Of Discrete Laminae To Single Face Of Additional Lamina Patents (Class 156/297)
  • Patent number: 11389769
    Abstract: Disclosed herein are filtration articles comprising a porous ceramic structure comprising a plurality of channels separated by a plurality of porous interior walls, and a nanomembrane disposed on at least a portion of a surface of the porous ceramic structure, wherein the nanomembrane comprises nanoparticles of at least one inorganic oxide, and wherein the nanoparticles are present in a concentration ranging from about 0.001 g/L to about 1 g/L based on the total volume of the porous ceramic structure. Methods for making such filtration articles and methods for filtering a particulate from a fluid using such filtration articles are also disclosed herein.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: July 19, 2022
    Assignee: Corning Incorported
    Inventors: Guohua Chen, Curtis Robert Fekety, Jianguo Wang, Huiqing Wu
  • Patent number: 11335933
    Abstract: A manufacturing device of a membrane-electrode assembly for a fuel cell is provided. The manufacturing device includes an electrolyte membrane feeding unit forming a first and second ionomer bases impregnated at both surfaces of a reinforcing layer and unwinding an electrolyte membrane wound in a roll type supplied in a predetermined transporting path. A first patterning unit is disposed at a rear side of the electrolyte membrane feeding unit and patterns a first ionomer protrusion pattern layer on the first ionomer base and a second patterning unit is disposed at the rear side of the first patterning unit and patterns a second ionomer protrusion pattern layer on the second ionomer base. A transfer unit is disposed at the rear side of the second patterning unit and couples a catalyst electrode layer on the first and second ionomer protrusion pattern layers by a roll laminating method.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: May 17, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Ki Hong Kim
  • Patent number: 11286993
    Abstract: A rotatable inner race is disclosed. The inner race may include a plurality of arcuate segments each having a first end with a first end geometry and a second end with a second end geometry. The first and second end geometries may be complimentary to each other to join adjacent arcuate segments at an interlocking joint. The rotatable inner race may further include a plurality of race engagement notches extending radially from an outer circumferential surface of each arcuate segment and the plurality of arcuate segments are joined together at the interlocking joints to form a race ring and the plurality of race engagement notches of each arcuate segment align with one another to define an array of race engagement notches around an outer circumference of the race ring.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 29, 2022
    Assignee: BorgWarner Inc.
    Inventors: David L. Podbielski, James R. Papania, Martin P. Keating
  • Patent number: 11183413
    Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 23, 2021
    Assignee: Rokko Systems Pte Ltd
    Inventors: Seung Ho Baek, Deok Chun Jang, Jong Jae Jung
  • Patent number: 11086184
    Abstract: The current invention describes an electrochromic panel having optimized visual properties. The properties have been optimized to provide an electrochromic panel having a very transparent clear state and a very black and opaque dark state. The coloration of the electrochromic panel has also been optimized to provide options for aesthetically pleasing windows. In one embodiment, the clear state comprises a CIE-Lab L* in transmission from 70 to 95, b* in transmission from ?8 to 8, and a* in transmission from ?4 to 4 and a dark state comprises a Tvis less than 0.01%, a CIE-Lab b* in transmission from ?8 to 8, and a CIE-Lab a* in transmission from ?8 to 8.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: August 10, 2021
    Assignee: KINESTRAL TECHNOLOGIES, INC
    Inventors: William S. Bergh, Jonathan Ziebarth, John Bass, Howard Turner
  • Patent number: 11064641
    Abstract: A component mounting machine including a camera configured to capture an image of a component held by a suction nozzle; and an image processing section configured to process the image captured by the camera, recognize the shape of the component, and measure shape data of the component; wherein, when the deviation amount of the measurement value of the shape data of the component exceeds the allowable value, the deviation amount of the measurement value of the shape data of the component is compared to a retry determination that is larger than the allowance value, and if the deviation amount of the measurement value of the shape data of the component exceeds the retry determination value, the component is determined to be abnormal and is discarded to a specified discard location.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: July 13, 2021
    Assignee: FUJI CORPORATION
    Inventors: Yuta Yokoi, Hiroshi Oike, Takahiro Kobayashi, Keiichi Ono
  • Patent number: 10952325
    Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: March 16, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Ching-Ho Hsieh, Ming-Hsing Wu, Shang-Wei Chen
  • Patent number: 10920045
    Abstract: Elastomeric composition for producing tire components comprising, based upon parts by weight per 100 parts by weight of rubber (phr): (A) 100 phr of a blend of rubber comprising at least 20% by weight of an isoprene polymer; (B) from 0 to 30 phr of silica; (C) from 0 to 50 phr of amorphous carbon black; (D) from 1 to 40 phr of graphene, wherein the graphene consists of graphene nanoplatelets, wherein at least 90% have a lateral size (x, y) from 50 to 50000 nm and a thickness (z) from 0.34 to 50 nm, wherein the lateral size is always greater than the thickness (x, y>z), and wherein the C/O ratio is ?100:1.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: February 16, 2021
    Assignee: DIRECTA PLUS S.P.A.
