With Significantly Flexible Platen Patents (Class 156/583.3)
  • Patent number: 7758713
    Abstract: Process for waterproofing semimanufactured footwear, clothing items and accessories, said semimanufactured product having a three-dimensional conformation with at least one inner surface and one outer surface, which comprises the following operative steps: arranging the semimanufactured product onto a shaped support (14; 27, 28; 30, 31) with at least one waterproofing sheath (18) shaped for entirely or partially cover the surfaces to be waterproofed of the semimanufactured product, at least one glue layer being arranged between these surfaces and the waterproofing sheath (18); pressing between two deformable plates (2, 2?) the semimanufactured product provided with the waterproofing sheath (18) and arranged on the shaped support (14; 27, 28; 30, 31). The present invention also relates to a machine that carries out said process, as well as the semimanufactured products obtained with said process or machine.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: July 20, 2010
    Assignee: Nextec S.R.L.
    Inventor: Luca Morlacchi
  • Publication number: 20100139869
    Abstract: A seaming system for forming a seam is disclosed, wherein the seam consists of at least two opposed sections of high-modulus, high-tenacity, low-elongation fabric sections joined by a tape. The system comprises a seamer head, and a seamer base that includes a topography configured to impart a predetermined pressure gradient to the adhesive layer, tape, and fabric sections of the seam. The resultant seam has a cross-section or thickness profile that generally corresponds to that of the applied pressure gradient. As such, the constructed seam more efficiently distributes stress imparted from any applied load.
    Type: Application
    Filed: February 9, 2010
    Publication date: June 10, 2010
    Inventors: John F. BREWER, Dhiraj H. Darjee, David R. Dingler
  • Patent number: 7699085
    Abstract: There is provided a laminating apparatus laminating an object to be laminated in a laminating part which has a diaphragm on an upper side and a heater panel on a lower side, by melting a filler in the object to be laminated and pressing the object to be laminated sandwiched between the diaphragm and the heater panel, the apparatus including: a sheet conveying the object to be laminated placed thereon to/out of the laminating part; and a lift mechanism lifting up/down a support part capable of supporting the sheet from the lower side.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: April 20, 2010
    Assignee: NPC Incorporated
    Inventor: Yoshiro Chikaki
  • Patent number: 7640717
    Abstract: The invention relates to a counter element (22) being adapted to apply a pressure to a first portion of a packaging material in association with heating of the packaging material in order to seal the first portion of the packaging material to a second portion of the packaging material. The element (22) being provided with an abutment surface (23) adapted to at least abut said first portion of the packaging material. The abutment surface (23) is provided with a plurality of indentations (24) adapted to entrap fluid or gas present in the vicinity of the abutment surface (23) and the first portion of the packaging material. The inventions also relates to a method of providing a counter element (22) as described above.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: January 5, 2010
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventors: Ebi Shokri, Roland Palmquist, Reinhard Kupfer, Renato Cetrelli
  • Publication number: 20090294036
    Abstract: A press and a method for laminating essentially plate-shaped workpieces under the effect of pressure and heat. In the closed state, a lower press half and an upper press half form a vacuum chamber utilizing a peripheral, one-part, or multi-part seals. A flexible membrane divides the vacuum chamber into a product half that can be evacuated that holds at least one workpiece and a pressure half that can be pressurized. The membrane is constructed and arranged so that it presses the workpiece directly or indirectly against a bottom side of the vacuum chamber due to a pressure difference generated in the vacuum chamber due to the evacuation of the product half and/or due to the pressurization of the pressure half. The membrane is mounted on a membrane frame that can be handled separately and that is connected detachably to the upper press half and that can be mounted on the membrane frame or tensioned in the frame from outside of the press.
