Continuous Strip Or Filament Electrode Patents (Class 204/206)
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Patent number: 7837839Abstract: The invention relates to an apparatus for galvanically depositing an electrically conductive layer onto a carrier on which, at least in some regions, a starter layer suitable for electroplating is disposed. The apparatus has an electroplating bath in which an electrolyte for depositing conductive material is provided, at least two contact rollers which are disposed outside of the electroplating bath and which can be connected as cathode and/or anodes, and at least one deflection roller which is connected between the contact rollers, the position of the deflection roller being changeable between two contact rollers such that by changing the position of the deflection roller a distance to be covered by the carrier and which is formed between two contact points of two adjacent contact rollers corresponds to the extension of the starter layer to be coated.Type: GrantFiled: June 6, 2007Date of Patent: November 23, 2010Assignee: BCT Coating Technologies AGInventors: Peter Fleissner, Johannes Fleissner
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Patent number: 7799182Abstract: Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power.Type: GrantFiled: December 1, 2006Date of Patent: September 21, 2010Assignee: Applied Materials, Inc.Inventors: Sergey Lopatin, David Eaglesham, Charles Gay
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Patent number: 7744732Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.Type: GrantFiled: April 6, 2006Date of Patent: June 29, 2010Assignee: Leviton Manufacturing Company, Inc.Inventor: Darrell W. Zielke
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Patent number: 7718522Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.Type: GrantFiled: May 29, 2008Date of Patent: May 18, 2010Assignee: UTAC Thai LimitedInventors: Chalermsak Sumithpibul, Somchai Nondhasitthichai, Apichart Phaowongsa
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Patent number: 7704352Abstract: Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.Type: GrantFiled: December 1, 2006Date of Patent: April 27, 2010Assignee: Applied Materials, Inc.Inventors: Sergey Lopatin, Nicolay Y. Kovarsky, David Eaglesham, John O. Dukovic, Charles Gay
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Publication number: 20100084264Abstract: An electroplating system is provided for electroplating a workpiece. The system includes a plating wheel having a side and a cylindrical wall extending from the side. The plating wheel has an interior chamber that at least partially defines a solution chamber that is configured to hold an electroplating solution. The cylindrical wall includes an opening extending through the cylindrical wall into fluid communication with the interior chamber. An external anode is located proximate to and positioned outside the cylindrical wall of the plating wheel to define an electroplating work area therebetween. An internal anode is held within the interior chamber of the plating wheel and positioned to align with the work area.Type: ApplicationFiled: September 23, 2009Publication date: April 8, 2010Inventors: Mark William Neff, David Jose deMiranda
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Patent number: 7678242Abstract: Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.Type: GrantFiled: December 5, 2005Date of Patent: March 16, 2010Assignee: Korea Institute of Industrial TechnologyInventors: Hong Kee Lee, Seong-Ho Son, Seok Bon Koo
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Patent number: 7655117Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.Type: GrantFiled: March 23, 2006Date of Patent: February 2, 2010Assignee: Leviton Manufacturing Co., Inc.Inventor: Darrell W. Zielke
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Patent number: 7641775Abstract: Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a lower drum soaked in the electrolyte of the electrolytic cell and installed to be rotatable together with the upper drum; a cathode belt mounted around outer circumferences of the upper and lower drums to move along an endless track and electrically connected to the upper drum so that the negative potential is applied thereto; and an anode unit installed to form a space from a metal electroplating surface of the cathode belt soaked in the electrolytic cell so that a positive potential is applied thereto, the anode unit having a slit for supplying the electrolytic to the space. This apparatus may increase a production rate of electrolytic metal foils.Type: GrantFiled: January 11, 2006Date of Patent: January 5, 2010Assignee: LS Mtron Ltd.Inventors: Jin-Kyu Yang, Yoea-Sang Yoon, Jong-Seo Yoon
