a sheath. The sheath is more rigid than the blade body and is fixed to the blade body in a state where the sheath covers a leading edge portion of the blade body and the vicinity thereof. The sheath extends in the longitudinal direction of the blade body from a blade root side to a tip end side of the blade body, and a base end portion of the sheath located on the blade root side of the blade body extends to the dovetail.

Abstract: Provided is a circuit assembly that enables suppression of a decrease in heat dissipation properties. A circuit assembly includes a circuit board having a conductive path, a heat dissipation member on which the circuit board is placed, and an insulating layer that is interposed between the circuit board and the heat dissipation member. A surface of the heat dissipation member that faces the circuit board is a rough surface having protrusions and recessions, and the circuit board and the heat dissipation member are fixed to each other by the insulating layer penetrating the protrusions and recessions of the rough surface.

Abstract: A three-dimensional network aluminum porous body which enables to produce an electrode continuously, an electrode using the aluminum porous body, and a method for producing the electrode is disclosed. A long sheet-shaped three-dimensional network aluminum porous body is provided to be used as a base material in a method for producing an electrode including at least winding off, a thickness adjustment step, a lead welding step, an active material filling step, a drying step, a compressing step, a cutting step and winding-up, wherein the three-dimensional network aluminum porous body has a tensile strength of 0.2 MPa or more and 5 MPa or less.

Abstract: An instrument panel as a vehicular panel includes a panel body on a surface side of which key tops are installed, a printed wiring section arranged on the surface side of the panel body, and an insulation outer layer arranged on the surface side of the panel body so as to cover the printed wiring section.

Abstract: A fan blade capable of dissipating a buildup of electrostatic charge configured for operation within the fan assembly of a gas turbine engine. The fan blade has a fan blade body covered in a static dissipative coating. A conductive ground tab is attached to the front face of an airfoil root of the fan blade. Connected to the ground tab, a conductive flow path travels up the neck portion of the airfoil and along a lower portion of the fan blade. As static charge builds up on the fan blade, the electrostatic charge migrates down the fan blade and into the conductive flow path. Traveling along the conductive flow path the buildup of electrostatic charge accumulates on the conductive ground tab and exits the fan blade through contact with a disc rotor covering touching the conductive ground tab.

Abstract: An airfoil for a gas turbine engine includes first pressure and suction side layers forming a cavity and terminating in ends near a trailing edge. The first and second suction side layers are constructed from a composite material. A bridge is wrapped about the ends.

Abstract: The present application relates to a blade of a rectifier of a low pressure compressor of an axial turbomachine. The blade can also be a rotor and/or turbine blade. The blade includes a composite material with a matrix and a reinforcement comprising a mesh with rods. The rods of the reinforcement are connected to each other and are distributed throughout the volume between the pressure side surface and the suction side surface of the blade. The mesh forms a three-dimensional structure extending over the majority of the thickness of the blade between the pressure side surface and the suction side surface and/or the majority of the length of the blade between the leading edge and the trailing edge. The present application also relates to an iterative method for manufacturing a blade composite where the reinforcement is formed by additive layer manufacturing based on titanium powder and then placed in an injection mold.

Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.

Abstract: Systems and methods in which the flow of fluid is electrically driven, including electrospinning and electrospraying systems and methods, are generally described.

Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.

Abstract: An electronic package includes a carrier, semiconductor chip, a lid, and a lid-ring. The carrier includes a top surface and a bottom surface configured to be electrically connected to a system board. The semiconductor chip is electrically connected to the top surface. The lid is attached to the top surface enclosing semiconductor chip and includes a perimeter recess. The lid-ring is juxtaposed within the perimeter recess. The lid-ring exerts a reverse bending moment upon the lid to limit warpage of the electronic package.

Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Abstract: A touch screen panel includes a substrate, touch electrodes disposed on a touch area of the substrate and configured to sense a touch, and a connection line disposed on the touch area, the connection line including a first end connected a touch electrode of the touch electrodes and a second end connected to a pad, the pad including a first conductive layer disposed on the substrate, a second conductive layer disposed on the first conductive layer, and a first protective conductive layer disposed on the second conductive layer, in which the touch electrode includes the first conductive layer, and the first protective conductive layer.

Abstract: The present application relates to a blade of low pressure rectifier axial turbomachine. The blade can also be a rotor blade and/or a turbine blade. The blade includes a composite material with a matrix and a reinforcement that includes a mesh forming a three dimensional structure with a plurality of rods that describe a three-dimensional mesh based on polyhedrons. The three-dimensional structure extends over the majority of the thickness of the blade between the pressure side surface and the suction side surface and/or the majority of the length of the blade between the leading edge and the trailing edge. The rods of the reinforcement are bonded to each other and are distributed throughout the volume between the pressure side surface and the suction side surface of the blade. The rods form a three-dimensional mesh occupying the entire blade. The present application also relates to an iterative method for manufacturing a blade by additional layer manufacturing.

Abstract: Multi-layer devices comprising a layer of an electrochromic lithium nickel oxide composition on a first substrate, the lithium nickel oxide composition comprising lithium, nickel and a Group 5 metal selected from niobium, tantalum and a combination thereof.

Abstract: A composite blade includes a composite airfoil section having airfoil pressure and suction sides extending chordwise between airfoil leading and trailing edges, a dovetail root attached to airfoil section and a blade shank therebetween, and a metallic leading edge shield covering an axially extending portion of airfoil section including at least a portion of airfoil leading edge and a radially and chordwise extending portion of a leading edge portion of the blade shank. Leading edge portion may be cut back from airfoil leading edge and a shank leading edge aft or downstream of airfoil leading edge. A nose may extend along a shield leading edge of the metallic leading edge shield with pressure and suction side legs extending aftwardly from nose along airfoil pressure and suction sides. Light weight insert may be located between nose and airfoil leading edges.

Abstract: An embedded integrated circuit package is made by providing a substrate with a patterned conductor layer defining bond pads. One or more components typically with upwardly facing contact pads are mounted on the substrate. The contact pads are wire bonded to the bond pads of the patterned conductor layer. A series of layers, each with one or more cut-outs corresponding to locations of the components forms a first solid stack containing cavities accommodating the components and associated wires. In one embodiment the layers are fiberglass layers and the layers are cured in the presence of a resin to form a solid body. In another embodiment the layers are thermoplastic layers.