With Heating Of Lamina Prior To Assembly Patents (Class 156/309.9)
  • Patent number: 11220094
    Abstract: A film-laminated metal plate having excellent retort adhesiveness includes: a metal plate; a resin film thermally fusion-bonded to a surface of the metal plate; and a bubble contained between the metal plate and the resin film. An average bubble height of three bubbles with higher heights among the bubbles measured by using a 3D analysis image of a laser microscope is 0 ?m or more and 5.0 ?m or less. The test piece is obtained by cutting a portion of one end side of the metal plate in a longitudinal direction while leaving the resin film on a side which becomes an inner surface side of the container when the film-laminated metal plate is processed into a container. When a retort treatment is carried out on the test piece at a temperature of 125° C.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: January 11, 2022
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Nobuo Kadowaki, Yoichiro Mori, Tadaaki Ochiai, Akihiko Hirata, Kazushi Iwakiri, Tomohiro Mizutani, Satoshi Kato
  • Patent number: 10815351
    Abstract: Disclosed are a process of producing a polyurethane foam product, a polyurethane foam product pre-mix, polyurethane foam product formulation, and a polyurethane foam product. The process of producing the polyurethane foam product includes contacting a halohydrin component with a polyurethane foam product pre-mix. The polyurethane foam product pre-mix includes the halohydrin component. The polyurethane foam product formulation includes a polyol component, an isocyanate component, and a halohydrin component. The polyurethane foam product is formed by the pre-mix having the halohydrin component.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: October 27, 2020
    Assignee: Evonik Operations GmbH
    Inventors: Juan Jesus Burdeniuc, Boxun Leng, Torsten Panitzsch, Stephan Wendel, Renee Jo Keller
  • Patent number: 10538054
    Abstract: A heat-dissipating film comprising a heat-conductive layer obtained by burning a mixture layer of flaky carbon and a binder resin to carbonize or burn off the binder resin, and plastic films covering the heat-conductive layer, the heat-conductive layer having a density of 1.9 g/cm3 or more and thermal conductivity of 450 W/mK or more, is produced by (1) sandwiching a mixture layer of flaky carbon and a binder resin with a pair of first plastic films to form a laminated film; (2) heat-pressing the laminated film to densify the mixture layer; (3) burning the mixture layer to carbonize the binder resin in the mixture layer; (4) pressing the resultant burnt layer to form the heat-conductive layer; and (5) sealing the heat-conductive layer with second plastic films.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: January 21, 2020
    Inventor: Seiji Kagawa
  • Patent number: 10399296
    Abstract: A method of manufacturing at least one structural panel (20) for an engineering structure comprises conveying a layered structure (40) through a roller assembly comprising at least one pair of heating rollers (50) and at least one pair of cooling rollers (52), where the cooling rollers are at a lower temperature than the heating rollers. The layer structure comprises a thermoplastic foam layer 24 and at least one skin layer (22). The heating rollers 0 heat the skin layer (22) to melt at least part of the foam layer (24) adjacent to the skin layer (22) and bond the foam layer (24) to the skin (22). The cooling rollers (52) cool the layered structure (40) so that the thermoplastic resolidifies, retaining its bond with the skin to form the bonded panel (20). This approach greatly reduces manufacturing costs for structural panels.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: September 3, 2019
    Inventor: Daniel Jefferson Muir
  • Patent number: 10256169
    Abstract: A highly-reliable semiconductor device has improved adhesion between a sealing material and a sealed metal member and/or a case member. In some implementations, the semiconductor device includes: a laminated substrate on which a semiconductor element is mounted; and a sealing material. In some implementations, the sealing material contains an epoxy base resin, a curing agent, and a phosphonic acid.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: April 9, 2019
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Naoyuki Kanai, Tatsuhiko Asai
  • Patent number: 10233525
    Abstract: Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: March 19, 2019
    Assignee: APPLE INC.
