Plural Superimposed Laminae Transferred Patents (Class 156/239)
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Patent number: 8372232Abstract: A heat transfer material kit is disclosed that includes a first image transfer material that includes a printable non-porous surface, and a second image transfer material that includes an outer layer having a film forming binder and thermoplastic particles. A method of using the kit is disclosed that includes the steps of a) imaging the substantially non-porous printable surface to form an imaged surface having printed and un-printed areas; b) positioning the outer layer adjacent the imaged surface; c) transferring a portion of the outer layer to the printed area while transferring a lesser portion of the outer layer to the non-printed area to form a coated imaged surface having a non-printed area with less coating than the printed area; and d) thereafter transferring the coated image to a substrate. Alternate methods of using the kit and applying images to substrates that provide good image appearance and durability are also disclosed.Type: GrantFiled: July 20, 2004Date of Patent: February 12, 2013Assignee: Neenah Paper, Inc.Inventor: Francis Joseph Kronzer
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Patent number: 8323439Abstract: To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.Type: GrantFiled: March 8, 2009Date of Patent: December 4, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kevin Dooley, Ratnesh Kumar Sharma, Lynn Sheehan, Sergio Escobar-Vargas, Anna Fenelon
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Publication number: 20120228008Abstract: Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method.Type: ApplicationFiled: March 9, 2012Publication date: September 13, 2012Applicant: TAIYO YUDEN CO., LTDInventors: Ryuichi KONDOU, Kenichi Ota
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Patent number: 8252136Abstract: The invention is to provide a process for production of a connected sheet product, which makes it possible to connect opposed end faces of two or more sheet products. A process for production of a connected sheet product including sheet products that are connected to one another and each have at least an optical member and a release film provided on one side of the optical member with a pressure-sensitive adhesive interposed therebetween, comprising: opposing a transverse end face of a first sheet product to a transverse end face of a second sheet product; connecting release films of the first and second sheet products with a connecting member (30a); and connecting surface members of the first and second sheet products with a connecting member (30b) on the opposite side from the release films.Type: GrantFiled: November 13, 2008Date of Patent: August 28, 2012Assignee: Nitto Denko CorporationInventors: Kazuo Kitada, Tadashi Yokouchi, Takaichi Amano, Tomokazu Yura
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Patent number: 8236126Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.Type: GrantFiled: August 23, 2010Date of Patent: August 7, 2012Assignee: Industrial Technology Research InstituteInventors: Kuang-Jung Chen, Shu-Tang Yeh, Ping-I Shih, Kung-Yu Cheng, Jian-Lin Wu
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Patent number: 8195323Abstract: Described herein is a system for controlling advance of a web material having characteristics of extensibility and comprising successive stretches of web for the production of respective articles, such as sanitary articles. In the passage from a delivery assembly to a treatment station functioning cyclically, the web material is subjected to extension. In order to ensure proper alignment of the individual articles with patterns or decorations provided thereon, the web must be fed to the treatment station in phase with the position reached by the treatment station within its operating cycle. A position sensor enables detection, for each stretch of web, of a real position of operation of the treatment station used for feeding the stretch of web itself to the treatment station with the aforesaid given phase relationship.Type: GrantFiled: August 13, 2008Date of Patent: June 5, 2012Assignee: Fameccanica. Data S.p.A.Inventor: Giambattista Simone
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Publication number: 20120128983Abstract: A method of fabricating multi-layered graphene includes disposing a first graphene layer on a carrier; disposing at least one second graphene layer on the first graphene layer to form a graphene sheet disposed on the carrier; and transferring the graphene sheet disposed on the carrier onto a substrate, wherein each of the graphene layers which constitute the graphene sheet has at least one damaged region, and the at least one damaged region of each of the graphene layers contacts at least one of non-damaged regions of a graphene layer or graphene layers, of the graphene layers, contacting the each of the graphene layers.Type: ApplicationFiled: November 17, 2011Publication date: May 24, 2012Applicants: SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION, SAMSUNG TECHWIN CO., LTD.Inventors: Jong-hyuk YOON, Duk-hwa NA, Young-il SONG, Dong-kwan WON, Byung-hee HONG, Na-young KIM
