Abstract: In the preparation of an improved adhesive composition, an epoxy-based prepolymer is obtained by the reaction of one or more epoxy resins with amino-terminated polyethers and/or carboxyl-terminated butadiene-nitrile rubbers. In one embodiment of the invention, both a solid epoxy resin and a liquid epoxy resin, each of which is a diglycidyl ether of a polyphenol such as bisphenol A, are used. The epoxy-based prepolymer is mixed with an acrylate-terminated urethane resin (preferably, one based on a polyol having a number average molecular weight of at least about 400) and a heat-activated latent curing agent to make an adhesive composition which can be pumpable at room temperature. Curable adhesives capable of expansion to about 100% with high impact resistance after curing may be obtained by inclusion of expanding agents such as expandable microspheres.

Abstract: A laminate formed from a first fiber-reinforced ply joined by a laminating resin composition to a second fiber-reinforced ply. The laminating resin composition is the cured residue of a polyester resin being end-terminated with an alkyl acrylate group and diluted with less than about 35 wt-% styrene. The first fiber-reinforced ply is laminated to the second fiber-reinforced ply with the laminating resin composition by coating a surface of the first ply with an adhesive composition. The coated first ply surface is joined with a surface of the second ply and the adhesive cured. In making the laminating resin composition, unreacted alkyl acrylate can be reacted with an epoxy to push the reaction to completion.

Abstract: A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): in which R1 represents H or -Z1-NH2 and Z1 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms and R2 represents H or -Z2-NH2 and Z2 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, it being possible for R1 and R2 to be identical or different. The tie resin may also be a copolymer having polyamide blocks and polyether blocks, the polyamide blocks resulting from condensation of at least one diacid and at least one diamine of formula (1). The invention also relates to a structure comprising a fluoropolymer layer, the tie layer and a substrate layer, respectively, as well as to a structure comprising a tie layer, respectively.

Abstract: The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides and oxygen and sulfur derivatives thereof, and oxygen and sulfur analogues of sulfimides.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: A laminated composite fabric material used for example in the manufacture of automobile air bags has at least one thermoplastic coating layer that is pressure laminated to a pre-treated fabric using an adhesive. The fabric, pre-treated with a curing agent such as an alkyl ether amine, resists penetration by the adhesive, resulting in a softer, more pliable composite fabric. The composite fabric also optionally includes a layer comprising a silicone polyurethane copolymer or acrylic cross-linked with a blocked isocyanate, which functions as a non-stick coating. The invention also relates to a method for manufacturing a laminated composite fabric.

Abstract: A method for bonding DVD layers which comprises EB bonding at least two layers of a DVD with an EB curable adhesive composition which consists essentially of at least one epoxy resin and at least one aryl iodonium salt (cationic) photoinitiator and DVDs produced by this method.

Abstract: This invention relates to a visible light or UV/visible light and anaerobically curable composition for encapsulating the surface of the primer mix disposed in the primer cup, particularly for use in center fire ammunition.

Abstract: Metal alkyl borohydrides are used as initiators of polymerisation, particularly in adhesive compositions for bonding a wide range of substrates including low surface energy substrates such as polyolefins. As described, the metal alkyl borohydrides are of the formula I or II. wherein R1 is C1-C10 alkyl, R2 and R3, which may be the same or different, are H, D, C1-C10 alkyl or C3-C10 cycloalkyl, phenyl, or phenyl-substituted C1-C10 alkyl or C3-C10 cycloalkyl, provided that any two of R1-R3 may optionally be part of a carbocyclic ring, and M+ is a metal ion. In particular, alkali metal trialkyl borohydrides are used, the alkali metal salt being selected from: Lithium triethylborohydride, Sodium triethylborohydride, Potassium triethylborohydride, Lithium tri-sec-butylborohydride, Sodium tri-sec-butylborohydride, Potassium tri-sec-butylborohydride, and Lithium triethylborodeuteride. Other exemplified compounds which are less effective on low surface energy substrates include Lithium 9-borabicyclo [3.3.

Abstract: The present invention provides a new class of materials effective as cure accelerators for anaerobic curable compositions. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as acetyl phenyl hydrazine and maleic acid or toluidines, surprisingly provides at least comparable cure speeds and physcial properties for the reaction products formed therefrom.

Abstract: A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorinating composition to the curable elastomer, contacting the layers and curing the layered article so formed. The resulting multilayer compositions and articles are also disclosed.

Abstract: A filter assembly and method includes a filter media attached to a perimeter frame using a polyimide material.

Abstract: The present invention discloses a seating system that includes a seat back (20) with one or more plastic panels (22) that extend across a lateral distance of the seat back (20). The seat back (20) preferably includes one or more reinforcements (30) attached to the plastic panels (22).

