Abstract: To satisfactorily apply a protective tape to a bump wafer, an application apparatus (1) for applying a protective tape (PT) to a wafer (W) includes: an application table (60) configured to support the wafer (W); a tape holding body (30) capable of holding the protective tape (PT) and configured to supply the protective tape (PT) held by the tape holding body (30) onto the wafer (W); and a pressing member (62) configured to press the protective tape (PT) from above. The pressing member (62) includes a protective layer outer periphery retainer (620) configured to press a peripheral portion of a protective layer (PL), which is laminated on the protective tape (PT) and has an outer diameter smaller than an outer diameter of the wafer (W), to apply the protective tape (PT) to the wafer (W).

Abstract: An example method of joining a first structure and a second structure is described that includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.

Abstract: A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.

Abstract: A method for manufacturing a thermoplastic composite product includes: providing a first and second thermoplastic composite component made from a consolidated stack of thermoplastic composite plies, said first and second component having a first and second ply drop off, respectively. The first and second components are positioned such that the first ply drop off and the second ply drop off are aligned, and the first and second components are fixedly connected by means of heating. The stacks of plies for the first and second components are constructed by stacking the plies in a stacking direction wherein the plies are arranged such that plies at a different position along the stacking direction are laterally offset relative to each other for the purpose of forming the first ply drop off and the second ply drop off, respectively, before consolidating.

Abstract: Apparatus for making a cardboard strip for packaging includes a store for a stack of cardboard sheets, a gripping mechanism for picking up a sheet from the stack and positioning another sheet on a first support for the application of adhesive, and a transfer mechanism for transferring the first sheet to rest on the second support with an end portion having the adhesive projecting towards the store and towards a third support. The third support is disposable in a raised position to raise an end portion of a second sheet coming from the store and in a lowered position to lower the end portion of the second sheet and position it at the end portion of the first sheet. A pressor presses the two superposed end portions of the two sheets to fix the end portions to one another to form a cardboard strip.

Abstract: A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

Abstract: A tooling for use in a method for electromagnetic welding of two contacted surfaces of molded parts. The tooling includes a rubber body and pressurizing means for pressurizing the rubber body and applying pressure to the contacted surfaces. The rubber body includes an embedded stiff body shaped such as to define different rubber body thicknesses in different directions, which causes a different pressure build-up in the different directions. A method for manufacturing the tooling. The tooling may be used in electromagnetic welding of two contacted surfaces of molded parts by moving a joining inductor along the contacted surfaces, generating an electromagnetic field in an induction-sensitive component of the molded parts to heat a thermally activated coupling means of the molded parts to above a melting temperature of the coupling means.

Abstract: This flexible mandrel for molding a composite material containing a thermosetting resin includes: a main body containing a first material; and a thermally conductive layer containing a second material having a higher thermal conductivity than the first material, the thermally conductive layer being formed so as to cover at least a portion of the main body. The thermally conductive layer extends from a contacting surface of the flexible mandrel, which comes into contact with the composite material during molding, to a non-contacting surface which does not come into contact with the composite material.

Abstract: A glue jamming prevention structure of a laminator is disclosed, having a main structure that includes a housing, an entry opening and an out-feeding opening respectively arranged at two sides of the housing, a left side board, a right side board, and a power element arranged in the housing. A first entry driving axle, a second entry driving axle, a first out-feeding driving axle, a second out-feeding driving axle, a left-side elastic assembly, and a right-side elastic assembly are arranged on the left side board and the right side board. A first driving belt is arranged on the first entry driving axle and the first out-feeding driving axle. A second driving belt is arranged on the second entry driving axle and the second out-feeding driving axle.

Abstract: A method for forming fiber composite preforms, the preform (1) include a web (2), a flange (3) and a bent part (2.1), and the method includes: laying-up a laminate (4) onto a tooling (5), the laminate (4) comprising lateral and transverse edges (4.1, 4.2) and the tooling (5) comprising a male part (7) comprising a surface (7.1) and a lateral wall (7.2), the web (2) being configured to be located over the surface (7.1) of the male part (7) and the flange (3) being configured to be located over the lateral wall (7.2) of the male part (7); forming the preform (1) over the male part (7); clamping the lateral edges (4.2) of the laminate (4) to the tooling (5) such that the web (2) and the flange (3) of the laid-up laminate (4) are kept under tensional loads, and bending a longitudinal portion of the male part (7).