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Patent number: 8172974Abstract: Methods and products for forming a coated image on a substrate are generally disclosed. The methods can include forming an image on a printable surface of a transfer coating layer of a printable transfer sheet. In a separate step, the negative mirror image of that same image is printed with toners on a toner printable sheet. After registering the sheets together, a portion of the transfer coating layer of the printable transfer sheet is transferred to the toner printable sheet, such that the portion of the transfer coating layer transferred to the toner printable sheet corresponds to the imaged areas on the toner printable sheet. However, the image formed on the printable surface of the transfer coating layer and the underlying transfer coating substantially remain on the printable transfer sheet. Thereafter, the image and the transfer coating layer remaining on the printable transfer sheet are transferred to a substrate.Type: GrantFiled: October 25, 2007Date of Patent: May 8, 2012Assignee: Neenah Paper, Inc.Inventor: Frank J. Kronzer
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Patent number: 8168513Abstract: A method for fabricating a packaging substrate includes: providing a base having a release film with two opposite surfaces, two first auxiliary dielectric layers enclosing the release film, and two metal layers disposed on the two first auxiliary dielectric layers, therewith an effective area defined on the two metal layers; forming an inner wiring layer from the two metal layers; forming on each of the two first auxiliary dielectric layers and the inner wiring layers a built-up structure having first conductive pads so as for two initial substrates to be formed on the opposite surfaces of the release film; removing whatever is otherwise lying outside the effective area; removing the release film; and forming dielectric layer openings in the two first auxiliary dielectric layers so as for two substrate bodies to be formed from the initial substrates, wherein a portion of the inner wiring layers are exposed to thereby function as second conductive pads.Type: GrantFiled: May 14, 2010Date of Patent: May 1, 2012Assignee: Unimicron Technology CorporationInventor: Chin-Ming Liu
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Patent number: 8163126Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.Type: GrantFiled: February 3, 2011Date of Patent: April 24, 2012Assignee: Fujitsu LimitedInventors: Tohru Harada, Kazuhisa Mishima, Hirokazu Yamanishi, Yoshiaki Yanagida
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Patent number: 8142591Abstract: The present invention relates to a method for liquid crystal display element without substrates, which comprises applying a release agent to assisting substrates in the process of producing the liquid crystal display so that the assembled liquid crystal display element can be separated from the assisting substrates and the liquid crystal display element is obtained, wherein said release agent comprises (a) 2-20 wt % of compounds selected from the group consisting of silicone, fluorine compounds and mixtures thereof; (b) 0.01-0.6 wt % of release modifier; and (c) a solvent as a complement to 100 wt %.Type: GrantFiled: September 12, 2008Date of Patent: March 27, 2012Assignee: Industrial Technology Research InstituteInventors: Yuung-Ching Sheen, Juh-Shyong Lee, Wen-Ping Chuang, Yih-Her Chang, Su-Mei Wei
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Patent number: 8137496Abstract: Provided is a method of fabricating a wire grid polarizer. The method includes: forming a photocatalytic layer on a first substrate; forming a patterned resin layer having a plurality of parallel grooves; forming a wire grid by filling the grooves with a metal; and transferring the wire grid and the resin layer to a second substrate.Type: GrantFiled: September 14, 2007Date of Patent: March 20, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Su-mi Lee, Chang-ho Noh
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Publication number: 20120002125Abstract: A process for producing a light-reflective film is disclosed. The process comprises (a) applying a curable liquid crystal composition to a first film having a thickness of d1; (b) drying the applied curable liquid crystal composition to form a cholesteric liquid crystal phase; (c) carrying out a curing reaction of the curable liquid crystal composition and fixing the cholesteric liquid crystal phase to form a lower layer; (d) repeating the set of the steps (a)-(c) three or more times on the lower layer to form a light-reflective multilayer having four or more layers of a fixed cholesteric liquid crystal phase; and (e) transferring the light-reflective multilayer, formed on the first film, onto a second film having a thickness of d2 which is smaller than d1; wherein the first film, fulfilling the condition of formula (1), is used. ( d 1 ) 2 × ( Y 1 ) ( d 3 ) × ( 1 - P 1 ) ? 0.Type: ApplicationFiled: June 29, 2011Publication date: January 5, 2012Applicant: FUJIFILM CORPORATIONInventor: Kazuhiro OKI