Abstract: A solid cyanoacrylate adhesive composition is disclosed which can be applied to a substrate in solid form and which polymerizes into an adhesive polymer upon liquefying. Preferably the solid cyanoacrylate composition liquefies at temperatures slightly above room temperature and polymerizes upon liquification. &egr;-caprolactones are used as a solidifying polymer with cyanoacrylate monomers and other additives to form the solid cyanoacrylate adhesive composition. The solid cyanoacrylate adhesive composition is easy to apply, especially stable in solid form and is capable of use in a variety of industrial, consumer and medical applications.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: The invention is a two part polymerizable composition comprising in one part an organoborane amine complex and one or more compounds containing ring opening heterocyclic moieties, and in a second part, compounds capable of being polymerized by free radical polymerization, a catalyst capable of polymerizing compounds containing ring opening heterocyclic moieties and optionally a component that will decomplex the organoborane amine complex. In one embodiment the invention is a two phase system comprising a first phase containing one or more polymers prepared from the compounds which polymerize by free radical polymerization and a second phase comprising polymerized or partially polymerized compounds derived from one or more compounds containing ring opening heterocyclic moieties.

Abstract: A resin impregnated overlay is applied to a wood veneer, which in turn may be adhered to a substrate.

Abstract: A method of production of veneer assemblies is provided wherein a thermocurable adhesive is placed along the joint between adjacent veneer sheets and a core substrate and subjected to heat pressing to bond the veneer to the core substrate.

Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.

Abstract: The invention is a two part polymerizable composition comprising in one part an organoborane amine complex and one or more compounds containing ring opening heterocyclic moieties, and in a second part, compounds capable of being polymerized by free radical polymerization, a catalyst capable of polymerizing compounds containing ring opening heterocyclic moieties and optionally a component that will decomplex the organoborane amine complex. In one embodiment the invention is a two phase system comprising a first phase containing one or more polymers prepared from the compounds which polymerize by free radical polymerization and a second phase comprising polymerized or partially polymerized compounds derived from one or more compounds containing ring opening heterocyclic moieties.

Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.

Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.

Abstract: A vinyl graphic marking film or label coated with a pressure sensitive acrylic adhesive designed to achieve high or permanent adhesion to polymeric low energy surfaces is disclosed. In addition to good adhesion to low energy surfaces, the graphic marking film or label may have microperforated or micro-rough edges which initiate tearing when removal is attempted. The article maintains flexibility and film strength for easy fabrication in graphic marking film or label manufacture.

Abstract: A multi-layer structure includes a layer of a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing electron donor.

Abstract: The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa·s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa·s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.

Abstract: The silylated polyurethane polymer includes a polyurethane prepolymer having between greater than about 50 to about 95% of NCO groups terminated with silane capping agents. The polymer has an improved mechanical properties. The polymer can also have between about 5% to less than about 50% of the NCO groups terminated with low molecular weight terminators.

Abstract: The present invention provides the following adhesive which is good in durability in bonding a glass plate and a resin composition containing a butyl type rubber. The present invention provides the following adhesive which is particularly suitable as an adhesive for bonding a glass plate and a resin composition containing a butyl type rubber, for a double glazing employing a spacer comprising a resin composition containing a butyl type rubber.

Abstract: A chip-type circuit component comprising a chip body which is formed by bonding first and second substrates with each other. A polyimide adhesion layer is provided between the first and second substrates and a thin film circuit pattern is formed on at least one of a pair of main surfaces of the first and second substrates which are opposite each other, while an external electrode is formed on an end surface of the chip body to be electrically connected with the thin film circuit pattern.

Abstract: The present invention provides UV/anaerobic dual cure adhesives, particularly well-suited for sealing the ring around the primer cup in center fire ammunition by UV cure and the primer cup in the cartridge by anaerobic cure.

Abstract: A solventless node adhesive for use in bonding honeycomb layers together. The node adhesive includes thermoset resin and thermoplastic particles dispersed in the adhesive. The node adhesive is applied to the honeycomb node lines while the thermoplastic particles remain dispersed in the adhesive. The amount of thermoplastic particles in the node adhesive is selected to keep the viscosity of the adhesive between 30 and 150 poise at room temperature. The node adhesive may be applied to the honeycomb nodes using conventional application procedures. The thermoplastic particles are dissolved during heat curing of the thermoset resin to form a thermoplastic toughened node adhesive.

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.

Abstract: The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Abstract: A method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of the substrate into contact with a second substrate to form a three layer film, and treating the three layer film with a free radical initiator. The laminating adhesive is formed by mixing an ethylenically unsaturated acid, a bis-silane and a polyamine, and the polyamine optionally can have a crosslinker reacted therein.

Abstract: A joint to be adhered to nylon resin moldings is disclosed, which comprises a copolymerized nylon or a composition comprising a copolymerized nylon or a copolymerized nylon blend and at least one of a nucleating agent and a lubricant. A method for adhering nylon resin moldings is also disclosed, which comprises adhering nylon resin moldings to the joint using a solvent adhesive. The joint and the solvent adhesive enable formation of an effective adhesive layer.

