Abstract: Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure. Other embodiments are described and claimed.

Abstract: In one or more embodiments disclosed herein, an electronic device may include a display device operable to project an image, a front cover substrate positioned over the display device and including a transparent material, and a protective coating disposed on at least a portion of the non-display area of the front cover substrate. The front cover substrate may include a display area over the display device and a non-display area around at least the perimeter of the front cover substrate. The protective coating may include an inorganic material. The protective coating may not be positioned over the display area.

Abstract: A method of anodizing an article of aluminum or aluminum alloy for forming a porous anodic oxide coating comprises an immersion step of immersing the article to be anodized in an electrolyte in a tank, wherein the electrolyte comprises an aqueous solution of 5-50 g/l sulphuric acid and 2-50 g/l phosphoric acid, and arranging the article as an anode with respect to one or more counter electrodes as arranged cathodes in the electrolyte, and an anodizing step of applying a positive anode voltage Va to the article, while the temperature of the electrolyte is in the range of 33-60° C.

Abstract: A laminate including a metal substrate having a chemically etched surface and a fluoroelastomer layer laminated in contact with the chemically etched surface or laminated in contact with a surface of a fluororesin layer laminated in contact with the chemically etched surface, and a gate seal including the laminate, are provided.

Abstract: Provided are a laminate including a metal substrate having a surface with an anodic oxide coating formed thereon, a fluororesin layer laminated in contact with the anodic oxide coating and a fluoroelastomer layer laminated in contact with a surface of the fluororesin layer facing away from the metal substrate, and a gate seal including the laminate.

Abstract: A heat-shielding film structure comprises a first and a second heat-shielding film. The first heat-shielding film is a heat-shielding film formed on a surface of a component that is formed from an Al alloy with an Al purity of less than 99.0% as a base material. The second heat-shielding film is a heat-shielding film formed on the surface of the first heat-shielding film. The second heat-shielding film is obtained by anodizing treatment of Al foil with an Al purity equal to or larger than 99.0%. The first heat-shielding film has a porous structure. The second heat-shielding film has a porous alumina on its surface. The first heat-shielding film and the porous alumina have a lower heat conductivity and a lower heat capacity per unit volume than the base material.

Abstract: The invention relates to a method for manufacturing a plate material which is used in the electrochemical process of metal as a part of a cathode on which surface a metal is deposited. The surface roughness of the plate material for the adhesion between the metal deposit and the plate material is achieved with at least one treatment in a coil processing line.

Abstract: An electronic module is disclosed, wherein the electronic module comprises: a first circuit board, comprising a top surface, a bottom surface, and a lateral surface connecting the top surface and the bottom surface of the first circuit board; wherein an electrode structure is disposed on the first circuit board, wherein a second circuit board is disposed under the bottom surface of the first circuit board, wherein a soldering material is disposed between the bottom surface of the electrode structure and the second circuit board and extended onto a wettable flank of the electrode structure to form a soldering structure, wherein said soldering structure comprises an outer surface that is located above the bottom surface of the first circuit board and outside the outmost portion of the lateral surface of the first circuit board.

Abstract: A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.

Abstract: A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

Abstract: The semiconductor device includes an insulating substrate including an insulating plate and a circuit plate; a semiconductor chip having a front surface formed with an electrode and a rear surface fixed to the circuit plate; a printed circuit board including a metal layer, and facing the insulating substrate; a conductive bonding material disposed on the electrode; and a conductive post having a leading end portion electrically and mechanically connected to the electrode through the bonding material, a base portion electrically and mechanically connected to the metal layer, and a central portion. In the conductive post, a wetting angle of a surface of the leading end portion with respect to the molten bonding material is less than the wetting angle of a surface of the central portion.

Abstract: A method of assembling a data storage device comprises forming an enclosure by overlapping each of a plurality of sidewalls of a cover with a corresponding sidewall of a base part, dispensing a liquid adhesive between the respective sidewalls of the cover and base part in such a quantity at each of a plurality of locations to promote capillary flow of the liquid adhesive to form a continuous film of liquid adhesive between the sidewalls, and curing the continuous film of liquid adhesive to form a hermetic seal between the cover and the base part. Embodiments may include surface treating the sidewall surface(s), which can help promote the capillary flow of the liquid adhesive. The hermetic seal provides for a lighter-than-air gas to be held therein.