Abstract: Provided is a laminating apparatus configured to improve the uniformity of the thickness of a laminate to be obtained to improve the yield of a product, such as a laminate. The laminating apparatus includes a pressing device including a first press block that is advanceable and retreatable, a second press block arranged to face the first press block, a first pressing rubber mounted inside the first press block, and a second pressing rubber mounted inside the second press block, the first pressing rubber and the second pressing rubber facing each other, the first pressing rubber having formed on a surface thereof facing the second pressing rubber a convex frame configured to surround a peripheral edge portion thereof.

Abstract: A process for joining a battery element (49) by at least one polymer thread (28, 30), comprises the method steps: a) applying a web-shaped or sheet-shaped electrode material (16) to a first separator web (12), b) heating the at least one polymer thread (28, 30) above the softening temperature of the polymer material, c) introducing at least one polymer thread (28, 30) between the first separator web (12) and a further second separator web (40) to be applied to the first separator web (12), and d) cooling the at least one polymer thread (28, 30) between the separator webs (12, 40) and forming at least one material-bond compound (46, 48) therebetween.

Abstract: A sealing device configured to create a frangible seal in a sample processing device is described. Methods of using the device to create one or more frangible seals in a sample processing device are also described.

Abstract: A horizontal pillow packing apparatus includes a center sealer configured to wrap a packing target object by bringing both end portions of a back surface of a belt-shaped film in a width direction into contact with each other and seal a center seal portion at which the both end portions of the back surface in the width direction are in contact with each other, and an end sealer configured to seal and cut both side portions of the belt-shaped film wrapping the packing target object in the width direction. The center sealer includes at least two pairs of heating rollers configured to nip and heat the center seal portion of the belt-shaped film wrapping the packing target object, and a pair of compression rollers configured to cool and compress, to bond the center seal portion, the center seal portion heated by the at least two pairs of heating rollers.

Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

Abstract: A device for sealing and cutting a film in a packaging apparatus, a packaging apparatus including the device, and a process using the device are provided. The device includes first and second members, one or both of which are movable with respect to the other. One of the members includes an elongated blade, and one of the members includes a cutting means positionable in a plurality of positions. The process includes creating a first seal on a tubular film, thereby creating a semi-sealed package, creating a second seal on the semi-sealed package, thereby creating a sealed package, creating a substantially transversal cut in the tubular film, thereby separating the semi-sealed package from a subsequent portion of the tubular film, and creating an incision in a section of the first or second seal, the incision defining a pre-determined breaking zone in the tubular film of the sealed package.

Abstract: A heatable roller, in particular a laminating roller for laminators, the heatable roller including a roller body including a cylindrical outer surface and defining a longitudinal axis; an elastic roller cover which is supported at the outer surface of the roller body; and a rod shaped heating module which is arranged in a central axial pass through opening of the roller body and which is connected at least torque proof with the roller body, characterized in that the roller body includes a cylindrical roller tube which defines a central axial pass through opening in which the rod shaped heating module is arranged.

Abstract: A method of manufacturing a flanged composite component is provided. The method includes coupling a composite structure to s first composite material. The method includes coupling a second composite material to the composite structure and placing a first expansion device within the composite structure. A forming element is coupled to at least one of the first composite material, the composite structure, and the second composite material against the mold. The method includes coupling a pressure element to the forming element to define a space among the mold, the forming element, and the pressure element. The method includes expanding the first expansion device to impart a force to the second composite material to move the second composite material away from the composite structure and into the space to facilitate forming a first flange.

Abstract: A composite mandrel includes a generally elongated mandrel body comprising a resilient mandrel core and an elastomeric mandrel outer layer disposed outside the mandrel core. A method for fabricating a contoured stiffened composite panel is also disclosed.

Abstract: A method is provided for manufacturing an image on a substrate, wherein the image includes an indicia and a frame. The method includes covering at least a portion the substrate with a carrier comprising magnetically alignable flakes, aligning the magnetically alignable flakes with a magnetic field of a magnetic assembly comprising a metal plate with an opening, and solidifying the carrier. The frame is formed at an edge of the opening and the indicia is visible within the frame. The magnetic assembly includes two magnets disposed so that the North pole of one magnet and the South pole of another magnet are proximate to the metal plate at opposite sides of the opening.

Abstract: There are provided a metal product having an internal space formed therein, allowing for improvements in the flow of a coolant in the internal space, such as a cooling channel and an increase in cooling efficiency, and a method of manufacturing thereof. The metal product includes a body part having a first space formed therein; a space formation member having a second space formed therein, mounted on the body part to be communicated with the first space; and a finishing part forming an exterior by covering the space formation member in a state in which the space formation member is mounted on the body part.

Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract: A production device 100 for a packaged electrode 20, to which a separator welding device is applied, includes joining heads 301 having joining tips 302 and 303 that join a pair of separators 30 to each other and holding units 304 that fasten the pair of separators. After the joining heads 301 are moved closer to each other with respect to the separators, and the separators are fastened by the holding units 304, the pair of separators is joined to each other by the joining tips 301. Meanwhile, after the joining heads 301 are separated from each other with respect to the separators, and the joining tips are separated from the pair of separators, the separators are released from fastening by the holding units 304.

Abstract: New and improved seal jaws and methods for creating a seal on a package containing a high-profile product therein are described herein. The seal jaws are configured to seal overlapping wrapping film segments together adjacent the product in a seal zone where the height of the product results in additional film width. The height of the product creates an inward pull that can prevent the additional film width from being taut, which can result in folds or wrinkles in a subsequently formed seal. Advantageously, the seal jaws described herein have a non-linear configuration that provides extra sealing surface area as compared to linear surfaces over the same lateral distance. The extra sealing surface is provided by an array of curvilinear peaks and valleys, where the peaks tension the overlapping film segments in the seal zone to substantially prevent the additional film width from forming folds in a subsequently formed seal.

Abstract: A bonding apparatus for a display device includes a film bonding device configured to attach an anisotropic conductive film to a panel, and a pressure device configured to bond a driving chip and a flexible printed circuit to the panel. The pressure device includes a pressure head including a heat source, a pressure tip attached to a bottom side of the pressure head and the pressure tip being configured to press the flexible printed circuit to the panel, and a transfer unit attached to an upper side of the pressure head, the transfer unit being configured to transfer the pressure head. The heat source is located in the pressure head.

Abstract: A sealing apparatus for sealing a travelling packaging film. The sealing apparatus includes a first actuator, a second actuator, a first seal member, a second seal member, a slide rail arrangement, and a linkage coupled to the slide rail arrangement and connecting each of the first and second actuators to the first and second seal member. The first and second sealing members are actuated toward and away from each other between a disengaged position and an engaged position for sealing the travelling packaging film.

Abstract: A connection device includes a mounting section on which an electronic component stacked with a thermosetting adhesive agent layer is mounted, a heat press head for heating and pressing the electronic component, a first elastic body that is disposed between the electronic component and a pressing surface of the heat press head so as to press an upper surface of the electronic component, and a support member that is disposed on a periphery of the electronic component and supports the first elastic body.

Abstract: An internally heated and pressurized system for fabricating a composite laminate structure and method for use thereof is disclosed. One of a plurality of thin, thermally conductive bond tools, prepreg fiber reinforced composite layers, and a pressure applying membrane are nested within a heated base, and then covered by a pressure sealed cover. The system is pressurized through the pressure sealed cover. The pressure causes the pressure applying membrane to force the prepreg fiber reinforced composite layers onto the upper surface of the bond tool. The heated base transfers heat to the composite layers via the bond tool, which heats and cures the composite layers together and to a shape determined by the upper surface of the bond tool. Each bond tool is formed with a generic lower surface for nesting within the heated base and an upper surface for forming composite layers into the shape of a specific part.

Abstract: A universal heat press machine includes an adjustable supporting frame having, a main body, an actuating handle assembly, and a heat pressing assembly. The heat press assembly includes a first pressing member attaching on the actuating handle assembly, and a second pressing member suspendedly extending from a lower portion of the main body to define an operational space. When the heat pressing assembly is in a heat press position, an imprinting surface of the work piece is arranged to rest on the second pressing member while other parts of the work piece is allowed to temporarily accommodate in the operational space. The first pressing member is pivotally moved to bias against the second pressing member and the imprinting surface of the work piece for imprinting the graphics on the imprinting surface.

Abstract: According to one embodiment, there is provided a substrate bonding method. The substrate bonding method includes disposing a first substrate and a second substrate to face each other. The substrate bonding method includes controlling the first substrate and the second substrate to have a temperature difference. The substrate bonding method includes, in a state where the first substrate and the second substrate are controlled to have the temperature difference, bonding the first substrate to the second substrate by bringing the first substrate into contact with the second substrate while deforming the first substrate so that a central portion of the first substrate is projected toward the second substrate. The central portion of the first substrate is on an inner side of a peripheral portion of the first substrate.

Abstract: A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.

Abstract: A universal heat press machine includes an adjustable supporting frame having, a main body, an actuating handle assembly, and a heat pressing assembly. The heat press assembly includes a first pressing member attaching on the actuating handle assembly, and a second pressing member suspendedly extending from a lower portion of the main body to define an operational space. When the heat pressing assembly is in a heat press position, an imprinting surface of the work piece is arranged to rest on the second pressing member while other parts of the work piece is allowed to temporarily accommodate in the operational space. The first pressing member is pivotally moved to bias against the second pressing member and the imprinting surface of the work piece for imprinting the graphics on the imprinting surface.