    Inventors: Giulio Cesareo, Massimiliano Bianchi, Antonino Di Pasquale
  • Patent number: 10923784
    Abstract: A heat-conductive sheet includes first and second insulating sheets placed on each other and a graphite sheet disposed between the first and second insulating sheets. The graphite sheet is entirely sealed by the first and second insulating sheets. The graphite sheet has a first slit provided therein. The first and second insulating sheets have a second slit passing through the first and second insulating sheets. The second slit is located inside the first slit of the graphite sheet.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: February 16, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshiya Sakaguchi, Takeshi Fujii
  • Patent number: 10906275
    Abstract: Disclose are a wood sheet and a method for manufacturing the wood sheet. In particular, the real wood sheet is prepared with natural wood sheets used for interior and exterior materials, a binder and a stiffener, thereby providing patterned veneer appearance. Further, the wood sheet may have improved physical properties and reduced weight and be manufactured with reduced cost.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: February 2, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hyo Jin Lee, Ho Tak Jeon
  • Patent number: 10843215
    Abstract: A method of applying a film to upper and lower appliques of a rear slider window assembly includes providing a support structure and positioning a rear slider window assembly at the support structure, with the rear slider window assembly including spaced apart fixed window panels, upper and lower appliques extending between the spaced apart fixed window panels, and a frame portion attached at the fixed window panels and appliques. An applicator includes first and second applicating devices for dispensing a strip of film onto a respective applique. The applicator is moved to a starting position where a roller of each applicating device presses an end region of the film onto the respective applique, and then is moved along the appliques with the rollers rolling along the respective appliques to press the film onto the appliques. The film strips are cut and pressed onto the respective appliques.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: November 24, 2020
    Assignee: MAGNA MIRRORS OF AMERICA, INC.
    Inventors: David G. Douma, Raymond C. LaHaie, III
  • Patent number: 10723036
    Abstract: A parallel veneer standby step, a cross veneer moving step, a cross veneer positioning step, a cross veneer standby step, a parallel veneer returning step, a parallel veneer positioning step, a superimposing step, and a superimposed veneer gluing step are included. Accordingly, a superimposed veneer is obtained in which the parallel veneer and the cross veneer are bonded with a high degree of adhesion and corresponding edges of the parallel veneer and the cross veneer substantially align with each other.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: July 28, 2020
    Assignee: Taihei Machinery Works, Ltd.