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Patent number: 8066839Abstract: Methods of making adhesive articles providing air egress by supplying a route for the air to flow out from under the construction are described. One method includes providing a release liner comprising a moldable layer having a release surface and a back surface; applying a first pattern of a first non-adhesive material to a first portion of the release surface; applying a second pattern of a second non-adhesive material to a second portion of the release surface, wherein the second pattern partially overlaps the first pattern; embedding at least one of the first or second non-adhesive materials into the moldable layer; and transferring an adhesive layer having a front and back surface and end edges onto the release liner, wherein the front surface of the adhesive layer is adhered to the release surface of the release liner.Type: GrantFiled: February 15, 2011Date of Patent: November 29, 2011Assignee: Avery Dennison CorporationInventor: Michael Hannington
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Patent number: 8034206Abstract: A method of fabricating a flexible display device, the method including applying a transparent adhesive layer on a carrier substrate, laminating a flexible substrate comprising a barrier layer on the transparent adhesive layer, forming a thin film transistor array on the flexible substrate, and separating the carrier substrate from the flexible substrate by irradiating a laser beam onto the barrier layer.Type: GrantFiled: September 9, 2008Date of Patent: October 11, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Hwan Kim, Nam-Seok Roh, Sang-Il Kim
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Patent number: 8016969Abstract: A process for finishing a wood or wooden board, in particular an MDF or HDF board, with an upper side and an underside. The process includes applying a sealing layer of melamine resin to the upper side of the board and printing a decoration onto the sealing layer. A protective layer is applied of melamine resin to the decoration and the board is pressed under the action of temperature until the protective layer and the sealing layer melt and bond to each other with the inclusion of the decoration printed on.Type: GrantFiled: June 18, 2009Date of Patent: September 13, 2011Assignee: Flooring Technologies Ltd.Inventor: Frank Oldorff
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Patent number: 8012289Abstract: The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.Type: GrantFiled: February 25, 2009Date of Patent: September 6, 2011Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Olivier Rayssac, Pierre Rayssac, legal representative, Gisèle Rayssac, legal representative, Takeshi Akatsu
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Patent number: 8012288Abstract: A method of fabricating a flexible display device, the method including applying an adhesive layer including polyimide on a carrier substrate, laminating a flexible substrate on the adhesive layer, and separating the carrier substrate from the flexible substrate by irradiating a laser beam or light onto the adhesive layer.Type: GrantFiled: August 12, 2008Date of Patent: September 6, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Myung-Hwan Kim, Woo-Jae Lee, Hyung-Il Jeon, Myeong-Hee Kim
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Publication number: 20110139359Abstract: An improved process for manufacture of polymer coated composite substrates is described. a coated composite substrate is prepared in the press by applying a layer of a primer coating composition to the surface of a compressible mat comprising fibers and/or particles and a resin binder. The primer coating composition is formulated preferably as a fast setting polymer latex capable of forming a chemically crosslinked polymer matrix when applied to the surface of a compressible mat. a thermosetting top coat composition can be applied directly over the wet primer coating composition before heat-processing the mat to improve surface quality and release characteristics. Compressing and heating the coated mat produces a primed composite substrate directly out of the press.Type: ApplicationFiled: February 23, 2011Publication date: June 16, 2011Applicant: Valspar Sourcing, Inc.Inventors: Frank Chen, Greg Muselman, Travis W. Idol, David H. Nowak
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Publication number: 20110143096Abstract: A thin film, a casing with decorative pattern, a thin film manufacturing method, and a casing manufacturing method are disclosed. The thin film includes a carrier film, a structure layer formed on the carrier film, a hardened layer, a release layer between the hardened layer and the carrier film, and an adhesive layer. The structure layer has a first pattern. The hardened player includes a recess portion forming a second pattern the same as the first pattern. The thin film manufacturing method comprises preparing the carrier film, forming in order the structure layer on the carrier film, the release layer on the structure layer, and the hardened layer on the release layer, and forming the adhesive layer above the hardened layer. By the casing manufacturing method, the hardened layer of the thin film adheres to a casing through the adhesive layer so as to obtain the casing with decorative pattern.Type: ApplicationFiled: May 23, 2010Publication date: June 16, 2011Inventor: HONG-YI HUANG