    Type: Application
    Filed: May 20, 2009
    Publication date: December 3, 2009
    Applicant: ROBERT BURKLE GMBH
    Inventors: Dagmar Metzger, Norbert Damm, Gerhard Dolker, Wolfgang Renz
  • Patent number: 7591924
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: September 22, 2009
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Charles M. Newton, Paul B. Jaynes
  • Patent number: 7566374
    Abstract: A method of making a mat with a textile surface and an elastomer backing is provided. The method includes mixing elastomer crumbs and a binder, depositing the crumb/binder mixture in a layer (22), placing a textile surface element (34) on the layer to form a mat assembly, and pressing the mat assembly in a press (9) while setting the binder. The elastomer crumbs are consolidated to form an elastomer backing (2) that includes voids between the elastomer crumbs, and the textile surface element is bonded to the elastomer backing to form the upper textile layer (1) of the mat.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: July 28, 2009
    Assignee: Milliken & Company
    Inventors: Peter C. Brazier, Thomas A. P. Brock, Robert C. Kerr, Bhawan Patel, Flemming Bojstrup, Patrick Morel
  • Patent number: 7537670
    Abstract: A thermal contact-bonding method employs a thermal contact-bonding apparatus including at least a hot plate, an upper chamber, and a resin sheet provided at a lower portion of the upper chamber. The method includes the steps of pressing the upper chamber against the hot plate, while at least a part of a surface of the hot plate is separated from the resin sheet, to be in a stand-by state of the thermal contact-bonding apparatus, for a time of not charging a material to be processed, charging the material to be processed between the resin sheet and the hot plate, and subjecting the material to be processed to a thermal contact-bonding processing by making a space between the resin sheet and the hot plate under a vacuum state.
    Type: Grant
    Filed: September 13, 2004
    Date of Patent: May 26, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yoshifumi Takeyama
  • Publication number: 20090011192
    Abstract: Methods, apparatus, and system for a protecting an optical lens material during formation of a dimensional image article. A heat compression laminator including a cushioning assembly provides an insulating barrier between the lower compression assembly of the heat compression laminator and the individual lenses of an optical lens material, such as the lenticules on a lenticular lens material. The cushioning web protects the optical lens material so as to prevent significant deformation during the application of heat and pressure in a laminating step. Use of the cushioning web can be especially advantageous during formation of clear, transparent, or semi-transparent dimensional image articles.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 8, 2009
    Inventors: John Tomczyk, David L. Williams
  • Patent number: 7465371
    Abstract: A pressing apparatus having a pressure plate (6) for the hot pressing of materials (5) of the following group: laminates, wood materials, wood-plastic materials, chip and flake boards, wood, paper, film and pulp combinations for floors, walls and ceilings, has at least one heated platen (3), and at least one resilient lining (10) is situated between the platen (3) and the pressure plate (6). In order to achieve short cycling time, uniform pressing action, high and uniform thermal gradients, avoidance of air inclusions and cold spots, and long useful life, with low numbers of rejects, the following solution is proposed: a) The pressure plate (6) has on the side facing the platen (3) at least one lining (10) firmly adhering to the pressure plate (6) and made of a thermally conductive, resilient plastic, and b) the pressure plate (6) is in contact with its lining (10) against the platen without any air gap. With it, material up to a size of 6 m×9 m and over can be hot-pressed perfectly.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: December 16, 2008
    Assignee: Bachmann Kunststoff Technologien GmbH
    Inventor: Wolfgang Bachmann
  • Patent number: 7418991
    Abstract: A substrate bonding apparatus for manufacturing a liquid crystal display (LCD) device includes stages, wherein the degree to which the stages are bent is minimized by the presence of elastic members.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: September 2, 2008
    Assignee: LG Display Co., Ltd.
    Inventors: Sang Seok Lee, Young Kug Lim, Jong Han Kim
  • Patent number: 7357166
    Abstract: An aircraft stringer lay-up assembly is provided comprising a contoured curing block and a first mandrel element positioned thereon. The first mandrel assembly includes a first bar assembly having a plurality of rigidity reducing first slots formed along a first mandrel length. The plurality of rigidity reducing first slots protruding partially through a first mandrel depth of the first mandrel element to allow the first bar assembly to conform to the contoured curing block. A composite ply assembly is laid up onto the first mandrel element and cured while conformed to said contoured curing block such that a contoured composite stringer element is generated.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: April 15, 2008
    Assignee: The Boeing Company
    Inventors: Doan D. Pham, Mark Tollan
  • Publication number: 20070284050
    Abstract: A method and apparatus is disclosed which include a pair of opposed seal bars for the manufacture of reclosable packages. The method and apparatus are particularly adaptable to form fill seal manufacture of reclosable packages. At least one of the opposed seal bars includes a rubberized or otherwise deformable sealing surface. This allows a hermetic seal to be formed across an abrupt transition of thickness of material between the opposed seal bars, such as when a zipper ends adjacent to a side seal in a reclosable bag.