    Inventors: Christopher D. Prest, Joseph C. Poole, Joseph Stevick, Quoc Tran Pham, Theodore Andrew Waniuk
  • Patent number: 9844928
    Abstract: Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: December 19, 2017
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Jean Claude Duart, Serge Rebouillat, Radoslaw Szewczyk, Roger Curtis Wicks
  • Patent number: 8968504
    Abstract: A method for manufacturing a laminated film according to the present invention is a method for manufacturing a laminated film constituted by laminating a first film and a second film. The method includes a lamination step of pasting together the first film and the second film in a state where the first film is stretched to be longer than a natural length thereof in a predetermined direction.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: March 3, 2015
    Assignee: Shinmarutokushushigyo Co., Ltd.
    Inventors: Takahiko Tsurumaki, Syusaku Sasano
  • Publication number: 20150047774
    Abstract: Methods of bonding polyester substrates together, comprising externally delivering thermal energy onto the bonding surfaces of the substrates and bringing the bonding surfaces into proximity with each other and bonding the substrates to each other.
    Type: Application
    Filed: November 28, 2012
    Publication date: February 19, 2015
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Joel A. Getschel, Mark A. Strobel, Matthew J. Schmid, Jeffrey P. Kalish, James M. Jonza, Ibrahim S. Gunes, Duane D. Fansler
  • Patent number: 8956496
    Abstract: Apparatus and methods for impinging a heated fluid onto the surface of a substrate and then locally removing the impinged fluid. The apparatus and methods may be used to heat a surface of a substrate e.g. so that the substrate can be melt-bonded to another substrate.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: February 17, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Kristopher K. Biegler, Michael R. Gorman
  • Publication number: 20150030808
    Abstract: Foam laminates reinforced by securing a reinforcement member between the layers of the laminate. The reinforcement member is secured between the sheets of foam that comprise the laminate during the lamination process. Spaces in the surface of the reinforcement member allow the foam sheets to bond to one another during lamination, securing the reinforcement member without additional steps or material.
    Type: Application
    Filed: November 13, 2012
    Publication date: January 29, 2015
    Inventor: Craig Cushman
  • Publication number: 20140374248
    Abstract: A method for the dry production of a membrane-electrode unit includes assembling a layered configuration including a centrally positioned membrane produced by extrusion and pre-dried at a temperature between 80° C. and 100° C. for 15 min to 30 min, a substrate-electrode unit on each side of the membrane having an electrode layer applied to a substrate, an optional frame around each substrate-electrode unit for fixing the substrate-electrode unit, and two separating films on outer sides. The configuration is pressed together between two laminating rollers so that a pressure connection is produced at least between the membrane and the electrode layers. A short production time is achieved because it is not necessary to keep the membrane moist at high temperatures under pressure. A membrane electrode unit and a roller configuration are also provided.
    Type: Application
    Filed: August 16, 2012
    Publication date: December 25, 2014
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Armin Datz, Klaus Dennerlein, Carola Kuehn, Andreas Reiner, Werner Straub
  • Publication number: 20140370245
    Abstract: A method for manufacturing a shaped product includes 1) heating at least three prepregs having a thickness of 0.3 mm to 5.0 mm each including reinforcing fibers having an average fiber length of 3 to 100 mm and a thermoplastic resin, 2) arranging those prepregs so as to constitute at least two layers including P layer and Q layer which are in contact with each other, and 3) then pressing those layers to manufacture one shaped product. A prepreg (p1) in the P layer and a prepreg (q1) in the Q layer are arranged such that at least a part thereof overlaps with each other, and two or more prepregs in the same layer are arranged so as not to be in contact with each other.