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Patent number: 7611584Abstract: A metal film-plating system including an unwinding process part configured to provide a film, a degreasing process part configured to remove impurities from the film, an etching process part configured to perform an etching process on the film, a neutralizing process part configured to perform a neutralizing process on the film, a coupling process part configured to couple the neutralized film with a coupling agent, a catalyst-adding process part configured to adsorb a catalyst onto the coupled film, an underplating process part configured to perform an underplating process on the film, and a plating process part configured to perform a plating process on the film. Further, at least one of the unwinding process part, the degreasing process part, the etching process part, the neutralizing process part, the coupling process part, the catalyst-adding process part, the underplating process part, and the plating process part includes a wetting apparatus configured to perform a wetting operation.Type: GrantFiled: February 15, 2006Date of Patent: November 3, 2009Assignee: LG Electronics Inc.Inventors: Myung Ho Park, Woon Soo Kim, Min Keun Seo
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Patent number: 7544274Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openinType: GrantFiled: December 27, 2005Date of Patent: June 9, 2009Assignee: Dowa Metaltech Co., Ltd.Inventors: Hiroshi Miyazawa, Terumasa Inao
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Patent number: 7488404Abstract: A process for hydrogenating carbon dioxide to generate methanol. In the process, a strip of copper base plate is transported by the groups of rotating drive rollers to deposit porous metallic zinc on the copper base plate. Hydrogen is generated from the porous metallic zinc upon electrochemical reactions in the inner space sealed with the above groups of rollers. Simultaneously, zinc oxide and copper oxide catalysts are formed on the porous metallic zinc. Carbon dioxide is introduced into the sealed inner space under high-temperature and high-pressure to generate methanol by hydrogenation.Type: GrantFiled: June 20, 2005Date of Patent: February 10, 2009Inventor: Masayoshi Matsui
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Publication number: 20080237048Abstract: A device for electrodepositing a conductive material from a first solution into at least one feature formed on a wafer includes a hollow body, an electrode, and a moving mechanism. The hollow body includes a first opening and a second opening. The first solution is supplied to the second opening and injected from the first opening. The electrode is disposed within the hollow body. A potential difference is applicable between the first electrode and the surface of the wafer to electrodeposit the conductive material into the at least one feature. The moving mechanism is mechanically coupled to the hollow body. The moving mechanism is configured to position the first opening of the hollow body over the at least one feature.Type: ApplicationFiled: March 30, 2007Publication date: October 2, 2008Inventors: Ismail Emesh, Ivo Raaijmakers
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Patent number: 7238264Abstract: A galvanizing device has at least one jet cell with a contact zone located after the jet cell in the direction of transportation of a work piece through the jet cell. At least one partition separates the jet cell from the contact zone. A seal surrounds the workpiece and is situated at an outlet of the jet cell. A pre-baffle surrounds the outlet and acts as a mount for the seal.Type: GrantFiled: September 12, 2003Date of Patent: July 3, 2007Assignee: Cooper Standard Automotive, Inc.Inventor: Peter Kulzer
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Patent number: 7160428Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.Type: GrantFiled: June 4, 2004Date of Patent: January 9, 2007Assignee: Mitsui Mining & Smelting Co., Ltd.Inventor: Akira Fujimoto
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Patent number: 7128817Abstract: A feed belt for strip-shaped elements includes a belt body and a plurality of fingers, the fingers being previously fabricated and coupled to the belt body at constant pitches. The belt body includes fitting openings and slits formed at one side of the fitting openings. Each fitting opening serves to be coupled with a fitting portion and an elastic hinge portion formed at one side of each finger. Each slit serves to be coupled with a bent gripper portion formed at the other side of the finger so as to allow movement of the bent gripper portion. The fitting portion and the elastic hinge portion of the finger, to be coupled into the fitting opening, are integrally formed. The bent gripper portion to be fitted into the slit is integrally connected with the elastic hinge portion through a direction conversion portion.Type: GrantFiled: November 25, 2003Date of Patent: October 31, 2006Assignee: JetTech Ltd.Inventor: Kee Yol Choi