    Type: Application
    Filed: June 9, 2006
    Publication date: December 13, 2007
    Inventors: Lars Wihlborg, Clifton Howell
  • Patent number: 7290580
    Abstract: The reinforcement combining apparatus includes: a stage having a pressing surface; and a tool having a pressing surface opposite to the pressing surface of the stage, wherein the stage and the tool sandwich and press a flexible wiring substrate and a reinforcement, thereby combining the reinforcement with the flexible wiring substrate. A heat conduction rubber having elasticity which allows the heat conduction rubber to transform at an arbitrary area is provided as a part of the pressing surface of the tool, and the tool exerts pressure to the flexible wiring substrate via the heat conduction rubber. Thus, it is possible to bond the reinforcement to the flexible wiring with them uniformly appressed to each other.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: November 6, 2007
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Katsuyuki Naitoh, Kazuhiko Fukuta
  • Publication number: 20070209763
    Abstract: Presses with heaters, such as mug presses, comprise a thermal sensor which is separated from a heater element by at least one layer of insulation. The thermal sensor is advantageously in electrical communication with the heating element to shut off the heating element when a predetermined temperature is reached. By spacing the thermal sensor from the actual heater, the sensor is insulated from the heater so that the temperature at the sensor will be less than the certain pre-determined temperature at the heater during heating. Accurate control of the heating of the mugs and substrate is achieved in a manner which eliminates the need for separately controlling and/or monitoring the time which the heat is applied.
    Type: Application
    Filed: January 26, 2007
    Publication date: September 13, 2007
    Inventor: Junming Chen
  • Patent number: 7262389
    Abstract: An apparatus is provided for forming bag edges in a layered plastic film. The apparatus includes a heated seal bar and a seal bar anvil. The seal bar anvil has a resilient tube configured to deform as the seal bar is driven into the tube to seal and sever a bag edge therebetween. According to one construction, the resilient tube is pressurized pneumatically from the inside so as to impart a specific, desired resilience to the tube as the tube and seal bar co-act on either side of the layered plastic film.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: August 28, 2007
    Inventors: Jere F. Irwin, Dale L. Vantrease
  • Patent number: 7052567
    Abstract: The apparatus of the present invention is generally characterized by a heating/inflation module having pressurizable interior and an attached heat curable pre-preg. In particular, an elastomeric, seamless composite is provided that includes a heating element disposed within a thermoset resin matrix. The composite adapted to maintain a consistent temperature profile and an internal air pressure. A first end piece is attached to a first end of the composite and has an air port for communication with a compressed air source, a vacuum port for communication with a vacuum supply source and at least one electrical cable port for communication with a power supply source. A second end piece attached to a second end of the composite. The apparatus further includes a pre-preg removably attached to an outer surface of the composite. The pre-preg includes a structural fiber matrix supporting a heat curable resin.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: May 30, 2006
    Assignee: Verline Inc.
