With Grounding Means Patents (Class 174/51)
  • Patent number: 7368666
    Abstract: A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface thereof. Solder bumps are provided on second lands. Since the pedestal bases used as the mounting reference of the insulating substrate is formed in a plate shape and is placed on the same plane as the first lands and the mother board, the contact state between the first lands a the mother board is effectively stabilized. In addition, since the solderable amount is more than that of a conventional invention, the solder is not detached due to an impact.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: May 6, 2008
    Assignee: Alps Electric Co., Ltd
    Inventor: Shuichi Takeda
  • Patent number: 7351479
    Abstract: A device or an enclosed area that can cause or is sensitive to electromagnetic interference (EMI) is shielded by at least partially surrounding the device or the area with a visible light-transmissive film comprising a flexible support, an extensible visible light-transmissive metal or metal alloy layer and a visible light-transmissive crosslinked polymeric protective layer, and optionally connecting at least one grounding electrode to the metal or metal alloy layer. The film has reduced susceptibility to fracture or corrosion compared to commercially available EMI shielding films, especially when bent or deformed.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: April 1, 2008
    Assignee: 3M Innovative Properties Company
    Inventors: Arnold W. Funkenbusch, Clark I. Bright, Robert J. Fleming
  • Publication number: 20080026613
    Abstract: Disclosed herein is a grounding connector. The grounding connector includes a female member, a male member, and a threaded member. The female member includes a first clamp section, a conductor connection section, and a center section between the first clamp section and the conductor connection section. The center section includes a first opening. The male member includes a barrel section, a second clamp section, and a web section between the barrel section and the second clamp section. The barrel section includes a threaded opening. The threaded member extends through the first opening. The threaded member is engaged with the threaded opening.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 31, 2008
    Inventor: Robert V. De France
  • Patent number: 7292447
    Abstract: A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: November 6, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co. Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wan-Lin Xia, Tao Li, Jun Long
  • Patent number: 7269030
    Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidates electrical terminations in one system; b) pre-terminates AC and DC equipment loads before site installation; c) provides multiple access points for facilitating equipment repair and installation; d) is easily expanded through the use of additional systems or expansion cabinets and e) is aesthetically functional given the cable entry and routing structure. Remote enclosure systems generally comprise: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) at least one removable radiofrequency (RF) port plate coupled to at least one of the side panels and/or the frame system; d) a bottom panel coupled to the frame system; and e) a cable management top assembly coupled to the frame system.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: September 11, 2007
    Assignee: Purcell Systems, Inc.
    Inventors: William Miller, Kelly Johnson
  • Patent number: 7268739
    Abstract: A second ground plane (18); has one end opposite to a connector (14), which end is connected to a first ground plane (17) by resistor connection element (41). Accordingly, it is possible to lower Q of resonance of the ground structure by the resistor connection element (41) and to prevent generation of an intense electromagnetic field attributed to an electromagnetic field of a data processing circuit. Especially when the resistor connection element (41) has a resistance value identical to a characteristic impedance of the ground structure, the ground structure is terminated in a matched way and it is possible to assure prevention of generation of an electromagnetic field attributed to resonance.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: September 11, 2007
    Assignee: NEC Corporation
    Inventors: Hideki Sasaki, Toshihide Kuriyama
  • Patent number: 7265998
    Abstract: A structure for wiring a wiring harness for an automobile between an electronic control unit and devices (22-24) is disclosed. The wiring structure is provided with a housing member (13) including a first portion (19) having a first connector for connection with the devices (22-24), a second portion (20) housing the electronic control unit and a third portion (14) being formed in a slim shape and interconnecting the first portion (19) and the second portion (20), and a wiring harness housed in the third portion (14), the wiring harness interconnecting the first connectors and the electronic control unit. The housing member (13) is arranged along a steering member (10) of the automobile in a manner that the third portion (14) is housed between a control module (12) of the automobile and the steering member (10).