    Inventors: Takuya Okumura, Yuki Kochi, Takuji Murakami
  • Patent number: 10480788
    Abstract: A combustor panel of a combustor may include a combustion facing surface, a cooling surface opposite the combustion facing surface, and heat transfer pins extending from the cooling surface. A grouping of the heat transfer pins may include a metallic coating.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: November 19, 2019
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: San Quach, John S. Tu, Robert M. Sonntag, Robert Selinsky, Jr., John J. Rup, Jr., Anthony Van
  • Patent number: 10473748
    Abstract: A laser beam is transmitted from a laser system to a shelving system by pointing the laser beam towards at least one label attached to the shelving system, by a computer system, using angular information of the laser beam relative to a reference frame. An angle between the laser system on the ceiling of the store to the position of the shelving system is determined by the computer system using the position of the laser system and the position of the shelving system. The laser beam is then transmitted from the laser system to the shelving system and pointed using the determined angle between the laser system on the ceiling of the store to the position of the shelving system. The laser is aimed at the x, y location where a label should be displayed, for example, according to the planogram for the store layout. If the label is not detected at the specified location, the discrepancy may be noted, for example, with a visual or other notification.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: November 12, 2019
    Assignee: WALMART APOLLO, LLC
    Inventors: Danika Goecke, Nicholaus A. Jones, Harika Valluripalli
  • Patent number: 10457021
    Abstract: Bio resin paperboard containers and cartons may include a bio resin laminated paperboard (BLP) that includes a sheet of paperboard having a first side and a second side opposite the first side; a first layer of bio resin laminated on the first side of the paperboard; and a second layer of bio resin laminated on the second side of the paperboard. Bio resins may include PEF, PBF, PTF, PPF, GPE, GPET, PLA, PDLA, PLLA, PHA, and PHBH. Methods may utilize a roll of BLP to form bio resin paperboard containers.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: October 29, 2019
    Inventor: Amisha Patel
  • Patent number: 10434726
    Abstract: Thermoplastic composite parts are produced by automated fiber placement followed by stamp forming a layup having tailored fiber orientations. The tailored fiber orientations are achieved by tow steering and result in a layup that does not wrinkle during forming.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: October 8, 2019
    Assignee: The Boeing Company
    Inventors: Gregory James Schoepen Hickman, James R. Fox, Charles R. Prebil, Randall Dow Wilkerson
  • Patent number: 10303904
    Abstract: When writing information to the IC tag of a medium, the control unit 54 of a printer 1 determines if a specific area in the storage space of the IC tag is in an initialized state, and writes to the IC tag if the IC tag is in the specific state.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: May 28, 2019
    Assignee: Seiko Epson Corporation
    Inventor: Toshiaki Koike
  • Patent number: 10257332
    Abstract: An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: April 9, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Manho Kim, Hwajoong Jung, Youngseok Kim, Youngkwon Yoon, Kihuk Lee, Yonghwan Choi, Sunhyoung Pyo
  • Patent number: 10169698
    Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: January 1, 2019
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Robert Neuman
  • Patent number: 10126578
    Abstract: A bonding apparatus is provided, which includes a base frame and a bonding platform, a tensioning mechanism, and an elevating mechanism which are disposed on the base frame. The tensioning mechanism includes a first tensioning portion and a second tensioning portion disposed on both sides of the bonding platform respectively. The first tensioning portion and the second tensioning portion are respectively connected to both ends of an object and used to tension the object. The bonding platform includes a bonding plane and the bonding plane is used to contact the object. The elevating mechanism is used to drive the bonding plane and/or the tensioning mechanism to generate a relative displacement between the bonding plane and the tensioning mechanism, and make a surface of the object in contact with the bonding plane flat under an action of both of the bonding platform and the tensioning mechanism.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: November 13, 2018
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventor: Jianlei Zhu
  • Patent number: 10076849
    Abstract: A method for manufacturing plywood includes receiving a face sheet on a main conveyor and feeding a plurality of pieces of core veneer onto a veneer conveyor by an automated core veneer feeder. The method also includes removing one or more of the plurality of pieces of core veneer from the veneer conveyor and placing the one or more of the plurality of pieces of core veneer onto the face sheet.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: September 18, 2018
    Assignee: Georgia-Pacific Wood Products LLC
    Inventor: J. T. Capps, Jr.
  • Patent number: 9967986
    Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: May 8, 2018
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Atapol Prajuckamol, Chee Hiong Chew, Yushuang Yao
  • Patent number: 9956746
    Abstract: Disclose are a wood sheet and a method for manufacturing the wood sheet. In particular, the real wood sheet is prepared with natural wood sheets used for interior and exterior materials, a binder and a stiffener, thereby providing patterned veneer appearance. Further, the wood sheet may have improved physical properties and reduced weight and be manufactured with reduced cost.
    Type: Grant
    Filed: December 6, 2014
    Date of Patent: May 1, 2018
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hyo Jin Lee, Ho Tak Jeon
  • Patent number: 9933321
    Abstract: A metal resistance strain gage with a high gage factor is provided. The electrical resistance strain gage includes a strain sensitive metallic element and has a chemical composition on a weight basis of approximately 63% to 84% Ni and approximately 16% to 37% Fe and a gage factor greater than 5.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: April 3, 2018
    Assignee: VISHAY MEASUREMENTS GROUP, INC.