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Patent number: 7942183Abstract: The present invention relates to a partial painting method, and more particularly, to a painting method wherein a printing layer is completely transferred onto a base material surface by attaching a hologram transfer film on the base material surface subjected to transparent painting, heat-treating it to transfer a printing portion and then removing a base material film. Since the printing layer is completely transferred onto and impregnated into the transferred surface of the present invention, there occurs no step and the printing layer is not erased due to a solvent. Further, the present invention relates a method of preparing a painting composition using a hologram transfer film and a painting method using the painting composition.Type: GrantFiled: May 15, 2006Date of Patent: May 17, 2011Inventor: Yeon-Kil Jeong
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Patent number: 7901538Abstract: A transparent conductive multi-layer structure having a smooth base material 1, a transparent conductive layer 2 formed on the smooth base material 1 by coating, an auxiliary electrode layer 3 formed in a pattern on the transparent conductive layer 2, and a transparent substrate 5 joined to the transparent conductive layer 2 and auxiliary electrode layer 3 through an adhesive layer 4. On a smooth peeled-off surface of the transparent conductive layer 2 from which the smooth base material 1 has been peeled off, various devices are formed to set up devices such as a dye-sensitized solar cell and an organic electroluminescent device.Type: GrantFiled: May 21, 2008Date of Patent: March 8, 2011Assignee: Sumitomo Metal Mining Co., Ltd.Inventor: Masaya Yukinobu
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Publication number: 20100258014Abstract: A composite stencil for applying designs to walls and other surfaces is disclosed. The stencil includes a porous textile support layer to which a flexible stencil mask is bonded by an adhesion layer. The support layer supports unconnected parts of the stencil mask without bridges common with traditional stencils. Further, the textile support layer in the open areas of the stencil can be colored with a sublimation dye to suggest to a user the colors that should be applied in the various areas of the stencil. A pressure sensitive adhesive is applied to the back of the stencil. In use, the stencil is removably adhered to a surface by the pressure sensitive adhesive, whereupon paint or other pigment is applied through the textile support layer to the surface. The lack of bridges permits the entire design to be applied with a single stencil in a single session. The stencil is cleanable and reusable to apply additional designs.Type: ApplicationFiled: November 16, 2009Publication date: October 14, 2010Inventor: Dirk Jan van Heijningen
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Publication number: 20100230039Abstract: A method and apparatus for patterning a substrate are provided. A template is formed by applying a precursor material to a patterned master substrate and curing or solidifying the precursor material. The template is detached from the master substrate using a carrier having a curved surface. The template is coated with a patterning material, and is then detached from the carrier and applied to the substrate to be patterned. The template is then dissolved without affecting the patterning material, and the patterning material may thereafter be finished to develop the pattern. In an alternate embodiment, the patterning material may be applied to the substrate and then imprinted using the template.Type: ApplicationFiled: March 11, 2010Publication date: September 16, 2010Applicant: APPLIED MATERIALS, INC.Inventor: Brian N. Hubert
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Publication number: 20100086786Abstract: Provided is a method of producing a multilayer coating film, the method including the steps of: turning multiple coating liquids into multiple layers in advance; and transferring the coating liquids turned into multiple layers onto a substrate, in which a mixing-preventing component that prevents two kinds of coating liquids which contact each other from mixing with each other is added to at least one of the two kinds of coating liquids in advance, and molecules of the mixing-preventing component are localized toward a vicinity of an interface between layers of the coating liquids so that the interface between layers is secured. The production method includes producing a multilayer coating film having good interlayer adhesiveness with ease and good productivity, by collectively applying multiple coating liquids without using a gelling agent or the like for modifying the viscosity of each coating liquid to be laminated.Type: ApplicationFiled: October 5, 2009Publication date: April 8, 2010Applicant: DAI NIPPON PRINTING CO., LTD.Inventor: Kiyoshi ITOH