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: September 4, 2007
    Assignee: Calsonic Kansei Corporation
    Inventors: Hitoshi Suzuki, Takashi Uchida
  • Patent number: 7253358
    Abstract: A grounding apparatus for a distribution device having a functional element and a grounding contact point includes a grounding rail having opposed end sections provided with a holding part for fitting the grounding rail to the functional element. An electrically conductive contact spring on each of the end sections extends outwardly beyond the holding part to make contact with the grounding contact point. A safety plug for use with the grounding apparatus includes an overvoltage protection device connected to a conductive contact tongue for contacting an electrical cable connected to the functional element. The overvoltage protection device has a grounding electrode and a conductive fitting in electrical contact with the grounding electrode is provided with an insulation-displacement terminal for connecting the safety plug to the grounding apparatus. A handling apparatus having a base body with a retaining groove is provided for installing the grounding apparatus to the distribution device.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: August 7, 2007
    Assignee: CCS Technology Inc.
    Inventors: Jurgen Matthies, Mike Breuer
  • Patent number: 7248484
    Abstract: Embodiments of the present invention provide an electro-magnetic suppressive structure. The electro-magnetic suppressive structure comprises a cover portion and an integrally formed conductive portion.
    Type: Grant
    Filed: March 12, 2003
    Date of Patent: July 24, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Brooks, Mike Cherniski, Kevin Smith
  • Patent number: 7230836
    Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radio frequency (RF) management system.
    Type: Grant
    Filed: March 4, 2004
    Date of Patent: June 12, 2007
    Assignee: Purcell Systems, Inc.
    Inventors: William Miller, Kelly Johnson
  • Patent number: 7208688
    Abstract: An apparatus, such as mail processing apparatus, has a housing with a cavity therein, a grounded metal chassis in the housing, an electronics mainboard in the housing having a first plug and contact arrangement, with a scale module that is pluggable into the cavity of the housing. The scale module has a base plate having a grounding arrangement, and a load cell and weighing electronics both mounted on the base plate. The weighing electronics has a second plug and contact arrangement that mates with the first plug and contact arrangement when the scale module is plugged into the cavity. A metal part in the housing is mechanically connected to the chassis and has a plate part that protrudes into the cavity. This plate part makes planar electrical contact with the grounding arrangement of the base plate, to produce a grounding path for the base plate, substantially immediately at the beginning of the act of plugging the scale module into the cavity.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: April 24, 2007
    Assignee: Francotyp-Postalia GmbH
    Inventors: Joachim Jauert, Axel Ortmann, Tilmann Schilling
  • Patent number: 7170002
    Abstract: A junction for joining a first section of conduit to a second section of conduit is described. The junction has a body, which has a first connecting portion for connecting a respective first section of conduit to said body and has a second connecting portion for connecting a second respective section of conduit to said body. The body defines a volume extending between the first connecting portion and the second connecting portion. The junction also has a lid which is engagable with the body and is adapted to close the aperture. The junction also has at least one earth connector which is located within the body and has at least one channel adapted to receive at least one earthed electrical cable in electrical contact with the body.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: January 30, 2007
    Inventor: Richard John Thompson
  • Patent number: 7164082
    Abstract: A wiring device common in household circuits includes a flexible brush that is a separate piece from a screw plate that receives electrical power. A terminal screw can thread into the screw plate. The brush may be positioned between the screw plate and the head of the terminal screw and can have a clearance hole through which the threads if the terminal screw can pass. Good electrical and thermal conductivity is assured between the screw plate and the brush by tightening the screw. A ground strap can be employed to hold a cover to a base of the electrical device. The strap can include openings which engage snap tabs on the cover to lock all components into a complete assembly. The strap also can have hooks which engage the cover to prevent the cover from being pulled out of the strap. The wiring device can be an electrical switch, a receptacle, or any similar type of device.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: January 16, 2007
    Assignee: Leviton Manufacturing Co., Inc.
    Inventors: Stephen R. Kurek, Anthony Tufano, Emma Levin
  • Patent number: 7161091
    Abstract: The invention relates to an interference-shielded mobile station (10), which includes a circuit board (11), a shield (12), and electrically conductive securing members (13), separate from the shield (12), for attaching the shield (12). In the shield (12) there are openings (15) for the securing members (13). The mobile station further includes grounding elements (16) for connecting the shield (12) and the securing members (13) galvanically to the circuit board (11). Each grounding element (16) extends to the said opening (15) at the securing member (13). The grounding element (16) is at the same time in contact with the securing member (13). In addition, the grounding element (16) is part of the shield (12) for grounding both the shield (12) and the securing member (13) to the ground level of the circuit board (11). The invention also relates to a corresponding arrangement and method in the interference shielding of a mobile station (10).