    Inventors: Thomas P. Kieffer, Robert B. Watson
  • Patent number: 9872395
    Abstract: A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: January 16, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Akira Yamada, Shinjiro Tsuji, Satoshi Adachi, Yasutaka Tsuboi, Toshihiko Tsujikawa
  • Patent number: 9627734
    Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: April 18, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki
  • Patent number: 9486968
    Abstract: The present invention relates to a substrate-free conductive surface covering, and a process to manufacture such covering, said surface covering comprising a core layer of sheet particles which are agglomerated and embedded in a polymer matrix, wherein the particles or the polymer matrix, or both, comprise an electrically conductive material.
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: November 8, 2016
    Assignee: Tarkett France
    Inventors: Tommy Anderson, Roland Karlsson, Anders Stokki, Cecilia Melin, Kristin Lindström
  • Patent number: 9464448
    Abstract: A tile aligning and lippage tuning system that uses an under tile base reusable upright connecting tab, which is detachably connected to said under tile base, a reusable flexible edge slotted cap, configured to slip over the connecting tab and latch thereto as the cap is slid further down the connecting tab. The cap has an edge slot so that the connecting tab can be separated from the cap, by merely sliding the cap, so that the connecting tab passes through the slot. A flexible spring-like portion of the cap provides increased force on the tile, even if undesired elongation of the connecting tab occurs.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: October 11, 2016
    Assignee: New Standards Manufacturing Co.
    Inventors: James P. Hoffman, Michele Volponi
  • Patent number: 9362256
    Abstract: A bonding process for a chip bonded to a thin film substrate is disclosed. The thin film substrate has a thickness of about less than 500 um. Curvature occurs in the thin film substrate due to Coefficient of Temperature Expansion (CTE) mismatch for different materials between the dielectric material and the embedded circuitry, where cooling and heating is applied during fabrication. A temporary carrier is prepared for the thin film substrate to paste, a flatten process is applied by a roller thereon so that the curvature of the thin film substrate can be eliminated and facilitated for of chips to be bonded thereto.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: June 7, 2016
    Inventor: Dyi-Chung Hu
  • Patent number: 9114586
    Abstract: A caul system for a composite structure having one or more core elements includes a lattice grid hard caul selectively locatable at a portion of the composite structure without core elements. The caul system further includes a soft caul selectively locatable at a portion of the composite structure having a core element. A method of forming a composite structure with one or more core elements includes locating a first laminate in a tool and locating one or more core elements over the first laminate. A second laminate is located over the one or more core elements. A lattice grid hard caul is placed over the second laminate, avoiding locations having core elements of the one or more core elements disposed thereat. A soft caul is located over the one or more core elements, thereby preventing deformation of the one or more core elements.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: August 25, 2015
    Assignee: SIKORSKY AIRCRAFT CORPORATION
    Inventors: Jonathan Bremmer, Paul H. Denavit, Edward Joseph Fabian, Jeffrey G. Sauer, William E. Hovan, III, Darryl Mark Toni
  • Patent number: 9079359
    Abstract: Provided are a microchip including a fluid circuit consisting of a space formed therein, a light-absorbing first substrate and a light-transmitting second substrate bonded onto the first substrate, and a groove, having a V-shaped section, extending parallelly to the fluid circuit on a surface of the second substrate opposite to the first substrate on a position immediately above at least part of the fluid circuit and a method of manufacturing the same.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 14, 2015
    Assignee: Rohm Co., Ltd.
    Inventors: Shun Momose, Hiroki Takeuchi
  • Publication number: 20150144737
    Abstract: An integrated composite trailing edge and its method of manufacturing. The trailing edge comprises an integrated main structure having an upper cover, lower flanges, and a set of ribs extending between the upper cover and the lower flanges, with a set of sandwich type lower panels attachable to the lower flanges of the integrated main structure. The method comprises the steps of providing a set of prepreg laminated preforms over a set of tool modules having a hollow so that each laminated configures a double C-shaped laminated preform having an upper section with a recess, two primary and secondary flanges, the upper section partly forming the upper cover, the two primary flanges partly forming the ribs and the two secondary flanges forming the lower flanges.