Abstract: A process for fabricating a partially polymerized prepreg material. Fibers are impregnated with thermosetting resin. The resin is partially polymerized to a degree of polymerization between 10% and 60%. The thermosetting composite parts are produced by drape forming of the prepreg material. The material laid-up in the form of tapes and heated at a temperature above the glass transition temperature of the prepreg state. The laid-up material is pressed and cooled to return the laid-up material to a temperature below the glass transition temperature of the prepreg state in question.

Abstract: A method for manufacturing a light distribution member has steps of providing a plurality of first light blocking film members, each of which including a first light blocking film covering a surface of a light-transmissive board, bonding a plurality of first light blocking film members, such that each first light blocking film is sandwiched between light-transmissive boards of adjacent first light blocking film members, to form a first bonded body, and cutting the first bonded body in a direction perpendicular to a lamination surface of the first light blocking film members so as to form a plurality of slices.

Abstract: An object of the present invention is to provide a copper foil excellent in softening resistance performance which reduces decrease in tensile strength after heat treatment at about 350° C. to 400° C. In order to achieve the object, a surface-treated copper foil provided with a rust-proofing treatment layer on both surfaces of a copper foil in which a rust-proofing treatment layer is constituted by zinc alloy, and the either rust-proofing treatment layer is a zinc alloy layer having zinc amount of 20 mg/m2 to 1,000 mg/m2; and the copper foil contains one or two or more of small amount elements selected from carbon, sulfur, chlorine and nitrogen, and a sum amount thereof is 100 ppm or more is adopted.

Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

Abstract: A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less than 100 microns.

Abstract: Provided is a colored rigid decorative member in which scratch resistance is improved, and deterioration of appearance quality due to a flaw, abrasion, or the like is suppressed, and which has various color variations with a high quality feel. An alloy adhesion layer having a high adhesion effect, an alloy gradient adhesion layer of which the content of a reactant gas is increased in a gradient manner, an abrasion-resistant layer having high hardness, an alloy recolored gradient layer of which the content of a reactant gas is decreased in a gradient manner, and a colored decorative layer having high decorativeness and color variations on the outermost layer are formed on a base using a film with an alloy of a metal having the high effect of adhering to a metal and high brightness (metal having poor corrosion resistance; Mo, W), a metal having high film hardness and high corrosion resistance (metal having poor adhesion; Nb, Ta), and a metal improving corrosion resistance performance (Cr, Ti, Hf, Zr).

Abstract: A method is provided for making electrical contact with an electronic component in the form of a stack formed from a plurality of material layers, which react upon application of an electric field, and a plurality of electrode layers, wherein each material layer is arranged between two of the electrode layers. An insulation structure is generated on at least one stack circumferential region of the stack, which exposes each second electrode layer of the at least one stack circumferential region for electrical contact to be made. Also, a contact-making structure is applied to the at least one stack circumferential region which is provided with the insulation structure. Before the step of generating the contact-making structure, the material layers are partially removed by a material-removing method such that the electrode layers are exposed close to the surface.

Abstract: The present invention relates to a method of joining a metal part 1 and a non-liquid polymer part 2. The first step of the method is to attach a primer 4 to a metal surface 3 of the metal part 1. The primer 4 is then polymerized so that the metal surface 3 is at least partly covered with surface immobilized polymer brushes 5. Then the metal surface 3 with the polymer brushes 5 is brought into contact with a polymer surface of the polymer part 2, so that an interface is obtained comprising the metal surface 3, the primer 4, the polymer brushes 5 and the polymer surface. Finally, the interface is heated by use of laser welding until the polymer brushes 5 and a part of the polymer part 2 melt or soften and mix to such an extent that the metal part 1 and the polymer part 2 remain joined after cooling. The welding may e.g. be performed so that so that welding seams are obtained along equidistant lines across the surface.

Abstract: An elastic wave filter device includes a transmission elastic wave filter chip and a reception elastic wave filter chip. The transmission elastic wave filter chip includes an insulating support substrate, a piezoelectric layer directly or indirectly supported by the support substrate, and an IDT electrode in contact with the piezoelectric layer. The reception elastic wave filter chip includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The thermal conductivity of the support substrate is higher than the thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate.

