With Grounding Means Patents (Class 174/51)
  • Publication number: 20130255988
    Abstract: A bracket and open back junction box assembly allows simplified wiring at a construction site. An open back junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads, at a prefab facility. A Metal Clad (MC) cable may be attached to the open back junction box and wires carried in the MC Cable may be connected to the leads. A mounting bracket is generally sandwiched between the open back junction box and the plaster ring for mounting to framing members at the construction site. Following assembly at the prefab facility, the prefab open back junction box is shipped to the construction site where the bracket and open back junction box assembly is mounted to framing members. Connections to wires carried by MC Cables are then facilitated by removing the rear cover plate to access the open back junction box interior.
    Type: Application
    Filed: June 3, 2013
    Publication date: October 3, 2013
    Inventor: Bruce G. Phillips
  • Publication number: 20130240695
    Abstract: A retainer for affixing an electromechanical device to adjacent motor vehicle support structure includes an locating pin integrally molded of relative hard material as an integral feature of the electromechanical device case. The locating pin includes parallel side walls forming an axially directed channel bifurcated by a tapered guideway and at least one inwardly facing engagement surface. The retainer also includes a relatively soft bushing clip having resilient arms slip-fit within said channel straddling the tapered guideway to self-lock with said engagement surface. The clip arms extend outwardly of said locating pin side walls and form opposed, axially extending bushing surfaces operative to engage vehicle support structure.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 19, 2013
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventor: SWEI-YIN CHAUNG
  • Publication number: 20130220662
    Abstract: According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.
    Type: Application
    Filed: April 1, 2013
    Publication date: August 29, 2013
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kabushiki Kaisha Toshiba
  • Publication number: 20130220661
    Abstract: An electrical device is provided that can selectively be powered through a neutral wire or an earth ground. The electrical device includes a line terminal, a neutral terminal, a ground terminal, and a selection mechanism. The line terminal is electrically connected to at least one load. The line terminal can be electrically connected to a line (or “hot”) wire. The neutral terminal is electrically connected to the at least one load. The neutral terminal can be electrically connected to the neutral wire. A first electrical path is provided from the line terminal through the at least one load to the neutral terminal. The ground terminal can conduct current to the earth ground. The selection can selectively provide a second electrical path from the neutral terminal to the earth ground via the ground terminal.
    Type: Application
    Filed: February 25, 2013
    Publication date: August 29, 2013
    Applicant: ABL IP Holding LLC
    Inventor: ABL IP Holding LLC
  • Patent number: 8455752
    Abstract: A photovoltaic (PV) ac-module grounding system includes a plurality of PV dc-voltage modules. Each PV dc-voltage module is integrated with a corresponding dc-ac micro-inverter to provide a corresponding PV ac-voltage module. Each PV ac-voltage module includes an ac-voltage plug and play connector that includes a dc ground conductor. Each dc-ac micro-inverter is internally electrically connected to its own chassis ground or metal enclosure which in turn is electrically connected to a corresponding dc ground conductor. A dc ground path is carried through an ac power bus from ac-voltage module to ac-voltage module through the plug and play connectors via the dc ground conductors.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: June 4, 2013
    Assignee: General Electric Company
    Inventors: Charles Steven Korman, Neil Anthony Johnson
  • Patent number: 8455772
    Abstract: A bracket and open back junction box assembly allows simplified wiring at a construction site. An open back junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads, at a prefab facility. A Metal Clad (MC) cable may be attached to the open back junction box and wires carried in the MC Cable may be connected to the leads. A mounting bracket is generally sandwiched between the open back junction box and the plaster ring for mounting to framing members at the construction site. Following assembly at the prefab facility, the prefab open back junction box is shipped to the construction site where the bracket and open back junction box assembly is mounted to framing members. Connections to wires carried by MC Cables are then facilitated by removing the rear cover plate to access the open back junction box interior.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: June 4, 2013
    Inventor: Bruce G. Phillips
  • Publication number: 20130122744
    Abstract: A receptacle assembly includes a front housing configured for mating with a header assembly and a contact module coupled to the front housing. The contact module includes a conductive holder having a first side wall and an opposite second side wall. The conductive holder has a chamber between the first and second side walls. The conductive holder has a front coupled to the front housing. The contact module includes a frame assembly that is received in the chamber. The frame assembly includes a plurality of contacts and a dielectric frame that supports the contacts. The contacts extend from the conductive holder for electrical termination. A plurality of ground clips are received in the chamber and extend from the front of the conductive holder. The ground clips are mechanically and electrically connected to the conductive holder.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 16, 2013
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Chad William MORGAN, Timothy Robert MINNICK, Dharmendra SARASWAT, Nathan William SWANGER, Charles S. PICKLES, Justin Shane MCCLELLAN, Lynn Robert SIPE, James Lee FEDDER
  • Patent number: 8420929
    Abstract: A ground fault protection device includes an electrically-conductive main body defining a reservoir having a plurality of drainage ports, and having downwardly-extending, ground-penetrating electrodes configured for minimal ground penetration. The device has handles for manual lifting and transportation, plus grounding terminals for connection of grounding cables. The device may be installed at a desired field location by applying downward force to the device to press the electrodes into the earth, thereby establishing an electrical connection between the grounding terminals and the ground via the main body and the electrodes. Grounding cables may then be connected between the grounding terminals and structures or equipment requiring grounding.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: April 16, 2013
    Assignee: R U Grounded Energy Inc.