    Inventors: Richard D. Blackmore, William M. Lepola
  • Patent number: 7021358
    Abstract: An apparatus for the application of aerospace composite laminates 10 is provided, including a non-contaminating outer layer 24 and an insulated base 12. The present invention further includes a constant temperature heating element 22 positioned between the non-contaminating outer layer 24 and the insulated base 12. A battery pack 32 is positioned within the insulated base 12 to power the constant temperature heating element 22. The present invention can further include an ergonomic element 34 mounted to the insulated base 12 to facilitate handling of the apparatus 10 for the application of aerospace composite laminates.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: April 4, 2006
    Assignee: The Boeing Company
    Inventors: Dennis J. Landi, Terrance Gondek, Philip Persaud
  • Patent number: 6973951
    Abstract: An apparatus for seaming roofing membranes to one another, wherein one of the membranes is secured to an underlying support structure by at least one protruding fastener is provided. The apparatus includes a wheeled carriage having an upwardly extending push/pull bar. A power supply propels the wheeled carriage and energizes a heating assembly that generates a heated airflow sufficient to fuse the roofing membranes to one another. A nozzle is coupled to the heating assembly for directing the heated airflow between the two membranes. A variable pressure roller assembly is coupled to the carriage and has a single durometer material carried by an axle that may have different diameter sections. The roller passes over the at least one protruding fastener while still applying a uniform pressure so as to form a substantially continuous width seam except where interrupted by the protruding fastener.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: December 13, 2005
    Assignee: BFS Diversified Products, LLC
    Inventor: Jeffrey W. Henegar
  • Patent number: 6972072
    Abstract: A device embodying the invention comprises a pair of members presenting a lower base surface and a member presenting an upper parallel surface when in an operative position. A platen pad material, which converts microwave energy to heat, is provided on one of the surfaces. When in an operative position the two platens provide uniform pressure over the surfaces of a laminating pouch carrying a document. The device is placed in a domestic microwave oven and the oven is operated for a period of time dependent on the rated power of the oven, the size of the document and the energy conversion capability of the platen pad. The platen pad converts the microwave energy to heat energy while applying uniform pressure over the surfaces of the pouch. This produces liquefaction of the adhesive which bonds the film to the document. The device is then removed from the microwave oven, permitted to cool, the lamination removed, and trimmed as may be necessary.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: December 6, 2005
    Assignee: Murph, LLC
    Inventor: Willis A. Murphy
  • Patent number: 6971429
    Abstract: An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: December 6, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Charles R Keil, Osvaldo Novello, Roberto Stanich
  • Patent number: 6951593
    Abstract: A laminating device 10 includes a vacuum grid 19 for holding a glass substrate 12, a curved pad 20, facing the glass substrate 12, for holding a laminated element 16 of a wafer 13 and an adhesive tape 15, and a driving element 22 for moving the curved pad 20 toward the vacuum grid 19. The curved pad 20 has a curved surface region 46 so that the distance to a smooth surface region 39 of the vacuum grid 19 is gradually increased from the center C toward the outside. By the driving element 22, the vacuum grid 19 and the curved pad 20 become close to each other in a substantially vacuum chamber. As a result, the glass substrate 12 and the laminated element 16 are gradually laminated to each other while removing a very small amount of air that may be present therebetween to the outside.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: October 4, 2005
    Assignee: Lintec Corporation
    Inventor: Koichi Yamaguchi
  • Publication number: 20040238115
    Abstract: An anisotropic conductive film (14) and circuit elements (16) are superimposed and disposed on a substrate (10). An isotropic pressing operation is performed by a pressing mold having a flexible layer (22) on the surface to be brought into contact with the circuit elements, and simultaneously heating is performed to bond the circuit elements onto the substrate. Since the flexible layer absorbs differences in thickness of the circuit elements, the plurality of circuit elements can be pressed simultaneously. Further, since the plurality of circuit elements are simultaneously heated, it is unnecessary to consider an influence of heat on unheated adjacent circuit elements in a case where the elements are heated one by one. The isotropic pressing makes it possible to prevent the anisotropic conductive film from protruding sideways. As a result, spaces between the circuit elements can be reduced.
    Type: Application
    Filed: May 10, 2004
    Publication date: December 2, 2004
    Inventors: Hisao Matsuno, Kenjiro Osugi
  • Publication number: 20040194880
    Abstract: A process for transferring a coating onto at least one optical surface of a lens blank which comprises:
    Type: Application
    Filed: January 2, 2004
    Publication date: October 7, 2004
    Inventors: Peiqi Jiang, Fadi O Adileh, Yassin Yusef Turshani, Steven Weber
  • Patent number: 6780280
    Abstract: A pressing cushion (1) for use in laminating presses has a textile support (2) with threads (3, 4, 5), at least some of which constitute thermally conductive threads (3, 4, 5) that bring about, either directly or by contact with other thermally conductive threads (3, 4, 5), a thermal transfer from one outer side to the other outer side of the pressing cushion (1). The support (2) includes a cushion layer (7) made of a flexible rubber material, wherein the thickness of the cushion layer (7) is less than that of the support (2). The cushion layer (7) is embedded into the support (2) in such a way that thermally conductive threads (4, 5) protrude beyond the cushion layer (7) on both outer sides of the pressing cushion (1).