    Type: Application
    Filed: December 20, 2012
    Publication date: December 18, 2014
    Applicant: Teijin Limited
    Inventors: Yasunori Nagakura, Yasuyuki Yokoe, Yutaka Kondou, Motoomi Arakawa
  • Publication number: 20140360668
    Abstract: Apparatus and method are disclosed for heat bonding or welding a thermoplastic component to a sealing member such as a film or foil having a thermoplastic portion. The apparatus preferably includes a 3-axis arrangement for accurate and repeatable positioning of the component and foil during bonding and for variation of bonding parameters, such as material, pressure, temperature and/or time.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 11, 2014
    Inventor: James Madsen
  • Publication number: 20140335301
    Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
    Type: Application
    Filed: December 21, 2012
    Publication date: November 13, 2014
    Inventors: Ronny Van 'T Oever, Marko Theodoor Blom, Jeroen Haneveld, Johannes Oonk, Marinus Bernardus Olde Riekerink, Peter Tijssen, Hendrik Jan Hildebrand Tigelaar, Jean-Noël Fehr, Jean-Christophe Roulet, Amitava Gupta
  • Patent number: 8859102
    Abstract: The disclosure is directed to a barrier structure including a fluoropolymer layer, a polymeric layer, and an adhesive layer. The barrier structure has a chemical permeation breakthrough detection time greater than about one hour for hazardous chemicals as measured by ASTM F739. The disclosure is further directed to a method of forming the aforementioned barrier structure. The barrier material is designed to be suitable for construction of shelters, clothing, containers and other articles requiring barrier properties.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: October 14, 2014
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: Hua Fan, Peter A. Kirk, II, Robert C. Hobbs, Anne B. Hardy, Michael J. Lussier
  • Patent number: 8859101
    Abstract: The disclosure is directed to an article including a first layer, second layer, and third layer. The first layer includes a fluoropolymer having a first major surface and a second major surface. The second layer overlies the first major surface of the first layer and includes an adhesive layer. The third layer overlies the second layer and includes a polymeric material. The article has a burst performance greater than 200 N as measured by ASTM D751 and a chemical permeation breakthrough detection time greater than about one hour as measured by ASTM F739. The disclosure is further directed to a method of forming the aforementioned multi-layer article.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: October 14, 2014
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: Peter A. Kirk, II, Ruth A. Jamke, Robert G. Pleydon, Jiri George Drobny
  • Patent number: 8859100
    Abstract: The disclosure is directed to a barrier structure including a fluoropolymer layer and a polymeric layer. The barrier structure has a chemical permeation breakthrough detection time greater than about one hour for hazardous chemicals as measured by ASTM F739. The disclosure is further directed to a method of forming the aforementioned barrier structure. The barrier material is designed to be suitable for construction of shelters, clothing, containers and other articles requiring barrier properties.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: October 14, 2014
    Assignee: Saint-Gobain Performance Plastics Corporation
    Inventors: Peter A. Kirk, II, Ruth A. Jamke, Robert G. Pleydon, Jiri George Drobny
  • Patent number: 8858743
    Abstract: The invention relates to a process for sealing an above-ground or underground construction. In particular it involves the use of non-reactive hot melt adhesives and flexible polyolefin films. This procedure in particular has the advantages that good and long-lasting adhesion can be achieved very quickly, and that in particular by using polyolefin strips coated with non-reactive hot melt adhesives, insulating strips can be obtained simply which are non-tacky at room temperature and can be processed and bonded easily at the construction site.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: October 14, 2014
    Assignee: Sika Technology AG
    Inventors: Martin Linnenbrink, Doreen Janke
  • Publication number: 20140290744
    Abstract: A solar cell supporting layer stack for mechanically supporting a solar cell is described. The solar cell includes: a rigid foam layer; one or more skin layers disposed adjacent to said rigid foam layer; and wherein said rigid foam layer and said one or more skin layers capable of providing mechanical support to said solar cell when said supporting layer stack is disposed adjacent to said solar cell.
    Type: Application
    Filed: October 12, 2012
    Publication date: October 2, 2014
    Applicant: Giga Solar FPC
    Inventor: Thomas G. Hood
  • Patent number: 8821679
    Abstract: The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: September 2, 2014
    Assignee: Material Sciences Corporation
    Inventors: Robert Roelofs, Dan Bullard, Mike Bilos, Bryan Tullis
  • Publication number: 20140238600
    Abstract: A transfer press comprising a frame, an upper platen assembly having an induction heatable upper platen, a lower platen assembly attached to the frame. The lower platen assembly is disposed below the upper platen assembly, and an apparatus is attached to the frame and to the upper platen for moving the upper platen between a raised and lowered position relative to the lower platen and for pressing the upper platen against the lower platen. An induction heater is located adjacent the upper platen for heating the upper platen.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Inventor: John Edward MAHN
  • Publication number: 20140216644
    Abstract: An adhesive film, which can be bonded when heat-activated, comprising a) a polymer-metal blend comprising at least one adhesive which can be bonded when heat-activated, and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.