    Inventor: Terry D. Mundle
  • Patent number: 8383936
    Abstract: A grounding mechanism is used for a slidable electronic device including a first housing, a second housing, a conductive member and a grounding tab. The grounding tab is for attachment to the first housing. The receiving portion is formed in the second housing. The conductive member is attached to the receiving portion. The grounding tab contacts the conductive member, the first housing is electrically connected to the second housing.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: February 26, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Chao Duan, Chia-Hua Chen
  • Patent number: 8367930
    Abstract: A grounding mechanism is used for an electronic device. The electronic device includes a housing and a battery cover. The grounding mechanism typically includes an elastic member including a main portion, a first bent portion, a second bent portion and a clamping portion. The main portion is attached to the housing. The first bent portion and the second bent portion respectively extend from two opposite ends of the main portion. The clamping portion extends from one side of the main portion, and includes two arms for clamping one part of the battery cover.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: February 5, 2013
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Shi-Xu Liang
  • Patent number: 8363424
    Abstract: A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: January 29, 2013
    Assignee: Wistron Corporation
    Inventor: Kun-Hui Lai
  • Patent number: 8338705
    Abstract: A grounding mechanism is used for a slidable electronic device including a first housing and a second housing. The grounding mechanism includes a grounding tab and a protrusion. The grounding tab is for attachment to the first housing, and defines a depression coated with a conductive layer. The protrusion is formed in the second housing. When the protrusion is received in the recess, the protrusion abuts against the conductive layer for electronically connecting the first housing to the second housing.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: December 25, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Chao Duan, Chia-Hua Chen
  • Patent number: 8334458
    Abstract: A grounding mechanism is used for a slide-type electronic device including a first housing and a second housing. The grounding mechanism includes a grounding tab for attachment to the first housing and an opening defined in the second housing. Two sidewalls are formed in the opening, and a conductive layer is coated on each sidewall. When the grounding tab is received in the opening, the grounding tab abuts against the conductive layer of the sidewalls for electronically connecting the first housing to the second housing.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: December 18, 2012
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Chao Duan, Chia-Hua Chen
  • Publication number: 20120305282
    Abstract: A kit or system of mounting tubes having various lengths that can be selected from to provide a single, one-piece device to fill the gap and provide the requisite support and stability between an electrical device or structural fixture and a mounting box (for example, junction box) is described. The mounting tubes are easy to install and can be used with any conventional components (for example, electrical devices, screws, fixtures). The mounting tubes can prevent wobbly fixtures or electrical devices, can reduce likelihood of electrical shock or other injury, and can reduce the likelihood of fires due to electrical failures caused by faulty installation. The mounting tubes can provide continuous grounding.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 6, 2012
    Inventor: Grant E. Frazer
  • Patent number: 8320107
    Abstract: A modular power distribution system comprises a chassis and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) a circuit protection device; and (ii) a power output connection location. Bus bars connect front power inputs to the backplane.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: November 27, 2012
    Assignee: ADC Telecommunications, Inc.