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: August 24, 2004
    Assignee: Thomas Josef Heimbach Gesellschaft mit beschrankter Haftung & Co.
    Inventors: Walter Halterbeck, Ralf Kaldenhoff
  • Publication number: 20040149379
    Abstract: Provided is an adjusting method of a gap width of a laminated body composed of a color filter substrate and a TFT array substrate. A decompression chamber acting as a closed space communicating with a vacuum pump is decompressed, while a pressurization chamber that includes a decompression chamber is pressurized by driving a compressor.
    Type: Application
    Filed: December 10, 2003
    Publication date: August 5, 2004
    Inventors: Takeshi Kobayashi, Fumiaki Kunimoto, Nobuo Shimizu
  • Patent number: 6752901
    Abstract: A coating press contains a press frame, press cylinders supported by the press frame, an upper press platen connected to the press cylinders, a lower press platen supported by the press frame, at least one pressure plate, and at least one pressure compensating cushion disposed between the upper press platen or the lower press platen and the pressure plate. The pressure compensating cushion is a hydraulic cushion having a lateral edge closure, a hydraulic medium, and covers including an upper cover and a lower cover. The upper and lower covers along with the lateral edge closure define a pressure-tight inner space filled with the hydraulic medium. A press controller is further provided.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 22, 2004
    Assignee: Heinrich Wemhoener GmbH & Co. KG
    Inventor: Ludwig Müsse
  • Patent number: 6645347
    Abstract: The invention concerns a process and a press for manufacturing laminated plastic cards, such as check guarantee cards, credit cards and the like of several films to be pressed together with each other. Moreover, operations are conducted with two compression plates which are movable relative to each other which accommodate in the compression slot the films to be pressed together with their pressure plates with the interposition of at least one compression pad. It is essential that this compression pad is held rigidly or displaceably on the press.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: November 11, 2003
    Assignee: Robert Bürkle GmbH
    Inventors: Wolfgang Stein, Jan Cerajewski
  • Patent number: 6579409
    Abstract: A segmented platen for heat-sealing a film material to a non-planar surface of an ink jet printer cartridge includes a heat-transferring housing having sidewalls defining an internal cavity and a first aperture. Heat-transferring segments, which partially protrude through the first aperture of the housing, are operable to independently move in relation to the housing and each other in a direction substantially parallel to the sidewalls of the housing. Biasing devices, corresponding in number to the segments, independently urge the segments through the first aperture of the housing, thereby urging the segments to follow any curvature in the non-planar surface of the ink jet printer cartridge. The platen further includes a heating element for generating and transferring heat into the housing. The segments receive the heat from the housing, and transfer the heat into the underlying film.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: June 17, 2003
    Assignee: Lexmark International, Inc.
    Inventors: Christina Allison Cullins, Stephen Francis DeFosse, James Paul Drummond
  • Patent number: 6565706
    Abstract: A support-frame bonding apparatus has an upper pressing member to which a semiconductor device is supplied and a lower pressing member to which a support frame is supplied. An elastic member is provided to the lower surface of a pressing tool in the upper pressing member. The elastic member is formed of a conductive silicon rubber having a satin finish on the side facing the semiconductor device. The outline of the area of the elastic member contacting the semiconductor device is substantially identical to the outline of an adhesive layer. The semiconductor device and the support frame are superposed via the adhesive layer and pressed against each other, the support frame being heated by the pressing stage. Thus, the semiconductor device is bonded to the support frame via the adhesive layer. The satin finish on the surface of the elastic member prevents the elastic member from sticking to the semiconductor device.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: May 20, 2003
    Assignee: NEC Electronics Corporation
    Inventor: Akihiro Moriuchi
  • Patent number: 6554046
    Abstract: A cleaving tool provides pressurized gas to the edge of a substrate to cleave the substrate at a selected interface. A substrate, such as a bonded substrate, is loaded into the cleaving tool, and two halves of the tool are brought together to apply a selected pressure to the substrate. A compliant pad of selected elastic resistance provides support to the substrate while allowing the substrate to expand during the cleaving process. Bringing the two halves of the tool together also compresses an edge seal against the perimeter of the substrate. A thin tube connected to a high-pressure gas source extends through the edge seal and provides a burst of gas to separate the substrate into at least two sheets. In a further embodiment, the perimeter of the substrate is struck with an edge prior to applying the gas pressure.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: April 29, 2003
    Assignee: Silicon Genesis Corporation
    Inventors: Michael A. Bryan, James K. Kai
  • Publication number: 20030075259
    Abstract: A method of repairing a composite component (1) having a damaged area including: laying a composite lay-up (7) over the damaged area; locating at least one pressure chamber (3, 4) over the damaged area, the pressure chamber including a displaceable abutment face (5, 6); circulating fluid at an elevated temperature and pressure through the pressure chamber (3, 4) to thereby compress the lay-up (7) between the abutment face of the pressure chamber and the composite and elevate the temperature thereof to effect curing of the lay-up.