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Patent number: 7686910Abstract: A method and a device for the automated application of a self-adhesive paint film to a three-dimensionally curved bodywork part, using a robotic application tool, the paint film being held ready in the form of a multi-layered film composite ready for picking up. After picking up has taken place, a protective strip on the adhesive side is removed from the film section, which is held taut, by means of a contact piece attached to the film composite on the end side and the adhesive side of the film section is thereby exposed. The paint film section is subsequently aligned above the body part to be covered, at a small distance from it, and is progressively pressed onto the bodywork part from the spaced-apart, taut position by means of a roller or doctor moving over the paint film.Type: GrantFiled: August 10, 2004Date of Patent: March 30, 2010Assignee: Daimler AGInventors: Uwe Habisreitinger, Bernhard Nordmann
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Publication number: 20100024968Abstract: A tool includes a body, a first cavity, a first porous top cover, and a first vacuum port. The first cavity is located on a first side of the body. The first porous top cover extends across the first cavity. A tool guide may attach to the body to align the tool with a component.Type: ApplicationFiled: July 30, 2008Publication date: February 4, 2010Applicant: UNITED TECHNOLOGIES CORPORATIONInventors: John H. Vontell, Ronald W. Brush
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Publication number: 20100025481Abstract: In a method for producing an apparatus for wireless communication, particularly a contactless card, a E-passport, a Smart label or the like, or for producing a prelaminate for such an apparatus, an antenna is produced by applying an antenna structure to a substrate using an additive method, such as metal deposition. The substrate can be made of a PVC or polycarbonate material. A transponder is then produced by connecting a bare chip to the antenna using a direct assembly process, such as a flip-chip process. In a next step, the apparatus or the prelaminate for the apparatus is produced by connecting the transponder to further layers using a laminating method, wherein at least one of the further layers in directly adjoining relationship to the substrate is made of a same material as the substrate.Type: ApplicationFiled: July 28, 2009Publication date: February 4, 2010Applicant: MÜHLBAUER AGInventors: VOLKER BROD, HANS-PETER MONSER
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Publication number: 20100024969Abstract: The invention relates to a protective cover sheet comprising a low birefringence protective polymer film and a layer that promotes adhesion to poly(vinyl alcohol), the protective cover sheet comprising at least one functional layer containing a UV-absorbing polymer.Type: ApplicationFiled: October 13, 2009Publication date: February 4, 2010Applicant: NITTO DENKO CORPORATIONInventors: Yongcai Wang, Hwei-Ling Yau, Timothy J. Hubert, Alain E. Gros, Timothy C. Schunk, Paul M. Hoderlein
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Publication number: 20090302756Abstract: An object of the present invention is to provide various flexible functional elements such as a film with a transparent conductive layer which is excellent in flexibility, more specifically, a film with the transparent conductive layer formed on a thin and flexible base film, and a flexible functional element selected from any of a liquid crystal display element, an organic EL element, and an electronic paper element as well as a flexible dispersion-type EL element, using the film with the transparent conductive layer, and a method for producing the same.Type: ApplicationFiled: June 26, 2006Publication date: December 10, 2009Inventors: Yuki Murayama, Masaya Yukinobu
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Patent number: 7617600Abstract: An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and forming an electronic module by mounting electronic parts to wires formed on the baseboard. The formation of the electronic circuit may also include removing the baseboard from the electronic module by dissolving the baseboard in water and deforming and resin-encapsulating the electronic module, which includes the electronic parts and wires in the state of lacking the baseboard.Type: GrantFiled: May 28, 2004Date of Patent: November 17, 2009Assignee: Toyota Jidosha Kabushiki KaishaInventors: Yasutaka Takeuchi, Hironao Hayashi
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Patent number: 7601236Abstract: To provide a method of manufacturing a display device having an excellent impact resistance property with high yield, in particular, a method of manufacturing a display device having an optical film that is formed using a plastic substrate. The method of manufacturing a display device includes the steps of: laminating a metal film, an oxide film, and an optical filter on a first substrate; separating the optical filter from the first substrate; attaching the optical filter to a second substrate; forming a layer including a pixel on a third substrate; and attaching the layer including the pixel to the optical filter.Type: GrantFiled: November 18, 2004Date of Patent: October 13, 2009Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Akio Yamashita, Yumiko Fukumoto, Yuugo Goto