    Inventors: Joseph Coffey, David Johnsen, Duane Sand, Bradley Blichfeldt
  • Patent number: 8300390
    Abstract: A chassis includes a main body having a backplane, a top cover plate, a bottom cover plate and left and right side plates connected with each other. An upper slide rail and a lower slide rail for securing single boards are provided in the main body, a fan is arranged at the upper position of the main body and a power distribution unit is arranged at the lower position of the main body, and a coupling element for coupling the fan with the power distribution unit is provided in the chassis. The coupling element may be a groove extending from the upper position to the lower position for accommodating cables and formed in the inner side of the side plate of the chassis, or may be two openings for passage of cables respectively provided at an upper position and a lower position of the side plate of the chassis.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: October 30, 2012
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Kaijun Wu, Zhenyu Zhuang, Junning Wang, Xin Wan
  • Patent number: 8278553
    Abstract: A harness module structure includes a module mounting portion, which is formed upon an obverse surface of a steering support member, which extends in approximately the direction of the width of a vehicle. A harness module is installed upon the module mounting portion. The harness module includes a harness module body proper, and a module cover, which is mounted upon the harness module body proper. The harness module body proper is enclosed by the module cover and the module mounting portion, and the module cover includes a grounding portion with respect to the module mounting portion, such that the harness module body proper has an interstice with respect to the module mounting portion, and is supported in a non-contact state thereupon, by way of the grounding portion.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: October 2, 2012
    Assignee: Calsonic Kansei Corporation
    Inventors: Hitoshi Suzuki, Fumihiro Okazaki, Takeshi Anzai, Kazuhiko Horikoshi, Takeshi Ogasawara
  • Patent number: 8253022
    Abstract: A suspension tray is provided that is adapted to hold a plurality of cables and/or wires that includes a device for electrically bonding and grounding the tray. The tray includes a series of spokes forming a wire mesh support on which the cables and/or wires are placed. The device (which serves to electrically bond and ground the tray) includes a plurality of conductive elements affixed to the wire mesh support. Each conductive element may include two side portions and a middle portion. The two side portions are preferably sealed with a paint composition and the middle portion includes a conductive surface that is capable of electrically bonding and grounding the tray.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: August 28, 2012
    Assignee: Cablofil, Inc.
    Inventors: Robert Crain, Dallas Kellerman
  • Patent number: 8247706
    Abstract: An enclosure of an electronic device includes an upper shell, a lower shell mounted to the upper shell, and an electrical outlet mounted to the lower shell. The lower shell includes a front plate defining an opening. The electrical outlet includes a connector and a number of wires electrically connected to the connector. An electromagnetic interference absorbing magnetic ring fits about some of the wires. The lower shell further defines a cable channel extending through an edge of the front plate and communicating with the opening. The wires pass through the cable channel and extend through the opening to enter into the lower shell, with the connector covering the opening.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: August 21, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Hsieh-Chou Liao
  • Patent number: 8248804
    Abstract: The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: August 21, 2012
    Assignees: Connex Electronics Co., Ltd.
    Inventors: Yun Heui Han, Hee Chang Rho, Hun Ho Kim, Yong Soo Yoon
  • Patent number: 8242361
    Abstract: A tuner housing according to the invention comprises a support for carrying electronic equipment and at least one cover part which is attached to the support. The support comprises at least one ground lug which extends through a hole of the cover part. The cover part is provided with a projection which projects into the hole and contacts the ground lug.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: August 14, 2012
    Assignee: Thomson Licensing
    Inventors: Kim Suan Pang, Lye Yoong Lum, Kok Keen Leong
  • Patent number: 8222533
    Abstract: A low profile photovoltaic connection system for placement in space restricted areas. The connection system includes a connection box, diodes, and heat sinks inside of the connection box. The heat sink element is maintained in contact with the diode element such that the heat sink dissipates heat externally of the junction box and the contacts are arranged with a flat surface parallel to the solar panel to reduce vertical elevation of the junction box when mounted to the solar panel.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: July 17, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Stephen Daniel Gherardini, Scott S. Duesterhoeft
  • Publication number: 20120152586
    Abstract: A system is employed to mount an electronic component on a shelf. A first restraining device is associated with a support structure in a first location. The first restraining device is configured to operably engage a mating piece associated with the electronic component. The support structure is configured to guide an electronic component along an axis of insertion when introduced to the shelf. A second restraining device is associated with the support structure in a second location. The second restraining device is configured to secure the electronic component via one or more fastening elements.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 21, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Kristopher John Frutschy, William Waters, Keven Peat, Stephen Brooker
  • Patent number: 8149594
    Abstract: An electromagnetic shield structure of an electronics housing includes a terminal having a protrusion for external connection; a substrate having the terminal disposed thereon and electrically connected to the terminal; a housing made of resin, enclosing the substrate and having an opening at a position corresponding to the protrusion of the terminal on a front surface side where the protrusion of the terminal is located; and an electromagnetic shield disposed so as to surround the substrate inside the housing, having an opening at the position corresponding to the protrusion of the terminal, and electromagnetically shielding the substrate. The electromagnetic shield has a bent portion formed on the front surface side for filling a gap between the terminal and the housing.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: April 3, 2012
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Yosuke Nishihata
  • Publication number: 20120067612
    Abstract: The disclosure herein provides for an electrical device housing that includes a protrusion, or bump, for securing a electrical ground wire to the housing. The housing may include a plurality of walls defining an interior space for housing the electrical device, including at least one side wall and a back wall orthogonal to the at least one side wall. The back wall may include an opening configured to allow access to the interior space of the housing. A protrusion may extend forward from the back wall into the interior space of the housing, and may include a mounting surface offset from the back wall in a direction toward the interior space of the housing, and a hole formed in the mounting surface for receiving a fastener to secure a ground wire to the housing.