    Type: Application
    Filed: July 10, 2012
    Publication date: August 7, 2014
    Applicant: tesa SE
    Inventor: Klaus Keite-Telgenbüscher
  • Publication number: 20140182782
    Abstract: A belt welding apparatus is provided for joining together the ends of one or more monolithic conveyor belts. In one form, a belt support is configured to support the belt ends in spaced relation to each other and a non-contact heating device is provided for being disposed between the belt ends to generate thermal radiation for joining the belt ends together. In one form, the non-contact heating device is a ribbon heating device. In another form, a drive mechanism is operable to cause relative movement of a pair of platens, for supporting belt ends, toward and away from each other and a heating device between heating and stowed positions. An actuator of the drive mechanism is movable by an operator between at least three operation positions corresponding to three different operation positions of the platens.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: Flexible Steel Lacing Company
    Inventors: Andrew J. Zieger, Joannes Stefanus van 't Schip
  • Publication number: 20140147641
    Abstract: A panel comprises a polymeric composite layer and a cover layer which is laminated to the polymeric composite layer, wherein the cover layer comprises a polymeric film.
    Type: Application
    Filed: June 30, 2011
    Publication date: May 29, 2014
    Applicant: Spanolux N.V.-Div. Balterio
    Inventor: Bruno Paul Louis Vermeulen
  • Publication number: 20140116619
    Abstract: A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C.
    Type: Application
    Filed: January 7, 2014
    Publication date: May 1, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takuya MASE, Takahiro FUJII, Asuka GOMI
  • Publication number: 20140110054
    Abstract: There is provided a manufacturing method for a composite structure that makes it possible to join a thermoplastic resin molding, which serves as a second member for reinforcement, while at the same time preventing the deformation of a first member to be reinforced. The second member contains magnetic substances in a portion thereof that is to be abutted on the first member. The second member is introduced into an induction heating unit and subjected to induction heating, thereby heating the abutting portion of the second member to join the second member to the first member.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 24, 2014
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tomohiko Shigihara, Takayuki Hoshino, Yosuke Ikadai, Yuuki Kami, Toshihiro Murakawa
  • Patent number: 8702896
    Abstract: A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: April 22, 2014
    Assignee: Ricoh Company, Ltd.
    Inventors: Mitsunobu Morita, Tomoyuki Kugo, Hiroshi Goto, Norihiko Inaba
  • Patent number: 8697337
    Abstract: An apparatus for laminating a film to a substrate and a method of using the same is described. The apparatus comprises a) a heated laminating roller and a second roller, wherein said heated laminating roller and said second roller are opposably mounted and form a nip; b) a drive mechanism for rotating the heated laminating roller and second roller; c) a film supply roller adapted to support a roll of film and supply the film over an outer surface of the heated laminating roller and into the nip, wherein the film is contactable with a top surface of the substrate at a point where the substrate advances through the nip; and d) a splitter bar in contact with the film supplied from the supply roller, wherein the position of the splitter bar controls a wrap angle between the film and the heated laminating roller.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: April 15, 2014
    Inventors: Albert G. Roshelli, Jr., David A. Recchia
  • Publication number: 20140079913
    Abstract: The invention provides a multilayer resin sheet that includes: a resin composition layer that includes a thermosetting resin and a filler; and an adhesive layer that is disposed on at least one surface of the resin composition layer, the adhesive layer having an arithmetic average surface roughness Ra of 1.5 ?m or less at a surface that does not face the resin composition layer.
    Type: Application
    Filed: February 24, 2012
    Publication date: March 20, 2014
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Yasuhiko Awano
  • Publication number: 20140063371
    Abstract: Provided is a cover structure used for a touch panel, including: a substrate and a masking layer buried in the substrate. The region where the masking layer is located defines a non-visible region of the touch panel. In addition, a method for fabricating the cover structure and a touch panel including the cover structure are also provided.
    Type: Application
    Filed: September 2, 2013
    Publication date: March 6, 2014
    Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.