    Type: Application
    Filed: September 19, 2002
    Publication date: April 24, 2003
    Inventor: Neil Graham
  • Patent number: 6484776
    Abstract: In one form of the present invention, a system for constructing a laminate (122) is disclosed. The system comprises a ply feeder (101) that sequentially stacks one or more plies (100) to form a ply stack (102). A computer (106) directs a laser (104) to cut each ply (100) to a desired shape after becoming part of the ply stack (102). The ply stack (102) is then placed on a reconfigurable tool (112). An applied pressure compresses the ply stack (102) against the reconfigurable tool (112) while an actuator (124) subsequently reconfigures the reconfigurable tool pins (114) to a predetermined shape. In a more particular embodiment, a composites forming process is used, such as diaphragm forming, to compress the ply stack (102) before the reconfigurable tool pins (114) are reconfigured. In another particular embodiment, the reconfigurable tool pins (114) are first reconfigured then a vacuum diaphragm forming process is utilized to compress the ply stack (102) against the reconfigurable tool (112).
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: November 26, 2002
    Assignee: Northrop Grumman Corporation
    Inventors: Raymond J. Meilunas, Gregory P. Dillon, Jerrell A. Nardiello
  • Patent number: 6481482
    Abstract: The present invention provides a laminating method and a laminating apparatus for a manufacture of photovoltaic modules capable of preventing or suppressing an occurrence of warp or cracks in a multilayer material to be processed and capable of improving the productivity, by minimizing a temperature difference between an upper surface and a lower surface of the multilayer material. In a method of laminating photovoltaic modules configured by a surfacing member 1, a filler 2, photovoltaic modules 3, another filler 5 and a backing member 6, the surfacing member 1 and the backing member 6 are heated from the outside to melt the fillers 2 and 5, for lamination.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: November 19, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventor: Mitsuhiro Shimotomai
  • Patent number: 6478926
    Abstract: Apparatus and process to form structural preforms from an electromagnetic energy activated binder and reinforcing material using low cost tooling. The apparatus includes one or more lay-up stations and forming stations.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: November 12, 2002
    Assignee: Solectria Corporation
    Inventors: Vasilios Brachos, Vincent Borbone
  • Patent number: 6470942
    Abstract: The present invention is designed to effectively band ornamental trims onto panel edges, such as those of furniture tops. The present invention utilizes pneumatic forces to hold the ornamental trims against the panel edges instead of traditional clamps, resulting in asserting a uniform pressure press-fitting the trims against the panel edges along a good length of the trims instead of merely along several points of the trims. furthermore, since the contacting surface of the present invention is made of a soft material, it would not leave any pressmarks or indentations on the trims as can left by a hardened clamp.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: October 29, 2002
    Assignee: Thermwood Corporation
    Inventor: Kenneth J. Susnjara
  • Publication number: 20020139489
    Abstract: The present invention is directed to an apparatus and method for applying adhesive labels of varying shapes and sizes to compact discs that are cut into varying shapes and sizes. The apparatus of the present invention comprises a base, a center rod, at least two positioning members on each side of the center rod, and a deformable element having a raised top surface and a substantially flat bottom surface, wherein the deformable element is fitted over the rod and between and adjacent to the positioning members. The shape and configuration of the deformable element facilitates the smooth and even application of the label to the compact disc when the label is applied to the compact disc.