    Type: Application
    Filed: September 16, 2011
    Publication date: March 22, 2012
    Applicant: Cooper Technologies Company
    Inventors: William Wagner, John Mure, Ryan Crouthamel
  • Patent number: 8138864
    Abstract: A circuit interrupter includes a housing having a molded case made of liquid crystal polymer. Separable contacts are disposed within the housing. An operating mechanism is disposed within the housing and is structured to open and close the separable contacts. A trip mechanism is disposed within the housing and is structured to cooperate with the operating mechanism to trip open the separable contacts. The trip mechanism includes an electronic trip circuit and a rigid, conductive base providing a ground to the electronic trip circuit. The rigid, conductive base is insert molded to a portion of the molded case.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: March 20, 2012
    Assignee: Eaton Corporation
    Inventors: Patrick W. Mills, Richard G. Benshoff, James M. McCormick
  • Publication number: 20120051822
    Abstract: A grounding structure achieves a conductive state between members by making contact with the members. One member includes a screw-shaped portion in at least part of the member, and the other member includes an anchoring portion that engages with the screw-shaped portion of the one member under a biasing force in an interlocked state.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 1, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Yasushi YAJIMA, Daisuke HIRUMA, Ryo HAMANO, Norihito HARADA
  • Publication number: 20120024563
    Abstract: A photovoltaic (PV) ac-module grounding system includes a plurality of PV dc-voltage modules. Each PV dc-voltage module is integrated with a corresponding dc-ac micro-inverter to provide a corresponding PV ac-voltage module. Each PV ac-voltage module includes an ac-voltage plug and play connector that includes a dc ground conductor. Each dc-ac micro-inverter is internally electrically connected to its own chassis ground or metal enclosure which in turn is electrically connected to a corresponding dc ground conductor. A dc ground path is carried through an ac power bus from ac-voltage module to ac-voltage module through the plug and play connectors via the dc ground conductors.
    Type: Application
    Filed: July 29, 2010
    Publication date: February 2, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Charles Steven Korman, Neil Anthony Johnson
  • Patent number: 8106297
    Abstract: By providing a grounding conductor assembly affixed to a conduit bushing in a manner which enables the grounding conductor assembly to extend inwardly from the bushing, effectively being positioned coaxially with the inside diameter of the rigid metal conduit, conduit bushing is realized which enables all grounding wires to be quickly and easily mounted to the grounding conductor assembly. The conduit bushing of the present invention includes a generally circular shaped cover or cap member mounted to the terminating end of the conduit and incorporating an enlarged aperture which overlies the elongated passageway formed in the conduit. In this way, the electrical power carrying wires are able to extend outwardly from the rigid metal conduit into the desired outlet box, junction box with the grounding wire being quickly affixed to the receiving zone of the grounding connector assembly.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: January 31, 2012
    Assignee: Bridgeport Fittings, Inc.
