Abstract: Techniques and mechanisms to facilitate connectivity between circuit components via a substrate. In an embodiment, a microelectronic device includes a substrate, wherein a recess region extends from the first side of the substrate and only partially toward a second side of the substrate. First input/output (IO) contacts of a first hardware interface are disposed in the recess region. The first IO contacts are variously coupled to each to a respective metallization layer of the substrate, wherein the recess region extends though one or more other metallization layers of the substrate. In another embodiment, the microelectronic device further comprises second IO contacts of a second hardware interface, the second IO contacts to couple the microelectronic device to a printed circuit board.

Abstract: Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.

Abstract: An electrical cable having a conductor having a protecting sheath and/or jacket comprising a base polymer (such as a thermoplastic or thermoset) having an abrasion reducing agent, a lubricant, a hydrophobic agent, and/or a UV protecting agent mixed therein. The resulting cable jacket and/or cable sheath defines an outer surface having abrasion reduction properties, lubricating properties, hydrophobic properties, and/or UV protecting properties.

Abstract: A semiconductor device, semiconductor device assembly, and method of forming a semiconductor device assembly that includes moisture impermeable layer. The assembly includes a first substrate and a second substrate electrically connected to a surface of the first substrate. The assembly includes a layer between the two substrates with the moisture impermeable layer between the layer and the surface of the first substrate. The layer may be non-conductive film, die attach film, capillary underfill, or the like. A portion of the surface of the first substrate may include a solder mask between the moisture impermeable layer and the first substrate. The moisture impermeable layer prevents, or at least inhibits, moisture within the first substrate from potentially creating voids in the layer. The moisture impermeably layer may be a polyimide, a polyimide-like material, an epoxy, an epoxy-acrylate, parylene, vinyltriethoxysilane, or combination thereof.

Abstract: A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger.

Abstract: A method for manufacturing a display device includes preparing a flexible substrate that includes an alignment mark in a frame area, preparing a spacer that includes a notch or a hole penetrating from a back surface side to a display surface side of the spacer, disposing the spacer on a back surface side of the flexible substrate, and bending the bent area of the flexible substrate to conform to a shape of the spacer and disposing the terminal area of the flexible substrate on the back surface side of the spacer. In the step of disposing the spacer, the alignment mark is read through the notch or the hole from the back surface side of the flexible substrate so as to position the spacer on the flexible substrate.

Abstract: An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.

Abstract: A battery connection unit includes an electronic component electrically connected to a battery terminal and a terminal of an electric wire, and an insulating support member that includes a first support body and a second support body and that supports the electronic component, where the first support body is disposed across a space in such a way that a first gap to a first surface becomes a first reference gap, the second support body is disposed across a space in such a way that a second gap to a second surface becomes a second reference gap, at least one first spring member that contacts the first surface while maintaining the first reference gap after attachment to the battery is disposed on the first support body, and at least one second spring member that contacts the second surface while maintaining the second reference gap is disposed on the second support body.

Abstract: A longitudinal cladding member for a motor vehicle, a method for manufacturing the longitudinal cladding member, and a motor vehicle having such a longitudinal cladding member. The longitudinal cladding member is to be fixedly connectable to a body of the motor vehicle, and in an assembled state covers a longitudinal member at least on the visible side of the motor vehicle.

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

Abstract: A sheet feeder feeds product, one at a time, from the bottom of a stack onto a second stage discharge conveyor in which the serialized products are brought into precise registration prior to being deposited onto a moving web. To achieve registration, the products are transported at a higher rate than the speed of a pair of timing belts having regularly spaced lugs projecting therefrom. The lug timing belts are positioned beneath the belts transporting the product with the lugs projecting into the product's path of travel. The speed deference is that a leading edge of the products is brought into engagement with the trailing edge of a laterally aligned pair of lugs before the product arrives at the discharge point of the second stage discharge conveyor. The transport rate on the second stage discharge conveyor is controlled to match the speed of the moving web.