    Type: Application
    Filed: November 24, 2014
    Publication date: May 28, 2015
    Inventors: Diego Garcia Martin, Julio Nunez Delgado, Lara Barroso Fernandez
  • Patent number: 9039857
    Abstract: An adherend surface of an adherend is stuck with a protection sheet being in substantially the same shape as the adherend surface and including base and adhesive layer by a method including: sticking the sheet on a first surface of a sticking tool foldable along a symmetry-axis position of the sheet; folding the tool with the sheet such that a second surface opposite to the first surface comes inside; peeling the sheet to a folded portion of the tool to expose a portion of the adhesive layer with the tool folded; pressing the exposed portion of the adhesive layer against the adherend surface to stick a portion of the sheet on the adherend; and moving the tool along the adherend surface to expose a remaining portion of the adhesive layer and pressing the remaining portion against the adherend surface to stick a remaining portion of the sheet on the adherend.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: May 26, 2015
    Assignee: LINTEC CORPORATION
    Inventor: Masahiro Nakamura
  • Publication number: 20150129105
    Abstract: Various decorative articles and methods of manufacturing same are described in which decorative elements are mixed or combined with one another to form highly attractive, dimensionalized articles.
    Type: Application
    Filed: October 3, 2014
    Publication date: May 14, 2015
    Inventor: Louis Brown Abrams
  • Publication number: 20150124197
    Abstract: The high intensity light output of edge lighting point light sources such as LEDs may generate undesired leakage light that is optically conducted by way of a continuum of the material of a components affixing adhesive member. In accordance with present disclosure, air filled grooves or other such discontinuities are formed in the adhesive member along respective light output pathways of the respective point light sources. One corresponding embodiment comprises spaced apart LEDs mounted on an FPCB; a light guide plate (LGP) disposed adjacent to the LEDs; a main support accommodating the LEDs and the LGP; and an adhesive member formed to affix together the FPCB, the main support, and the light guide, wherein the adhesive member is patterned to define air filled grooves along respective light output pathways of the LEDs.
    Type: Application
    Filed: March 14, 2014
    Publication date: May 7, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Dong-Yeol YEOM, Sun Hee OH, Rae Young KIM, Taek-Sun SHIN, Kwang-Wook CHOI
  • Patent number: 9011628
    Abstract: The present invention is a decorative laminated article comprising an image bearing thermoplastic interlayer wherein the image has been printed on the interlayer using an ink jet printing process, wherein the pigment comprises at least one pigment selected from the group consisting of: PY 120; PY 155; PY 128; PY 180; PY 95; PY 93; PV19/PR 202; PR 122; PB 15:4; PB 15:3; and PBI 7. The interlayer material of the present invention can be, for example, PVB, PET, or polyurethane.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: April 21, 2015
    Assignee: Kuraray America Inc.
    Inventors: Hamdy A. Elwakil, Ronald Roman, Rebecca L. Smith, Chaucer C. Tang
  • Patent number: 8992715
    Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.
    Type: Grant
    Filed: March 27, 2013
    Date of Patent: March 31, 2015
    Assignee: Dieffenbacher GmbH Maschinen-und Anlagenbau
    Inventors: David R. Cramer, Neal J. Beidleman, Colin R. Chapman, Don O. Evans, Michael K. Passmore, Michael L. Skinner
  • Patent number: 8992714
    Abstract: A method produces adhesive tapes which are adhesive at least on one side, wherein an adhesive tape web, in which the at least one adhesive side is covered by a first liner, is guided into a cutting device in which a total of N individual adhesive tape strips located next to one another are produced in the machine direction from the adhesive tape web. Every other adhesive tape strip is removed from the first liner and is applied to a second liner in each case having a spacing a between the individual adhesive tape strips. The liners are cut between the adhesive tape strips located on the first liner and on the second liner, and the individual adhesive tapes, together with the liner strips, are wound up in a total of X rolls in a form of an Archimedean spiral.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: March 31, 2015
    Assignee: tesa SE
    Inventors: Michael Tach, Bruce Dirk Ehlers, Markus Gabriel, Christian Fröhlich
  • Publication number: 20150077142
    Abstract: A planar sensor having a conductor pattern for electric field sensing and its manufacturing method, the planar sensor comprising arrays of planar electrically conductive sensor areas (2) arranged to follow each other in a successive manner along the longitudinal direction, and conductors connecting electrically conductive sensor area to at least one connector, wherein the sensor further comprises a first elastic flooring layer (3) and at least one of the following: a second elastic flooring layer (4) or a flexible circuit board, and the electrically conductive sensor areas (2) and the conductors are attached between the first elastic flooring layer (3) and the second elastic flooring layer (4) or between the first elastic flooring layer (3) and the flexible circuit board to form a unitary floor sensor structure.