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Patent number: 7572348Abstract: Method for printing objects, whereby these objects (15) are provided with a multi-layered print, characterized in that to this aim, on one hand, two or more layers of printing medium (10-11-12), which at least partially are situated one above the other, are provided on a supple carrier (13) and, on the other hand, these layers (10-11-12) are simultaneously transferred onto the object (15) to be printed by bringing said carrier (13), together with the layers of printing medium (10-11-12) present thereon, and the object (15) into mutual contact.Type: GrantFiled: April 24, 2003Date of Patent: August 11, 2009Assignee: Akzo Nobel Coatings International B.V.Inventor: Marc Maria Leo Jan LaFaille
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Patent number: 7544265Abstract: The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release layers characterized in that the reversible connection is formed by a connecting layer produced using a first material as the basis, the connecting layer further comprising a nanoparticle concentrating zone of a second material disposed to facilitate release of the substrate, the first and second materials being selected to maintain the bonding energy of the reversible connection substantially constant even when the substrate is exposed to heat treatment.Type: GrantFiled: July 5, 2006Date of Patent: June 9, 2009Assignee: S.O.I.Tec Silicon on Insulator TechnologiesInventors: Pierre Rayssac, legal representative, Gisele Rayssac, legal representative, Takeshi Akatsu, Olivier Rayssac
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Patent number: 7537668Abstract: A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a metal foil on the adhesive layer by means of plating, lamination or sputtering, and forming a high density circuit on the metal foil serving as a seed layer by means of pattern plating. Specifically, the method of the current invention includes the steps of attaching adhesive means to one surface of a reinforced substrate (rigid substrate or carrier film), forming a seed layer on the adhesive means and forming a circuit pattern on the seed layer, laminating an insulating layer on the circuit pattern and removing the reinforced substrate (rigid substrate or carrier film), and removing the seed layer.Type: GrantFiled: June 6, 2005Date of Patent: May 26, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Ryoichi Watanabe
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Publication number: 20090044900Abstract: A manufacturing apparatus has a joining mechanism for bonding a photosensitive web to a glass substrate such that a cushion layer thereof faces the glass substrate, thereby to produce a joined substrate. The manufacturing apparatus also has a cooling mechanism for forcibly cooling the joined substrate with cooling air, a heating mechanism for heating the cushion layer to a temperature in a predetermined temperature range up to a glass transition temperature thereof, and a peeling mechanism for peeling off a base film of the photosensitive web from the heated joined substrate. The cooling mechanism, the heating mechanism, and the peeling mechanism are successively arranged in the direction in which the joined substrate is fed along.Type: ApplicationFiled: March 16, 2006Publication date: February 19, 2009Applicant: Fujifilm CorporationInventors: Kazuyoshi Suehara, Yasuhisa Watanabe, Haruhito Arimitsu, Hidenori Gotoh
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Patent number: 7491282Abstract: It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component.Type: GrantFiled: March 31, 2004Date of Patent: February 17, 2009Assignee: TDK CorporationInventors: Masahiro Karatsu, Shigeki Sato, Masaaki Kanasugi
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Patent number: 7473450Abstract: To provide a protective layer thermal transfer film which can form a protective layer that is superior in the water based ink fixing property, solvent-resistant property and, in particular, water-resistant property and also has a superior peeling property. The present invention relates to: a protective layer thermal transfer film, comprising: a thermally transferable protective layer on or over at least one part of one surface of a substrate film, wherein the protective layer is formed on or over the substrate by laminating at least a peeling layer serving as an outermost surface layer after transfer; and the peeling layer containing at least polyvinyl pyrrolidone, and a printed article with the protective layer transferred onto an image on the printed article.Type: GrantFiled: September 27, 2005Date of Patent: January 6, 2009Assignee: Dai Nippon Printing Co., Ltd.Inventor: Kenichi Hirota