    Inventors: Yau-Chen Jiang, Jianbin Yan, Defa Wu, Feng Chen
  • Patent number: 8652290
    Abstract: Apparatuses and methods for bonding together two or more layers of oriented polymer material or secondary material to form a rigid member. Two or more layers of material are initially restrained along an orientation axis to prevent contraction and loss of orientation. Then, the contact surfaces of each layer of material are heated to a temperature above the melting point for each respective material. Next, the heated contact surfaces are merged together, and pressure is applied to the merged contact surfaces to combine the layers. Once combined, the layers are cooled, and a rigid unitary member is formed.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: February 18, 2014
    Inventors: David G. Haverty, Thomas B. Peeler
  • Publication number: 20140014266
    Abstract: The invention relates to an edge coating apparatus (1) for application of a strip-shaped edge strip (4) to narrow surfaces (6) of a work piece (5), wherein the edge strip (4) can be attached to the narrow surfaces (6), particularly in multiple layers, without adhesive or with a hot-melt glue layer between edge strip (4) and narrow surface (6), in heat-activatable manner, having at least a feed device (7) for the edge strip (4) and a press-down device (9) that presses the heat-activated edge strip (4) against the narrow surface (6) of the work piece (5).
    Type: Application
    Filed: March 31, 2012
    Publication date: January 16, 2014
    Inventor: Christof Schulte-Goebel
  • Patent number: 8608897
    Abstract: An adhesive-applying method is disclosed herein. The method comprises: providing a film comprising pressure sensitive adhesive coated on a major surface thereof; heating the film to a softening point of the film; and pressing the film against a substrate with an application device, the application device comprising a film-contacting portion, the film-contacting portion comprising a foam material and having a thermal conductivity of less than 1.8 BTU/hr-in-ft2-° F.; wherein the pressure sensitive adhesive on the major surface of the film adheres to the substrate. Application devices and kits that may be used in conjunction with the method are also disclosed herein.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: December 17, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Ronald S. Steelman, John R. David
  • Patent number: 8580072
    Abstract: A device for the intake or manipulation of a fluid, in particular, a liquid, and a method for the production of a device of this type in which a flat, non-preformed covering film is laminated onto a carrier, a three-dimensionally shaped or convex chamber wall being formed solely by means of the laminating process. The chamber wall which forms a boundary of a chamber for the fluid is partially deformable. The device is simple to produce and can be used universally.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: November 12, 2013
    Assignee: Boehringer Ingelheim microParts GmbH
    Inventors: Gert Blankenstein, Tobias Rodenfels, Dirk Kurowski, Mario Hempel
  • Patent number: 8580069
    Abstract: To provide a method of bonding two materials directly with each other, at least one of which is made of a plastic material, which method is applicable to bonding two materials, with no need to use any bonding agent and without allowing the materials to be exposed to high temperature and/or high pressures. In this method in which a first member made of a plastic material and a second member are bonded together, one surface of the first member to be bonded with the second member is irradiated with energy rays having a quantity of energies not lower than 4 eV, followed by directly bonding the first and second members together without any bonding agent being used.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: November 12, 2013
    Assignee: Kuraray Co., Ltd.
    Inventors: Tatsufumi Watanabe, Junichi Tanaka, Atsushi Nagasawa, Shinji Hiramatsu, Katsuya Fujisawa
  • Patent number: 8551282
    Abstract: A heating system for hot coupling or laminating at least two films or thin sheets, said heating system comprising at least a heater group comprising at least a burner, and an airtight chamber.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: October 8, 2013
    Assignee: S.A.T. Engineering S.A.S. di Francesco d'Ursi & C.
    Inventor: Francesco D'Ursi
  • Patent number: 8529719
    Abstract: An efficient and cost-effective method of manufacturing a kink-resistant tube, wherein a coated wire is wound around a mandrel while simultaneously being heated to melt the coating, is provided.