    Inventor: Kenneth M. Kiely
  • Patent number: 8080733
    Abstract: According to one embodiment, an electronic apparatus includes a casing, an attachment portion, a first projecting portion, a second projecting portion and a conductive member. The casing has an outer wall, an inner surface of which is provided with a first conductive layer. The attachment portion is provided on the inner surface of the outer wall, provided with an opening which is open to an outside of the outer wall and includes a bridging portion bridging the opening. The first projecting portion projects from the attachment portion in a position apart from the opening. The second projecting portion, projecting from the attachment portion, is located between the opening and the first projecting portion and provided with a second conductive layer electrically connected to the first conductive layer. The conductive member is attached to the attachment portion, and has a first portion elastically brought into contact with the second conductive layer.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: December 20, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuo Matsumoto, Toshio Konno
  • Patent number: 8053667
    Abstract: A housing of a Quad Small Form-Factor Pluggable transceiver module includes a metallic casing and a plurality of elastic grounding assemblies. The metallic casing has a lower casing, a plurality of partitions and an upper casing. The lower casing is connected to the upper casing. The partitions are provided between the lower casing and the upper casing at intervals, thereby separating the interior of the metallic casing into a plurality of accommodating spaces. The accommodating spaces each receives a connector of a transceiver module, thereby forming a plurality of ports. Thus, the connectors of the transceiver modules share the common housing, thereby reducing the occupied space on the circuit board and increasing the number of the transceiver modules arranged on the circuit board.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: November 8, 2011
    Assignee: Jess-Link Products Co., Ltd.
    Inventors: Chun-Hua Chen, Chun-Hsu Chen
  • Patent number: 8053683
    Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.
    Type: Grant
    Filed: March 30, 2009
    Date of Patent: November 8, 2011
    Assignee: Lockheed Martin Corporation
    Inventors: Douglas A. Slocum, John G. Davis, Jamey Kelsall, John A. Stubecki
  • Publication number: 20110266019
    Abstract: A grounding mechanism is used for a slidable electronic device including a first housing and a second housing. The grounding mechanism includes a grounding tab and a protrusion. The grounding tab is for attachment to the first housing, and defines a depression coated with a conductive layer. The protrusion is formed in the second housing. When the protrusion is received in the recess, the protrusion abuts against the conductive layer for electronically connecting the first housing to the second housing.
    Type: Application
    Filed: July 28, 2010
    Publication date: November 3, 2011
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: CHAO DUAN, CHIA-HUA CHEN
  • Publication number: 20110266020
    Abstract: A grounding mechanism is used for a slidable electronic device including a first housing, a second housing, a conductive member and a grounding tab. The grounding tab is for attachment to the first housing. The receiving portion is formed in the second housing. The conductive member is attached to the receiving portion. The grounding tab contacts the conductive member, the first housing is electrically connected to the second housing.
    Type: Application
    Filed: July 28, 2010
    Publication date: November 3, 2011
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: Chao Duan, Chia-Hua Chen
  • Publication number: 20110266018
    Abstract: A grounding mechanism is used for a slide-type electronic device including a first housing and a second housing. The grounding mechanism includes a grounding tab for attachment to the first housing and an opening defined in the second housing. Two sidewalls are formed in the opening, and a conductive layer is coated on each sidewall. When the grounding tab is received in the opening, the grounding tab abuts against the conductive layer of the sidewalls for electronically connecting the first housing to the second housing.
    Type: Application
    Filed: July 28, 2010
    Publication date: November 3, 2011
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: CHAO DUAN, CHIA-HUA CHEN
  • Patent number: 8044297
    Abstract: A land electrode for a high voltage direct current transmission system including a converter station with a grounding point. The land electrode is connected to the grounding point and includes a plurality of electrode sections. A line electrode includes a part interconnecting two electrode sections. The part of the line electrode exhibits a line resistance. Each electrode section includes at least one electrode element.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: October 25, 2011
    Assignee: ABB Technology Ltd.
    Inventors: Gunnar Asplund, Gunnar Flisberg, Lars Weimers, Jan Lundquist, Urban Åström, Dan Karlsson
  • Publication number: 20110240328
    Abstract: By providing a single housing, component or element incorporating a plurality of passageways or receiving zones formed therein in cooperating association with a mounting ring or clamp constructed for being quickly and easily secured to a clamp, conductor or conduit mounted to an electrical box, junction box, meter box, or similar enclosure, an efficient, easily manufactured and easily assembled bonding bar or grounding bridge is achieved. Preferably, the plurality of passageways/receiving zones are constructed with each passageway or receiving zone cooperatively associated with a locking screw or set screw configured to enable grounding conductors to be inserted through the passageway/receiving zone and securely mounted therein. In this way, grounding conductors from telephones, cable televisions, satellite receivers, radios, television antennas, and the like may be inserted into the passageways/receiving zones and securely mounted in the desired position.