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Patent number: 7438963Abstract: Method for producing a laser-printable film which comprises printing an engraving layer comprising a UV-curable coating onto a support film, applying an electron-beam curable coating on top of the engraving layer, and then curing the film by electron irradiation.Type: GrantFiled: July 10, 2002Date of Patent: October 21, 2008Assignee: tesa AGInventors: Arne Koops, Michael Blümel
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Patent number: 7426783Abstract: In order to avoid any positional misalignment between an ink passage hole formed on a manifold plate and a nozzle formed on a nozzle plate, the nozzle plate on which no nozzle has been formed, is stacked on and bonded to the manifold plate having the ink passage hole. After the nozzle plate is bonded to the manifold plate, the nozzle is formed on the nozzle plate. Then, a water-repellent film is formed on an ink-discharging surface of the nozzle plate. Further, a cavity plate or the like is bonded to the manifold plate and an ink jet head is completed.Type: GrantFiled: December 27, 2005Date of Patent: September 23, 2008Assignee: Brother Kogyo Kabushiki KaishaInventors: Atsushi Ito, Yasuo Okawa
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Patent number: 7351300Abstract: There is provided a peeling method capable of preventing a damage to a layer to be peeled. Thus, not only a layer to be peeled having a small area but also a layer to be peeled having a large area can be peeled over the entire surface at a high yield. Processing for partially reducing contact property between a first material layer (11) and a second material layer (12) (laser light irradiation, pressure application, or the like) is performed before peeling, and then peeling is conducted by physical means. Therefore, sufficient separation can be easily conducted in an inner portion of the second material layer (12) or an interface thereof.Type: GrantFiled: August 14, 2002Date of Patent: April 1, 2008Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Toru Takayama, Junya Maruyama, Shunpei Yamazaki
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Publication number: 20080017301Abstract: A method of making an image transfer film article and a method of protecting graphic substrates are disclosed. One method of making an image transfer film article includes printing an image onto a transparent thermoplastic protective layer, where the image is formed by an ink-jet printer and an organic solvent-based ink including an organic solvent, a thermoplastic material, and a pigment; and then drying off at least a portion of the organic solvent to form the image transfer film article.Type: ApplicationFiled: June 29, 2006Publication date: January 24, 2008Inventors: Jeffrey O. Emslander, Frank T. Sher
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Patent number: 7306689Abstract: An optical waveguide having a optical waveguide path capable of securing a high light propagation characteristic regardless of the type of a supporting base, provided with a multilayer circuit board, an optical waveguide path arranged on the multilayer circuit board, a light receiving element, IC chips, and a light emitting element, the optical waveguide path formed on a transparent substrate excellent in flatness and transferred to the multilayer circuit board. The light propagation loss becomes small, and a signal to be transmitted at a high speed being transmitted as a light signal and a signal which can be transmitted at a relatively low speed being transmitted as an electrical signal, whereby the signal propagation delay which becomes the problem when a signal is transmitted by only electrical wiring is overcome, and the influence of electromagnetic noise becomes small.Type: GrantFiled: November 19, 2004Date of Patent: December 11, 2007Assignee: Sony CorporationInventors: Akihiko Okubora, Tsuyoshi Ogawa
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Patent number: 7297221Abstract: A method of producing a decorative molded object which is a resin molded object decorated with a color design image representing a letter, a symbol, a figure, or the like, includes the steps of printing a color design image on an image carrying layer with an output apparatus that collectively outputs color design data to form a coloring agent layer for displaying the color design image on the substrate sheet, transferring the coloring agent layer on the substrate sheet onto a resin molded object to be decorated, peeling the substrate sheet with the transferred coloring agent layer left on the resin molded object to form a color design image layer on the resin molded object and curing, after application and deposition onto the color design image layer, a transparent resin liquid to thereby form a transparent resin layer.Type: GrantFiled: November 21, 2003Date of Patent: November 20, 2007Assignee: Polymatech Co., Ltd.Inventor: Atsushi Hikita