    Type: Application
    Filed: September 4, 2012
    Publication date: March 19, 2015
    Applicant: ELSI TECHNOLOGIES OY
    Inventors: Temmo Pitkänen, Juha Lindström
  • Publication number: 20150062424
    Abstract: A camera module includes a substrate, an image sensor electrically connected to a surface of the substrate, a lens holder connected to the substrate and covering the image sensor, a lens holder received into the lens holder, a connecting board, and an ACF positioned between the substrate and the connecting board. The image sensor includes a sensing surface and a number of side surfaces connecting to the sensing surface. The substrate is electrically and mechanically connected with each other by the ACF. An adhesive is distributed on each corner of the image sensor, and the adhesive connects the side surfaces of the image sensor to the substrate.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 5, 2015
    Inventor: SHIN-WEN CHEN
  • Patent number: 8951379
    Abstract: In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: February 10, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Shingo Yamada
  • Patent number: 8945337
    Abstract: The present invention relates to a method to produce a polymeric sheet comprising the steps of providing an acid-based polymer, providing a neutralizing agent, the neutralizing agent being selected from the group consisting of an organic metallic compound, a metallic salt of a fatty acid, and an ionomer, or a mixture thereof, providing a processing oil, mixing said acid-based polymer, said neutralizing agent, said processing oil, to obtain a polymeric composition, and processing said polymeric composition to form a polymeric sheet. The polymeric sheet may be used as a component, or as a substrate, of a surface covering. The polymeric sheet may also be used to form polymeric particles which are component of so-called “homogenous”, or substrate-free, surface covering.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: February 3, 2015
    Assignee: Tarkett Inc.
    Inventors: Victor Caldas, Daniel Tremblay, Marcus Hyde, Jean-François Courtoy
  • Publication number: 20150020964
    Abstract: A lens array fabrication method for fabricating a lens array includes: receiving pins (16) of a film attaching instrument (jig) in second guide holes (10) of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins (16); causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins (16) in first guide holes (7) of a lens array main unit; fitting a film holding protrusion (15) in a depression part (6); bonding the film (D) to a bonding region (i); removing the pins (16); and causing a detachment between the film (D) and a second detachment film (E).
    Type: Application
    Filed: December 28, 2012
    Publication date: January 22, 2015
    Applicants: ENPLAS CORPORATION, TOMOEGAWA CO., LTD.
    Inventors: Masahiro Tanazawa, Shimpei Morioka, Makoto Goto, Nobuhiro Hashimoto
  • Publication number: 20150011128
    Abstract: A circuit board that is to be mounted in a connector socket includes a plurality of electrical connectors located along a side edge of the circuit board. Retention bosses are formed on first and second opposite sides of the circuit board, each of the retention bosses protruding from a surface of the circuit board and extending parallel to and adjacent to the first edge of the circuit board. When the first edge of the circuit board is inserted into a slot of a connector socket, contact surfaces of the first and second retention bosses contact top surfaces of the connector socket to help immobilize the circuit board with respect to the connector socket. Adhesive layers on the contact surfaces of the first and second retention bosses may adhere to the top surfaces of the connector socket to help hold the circuit board immobile with respect to the connector socket.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 8, 2015
    Inventors: MICHAEL STOCK, SCOTT SEMMLER
  • Publication number: 20140352885
    Abstract: A method of blocking a lens member having a surface to be manufactured on a lens holding unit, the method comprising: a lens member providing step during which a lens member comprising engraved markings is provided, a contrast providing step during which contrast elements are placed on the engraved markings, a taping step during which the marked surface of the lens member is taped with an adhesive tape over the contrast elements, and a blocking step during which the lens member is blocked on a lens holding unit via the taped surface.