Abstract: The invention relates to a method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of said substrate into contact with a second substrate to form a three layer film, and treating said three layer film with a free radical initiator, wherein said laminating adhesive is formed by mixing an ethylenically unsaturated acid and a polyamine.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.

Abstract: In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.

Abstract: An epoxy-based soldering flux is used to solder a flip-chip IC device to a metallic bond site on a substrate material. The soldering flux is composed of a thermosetting epoxy resin and a cross-linking agent with inherent flux activity. When heated the cross-linking agent cleans the metal oxides from the metal surfaces on the chip and then reacts with the epoxy resin to form a thermosetting epoxy residue. The flux residue left on the board after soldering does not inhibit the flow of an underfill encapsulant. The underfill binds to the thermosetting residue of the flux which increases adhesion strength preventing delamination of the chip during thermal cycling.

Abstract: A moisture reactive hot melt adhesive composition formed by admixing components including a polyisocyanate, an amorphous polyol and 0.1 to 10%, by weight based on the weight of the adhesive composition, of certain styrene/allyl alcohol copolymers, wherein the ratio of NCO/OH groups of the components on an equivalents basis is from 1.05 to 2.5, the components being free from crystalline polyesters and polyethers and the components containing less than 1%, by weight based on the total weight of the components, of water is provided.

Abstract: In one embodiment the invention is An adhesive composition comprising a) a polymer having a flexible backbone and a reactive moiety capable of cross-linking, b) a particle comprising an active agent encapsulated in an encapsulating agent wherein the active agent comprises a catalyst for cross-linking of the reactive moiety, a curing agent for the reactive moiety, an accelerator for the curing reaction or a mixture thereof; and the encapsulating agent comprises a side chain crystallizable polymer wherein the active agent is not substantially extractable from the particle at ambient conditions in a first extraction after particle formation. This composition is used in binding two subtracters together.

Abstract: Solvent-free and water-free radiation-curable primers based on hydroxy-functional prepolymers and cycloaliphatic epoxides or based on hydroxy-functional prepolymers and olefinically unsaturated compounds or based on epoxides and vinyl ethers together with cationic or free-radical initiators may be applied in the same manner as conventional commercial solvent-free laminating adhesives and, for many coatings, allow subsequent in-line coating without there being any need to evaporate solvent or water from the primer coating.

Abstract: A method for manufacturing a highly productive key pad with rigid resin key top, wherein the key top adhesion surface 2, 6 of the key pad 1, 5 or a portion thereof is surface altered by at least one method selected from short wavelength UV irradiation treatment, corona discharge treatment, flame treatment and plasma treatment and can be adhered with reactive hardening resin 3, 7 such as urethane base resin, epoxy base resin, amino base resin, acrylic base resin, cyanoacrylate base resin and photo reactive hardening resin, thereby reducing adhesion operation time, without fear of dislocation during the adhesion.

Abstract: A vinyl graphic marking film or label coated with a pressure sensitive acrylic adhesive designed to achieve high or permanent adhesion to polymeric low energy surfaces is disclosed. In addition to good adhesion to low energy surfaces, the graphic marking film or label may have microperforated or micro-rough edges which initiate tearing when removal is attempted. The article maintains flexibility and film strength for easy fabrication in graphic marking film or label manufacture.

Abstract: A metal film, particularly, a stainless steel film having been not subjected to roughing treatment, and an aromatic polyimide substrate film having a thermoplastic surface can be combined with a high bonding strength to form a metal film/aromatic polyimide film laminate, utilizing an amorphous aromatic polyimide film of 0.05 to 3 &mgr;m thick which has a glass transition temperature in the range of 200 to 300° C.

Abstract: A curable, high temperature, carbonaceous, cement paste composition comprising a catalyst; a carbon filler present in an amount of about 20 to about 60 wt. %; a polymerizable monomeric system present in an amount of about 7 to about 30 wt. % comprising a dialkyl ester of an aromatic tetracarboxylic acid, an aromatic diamine, and a monoalkyl ester of an acid selected from the group consisting of 5-norbornene-2,3-dicarboxylic acid and phthalic acid; and a furan solvent present in an amount of about 20 to about 60 wt. %. The most preferred embodiment comprising a monomeric system comprising a dimethyl ester of 3,3′,4,4′-benzophenonetetracarboxylic acid, 2,2′-bis (4-[4-aminophenoxyl]phenyl)propane and a monomethyl ester of 5-norbornene-2,3-dicarboxylic acid with furfuryl alcohol and a catalytic solution of about 50% ZnCl2, has a glass transition temperature of about 280° C. after curing by heating at about 2° C./minute to about 240° C. and holding for about 2 hours.