    Type: Application
    Filed: March 31, 2010
    Publication date: October 6, 2011
    Inventor: Kenneth M. Kiely
  • Publication number: 20110232935
    Abstract: A grounding mechanism is used for an electronic device. The electronic device includes a housing and a battery cover. The grounding mechanism typically includes an elastic member including a main portion, a first bent portion, a second bent portion and a clamping portion. The main portion is attached to the housing. The first bent portion and the second bent portion respectively extend from two opposite ends of the main portion. The clamping portion extends from one side of the main portion, and includes two arms for clamping one part of the battery cover.
    Type: Application
    Filed: July 29, 2010
    Publication date: September 29, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventor: SHI-XU LIANG
  • Publication number: 20110216509
    Abstract: According to one embodiment, an electronic apparatus is provided with a first housing that comprises a first ground and a second housing comprising a second ground. The electronic apparatus further comprises (i) a plurality of first protrusions on an inner surface of the first housing, at least one of the plurality of first protrusions comprising, on a peripheral surface thereof, a first conductor electrically connected to the first ground; (ii) a hinge pivotably connecting the first housing and the second housing; and (iii) a cable extending between inside the first housing and inside the second housing through the hinge, supported by the plurality of first protrusions, electrically connected to the first conductor in the first housing, and electrically connected to the second ground in the second housing, the cable electrically connecting the first ground and the second ground.
    Type: Application
    Filed: May 17, 2011
    Publication date: September 8, 2011
    Inventor: Masashi Mikami
  • Patent number: 8013248
    Abstract: A corrugated clamp includes a base section, a lid section, and a bracket section. The base section and lid section are provided on their inner peripheral surfaces with concavo-convex portions to be fitted to an annular concavo-convex portion of a corrugated tube. The bracket section projects from an exterior of the base section to be engaged with a vehicle body. A ground wire is drawn out from a wire harness extending through the corrugated tube. A core wire is exposed from the ground wire by stripping an insulation sheath of the ground wire. The exposed core wire is brought into contact with an inner surface of the concavo-convex portion of the base section and is fixed between the inner surface of the base section and an outer surface of the corrugated tube.
    Type: Grant
    Filed: December 1, 2008
    Date of Patent: September 6, 2011
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Tsutomu Sakata, Katsuji Suzuura
  • Patent number: 8002206
    Abstract: A solenoid operated valve assembly is provided. The valve assembly may include a solenoid having a solenoid coil and an armature movable under influence of the solenoid coil. The valve assembly may also include a valve member operably connected to the armature and configured to selectively contact a valve seat. The valve assembly may further include an outer body containing the solenoid, the armature, the valve member, and the valve seat. In addition, the valve assembly may include a grounding device including an electrically conductive element disposed between the valve member and the outer body.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: August 23, 2011
    Assignee: Caterpillar Inc.
    Inventors: Scott F. Shafer, Jeremy T. Claus, Daniel R. Ibrahim
  • Patent number: 8004068
    Abstract: Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate (102) (e.g., chip carrier) has an adhesive layer (104), where electronic components (106, 108) are attached. An insulating layer (110) is formed over the plurality of electronic components, and a conductive encapsulant structure (115) is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry (140) is formed over, and in electrical communication with, the plurality of electronic components. A shielding via (150) is formed through the multilayer circuitry such that it contacts the conductive encapsulant.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: August 23, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jinbang Tang, Jong-Kai Lin
  • Patent number: 7994434
    Abstract: A shielding apparatus has first and second electrically conductive sheets attached to an interior of a housing. A gap between the first and second electrically conductive sheets has a size based on a predefined desired cutoff frequency, and the widths of the first and second electrically conductive sheets are no more than twice the size of the gap. The lengths of the first and second electrically conductive sheets are at least four times the size of the gap.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: August 9, 2011
    Assignee: International Business Machines Corporation
    Inventors: Alan F. Benner, Casimer M. DeCusatis
  • Patent number: 7981730
    Abstract: An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (1) using a double side adhesive tape (2), and then sequentially depositing an insulating layer (15) and a conductive shielding layer (16) before encapsulating the modules with a molding compound (17). After removing the adhesive tape (2) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (100) is formed over the exposed surface, where the circuit substrate includes shielding via structures (101-112) that are aligned with and electrically connected to the conductive shielding layer (16), thereby encircling and shielding the circuit module(s).