Abstract: A fixture includes a base, a carrier plate, a number of pressing strips, and a cover. The base defines a base receiving chamber. The carrier plate is received in the base receiving chamber and defines a number of receiving portions in a surface opposite to the base, each receiving portion is configured for receiving a camera module, the receiving portions being arranged in a plurality of lines, the carrier plate defines a spacing portion between each two adjacent receiving portions in the same line. Each pressing strip is pressed into the spacing portions associated with one of the lines of the receiving portions to press the camera modules in the lines of the receiving portions. The cover is fixed to the base and covers the carrier plate.

Abstract: A radome comprises a substrate comprising a first material and an outer layer comprising a second material and positioned adjacent to the substrate. Methods for making and using the radome are also disclosed.

Abstract: A method produces adhesive tapes which are adhesive at least on one side, wherein an adhesive tape web, in which the at least one adhesive side is covered by a first liner, is guided into a cutting device in which a total of N individual adhesive tape strips located next to one another are produced in the machine direction from the adhesive tape web. Every other adhesive tape strip is removed from the first liner and is applied to a second liner in each case having a spacing a between the individual adhesive tape strips. The liners are cut between the adhesive tape strips located on the first liner and on the second liner, and the individual adhesive tapes, together with the liner strips, are wound up in a total of X rolls in a form of an Archimedean spiral.

Abstract: An embodiment of the present invention provides a method for manufacturing a composite preform from tape material, including feeding a tape section into a tape section guide that suspends the tape across a tooling surface, moving at least one of the tape section guide and the tooling surface relative to each other to position the tape section at a desired location and orientation relative to the tooling surface, moving the tape section toward a pre-existing tape section disposed on the tooling surface, and tacking the tape section to the pre-existing tape section. A corresponding apparatus for manufacturing composite preforms is also disclosed.

Abstract: An absorbent article has an absorbent composite that includes a water-insoluble fibrous matrix, a superabsorbent polymer composition that has an initial absorbent capacity of at least about 5 grams of saline per gram of superabsorbent polymer composition; and a first triggering mechanism having a first release time of between about 5 and 60 minutes, and a second triggering mechanism. The superabsorbent polymer composition may have a second absorbent capacity that is at least about 25% greater than the first absorbent capacity as measured by the mCRC Test.

Abstract: In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.

Abstract: A method for creating personalized tile that includes creating a tile base, attaching borders to the tile base through the process of scoring and slipping the tile base and the borders to create a tile, and placing mosaics onto the tile.

Abstract: A marine grade, exterior composite finish flooring comprised of a plurality of synthetic wood strips, evenly spaced and joined with a silicone adhesive. The fabrication process involves coating a board with a masking agent and then sawing the board into strips so that the masking agent is only on the tops of the strips and not on the edges. Then adhering the strips to a substrate to achieve proper spacing and orientation. A silicone adhesive caulk is then pressed into the joints and allowed to partially cure. The caulk stuck on the surface of the boards is easily removed as a result of the masking agent. Completed panels are then adhered to a subfloor, for example on the deck of a boat for a durable and aesthetically pleasing deck surface.

Abstract: Disclosed is a device for holding a plurality of semiconductor devices during thermocompression bonding, comprising: a body; a plurality of support surfaces at a first side of the body, each support surface being configured for holding at least one semiconductor device during thermocompression bonding; and a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body. In particular, the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more semiconductor devices against the support surfaces at the first side of the body or to release the same therefrom.

Abstract: A method of protecting a user from a strike by a maximum threat includes adhesively bonding a plurality of solid elements to a support structure in a planar array, dimensions and material properties of the solid elements, support structure, and adhesive being selected to cause an impacted solid element to be dislodged by the maximum threat, and to combine its mass with the projectile for reduced velocity and increased impact area. The support structure is configured to fail in tensile and to allow the combined projectile and solid element to pass through the support structure. The solid elements can be ceramic, and can be commutated upon impact while remaining substantially intact. The solid elements can include titanium backing layers. After formation, ceramic cores can be compressed upon cooling by an outer ceramic layer having a higher coefficient of thermal expansion, the outer layer being formed by glazing or doping.