Abstract: A device for welding the bottom flange of a stiffener on the side of a skin. The stiffener and the skin are made of a composite comprising a thermoplastic polymer matrix. The device comprises a punch, an anvil and a press to make a clamping between the punch and the anvil. The punch comprises a part forming a pressure table with a cross-section width less than or equal to the width of the stiffener bottom flange and a heating element with width less than the width of the pressure table. The anvil comprises a cooling component and has a cross-section width smaller than the width of the skin. A method for implementing the device.

Abstract: A device for laying up a dry preform having an elongated shape includes a punch that reproduces the elongated shape of the dry preform, a depositing assembly, and a mobile carrier that moves at least one of the punch and the depositing assembly. The depositing assembly deposits, onto the punch, a fibrous band including a small amount of binding agent to make up the dry preform having a cross-section with at least two non-coplanar wings. The depositing assembly also includes pressing devices that press the fibrous band, a channel that pre-shapes the fibrous band to have the cross-section, and a calibration device that applies a normal pressure to all surfaces of the dry preform that are opposite from the punch while cooling the pressed portion of the fibrous band to control a thickness of the dry preform having the cross-section.

Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.

Abstract: A surface of a laminate base body including a projection is caused to penetrate at least a film-shaped laminating body and surely laminated by a simple configuration, and a laminate thereof is formed at a uniform thickness without an occurrence of voids. A laminating device is provided with a heating unit configured to heat at least an insulating resin film; an upper plate and a lower plate configured to be capable of opening and closing, and configured to form a chamber that becomes sealed upon closing; a receiving member having an elasticity and disposed on the upper plate; an elastic membrane body disposed on the lower plate; a vacuuming unit configured to vacuum inside of the chamber; and a compressing unit configured to bloat the elastic membrane body.

Abstract: A portable laminator designed primarily for home use where the laminator includes a handle for carrying which may also act as a guide for articles being fed into the laminator. In alternate embodiments, the laminator includes a cover which may first position acts as a guide for material being fed into the laminator and in a second position acts as a cover for the laminators feed slot. In additional embodiments, the laminator includes a double walled housing to provide insulation from the heating elements.

Abstract: The present invention relates to a fuel cell assembly and method of manufacturing same, and a bonding part manufacturing method and device. For instance, in a resin frame, a depression part is subsidence formed from a lower-end face toward an upper-end face, and a housing hole is pass-through formed from a top surface of the depression part toward the upper-end face. For instance, the depression part, a cathode-side electrode and an electrolyte film are housed, and in such a circumstance, an anode-side electrode is housed in the housing hole. A portion of the resin frame permeates a gas diffusion layer which configures the anode-side electrode and is a porous body. Via the permeated site, the resin frame and the gas diffusion layer (anode-side electrode) are integrally bonded.

Abstract: Convey means for pitch-feeding the semiconductor cell to which the conductive tapes have been attached, lead wire processing means for forming-processing the lead wire, provisional pressure-bonding means which is provided at a part opposed to the semiconductor cell that is pitch-fed, holds the lead wires which are forming-processed, repeats provisional pressure-bonding of the lead wires to the conductive tapes provided on the upper surface and lower surface of the semiconductor cell that is pitch-fed, and alternately connects the upper surfaces and lower surfaces of the neighboring semiconductor cells, and main pressure-bonding means which is disposed on a downstream side of the provisional pressure-bonding means in a direction of conveyance of the semiconductor cell, and which mainly pressure-bonds, simultaneously, the paired upper and lower lead wires which have been provisionally pressure-bonded to the upper surface and lower surface of the semiconductor cell.

Abstract: Disclosed is a method for producing a semiconductor device in which solder joints are made between a semiconductor chip with bumps and a substrate with electrodes corresponding to the bumps through a thermosetting adhesive layer, the method including the successive steps of: (A) forming a thermosetting adhesive layer in advance on a surface including bumps of the semiconductor chip; (B) laying a surface on the thermosetting adhesive layer side of the semiconductor chip, on which the thermosetting adhesive layer is formed, and a substrate one upon another, followed by pre-bonding using a heat tool to obtain a pre-bonded laminate; and (C) interposing a protective film having a thermal conductivity of 100 W/mK or more between the heat tool and a surface on the semiconductor chip side of the pre-bonded laminate, melting a solder between the semiconductor chips and the substrate and simultaneously curing the thermosetting adhesive layer using the heat tool.