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Patent number: 7112264Abstract: A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive.Type: GrantFiled: June 27, 2003Date of Patent: September 26, 2006Assignee: Canon Kabushiki KaishaInventors: Hidetoshi Tsuzuki, Noboru Toyama, Yasuyoshi Takai, Ryo Hayashi, Yuichi Sonoda, Masumitsu Iwata, Yusuke Miyamoto
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Patent number: 7097755Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.Type: GrantFiled: November 4, 2002Date of Patent: August 29, 2006Assignee: ASM Nutool, Inc.Inventors: Bulent M. Basol, Halit N. Yakupoglu, Cyprian E. Uzoh, Homayoun Talieh
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Patent number: 7045053Abstract: An apparatus for the superficial electrolytic treatment of metal strips, comprising several separate and non-communicating tanks, or containers, located along the path of metal strip (13). A series of electrodes in pairs (14?, 15?, 14?, 15?, 14??, 15??), arranged as tunnels, is situated along the path. Each pair is associated with a container (2?, 2?, 2??), in which an electrod 14?, 14?, 14??) of each pair is located above the strip and the other (15?, 15?, 15??) is located below said strip, in a reciprocally opposits position and at an appropriate distance. The electrode pairs alternately have opposite polarity and each of them is respectively associated with a container. Rollers (3, 3?, 3?, 3??) in pairs for strip pressing are situated at the common border of adjacent containes for the galvanic separation of the strip surface areas facing the electrode pairs of opposite polarity.Type: GrantFiled: September 21, 2001Date of Patent: May 16, 2006Assignee: Danieli & C.Officine Meccaniche S.p.A.Inventors: Ralf Matzka, Dieter Gruchot
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Patent number: 7045043Abstract: The present invention relates to a method of reducing a band mark on an electroplating steel sheet, which can also reduce plating defects and damages to the materials caused by the differences in the physical characteristics of composition materials of a conductor roll used during electroplating Zn or Ni onto a steel sheet. In other words, the present invention comprises ceramic coating portions of circular bands, placed respectively in a thin strip at the both edge regions of the metal band position at the central portion of a conductor roll. In this manner, the present invention has the effects of reducing a band mark on a plating steel sheet, and also suppressing the generation of static electricity by eliminating the level difference between the conductive material (metal band portion) and the non-conductive material (rubber section). The present invention is also cabaple extending the life of a conductor roll by enhancing the wear and corrosion resistances thereof.Type: GrantFiled: July 24, 2000Date of Patent: May 16, 2006Assignee: Pohang Iron and Steel Co., Ltd.Inventors: Hyung-Jun Kim, Shi-Yeob Lee
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Patent number: 6991717Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.Type: GrantFiled: April 5, 2002Date of Patent: January 31, 2006Assignee: 3M Innovative Properties CompanyInventors: Gregory F. King, John S. Huizinga, James N. Dobbs, Luther E. Erickson, Daniel H. Carlson, Dale L. Ehnes, Gary A. Shreve
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Patent number: 6949171Abstract: This invention is a method of providing conductive tracks on a printed circuit including coating a substrate carrying printed tracks with an electro-plating solution with a tool which provides a first electrode of an electro-plating circuit and a second electrode provided by the tracks which are to be electroplated, and a tool suitable for use in electro-plating electrically conductive regions of a substrate, the tool including an absorptive member in which plating solution can be carried; a first electrode of an electro-plating circuit adapted to make electrical contact with plating solution carried by the absorptive member; and at least one tool second electrode electrically insulated from the first electrode and spaced from the absorptive member, the tool second electrode being so positioned that as the absorptive member is wiped across a surface of a substrate, the second electrode contactor can be wiped across the surface of the substrate to contact electrically conductive regions of the substrate to forType: GrantFiled: September 25, 2002Date of Patent: September 27, 2005Assignee: TDAO LimitedInventor: John Michael Lowe