Abstract: A device and method for bonding first substrates to second substrates. The device includes: a receptacle for accommodating a carrier substrate, a placement device for placing multiple first substrates on a substrate side of the carrier substrate that faces away from the receptacle, and a fixing device for fixing each of the first substrates on the substrate side on at least one fixing section of each first substrate. The method includes the following steps: placement of multiple first substrates on a substrate side of a carrier substrate accommodated on a receptacle, and fixing of each first substrate on the substrate side on at least one fixing section of each first substrate.

Abstract: The present invention discloses a method of splicing polarized films. The method includes steps of providing a substrate; attaching a first polarized film to the substrate; attaching a second polarized film to the substrate so that a side portion of the second polarized film is correspondingly overlapped with a side portion of the first polarized film; correspondingly cutting off the overlapped side portions of the first polarized film and the second polarized film; removing separated parts of the side portions from the first polarized film and the second polarized film; and performing a flatten treatment to the cut side portions of the first polarized film and the second polarized film. The method effectively reduces the interval between spliced polarized films so that the light leakage problem at the joint position is improved.

Abstract: A method for manufacturing a liquid crystal display device by feeding carrier films from continuous rolls, respectively, and by bonding optical films, which are being peeled off or have been peeled off from the carrier films, respectively, to first and second panel surfaces of a liquid crystal panel, respectively, with a pressure-sensitive adhesive interposed therebetween so that the liquid crystal display device is obtained. The method includes: a first bonding step including bonding a first optical film to the first panel surface; a rotation step including rotating the liquid crystal panel; a second bonding step including bonding a second optical film to the first optical film; and a third bonding step including bonding a third optical film to the second panel surface of the liquid crystal panel.

Abstract: Provided is an ESD protection device having high insulation reliability and good discharge characteristics. An ESD protection device includes a first discharge electrode and a second discharge electrode that are disposed so as to face each other, a discharge auxiliary electrode (18) formed so as to span between the first discharge electrode and the second discharge electrode, and an insulator base that holds the first discharge electrode, the second discharge electrode, and the discharge auxiliary electrode (18). The discharge auxiliary electrode (18) includes an aggregate of a plurality of metal particles (24) each having a core-shell structure including a core portion (22) that contains, as a main component, a first metal and a shell portion (23) that contains, as a main component, a metal oxide containing a second metal. A pore (26) is present in at least part of the shell portion (23).

Abstract: A method of transferring a plurality of metal foil labels from a metal foil strip onto a continuous film liner in spaced apart juxtapositions, the method comprising placing metal foil strips onto a continuous web to form an assembly of the strips and the web, feeding the foil strip assembly through a compression roller module, and then feeding the foil strip assembly to a rotary die cutting module to cut through said metal foil strip and portions of said web to form a plurality of metal foil labels.

Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.

Abstract: A strain sensor provided with a substrate that has flexibility; a carbon nanotube (CNT) film that is provided on the surface of the substrate and that has a plurality of CNT fibers oriented in one direction; and a pair of electrodes that are arranged at both ends in the orientation direction of the CNT fibers in the CNT film; in which the CNT film has a plurality of CNT fiber bundles that consist of the plurality of CNT fibers, and a resin layer that covers the peripheral surface of the plurality of the CNT fiber bundles and joins with the surface of the substrate.

Abstract: A method for producing an object of composite material comprising the steps of: placing one or several prepregs on a plane surface, forming a fiber stack; lifting over the fiber stack to a molding tool; downforming the fiber stack; curing the downformed fiber stack; where the method also comprises the step of: orienting the fiber directions so that all fibers, when the fiber stack is lifted over to the molding tool, will cross an edge of the molding tool only once.