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: September 10, 2013
    Assignee: Applied Medical Resources Corporation
    Inventors: Edward D Pingleton, Matthew N Petrime, Ghassan Sakakine, Jeremy J Albrecht, Nabil Hilal
  • Patent number: 8524031
    Abstract: The invention relates to a lining method and a lining installation for the production of multi-layer products which are used, for example, to produce floor or wall coverings or interior trim for passenger transport vehicles, such as cars, railroad cars, ship cabins and aircraft cockpits.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: September 3, 2013
    Assignee: Tarkett SAS
    Inventors: Luc Forget, Alexandre Siche
  • Publication number: 20130220538
    Abstract: A dunnage platform is in the general shape of a rectangular slab with legs extending form one side. The dunnage platform is made from an expanded polystyrene core. A chemical combination process is used to chemically combine portion of the core proximal to its surface with high impact polystyrene. In a first of two parts of the combination process, the core is placed in a forming mold with one of its two sides and two thirds of its thickness extending therefrom. A heated sheet of high impact polystyrene is brought into contact with the portion of the core extending from the mold. In a similar manner, the other of the two sides of the core is made to extend from the forming mold for contact with a heated sheet of high impact polystyrene.
    Type: Application
    Filed: April 6, 2013
    Publication date: August 29, 2013
    Applicant: AIRDEX INTERNATIONAL, INC.
    Inventor: AIRDEX INTERNATIONAL, INC.
  • Publication number: 20130189625
    Abstract: An apparatus for laminating a film to a substrate and a method of using the same is described. The apparatus comprises a) a heated laminating roller and a second roller, wherein said heated laminating roller and said second roller are opposably mounted and form a nip; b) a drive mechanism for rotating the heated laminating roller and second roller; c) a film supply roller adapted to support a roll of film and supply the film over an outer surface of the heated laminating roller and into the nip, wherein the film is contactable with a top surface of the substrate at a point where the substrate advances through the nip; and d) a splitter bar in contact with the film supplied from the supply roller, wherein the position of the splitter bar controls a wrap angle between the film and the heated laminating roller.
    Type: Application
    Filed: January 23, 2012
    Publication date: July 25, 2013
    Inventors: Albert G. Roshelli, JR., David A. Recchia
  • Patent number: 8443859
    Abstract: A manually operated or automated bonding tool for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool includes a loading module in which the bare bonding part is loaded, an oven module in which the bare bonding part is heated, an adhesive picking station module in which the adhesive is attached to the heated bare bonding part, and a part transfer module which advances the bare bonding part sequentially from the loading module, through the oven module, and to the adhesive picking station module. The oven module includes an elongated heating block having a bonding part guide by which the bare bonding parts are transferred through the oven and to the adhesive picking station module. The part transfer module is used to push the unheated bare bonding part into and through the oven module and into position on the adhesive picking station module.
    Type: Grant
    Filed: September 18, 2010
    Date of Patent: May 21, 2013
    Assignee: A. Raybond et Cie
    Inventors: Mathias Hänsel, Herbert Le Pabic, Frederic Laure, Olivier Daverio
  • Patent number: 8438710
    Abstract: A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: May 14, 2013
    Inventor: Gang Li
  • Publication number: 20130112351
    Abstract: A method for the attachment of a formed adhesive element (34,34?) to a hot bonding part (10) in a practical and efficient way is disclosed. The formed adhesive element may be attached to the hot bonding part by the end-user prior to attachment of the hot bonding part to the substrate. In order to attach the formed adhesive element (34,34?) to the bonding part according to the disclosed invention, the bonding part (10) is heated then is moved in position over the formed adhesive element positioned on a detent of a matrix plate (36). Thereafter the hot bonding part is moved into contact with the formed adhesive element or the formed adhesive element is moved against the hot bonding part. The bonding part, now having the formed adhesive element attached, is ready for attachment to the substrate. One or more formed adhesive elements may be attached to the bonding part. Attachment of the formed adhesive elements to the bonding part may be done manually or mechanically.
    Type: Application
    Filed: May 3, 2011
    Publication date: May 9, 2013
    Applicant: A. RAYMOND ET CIE
    Inventors: Mathias Hansel, Frederic Laure, Olivier Daverio
  • Patent number: 8409386
    Abstract: Storage tank assemblies and methods for water on water reverse osmosis systems. A bladder type storage tank is fabricated by forming first and second shells, which when joined together at a center region of each shell, form a tank enclosure, the first shell having first and second openings therein away from the center region of the respective shell, coupling a bladder to the first opening in the first shell so that the bladder will be within the tank enclosure when the first and second shells are joined together at a center region of each shell, temporarily holding the bladder in a collapsed state away from the center region of the first shell with one or more strings and passing the strings through the second opening, welding the first and second shells together at the center region of each shell to form the tank enclosure, and withdrawing the strings to release the bladder.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: April 2, 2013
    Assignee: Next-RO, Inc.