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: January 9, 2007
    Assignee: Nokia Corporation
    Inventors: Pekka Kiishinen, Aleksi Sievänen
  • Patent number: 7158388
    Abstract: At the opening (3) for insertable electronic or similar cards in a housing (1) for electronic circuits a frame is mounted including separate frame parts (5, 5?, 5?) having outer portions connecting to the edges of the opening. The frame can by its modular construction be adapted to an arbitrary number of shielding or cover plates (7) that are comprised in such cards and are placed or are to be placed in the opening. A simple mark-up of the position for a card can be easily made on a frame part located at the part opening for the card. The frame parts form together with the cover plates a whole continuous surface. Intermediate frame parts (5) divide the opening in part openings, each intended for only one cover plate. Elastic contact elements (27) are provided mounted in recesses in the frame parts to electrically connect adjacent cover plates to each other and a frame part to that cover plate or those cover plates which are located at the frame part.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: January 2, 2007
    Assignee: Bertil Lohman Design AB
    Inventor: Bertil Lohman
  • Patent number: 7142434
    Abstract: EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: November 28, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Patent number: 7138579
    Abstract: A flexible grounding strip includes an electrically conductive strip having an elongated base, opposite sides of which extend to respective flanges spaced from the base. Each flange extends from one side of the base and terminates at an edge generally facing the opposed side of the base. The edges are spaced from each other. Each of the opposite sides have lengthwise spaced slots extending partly across the base towards the opposite side of the base. The slots extending from one side of the base are interleaved with slots extending from the opposite side of the base.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: November 21, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: George D. Megason, Thomas T. Hardt
  • Patent number: 7122739
    Abstract: A universal ground strap assembly including a strap having a series of uniformly sized and spaced apertures to facilitate the installation of the ground strap assembly onto a wide range of structures of various shaped and sized cross-sections is provided. A stud, through which the strap is secured, includes a terminal portion adapted to accommodate and have secured therein a ground wire. The stud includes a curved surface to engage the elongated strap with smooth transition. The stud may be captivated on the strap by at least one projection extending into the hole in the strap within which the stud is held. A curved sliding nut supported upon the strap and a curved surface of the stud are used to form a tight clamping action of the strap about the structure to be grounded, without subjecting the strap to localized stresses or tearing, but permitting the strap to tightly encircle the structure. The curved sliding nut is also captivated on the strap with stops and defines a hole to receive the stud.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: October 17, 2006
    Assignee: Senior Industries, Inc.
    Inventor: George J. Franks, Jr.
  • Patent number: 7112742
    Abstract: To maintain an interior environment in an environment in which negative ions are abundant, and to stably maintain the environment at a higher level with maintaining an efficacy of the charcoal included in a paint containing a charcoal powder applied to a wall face in a room, a floor face in the room is formed by an insulator and the wall face is made to have a grounding electric potential by connecting it to a grounding electrode buried in a ground according to a method of the invention. The grounding electrode device includes a main body formed in a bottomed tubular body by a metal, and a charcoal and a catalyst are accommodated in the main body.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: September 26, 2006
    Assignee: Healthcoat Clearway Co., Ltd.
    Inventor: Michiharu Yoshimatsu
  • Patent number: 7098398
    Abstract: An adjustable spring grounding pin for grounding separate parts of an electrical device, for example end shields and a stator of an electric motor, automatically adjusts its circumferential dimension to provide a tight grounding fit between aligned holes of different interior diameters in the end shields and the stator of the device as the grounding pin is driven into the aligned holes.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: August 29, 2006
    Assignee: Emerson Electric Co.
    Inventors: Clifton Wade, III, L. Ranney Dohogne, William R. Lewis
  • Patent number: 7095626
    Abstract: An easily openable one-piece RF interference shield and method of manufacturing the same that is cost efficient and easily adapted for use with existing electrical devices. The RF shield having a plurality of interconnected sidewalls, a substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components.
    Type: Grant
    Filed: May 29, 2003
    Date of Patent: August 22, 2006
    Assignee: Interplex Nas Inc.