Abstract: The invention discloses a compound paper sticking process for lithium ion battery fuses, which comprises the following steps: a compound paper tape formed by the composite of square compound paper and L-shaped compound paper is prepared; a compound paper tape is installed on a semi-automatic compound paper sticking machine; the semi-automatic compound paper sticking machine is started and the compound paper tape moves forward; the semi-automatic compound paper sticking machine stops moving when the compound paper tape moves to working position; operators stick battery fuses on the compound paper of the compound paper tape; the semi-automatic compound paper sticking machine is started and the compound paper of the tape with battery fuse moves forward; the operators take down the battery fuse moved to a rewinding shaft at the other end of the semi-automatic compound paper sticking machine; the compound paper of battery fuse is shaped manually.

Abstract: Disclosed is a method for producing a web (2) comprising at least one protective layer (11, 11a), at least one functional layer (13), and at least one reinforcement layer (14). The reinforcement layer (14) is provided with greater tear strength than the protective layer (11, 11a) while the reinforcement layer (14) is glued to the functional layer (13) or the protective layer (11, 11a). According to the inventive method, the functional layer (13) is welded together with at least one protective layer (11, 11a) on at least one side by means of heat lamination in order to produce a prelaminate (20), and the obtained prelaminate (20) is then glued to the reinforcement layer (14).

Abstract: Provided are a material roll and a method for manufacturing the material roll in which lifting between base films and an optical film is hardly generated. Provided is a material roll (R), wherein a first base film (F12), a first pressure-sensitive adhesive layer (F14), an optical film (F11), a second pressure-sensitive adhesive layer (F15) and a second base film (F13) are wounded together in a manner that said layers are laminated in said order from outer side. An adhesive power A of the first pressure-sensitive adhesive layer (F14) at an interface on the first base film (F12) side, an adhesive power B of the first pressure-sensitive adhesive layer (F14) at an interface on the optical film (F11) side, an adhesive power C of the second pressure-sensitive adhesive layer (F15) at an interface on the optical film (F11) side, and an adhesive power D of the second pressure-sensitive adhesive layer (F15) at an interface on the second base film (F13) side satisfy the relationships A<B and A<C<D.

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract: The urisheath provided here includes an element of thin material (a strip) that allows at least two lengths of it to run in a parallel fashion down either side of the sheath. The is obtained by injection molding the strip in liquid silicone in the silicone injection molding process for the urisheath, either by one, two or more component injection molding. The injection molding takes place in an injection molding form for a urisheath with a cavity for the body portion and a cavity for the strip portion wherein the cavity for the body portion is connected to the cavity for the strip portion creating an attachment zone between the strip and the sheath.

Abstract: A method of applying a strip of tape includes directing air pressure at a raised section of a conductor.

Abstract: A method for manufacturing a cushioning element may include securing a plurality of pad components to pins that extend outward from a base, each of the pins having a non-circular short-axis cross-sectional shape. The pad components are then compressed between the base and a material layer to bond the pad components to the material layer. In some configurations, the pins may have an elongate short-axis cross-sectional shape. In some configurations, the pins may have an elliptical short-axis cross-sectional shape. Additionally, in some configurations, the pins may have a short-axis cross-sectional shape selected from triangular, square, rectangular, hexagonal, and semi-circular.

Abstract: A method for manufacturing the cushioning elements may include utilizing a die with a plurality of die elements positioned in a particular arrangement. A polymer material, which may be a polymer foam material, is located between the die and an extractor. The polymer material is compressed between the die and the extractor, and the die elements cut the polymer material to form a plurality of pad components, which are arranged like the die elements. The die and the extractor are separated, and the pad components are secured to the extractor in the arrangement of the die elements. Additionally, the pad components are bonded to at least one material layer such that the pad components remain in the arrangement of the die elements.

Abstract: A method includes moving an absorbent composite in a machine direction, severing the composite at a first cut oriented in a direction that is non-parallel and non-perpendicular with the machine direction, severing the composite at a second cut oriented in a direction that is non-parallel and non-perpendicular with the machine direction, severing the composite at a third cut oriented in a direction that is perpendicular to the machine direction, and separating the composite along the first cut, the second cut, and the third cut into discrete absorbent articles.