Abstract: A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

Abstract: A method for manufacturing an electrode. To provide a particularly cost-effective method, which is able to provide a current collector layer that adheres well and is electrically well-connected, the method including: a) providing a layer having an active material; b) one-sided electrochemical deposition of a metallic material on the layer having the active material, thus forming a current collector layer having the metallic material; c) joining the product obtained in b) to another layer having an active material and to a contact element so that the current collector layer having the deposited metallic material is situated between two layers having an active material, and that the contact element for establishing contact is at least partially exposed and is in contact with the current collector layer having the deposited metallic material.

Abstract: Provided is a metal card including a metal card sheet made of duralumin and an anodized layer formed by anodizing a surface of the metal card sheet, wherein a background color or pattern of the metal card is determined according to a composition of electrolyte of the anodizing for forming the anodized layer.

Abstract: A method for manufacturing a phosphor device may include: providing an optical transmitting member having a first end face and a second end face, whereby the optical transmitting member is designed for guiding exciting light entering through the first end face onto a phosphor layer arranged on the second end face, whereby at least a part of the exciting light is being wavelength-converted by the phosphor layer, and whereby the optical transmitting member is further designed for at least partially collecting and guiding the light converted by the phosphor layer; attaching an optically transparent electrode on the second end face of the optical transmitting member; providing a phosphor and a counter-electrode designed for electrophoretic deposition of the phosphor; and depositing a phosphor layer on the optically transparent electrode by means of electrophoretic deposition, thereby using the optically transparent electrode as a coating electrode.

Abstract: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is in the range of 0.05 to 5 wt %.

Abstract: A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less than 100 microns.

Abstract: A plastics film with improved energy-shielding properties, suitable for application on a transparent or translucent surface, such as glass, and which is at least 50% transparent for visible light, further characterized in that it includes at least one plastic carrier layer with on top thereof as a functional layer a metallic layer consisting of antimony and/or arsenic together with indium and/or gallium, wherein the plastics film contains a total of indium (In), gallium (Ga), antimony (Sb) and arsenic (As) together, which are present as an alloy, such as indium andmonide, gallium andmonide, indium arsenide, indium gallium arsenide and/or gallium arsenide, of at least 4.0 ppm by weight and at most 25.0 ppm by weight. A glass plate to which the film is attached, is described as are objects provided with the glass plate. Methods are described for the production of the film, the glass plate and the objects.

Abstract: An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film.

Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.

Abstract: Fabrics made for watersports and outerwear apparel, tents, sleeping bags and the like, in various composites, constructed such that there is at least one metal layer, forming a radiant barrier to reduce heat loss via radiation, and insulating this metal layer from conductive heat loss, and a process for its manufacture.

Abstract: Apparatus and methods related to capacitive sensors are provided. Metal walls are formed in an interdigitated pattern. A dielectric material corresponding to a selected analyte is deposited in contact with the metal walls thus defining a capacitive sensor. Exposure to the analyte causes the electrical capacitance to vary in accordance with intensity. Analyte detection or measurement, data acquisition, or other operations can be performed by way of the capacitive sensors of the present teachings.

Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Abstract: A touch sensitive device that includes a touch sensor having an opaque passivation layer is disclosed. The opaque passivation layer can be made from an organic or inorganic material, such as acrylic. The opaque passivation layer can be positioned in the touch sensitive device between the cover material of the device and conductive traces located on the touch sensor to hide the conductive traces from the user's view and protect the conductive traces from corrosion. Processes for making the touch sensitive devices that include a touch sensor having an opaque passivation layer are also disclosed.

Abstract: In one embodiment, a method for creating a pattern in a layer of an organic electronic device that includes selectively irradiating a portion of the layer is provided, and devices and sub-assemblies made by the same.

Abstract: A flexible piezoelectric structure and a method of making the structure are disclosed. A piezoelectric film having a relatively high piezoelectric coefficient is attached to a flexible substrate. The piezoelectric film is fabricated on a different substrate and transferred to the flexible substrate by contact.

Abstract: A pallet is made from thermoformed polymeric sheets with an attached communications device. A further aspect of the present invention includes a radio frequency identification device attached to an apparatus. In still another aspect of the present invention, a communications device is incorporated into one or more sheets of a pallet or other container prior to forming. Methods of making and using a thermoformed pallet and container having a communications device are also provided.