    Type: Application
    Filed: December 6, 2012
    Publication date: December 4, 2014
    Inventors: Marc Reignault, Pascal Le Bouillonnec
  • Publication number: 20140352886
    Abstract: Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix.
    Type: Application
    Filed: August 15, 2014
    Publication date: December 4, 2014
    Inventors: Chi Hoon Choi, Gun Goo Lee, Cheol Choi, Hee June Kim, Yong Kil Kil, Yong Hoon Yoon, Tae Min Park
  • Publication number: 20140356587
    Abstract: A method of preventing fouling structure including: preparing an antifouling pressure-sensitive adhesive tape including a base material layer (A) and a pressure-sensitive adhesive layer (A), and an easily adhering pressure-sensitive adhesive tape including a base material layer (B) easily adhering to the pressure-sensitive adhesive layer (A) and a pressure-sensitive adhesive layer (B); bonding the easily adhering pressure-sensitive adhesive tape to a surface of a structure, and bonding the antifouling pressure-sensitive adhesive tape onto the bonded easily adhering pressure-sensitive adhesive tape so that lengthwise directions of the tapes are non-parallel with each other, or bonding the two or more antifouling pressure-sensitive adhesive tapes and the at least one easily adhering pressure-sensitive adhesive tape onto a surface of a structure so that the antifouling pressure-sensitive adhesive tapes are prevented from overlapping each other and a junction between the antifouling pressure-sensitive adhesive ta
    Type: Application
    Filed: January 15, 2013
    Publication date: December 4, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kazutaka Hara, Naoki Kurata, Tomonari Naito, Taiki Sueyoshi, Satoru Suzuki, Koji Maruyama
  • Publication number: 20140347578
    Abstract: A touch panel includes a first planar body having a first electrode patterned on one surface of a first substrate and a first lead-out wiring electrically connected to the first electrode, a cover sheet, a second planar body provided between the first planar body and the cover sheet except a predetermined region of a side edge of the first substrate, and a flexible wiring board interposed at a gap portion formed between the predetermined region of the side edge of the first substrate and the cover sheet, wherein the flexible wiring board includes a connector portion fixed onto the connection terminal of the first lead-out wiring held by the first planar body and electrically connected with the first lead-out wiring, and a spacer member that abuts with both the connector portion and the cover sheet is disposed between the connector portion and the cover sheet.
    Type: Application
    Filed: November 9, 2012
    Publication date: November 27, 2014
    Applicant: GUNZE LIMITED
    Inventors: Tsutomu Yamada, Masaya Nakagoshi, Kousuke Nakajima
  • Publication number: 20140345788
    Abstract: A method of forming a containment system for an absorbent article that includes a front end region, rear end region, a first elasticized leg cuff and a second elasticized leg cuff. The method includes providing a first containment flap and a second containment flap that can each include a stem, an inner flap projection, and an outer flap projection. The method can further include securing the outer flap projection of the first containment flap in at least a portion of at least one of the front end region and the rear end region and securing the outer flap projection of the second containment flap in at least a portion of at least one of the front end region and the rear end region.
    Type: Application
    Filed: May 22, 2013
    Publication date: November 27, 2014
    Applicant: Kimberly-Clark Worldwide, Inc.
    Inventors: Robert Lee Popp, Scott Simon Craig Kirby, Rodney Allan Butler, Kylie Brooke Bridger, Jeffrey Alan DeBroux, David Fleger Bishop, Michael John Faulks
  • Patent number: 8894793
    Abstract: A method for manufacturing a liquid crystal display device by feeding carrier films from continuous rolls, respectively, and by bonding optical films, which are being peeled off or have been peeled off from the carrier films, respectively, to first and second panel surfaces of a liquid crystal panel, respectively, with a pressure-sensitive adhesive interposed therebetween so that the liquid crystal display device is obtained. The method includes: a first bonding step including bonding a first optical film to the first panel surface; a rotation step including rotating the liquid crystal panel; a second bonding step including bonding a second optical film to the first optical film; and a third bonding step including bonding a third optical film to the second panel surface of the liquid crystal panel.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: November 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Satoshi Hirata, Seiji Umemoto