    Inventor: Jack Seidler
  • Patent number: 7092639
    Abstract: A transmitter comprises an oscillator, a phase lock loop, a serializer, and an electrical-to-optical converter. The oscillator is enclosed in a metal shield. The metal shield is soldered to a ground ring of the printed circuit board. In one embodiment, the oscillator is voltage-controlled oscillator.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: August 15, 2006
    Assignee: Intel Corporation
    Inventors: Craig Schultz, Joshua Oen
  • Patent number: 7082037
    Abstract: A sheet metal cover (11) for a PC card, or electronic card, includes identical top and bottom sheet metal cover parts (13, 12) with opposite sides constructed to allow the cover parts to be joined together by merely pushing the sides of the top cover part forcefully down against the sides of the bottom cover part. One side (23) of each cover part is bent and cut to form a plurality of latching lugs (37), and the other side (24) of each cover part is bent and cut to form a plurality of slots leading to recesses that each receives a lug and then resists movement of the lug out of the recess. Each lug has outer and inner legs (38, 39) that are joined in a fold of less than 90°. The slots each receives a lug only when the inner and outer legs of the lug are deflected closer together.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: July 25, 2006
    Assignee: ITT Manufacturing Enterprises, Inc
    Inventor: Andreas Michael Schremmer
  • Patent number: 7078621
    Abstract: Lightning at or near the site of an oil storage tank can cause a charge build up in the tank. This charge must be discharged to ground at rapid speeds to prevent arcing, sparks and fire. The tank has a metal floating roof which can be used to discharge the charge to ground by connecting a low impedance braided wire to the floating roof, and then connecting the wire to a take up reel at the top rim of the tank. The take up reel keeps any slack out of the wire. The path to ground is liquid to floating roof, to braided wire, to take up reel, to wall of tank, to earth ground.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: July 18, 2006
    Assignee: Lightning Eliminators & Consultants, Inc.
    Inventors: Roy B. Carpenter, Jr., Darwin N. Sletten
  • Patent number: 7061774
    Abstract: A compact computer system board 10 comprises dual on PCB expansion zones 11, 12, expansion connectors 113, 123 which can be connected to expansion boards. Once a expansion board is connected to the expansion connector 113 (123) in the on PCB expansion zone 11 (12) to extent the application of the system 10, a metal housing cover 20 will be mounted above the on PCB expansion zone 11(12). The shield expansion apparatus formed by on PCB expansion zone 11 (12) and metallic housing cover 20 isolates the electromagnetic interference between add-on expansion daughter card and the environment outside of the shield expansion apparatus. The metal housing cover 20 as well as the on PCB expansion zone 11 (12) function as the heat sink of the add-on expansion daughter card inside the apparatus.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: June 13, 2006
    Inventor: Franklin Zhigang Zhang
  • Patent number: 7061775
    Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: June 13, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Patent number: 7056161
    Abstract: A preferred embodiment of an electrical connection employs a stud having a patterned segment, a shoulder and a flange. In another aspect of the present invention, the shoulder has seven or more predominantly flat faces. In a further aspect of the present invention, the shoulder has an octagonal cross sectional shape.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: June 6, 2006
    Assignee: Newfrey LLC
    Inventors: Mark H. Delcourt, Thomas Gouin
  • Patent number: 7046521
    Abstract: Apparatus for housing electrically powered components to protect such components from damage and interference caused by lightning strikes and other externally generated magnetic fields. Methods of manufacturing such enclosures are also disclosed. A cable entry port and door entry are also disclosed.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: May 16, 2006
    Inventor: Victor H. Garmong
  • Patent number: 7034223
    Abstract: A PCB mounting apparatus includes a supporting plate (20) defining a number of through holes, a number of standoffs (50) engaging in the through holes, and a number of grounding members (60) attached to the standoffs. The standoff each includes a head (52) having a holding portion, a flange (54), a post (56), and a base (58). The grounding member each includes a first ring (62) supported on the flange, a second ring (68) supported on the base, and a band (66) connecting therebetween. The PCB (80) defines a number of fixing apertures (82). The combined standoff and grounding member is disposed in the through hole. The PCB is placed upon the supporting plate with the fixing apertures engaging the holding portions of the standoffs and contacts the first rings of the grounding members. The standoffs and the grounding members are made of conductive materials.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: April 25, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: 7031171
    Abstract: A housing adapted for receiving electronic cards therein, the housing comprising a chassis shielded from electromagnetic interference and having an opening in a face thereof. The chassis is adapted for receiving electronic cards therein. The chassis comprises a conductive cast shell Connector panels each have a printed circuit board body with a conductive plane, a card connector adapted for being connected to an electronic card in the housing, and input/output connectors. Each input/output connector is connected to the card connector by a printed circuit of the printed circuit board body. Each input/output connector is adapted for being connected to an input/output of a peripheral device. The connector panels are adapted for being mounted side by side and in shielding connection to cover the opening of the chassis so as to maintain an electromagnetic interference shielding of the housing.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: April 18, 2006
    Assignee: Miranda Technologies Inc.