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: July 19, 2011
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jinbang Tang, Darrel R. Frear, Scott M. Hayes, Douglas G. Mitchell
  • Publication number: 20110155411
    Abstract: According to one embodiment, an electronic apparatus includes a casing, an attachment portion, a first projecting portion, a second projecting portion and a conductive member. The casing has an outer wall, an inner surface of which is provided with a first conductive layer. The attachment portion is provided on the inner surface of the outer wall, provided with an opening which is open to an outside of the outer wall and includes a bridging portion bridging the opening. The first projecting portion projects from the attachment portion in a position apart from the opening. The second projecting portion, projecting from the attachment portion, is located between the opening and the first projecting portion and provided with a second conductive layer electrically connected to the first conductive layer. The conductive member is attached to the attachment portion, and has a first portion elastically brought into contact with the second conductive layer.
    Type: Application
    Filed: October 13, 2010
    Publication date: June 30, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yasuo MATSUMOTO, Toshio Konno
  • Publication number: 20110120744
    Abstract: A grounding mechanism includes a grounding end, and a clip device connected to the grounding end for electrically connecting an electronic device to the grounding end. The clip device includes a first clip for contacting against a lateral side of the electronic device in a first direction so as to ground the electronic device in the first direction, and a second clip for contacting against another side of the electronic device in a second direction different from the first direction so as to ground the electronic device in the second direction.
    Type: Application
    Filed: February 10, 2010
    Publication date: May 26, 2011
    Inventor: Kun-Hui Lai
  • Publication number: 20110114356
    Abstract: Apparatus for bleeding electrical charge and methods for installing a ground stud in a composite structure. The apparatus includes a ground stud and a composite structure including a hole. In one embodiment the ground stud engages the hole in the composite structure in a transition fit. In another embodiment the ground stud is countersunk within the composite structure. Embodiments of the present methods include drilling a hole in the composite structure; inserting the ground stud into the hole such that the ground stud is in electrical contact with conductive fibers within the composite structure; securing the ground stud to the composite structure; and attaching a connective device to the ground stud such that the connective device is in electrical contact with the ground stud. In some embodiments the ground stud and the composite structure engage one another in a transition fit.
    Type: Application
    Filed: January 24, 2011
    Publication date: May 19, 2011
    Applicant: THE BOEING COMPANY
    Inventors: Stephen M. Braden, John R. Porter, Nick I. Tavernarakis
  • Patent number: 7943869
    Abstract: A lightning resistive bush body includes a cylindrical bush body. The bush body is composed of an inner insulative layer, a center electric-magnetic absorbing metal layer and an outer insulative layer, wherein the inner insulative layer, the center electric-magnetic absorbing metal layer and the outer insulative layer is integrated, and the center electric-magnetic absorbing is provided between the inner insulative layer and the outer insulative layer, and two axial edges of the center electric magnetic absorbing metal layer shape having radial openings.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: May 17, 2011
    Inventor: Lianjun Li
  • Patent number: RE42331
    Abstract: An all stainless steel grounding electrode uses a coating of stainless steel for an upper collar which has a dual purpose cable connector. The cable connector can accommodate a cable lug and bolt connection or a cad weld connection. A cap for the collar has a one quarter turn dual heavy duty thread set to prevent corrosion from locking up the cap. An osmotic material is placed and replaced in the grounding electrode via the cap.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: May 10, 2011
    Assignee: Lightning Eliminators & Consultants, Inc.
    Inventors: Roy B. Carpenter, Jr., Peter Carpenter, legal representative, Nathan M. Mascarenas, Darwin N. Sletten
  • Patent number: RE44040
    Abstract: A plasma display device includes a plasma display, a chassis having conductivity that supports the plasma display, a tuner circuit, a scan driver, a sustaining driver and so forth used to display a video on the plasma display, a back cover that covers the chassis, the scan driver, the sustaining driver, etc., and a shield body that covers the tuner circuit. The shield body is electrically connected to the chassis and to the back cover.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: March 5, 2013
    Assignee: Panasonic Corporation
    Inventor: Yasuhito Fukui