Abstract: A positioning device for positioning a number of two-sided adhesive pieces includes a base, a number of pulling blocks, and a pressing block. The base includes a positioning block defining a number of positioning holes. Each pulling block includes a connecting plate, and a supporting plate protruding out from a top end of the connecting plate. A first surface of each adhesive piece is adhered on a top surface of one of the supporting plate. The connecting plate is received in a corresponding one of the positioning hole. The pressing block is attached to the positioning block. A second surface of each adhesive piece to be adhered to a bottom surface of the pressing block.

Abstract: A method for producing a laminated optical film that allows three-dimensional images to be reproduced, which is preferably used in a large image display apparatus. One embodiment of the method includes laminating a polarizing plate and a ?/4 plate and forming a ?/2 layer partially on the ?/4 plate. The polarizing plate and the ?/4 plate are laminated such that an angle between an absorption axis of a polarizer of the polarizing plate and a slow axis of the ?/4 plate is substantially 45°, and the ?/2 layer is formed such that an angle between the absorption axis of the polarizer and a slow axis of the ?/2 layer is substantially 45°.

Abstract: A cover tape includes a polymer film substrate having first and second opposed major surfaces. A primer layer is disposed on the first major surface of the polymer film substrate. A static control layer is disposed on the primer layer, the static control layer comprising carbon nanotubes dispersed in a dielectric polymeric binder, wherein the static control layer has a thickness of from 0.1 to 2 microns. Adhesive strips are disposed on the static control layer adjacent opposite edges of the static control layer. Methods of making cover tapes according to the present disclosure, and component packages including them, are also disclosed.

Abstract: The present invention is directed to a process for manufacture of a solar panel string assembly for a solar canopy including: horizontally aligning two solar panel support channels substantially parallel to one another; applying an adhesive with a robotic tool to an upper portion of the solar panel support channels, the robotic tool comprising a fixed track aligned parallel with the two solar panel support channels, a robotic arm assembly movably supported by the track, a positioning member for adjusting the position of the robotic arm assembly along the track, and wherein the robotic arm comprises an adhesive applicator and a vacuum lift component; and lifting with the vacuum lift component of the robot arm assembly of the robotic tool and aligning a solar panel on top of the two solar panel support channels near opposing edges of the solar panel.

Abstract: There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2?D99/D50?3 and 2?D50/D1?3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented.

Abstract: A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.

Abstract: A method for interleaving a module including the cutting out of the module on a strip, the gripping of the cut-out module, the conveying of the module right up to a station for affixing and adhesively bonding modules. The module being heated by a heater via heat conduction of an affixing system upon conveying and then affixing of the preheated module by positioning the head of a first guiding member on the upper portion of a second guiding member forming a mask showing the imprint of the module or chip, preformed on the card, by displacement of the affixing system and of positioning the lower portion of the second guiding member on the surface of the card by displacement of the assembly formed by the affixing system and the second guiding member. A device for interleaving a module is also described.

Abstract: The present invention relates to polyethylene material that has a plurality of unidirectionally oriented polyethylene monolayers cross-piled and compressed at an angle to one another, each polyethylene monolayer composed of ultra high molecular weight polyethylene and essentially devoid of resins. The present invention further relates to ballistic resistant articles that include or incorporate the inventive polyethylene material and to methods of preparing the material and articles incorporating same.

Abstract: An absorbent article having improved handling of liquid and improved intake and retention of liquid loadings during use. The absorbent article can minimize the amount of moisture in contact with a wearer's skin and can provide a feeling of softness on the skin of the wearer.

Abstract: A flexible material includes a plurality of separate resilient elements joined to a flexible, resiliently stretchable substrate. Such a material is suitable for providing protective war for human and animal bodies. Preferably, the elements includes a foam material such as a closed cell polyethylene foam and the substrate includes a knitted fabric. In an advantageous embodiment, a second flexible substrate is bonded over the elements to sandwich them between the two layers of substrate.