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Patent number: 7279060Abstract: The invention generally relates to polymer films used as protective cover sheets for polarizer plates, a method for producing polarizing plates, and a Liquid Crystal Display employing the same. More particularly, the invention relates to cover sheet composites having a removable, carrier substrate and, optionally, a strippable, protection layer that protects the cover sheet from abrasion and dirt during the manufacture of the cover sheet and polarizer plates.Type: GrantFiled: May 4, 2004Date of Patent: October 9, 2007Assignee: Eastman Kodak CompanyInventors: Janglin Chen, Charles C. Anderson, Timothy J. Hubert, Yongcai Wang, Timothy C. Schunk
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Patent number: 7252733Abstract: The invention generally relates to polymer films used as protective cover sheets for polarizer plates, a method for producing polarizing plates, and a Liquid Crystal Display employing the same. More particularly, the invention relates to a cover sheet composite having a removable, carrier substrate and a cover sheet comprising a low birefringence polymer film and a layer that promotes adhesion to polyvinyl alcohol on the same side of the carrier substrate as the low birefringence polymer film. The guarded cover sheet of the invention is less susceptible to defects due to dirt and abrasion during the manufacture of the cover sheet and polarizer plates. In addition, the cover sheet has excellent adhesion to polyvinyl alcohol-containing dichroic films and eliminates the need to alkali treat the cover sheet prior to lamination to the dichroic films.Type: GrantFiled: May 4, 2004Date of Patent: August 7, 2007Assignee: Eastman Kodak CompanyInventors: Yongcai Wang, Janglin Chen, Charles C. Anderson, Timothy J. Hubert, Timothy C. Schunk, Richard A. Castle
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Patent number: 7232499Abstract: A method of laminating a pre-press proof (200) is disclosed comprising the steps of treating a sheet of plastic material (330) with a corona discharge. Laminating a pre-laminate sheet (240) comprising a first thermoplastic layer (304) and a first support layer (150) to the sheet of corona discharged treated plastic material (330). Removing the first support layer (150) to form a pre-laminated receiver stock (230). Creating an imaged receiver sheet (140) with a second support layer (170). Laminating the imaged receiver sheet (140) to the pre-laminated receiver stock (230) thereby encapsulating the image. Removing the second support layer (170) thereby forming the pre-press proof (200).Type: GrantFiled: December 22, 2003Date of Patent: June 19, 2007Assignee: Eastman Kodak CompanyInventors: Roger S. Kerr, David A. Niemeyer, Larry R. Gartz
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Patent number: 7208062Abstract: Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting resin composition that has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface which after roughening, allows forming a conductor layer by plating, and is solid at ambient temperature, layer B is a layer of a thermosetting resin composition that has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature, layer A is laminated adjacent to the support base film, and layer B layer has a fluidity that allows the filling of a resin into a through hole and/or a via hole.Type: GrantFiled: May 20, 2004Date of Patent: April 24, 2007Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Tadahiko Yokota
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Patent number: 7160411Abstract: The present invention relates to a heat-setting label sheet that is a polymeric transfer sheet that can be marked and transferred by the consumer. Also encompassed by the present invention is a method of transferring the heat-setting label sheets. The heat-setting label sheets of the present invention comprise a support; an optional pressure sensitive adhesive layer; an Adhesion Layer comprising a thermoplastic polymer which melts in the range of 50–250° C., a wax which melts in the range of 50–250° C., or combinations thereof; an optional opaque layer comprising a styrene-butadiene latex, thermoplastic polymer, elastomer, and optional pigment; and a second optional opaque layer comprising vinyl acetate-ethylene copolymer, thermoplastic elastomer, elastomer and optional pigment. The heat-setting label sheet of the present invention can be imaged by an electrostatic printer or copier, ink jet printer, offset or screen printing, craft-type marking, and the like.Type: GrantFiled: June 10, 2004Date of Patent: January 9, 2007Assignee: Fóto-Wear, Inc.Inventors: Scott A. Williams, Heather Reid
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Patent number: 7097726Abstract: The invention relates to a preparation method of an identification card with utilizing a protective layer transfer foil having a peeling layer and a releasing layer laminated on the peeling layer, the preparation method comprising: adhering the transferring layer onto a card substrate; and peeling off the peeling layer to prepare the identification card. The peeling layer including a support and a releasing layer, the transferring layer including a photo-cured resin layer. A maximum electrostatic amount of the peeling layer at the peeling step is 0 to 30 kV.Type: GrantFiled: September 23, 2003Date of Patent: August 29, 2006Assignee: Konica CorporationInventors: Ryoji Hattori, Shigehiro Kitamura