    Inventors: Sylvain Marcotte, Hugues Ricard, Daniel Rochette, Frédéric Rouette
  • Patent number: 7005575
    Abstract: Device for arranging cables in a junction box extractable from a chassis. Between the junction box (1) and the chassis (2) there is a conduit (5) into which the cables (7) are run from the front viewed from the direction in which the box is extracted from the chassis (2), whereby the length of the cable (7) in the chassis (2) is chosen so that the junction box (1) can be drawn out of the chassis (2) for a distance determined in advance.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: February 28, 2006
    Assignee: MT Memoteknik AB
    Inventor: Lars Hedström
  • Patent number: 6997722
    Abstract: A system for dissipating static electric charge from electronics on a circuit board as the board is inserted into the enclosure, the system comprising one or more elastic, deformable and electrically conductive gaskets mounted within the enclosure for engaging ground pins on the circuit board.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: February 14, 2006
    Assignee: Elma Electronic Inc.
    Inventor: Urs Mangold
  • Patent number: 6972369
    Abstract: A flexible grounding strip includes elongated electrically conductive strip having a base extending between spaced, opposed sidewalls. At least one of the sidewalls has a flange spaced from the base and extending towards the opposed sidewall. Each of the sidewalls has a series of lengthwise-spaced slots extending widthwise across the sidewall into and at least partly across the base towards the opposed sidewall. The slot dimensions and spacing impart flexibility to enable the strip to bend transversely of its length.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: December 6, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: George D. Megason, Thomas T. Hardt
  • Patent number: 6963495
    Abstract: An enclosure for computer-based telephone switching equipment that suppresses the radiation of electromagnetic interference through the use of multiple overlapping seals and apertures.
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: November 8, 2005
    Assignee: Computer Network Technology Corporation
    Inventors: Thomas J. Carullo, Arthur G. Willers, Ryan K. Goodenough
  • Patent number: 6939149
    Abstract: An electrical receptacle, which includes a first housing portion and a second housing portion coupled to the first housing portion. An electrical device is positioned between the first and second housing portions. The terminal has a base and a first protrusion and a second protrusion extending transverse to the base. The first and second protrusions are on opposite sides of the terminal. A clamp is located adjacent to the terminal and positioned between the first and second protrusions and is adapted to couple an electrical wire to the terminal. A fastening device extends through the clamp and is adapted to rotate relative to the terminal. When rotated, the clamp engages at least one of the first and second protrusions on the terminal to limit rotation of the clamp relative to the terminal, thereby preventing separation of the housing.
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: September 6, 2005
    Assignee: Hubbell Incorporated
    Inventors: John P. Goodsell, Nelson Bonilla, Peter A. Czerner
  • Patent number: 6940731
    Abstract: An integrated drive panel for a peripheral/drive bay within the case of a computer or like electronic device comprises a cover assembly having an integral EMI shield. The integrated drive panel does not require removal of the front bezel of the computer case or access to the peripheral/drive bay from inside the computer case during installation and removal.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: September 6, 2005
    Assignee: Gateway Inc.
    Inventors: David R. Davis, Vernon D. Erickson, Jon Smedley, Richard A. Gibson
  • Patent number: 6936765
    Abstract: An insert bridges a junction box to provide a continuous path between consecutive pipes of an electrical wiring guideway. The insert includes a generally tubular body having a first end and a second end. The insert has a length that is sized to bridge a gap across the junction box and a diameter that is sized for sliding into a pipe of the electrical wiring guideway. A first flange surrounds the generally tubular body and is spaced from the first end thereof. A second flange surrounds the generally tubular body and is spaced from the second end thereof. The flanges abut opposing inner walls of the junction box to ensure that the insert is not lost into a pipe. A slit extends along the length of the insert to allow for removal of the insert once the electrical wiring has been laid.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: August 30, 2005
    Inventor: Jay Horner
  • Patent number: 6935869
    Abstract: A meter box ground clamp for clamping a ground wire to a metallic meter box includes a clamp body, a wedge body, a bolt member and a ground engagement bolt. The clamp body has a base segment and first and second leg segments, each of the leg segments having a laterally extending extension segment for engaging the exterior surface of the meter box drip cap. The wedge body includes an upper segment disposed proximate to the clamp body legs, a lower segment disposed proximate to the clamp body base segment, and a middle segment extending from the lower segment, through a slot of the clamp body base segment, to the upper segment. The bolt member head is disposed above an upper portion of the clamp body base segment, with the shaft extending downwardly through an opening of the base segment upper portion.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: August 30, 2005
    Assignee: Electric Motion Company, Inc.