    Type: Application
    Filed: December 13, 2000
    Publication date: October 3, 2002
    Inventor: Bruce Edward Grogg
  • Publication number: 20020079053
    Abstract: A method is provided for manufacturing a laminate with cushioning material for forming press made with fiber material layers 31 and 32 superimposed with a bonding material layer 30 interposed, an upper rubber layer 33 positioned on an upper surface of one fiber material layer 31, a lower rubber layer 34 positioned on a lower surface of the upper rubber layer 33, and a lower exudation preventing layer 36 positioned on a lower surface of the lower rubber layer 34.
    Type: Application
    Filed: October 29, 2001
    Publication date: June 27, 2002
    Applicant: Yamauchi Corporation
    Inventors: Atsuo Tanaka, Akira Yoshida
  • Publication number: 20020074091
    Abstract: A tray sealing assembly includes a seal support frame for supporting a flange of a tray during sealing of a sealing film to the flange, a seal plate having a sealing surface provided with a raised bead, and a heater for heating the seal plate. The seal support frame is movable relative to the seal plate between a retracted position and a seal position in engagement with the seal plate. Preferably, the raised bead forms a continuous closed loop on the sealing surface. The raised bead produces a reliable seal between the sealing film and the tray flange, despite the presence of contaminants on the tray flange.
    Type: Application
    Filed: November 27, 2001
    Publication date: June 20, 2002
    Applicant: Harpak, Inc.
    Inventor: Vincent E. Faherty
  • Publication number: 20020069961
    Abstract: Provided is an adjusting method of a gap width of a laminated body composed of a color filter substrate and a TFT array substrate. A decompression chamber acting as a closed space communicating with a vacuum pump is decompressed, while a pressurization chamber that includes a decompression chamber is pressurized by driving a compressor.
    Type: Application
    Filed: October 30, 2001
    Publication date: June 13, 2002
    Applicant: IBM
    Inventors: Takeshi Kobayashi, Fumiaki Kunimoto, Nobuo Shimizu
  • Publication number: 20020056524
    Abstract: A device for pressing the adhesive-glued areas of continuously conveyed, flat objects, preferably the bottoms of flat-laying bags, consists of two dual belt conveyors running parallel to each other and mounted in a rack, and whose conveyor belts pressed against each other form pressing belts. To be able to quickly and easily adjust the pressing belts to a different position of glued areas to be pressed, at least one dual belt conveyor is mounted on a support or frame that is guided cross-sliding in the rack.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 16, 2002
    Inventor: Ulrich Eckelt
  • Patent number: 6383335
    Abstract: A heat bonding apparatus for manufacturing an ink-jet printhead, whereby a flexible circuit tape is heat-bonded on the an IC chip of an ink-jet printhead so that a signal from the printing apparatus can be transmitted to the IC chip of the ink-jet printhead to control the ink-jet printing operation. The heat bonding apparatus comprises a head seat; a heat bonding head seated in the head seat, the heat bonding head being movable along with the head seat to carry out a heat bonding process; and a heat bonding sheet of arc shape and in the form of an elastic metal sheet. The heat bonding sheet is deformable under pressure and one end of the heat bonding sheet is secured to the heat bonding head so that when the heat bonding sheet is pressed for heat bonding the flexible circuit tape and the IC chip, the heat bonding sheet undergoes deformation and in the mean time pushes the air away from between the flexible circuit tape and the IC chip to let them fully contact each other.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 7, 2002
    Assignee: Wisertek International Corp.
    Inventors: Ji-chen Wu, Chen-hua Lin
  • Patent number: 6367530
    Abstract: The present invention is a conveyor apparatus for conveying a multilayer material to be processed, used in a laminator having an upper chamber and a lower chamber partitioned by a diaphragm with or without a heating device disposed in the lower chamber, wherein a conveying belt is disposed under the multilayer material to pass through only two side edges of all four side edges of each chamber opposed to each other along a conveying direction of the multilayer material. Accordingly, the multilayer material can be conveyed in a reasonable manner without injuring a laminating function by the conveyor apparatus in the laminator.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: April 9, 2002
    Assignee: Nisshinbo Industries, Inc.
