Soft Yielding Material Pin Patents (Class 174/205)
  • Patent number: 8076587
    Abstract: A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving components of a circuit, and conductors embedded in the PCB for electrically connecting the components together to complete the circuit. Each of the cavities has a wall (36A?) upstream of the G-forces which supports the respective component in direct contact in order to prevent the development of tensile loads in a bonding layer (37A). When the component is an integrated circuit (50), titanium conductors (63) are coupled between exposed ends of the embedded conductors and contact pads on the integrated circuit. A gold paste (51) may be inserted into interstitial gaps between the integrated circuit and the upstream wall.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: December 13, 2011
    Assignee: Siemens Energy, Inc.
    Inventors: David J. Mitchell, Anand A. Kulkarni, Andrew J. Burns