    Inventor: Randolph L. Auclair
  • Patent number: 6933442
    Abstract: A grounding connector having at least a first layer and a second layer. A conductor, such as a grounding wire, is secured between the first layer and the second layer. The first and second layers are made of a material with the same or similar galvanic potentials as the conductor such that galvanic corrosion between the conductor and the first and second layers is minimized.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: August 23, 2005
    Assignee: Senior Industries, Inc.
    Inventor: George J. Franks, Jr.
  • Patent number: 6930891
    Abstract: An electromagnetic shielding plate having high shielding effect is provided. The electromagnetic shielding plate is formed of a conductive plate having elasticity and is provided on the edge thereof with a connecting strip bent in such a manner that the tip thereof projects from the surface of the plate, and with a supporting portion. When the electromagnetic shielding plate and the printed substrate are connected, it is ensured that the ground pattern 201 of the printed board 200 and the connecting strip are brought into contact with respect to each other, thereby a high shielding effect can be obtained.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: August 16, 2005
    Assignee: Sony Computer Entertainment Inc.
    Inventors: Toshikatsu Hama, Osamu Murasawa
  • Patent number: 6894220
    Abstract: A grounding member support forms an interference or friction fit with an opening defined by a circuit board. A compliant, electrically conductive grounding member couples to the grounding member support. The grounding member electrically couples a grounding layer of the circuit board with a support mount coupled to the circuit board. During assembly, insertion of the grounding member support within the opening defined by the circuit board creates an expansive or lateral force on the opening. Furthermore, during assembly, the support mount compresses the compliant, electrically conductive grounding member against the circuit board. The interference fit between the grounding member support and the opening along with compression of the grounding member between the circuit board and the support mount limits the amount of stress received by a surface of the circuit board.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: May 17, 2005
    Assignee: Cisco Technology, Inc.
    Inventors: Frederic Michael Kozak, Lester Creekmore
  • Patent number: 6881897
    Abstract: In a shielding structure of a shielding electric wire in which the shielding electric wire and a ground wire are interposed between two resin members, and a compressive force is caused to act on the resin members and an ultrasonic wave is simultaneously applied to fuse the resin portions, thereby forming a shielded portion, a protruded portion 20 is provided on one of junction faces of the two resin members and a hole 21 including a protrusion inserting portion 21a for inserting the protruded portion 20 and a resin inflow portion 21b provided in an inner position from the protrusion inserting portion 21a and having a smaller width than a width of the protrusion inserting portion 21a is provided on the other junction face, and step faces at both sides on a boundary between the protrusion inserting portion 21a and the resin inflow portion 21b in the hole 21 are formed to be a pair of inclined faces 21c and 21c.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: April 19, 2005
    Assignee: Yazaki Corporation
    Inventors: Akira Mita, Tetsuro Ide
  • Patent number: 6882040
    Abstract: A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10). A metal base (10) can have side portions (12) with connection electrodes (15) having a surface level higher than that of electrodes (7 and 8) on a surface of the semiconductor chip (1) by a difference (d). The semiconductor device (10) can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7 and 8) and the mounting substrate, thereby raising the reliability of the soldering connection.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: April 19, 2005
    Assignee: NEC Electronics Corporation
    Inventor: Futoshi Hosoya
  • Patent number: 6879033
    Abstract: A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device (10) of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10). A metal base (10) can have side portions (12) with connection electrodes (15) having a surface level higher than that of electrodes (7 and 8) on a surface of the semiconductor chip (1) by a difference (d). The semiconductor device (10) can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7 and 8) and the mounting substrate, thereby raising the reliability of the soldering connection.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: April 12, 2005
    Assignee: NEC Electronics Corporation
    Inventor: Futoshi Hosoya
  • Patent number: 6879495