Abstract: A hollow panel including a hollow central board or body and two external sheets forming a sandwich, the central body being made of wood fiber and glues and made in a mold, the mold having an uneven surface with oblique walls and truncated vertices where, the external sheets, made form the same material as the central body, are joined using the same glues, and the mold has a fixed peripheral frame, a thrust platform and a heating plate with a serrated plate to which another, similar plate is brought close such that the two serrated plates constitutes the mold, where the latter plate is rigidly secured to the upper hot plate of the press for forming the central board or body, and the teeth of the two plates are offset in a staggered pattern, and do not meet, to form the uneven surface with the desired thickness.

Abstract: The present invention is to provide a laminating apparatus which significantly improves the laminating efficiency of a workpiece such as a photovoltaic module. In order to significantly improve the laminating efficiency of a workpiece such as a photovoltaic module, at least one sub-laminating apparatus is disposed subsequent to a main laminating apparatus, a hot plate of the main laminating apparatus is formed in such a way that a heat-supplying section thereof configured to supply heat to the workpiece on the hot plate is made of a material having a thermal conductivity of not less than 110 (Wm?1K?1) and not more than 398 (Wm?1K?1), and a hot plate of the sub-laminating apparatus is formed in such a way that a heat-supplying section thereof configured to supply heat to the workpiece on the hot plate is made of a material having a thermal conductivity of not more than 20 (Wm?1K?1).

Abstract: A machine for forming foam cushions comprises a web of film comprising a pair of film panels positioned face to face and having first and second lengthwise edges, and first and second foam dispensing assemblies positioned to dispense foam between the film panels, each foam dispensing assembly comprising first and second valves that dispense first and second foam components, respectively, the valves positioned so that respective foam component streams exiting the valves intersect.

Abstract: Apparatus and methods are disclosed for bonding first and second grommet portions positioned on opposite sides of a sheet by means of localized heat and pressure applied to the first and second grommet portions. Heat and pressure may be applied by first and second pedestals positioned facing the first and second grommet portions. A registration post may secure to the first pedestal and extend through apertures in the grommet portions and sheet. The second pedestal may define an aperture for receiving the registration post. The registration post may be resiliently mounted to the first pedestal and be depressible into the first pedestal. The first and second grommet portions may have a lower melting temperature than the sheet and may bond to one another through an aperture defined by the sheet.

Abstract: A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.

Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

Abstract: A method for the dry production of a membrane-electrode unit includes assembling a layered configuration including a centrally positioned membrane produced by extrusion and pre-dried at a temperature between 80° C. and 100° C. for 15 min to 30 min, a substrate-electrode unit on each side of the membrane having an electrode layer applied to a substrate, an optional frame around each substrate-electrode unit for fixing the substrate-electrode unit, and two separating films on outer sides. The configuration is pressed together between two laminating rollers so that a pressure connection is produced at least between the membrane and the electrode layers. A short production time is achieved because it is not necessary to keep the membrane moist at high temperatures under pressure. A membrane electrode unit and a roller configuration are also provided.

Abstract: A film sticking device includes a pressing part configured to press a film by contacting a surface of the film and pressing the film. A supporting part is coupled to the pressing part and supports the pressing part. A guiding part is configured to guide the supporting part and move the supporting part between a first position and a second position. The second position is separated from the first position. A body has one end coupled to the guiding part. The supporting part is positioned at the first position when a center part of the pressing part contacts the surface of the film.

Abstract: A press apparatus for curing adhesive on inner adhesion surfaces of substantially continuous wood products (1) under synchronous compression heating. The apparatus includes at least two presses (2) having a mutual distance from each other fulfilling the precondition: L/(n?1), where L is the working length of each press and n is the number of presses in series.

Abstract: A device (20) for bonding or welding a membrane, including an undercarriage (30) for supporting the device on the membrane at least at one contact point, which is formed by a pressing element (40) for pressing the membrane onto a metal plate to be bonded or welded thereto, and at least at two further contact points, which are formed by castors (31, 32). A frame (42) extends upwards from the undercarriage (30), wherein the device (20) can be manoeuvred using the frame. The pressing element (40) includes a heating device (46), which is designed as an induction coil, by which the metal plate, which is provided with an adhesive or weldable coating, can be heated. An induction generator and a control and cooling device thereof are mounted in or on a housing (50), which is fixed to the frame (42) at a distance (A) above the undercarriage (30). The device (20), which is formed as one part, can be tilted for moving around a castor axis (28) and can then be lowered via the metal plate onto the membrane.