    Inventors: John Jay Julos, Timothy Allen Beall
  • Publication number: 20130037211
    Abstract: The invention relates to a device for welding profiled parts (8), in particular plastics profiled parts, having at least one welding head (1) that can be positioned in a predetermined or predeterminable target welding position (6) relative to another welding head (1, 9) and/or relative to a holding device. According to the invention the welding head (1) and/or a part of the welding head (1), that comprises at least one heating element, such as a heating plate, for melting the profiled parts, can be positioned and/or is movable in accordance with at least one dimensional variation of at least one of the profiled parts (8) from a target dimension in a spatial tolerance range (5) around the target welding position (6).
    Type: Application
    Filed: February 1, 2011
    Publication date: February 14, 2013
    Applicant: ROTOX Besitz-und Verwaltungsgesellschaft mbH
    Inventors: Bernd Eisenbach, Hans Schmitt
  • Patent number: 8366854
    Abstract: The invention relates to a method for producing a decorated laminate having a plate-shaped core made of wood or wood material, a decorative layer on at least one side of the core, and a cover layer made of aminoplast on the decorative layer, comprising the following steps: attaching the decorative layer, applying a layer made of an aqueous solution of an aminoplast precursor to form a cover layer on the decorative layer, at least partially drying the cover layer, curing the aminoplast under pressure and heat, wherein a part of said solution of said aminoplast precursor is initially applied and the partial layer thus generated is dried and said step is repeated at least twice, in order to form the final cover layer.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: February 5, 2013
    Assignee: Surface Technologies GmbH & Co., KG
    Inventor: Carsten Buhlmann
  • Patent number: 8361271
    Abstract: To form an electrostatic chuck, a bonding sheet is applied onto the upper surface of a cooling plate and then the cooling plate is placed in a vacuum dryer at a pressure of 2,000 Pa or less for a pre-bake treatment at 120° C. to 130° C. for 15 to 40 hours, followed by natural cooling. A plate is then stacked on the bonding sheet so that the lower surface of the plate is aligned with the upper surface of the bonding sheet, which is applied onto the cooling plate. The resulting stacked body is placed in a heat-resistant resin bag, and is then placed in an autoclave and treated together for several hours under pressure and heat.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: January 29, 2013
    Assignee: NGK Insulators, Ltd.
    Inventors: Yasufumi Aihara, Hiroya Sugimoto, Shunsuke Tanaka, Kazuma Ohba, Jyunya Waki
  • Publication number: 20120270022
    Abstract: A process for producing a composite of a polyarylene ether ketone foil a metal foil is provided. The process includes: providing a foil of thickness from 5 to 1200 ?m made of a molding composition which comprises: from 60 to 96 parts by weight of polyarylene ether ketone, from 2 to 25 parts by weight of hexagonal boron nitride and from 2 to 25 parts by weight of talc, where the sum of the parts by weight of the components is 100; providing a metal foil of thickness from 10 to 150 ?m; and pressing the foils without using an adhesive at a temperature in the range from Tm?40K to Tm+40K and at a pressure in the range from 4 to 5000 bar. Also provided is the adhesive-free composite foil which is suitable for producing dimensionally stable circuit boards.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 25, 2012
    Applicant: Evonik Degussa GmbH
    Inventors: Kirsten ALTING, Joerg BLASCHKE
  • Patent number: 8287676
    Abstract: A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible resin film. When the substrates are laminated, the lower substrate 6 on one hand is aligned to the upper substrate 7 on the other hand in every arbitrary length. With this arrangement, productivity can be improved as well as a positional dislocation due to accumulation of positioning errors can be prevented.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: October 16, 2012
    Assignees: JSR Corporation, Sumitomo Chemical Company, Limited, Sumitomo Bakelite Co., Ltd., Dai Nippon Printing Co., Ltd., Toppan Printing Co., Ltd., NEC Corporation, Hitachi Chemical Co., Ltd.
    Inventor: Atsuo Nozaki