    Inventor: Mitsuhiro Shimotomai
  • Publication number: 20020003029
    Abstract: A press device for coating table board-shaped pieces of furniture on their upper side and side surfaces, whereby the workpieces lie next to each other on a supporting system that has many supporting bolts distributed in a grid-like manner, which can be adjusted between a passive position out of contact with the workpieces and a coating position that supports the workpieces. An elastic membrane is arranged above the supporting bolts, on which the workpieces can be placed. The elastic membrane functions to support the coating film during the coating operation.
    Type: Application
    Filed: July 9, 2001
    Publication date: January 10, 2002
    Inventor: Reinhard Huber
  • Patent number: 6309505
    Abstract: One wafer is placed on a wafer support table with its frontside facing upward, and the other wafer is chucked by a wafer chuck portion with its frontside facing upward. The wafer chuck portion is pivoted about a shaft through about 180° to make the two wafers face each other substantially parallel. In response to the cancel of the chucking of the upper wafer by the wafer chuck portion, the central portion of the upper wafer is pressed by a press pin to superimpose the two wafers.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: October 30, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toru Takisawa, Takao Yonehara, Kenji Yamagata
  • Patent number: 6250217
    Abstract: The invention provides a multi-funtion diaphragm press having upper and lower platen assemblies separated by a flexible membrane. One of the platen assemblies is movable between a first position whereby it does not contact the flexible membrane and a second position whereby the flexible membrane is contacted to provide a rigid membrane.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: June 26, 2001
    Assignee: Kory Dubay Manufacturing Australia Pty. Ltd.
    Inventor: Bogdan Eugene Korybutiak
  • Patent number: 6241839
    Abstract: The present invention relates to a vacuum lamination apparatus suitable for vacuum-laminating a stacked body. The vacuum lamination apparatus includes a mounting table including a metal plate having a front surface on which the stacked body is to be positioned. The apparatus also includes a vacuuming pipe comprising a looped hollow pipe having an inside circumference and a plurality of vents spacedly perforated at the inside circumference thereof. The vacuuming pipe is arranged in and fixed to the front surface of the metal plate. The front surface of the metal plate has a front surface with a center line average height of 0.2 to 1.5 &mgr;m. The vacuuming pipe is fixed to the front surface of the metal plate by intermittently welded portions provided at a contact region between the front surface of the metal plate and the vacuuming pipe. A sealant is disposed to the entire contact region, whereby the vacuuming pipe and the metal plate are integrated.
    Type: Grant
    Filed: February 5, 1999
    Date of Patent: June 5, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takehito Yoshino, Kimitoshi Fukae, Yuji Inoue, Shigenori Itoyama
  • Patent number: 6237483
    Abstract: An apparatus for performing a global planarization of a surface of a deformable layer of a wafer on a production scale. The apparatus includes a chamber having a pressing surface and containing a rigid plate and a flexible pressing member or “puck” disposed between the rigid plate and the pressing surface. A wafer having a deformable outermost layer is placed on the flexible pressing member so the deformable layer of the wafer is directly opposite and substantially parallel to the pressing surface. Force is applied to the rigid plate which propagates through the flexible pressing member to press the deformable layer of the wafer against the pressing surface. Preferably, a bellows arrangement is used to ensure a uniformly applied force to the rigid plate. The flexible puck serves to provide a self adjusting mode of uniformly distributing the applied force to the wafer, ensuring the formation of a high quality planar surface.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: May 29, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Guy Blalock
  • Patent number: 6230774
    Abstract: A transfer press apparatus is provided which includes, among other features, a frame, a cuff assembly supported on the frame and including a support formed of a heat-conductive material with radially opposed inner and outer surfaces and a heating element disposed on the outer surface of the support, and an actuating assembly for positioning the cuff assembly from an engaged to a disengaged position.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: May 15, 2001
    Assignee: Hix Corporation
    Inventor: Phillip D. Ward
  • Patent number: 6227270
    Abstract: A vacuum laminating apparatus includes a laminating space formed by a base member, a tube having deaeration holes, and a flexible lid member.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: May 8, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shigenori Itoyama, Kimitoshi Fukae, Yuji Inoue