Abstract: Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

Abstract: Disclosed herein is a flexible composite laminate barrier for placement near the interior of a window to control the passage of heat therethrough. The barrier comprises a first exterior-directed layer, an intermediate layer, and a third interior-directed layer. The first layer comprises a sheet having an exterior-directed surface and an interior-directed surface, and a coating disposed on the exterior-directed surface of the sheet. The intermediate layer comprises a sheet having an exterior-directed surface and an interior-directed surface, and an aluminum layer adhered to the exterior-directed surface of the intermediate layer. The third layer comprises a sheet of similar or same material as that of the first sheet. An adhesive is disposed between both the adjacent layers and the layers are calendered together to form the composite laminate barrier.

Abstract: Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a first roughened surface layer which has been treated by a first roughening treatment by copper metal, a second roughened surface layer which has been treated by a second roughening treatment by copper metal, and a third treated surface layer which has been treated by a third treatment process by zinc metal are sequentially provided on one surface of an untreated copper foil.

Abstract: Exemplary techniques for improving the performance of signals transmitted by conductive circuit traces are disclosed. The techniques may be realized as a method comprising the step of reducing a surface roughness of at least one surface of a conductive circuit trace. Alternatively, the techniques may be realized as a circuit board for transmitting at least one signal, the circuit board comprising at least one conductive circuit trace for carrying at least one signal, the at least one conductive circuit trace having at least one polished surface. Further, the technique may be realized as a conductive circuit trace for carrying a signal, the conductive circuit trace comprising conductive material having a plurality of surfaces substantially parallel with a direction of propagation of the signal, wherein the plurality of surfaces includes at least one polished surface having a reduced surface roughness.

Abstract: A method for bonding a sheath made of a first metallic material to an airfoil made of a second metallic material includes treating the bonding surface of the airfoil; treating the bonding surface of the sheath; placing an adhesive between the bonding surfaces of the airfoil and the sheath; and pressing the airfoil and sheath together so that the adhesive bonds the sheath to the airfoil.

Abstract: Methods and apparatus provide for: disposing an intermediate layer formed from at least one of: a metal, a conductive oxide, and combined layers of the metal and the conductive oxide, on one of a first material layer and a second material layer; and coupling the first and second material layers together via an anodic bond between the intermediate layer and the other of the first and second material layers.

Abstract: Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for interlayer connection can include forming a circuit pattern on one side of a carrier, pressing one side of the carrier into one side of the insulator, removing the carrier, forming a hole penetrating through the insulator by processing one end of the circuit pattern, and forming a conductive material inside the hole to have the conductive material correspond to the via.

Abstract: A method for detachably gluing at least one porous substrate to another material using at least one layer of a detachable adhesive comprising an ungluing admixture adapted for generating gases which, by gas expansion or gas migration towards at least one of the interfaces of the detachable adhesive layer, weakens the adhesive bond when heated by a detaching control, the aforementioned method including, before gluing, applying a metal sealing coating onto at least one of the substrates.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

Abstract: Disclosed is a method for producing a polymer-based microfluidic device, including: forming a microstructure on a lower polymer matrix; coating the lower polymer matrix with TiO2 to perform patterning of TiO2; bonding the lower polymer matrix with an upper polymer matrix; and radiating UV lights thereto to convert TiO2-coated regions into hydrophilic regions. Disclosed also is a polymer-based microfluidic device obtained by the method. The method enables development of a microfluidic device having high stability and long-term durability.

Abstract: A method of manufacturing a multilayer wiring substrate of the present invention includes a preparation step of preparing a sheet-like insulation core having a thickness of 100 ?m or less; a drilling step of forming through-holes which are open at a front surface and a back surface of the insulation core by subjecting the insulation core to laser drilling; a conductor forming step of forming, through electroless copper plating and subsequent copper electroplating, through-hole conductors which completely fill the corresponding through-holes of the insulation core and a respective conductor layer on each of the front surface and the back surface of the insulation core; and a lamination step of laminating a plurality of resin insulation layers and a plurality of conductor layers alternately in multilayer arrangement on each respective conductor layer on the front surface and the back surface of the insulation core.

Abstract: The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.