    Abstract: In general the invention features a disk drive carrier and a method for inserting a disk drive into a peripheral bay chassis. The disk drive carrier includes a base for receiving a disk drive into and a latching mechanism that is rotatably attached to the base. The rotatably mount permits a lever to rotate between an open position and a closed position. The lever includes a lower engagement point and an upper engagement point. The disk drive carrier can additionally include a downwardly movable release tab attached to the upper engagement point facilitating release of the engagement point from a P-Bay chassis. The disk drive carrier can also include an electromagnetic interference (EMI) shield to create a tight EMI seal in the front of a P-Bay chassis slot.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: April 12, 2005
    Assignee: Intel Corporation
    Inventor: Kevin G. Jiang
  • Patent number: 6867982
    Abstract: A high frequency component minimizes changes in the inductance of a chip coil mounted on a substrate such that stable characteristics are obtained. In the high frequency component, chip components including the chip coil are mounted on the substrate. A hole is provided in a portion of a metal cover positioned above the chip coil when the metal cover covers the top portion of the substrate.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: March 15, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tomonori Ito, Norio Yoshida, Takahiro Watanabe
  • Patent number: 6864422
    Abstract: A clip includes an integral u-shaped body of insulating material including two parallel fingers joined by a spine to define a gap between the fingers. The fingers have respective holes each sized to receive a screw, the holes being coaxial. At least one of the fingers has a projection that projects into the gap, the hole of the respective finger being contained at least partially within the projection. The body is sufficiently resilient to permit the two parallel fingers to be spread apart.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: March 8, 2005
    Assignee: Bose Corporation
    Inventors: Dan Dionne, James May, Charles L. Chisolm, Suresh Chintalapati
  • Patent number: 6861189
    Abstract: The invention here disclosed is a back wire ground clamp for a wiring device such as a switch or receptacle having a ground strap which supports an outwardly projecting ground lug having a front edge and adapted to receive a ground connection. The ground lug is coupled to a clamp plate by means of a screw which passes through a clearance opening in the clamp plate and is threaded into a receiving opening in the ground lug. The clamp plate supports a blocking tab which extends downward below the front edge of the ground lug and extends side ways for a distance which is less than the length of the front edge of the ground lug. The blocking tab prevents the clamp plate from rotating relative to the ground lug as the screw is tightened and defines an opening between the clamp plate and the ground lug along the front edge of the ground lug into which a single ground wire can be inserted.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: March 1, 2005
    Assignee: Leviton Manufacturing Co., Inc.
    Inventors: Jeff Greene, Anthony Tufano, David B. Balaban
  • Patent number: 6859371
    Abstract: A structure of an EMI shield that can be easily installed to and removed from a base of an electronic equipment, where the base has at least one hook. The EMI shield comprises a casing for covering a circuit board on the base, wherein the casing includes a plurality of holes for thermal dissipation, and a plurality of flanges extending laterally from a bottom of a lateral side of the casing. The flanges comprise at least one groove to engage with the at least one hook of the base for positioning the EMI shield, and an opening, which is extended to a lateral side of the casing so that a power cord of the circuit board can be through the opening. At least one of the flanges comprises a spring finger, which is engageable with a concave portion of the base for fixing the EMI shield on the base without using screws.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: February 22, 2005
    Assignee: HannStar Display Corp.
    Inventor: Jing Jang Huang
  • Patent number: 6846986
    Abstract: RF emission may be reduced by providing grounding strips between optical transmitter and receiver modules in an optical transceiver package. The grounding strips includes an upper portion to fit over a top of the module, a transition portion to span a distance between the top of the module and the board, and a lower portion in electrical connection with a grounding pad on the board. The grounding strip may be substantially as wide as the module that it covers. Angled tabs may be provided to fit within registration holes in the ground pad. The grounding strip may be press-fitted onto the module or soldered. The low impedance ground strip increases the connectivity of the optical module to the board and may replace grounding leads to the external housing to reduce RF emissions.
    Type: Grant
    Filed: November 7, 2003
    Date of Patent: January 25, 2005
    Assignee: Intel Corporation
    Inventors: Arie Ravid, Joshua T. Oen, Richard H. Hsu