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Patent number: 6929734Abstract: The apparatus is provided with a wire guiding means disposed in a liquid bath for turning the direction of a wire to feed the wire into and out of the bath contained by the liquid. The wire guiding means includes a tubular conduit having a first open end disposed in the liquid, a second open end disposed above the liquid, and a middle curved portion for guiding the wire through the tubular conduit. The tubular conduit can be at least partially filled with the liquid. Preferably, the treatment liquid is an electrodeposition liquid. A plurality of the tubular conduits may be disposed in the bath substantially parallel with each other. Preferably the first open end is connected to a bottom portion of the bath through a coupling such that the treatment liquid in the bath can flows into the tubular conduit. The second open end is positioned higher than the first open end.Type: GrantFiled: August 5, 2002Date of Patent: August 16, 2005Assignee: Goto Electronic, Co., Ltd.Inventor: Yoshihide Goto
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Patent number: 6837973Abstract: A process and apparatus are provided for producing an electrolytically coated, hot-rolled steel strip without any intervening strips. The apparatus includes a chemical pickling section being combined in one line with an electrolytic coating section containing electrolytic cells so that the pickled steel strip is fed directly to the electrolytic coating section without any intermediate steps. The spent electrolyte solution from the electrocoating section to the pickling section to pickle the steel. The spent pickling acid can also be used to generate the electrolyte solution that is fed to the electrocoating section.Type: GrantFiled: July 29, 1999Date of Patent: January 4, 2005Assignee: Andritz-Patentverwaltungs-Gesellschaft m.b.H.Inventor: Wilhelm Karner
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Publication number: 20040159549Abstract: An apparatus and method for fabricating metal fibers using electroforming are provided in which continuous metal fibers can be fabricated. Here, any kind of metal which can be electroplated is electro-deposited on the surface of a negative electrode in diameter of a desired size corresponding to a plurality of non-conductive patterns of the negative electrode surface in an electrolyzer, and the electro-deposited metal is continuously separated.Type: ApplicationFiled: February 14, 2003Publication date: August 19, 2004Inventors: Yong Bum Park, Chang Sung Ha
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Patent number: 6752915Abstract: The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the plurality of rollers has a mechanism for limiting deformation of the web within Y/E, and a web conveying method using a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and the web is conveyed while the deformation of the web is limited within Y/E by a mechanism that is provided for at least one roller of the plurality of rollers. The apparatus and the method prevent meandering of the web.Type: GrantFiled: March 27, 2001Date of Patent: June 22, 2004Assignee: Canon Kabushiki KaishaInventors: Kozo Arao, Noboru Toyama, Yuichi Sonoda, Yusuke Miyamoto
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Publication number: 20040104120Abstract: A cell to electroplate and/or electropolish semiconductor wafers includes an electrolyte receptacle and a wafer chuck assembly. The cell also includes a first actuator configured to translate the wafer chuck assembly between a first position and a second position, where the wafer chuck assembly covers the electrolyte receptacle in the first position and retracts from the electrolyte receptacle in the second position.Type: ApplicationFiled: November 24, 2003Publication date: June 3, 2004Inventors: Hui Wang, Felix Gutman, Voha Nuch
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Patent number: 6740164Abstract: Plating apparatus and plating method that can plate more uniformly on a processing surface of a workpiece are provided. The plating apparatus is comprised of a plating solution bathe which is provided with a first electrode held in a state soaked in a plating solution; a workpiece holding mechanism which holds a workpiece to contact its processing surface to the plating solution; and a contact member, disposed in the workpiece holding mechanism, that electrically contacts with the circumferential edge of the workpiece so to form a conductive layer on the workpiece surface as a second electrode. The contact member is divided along the circumferential direction of the workpiece with which they are electrically contacted. Thus, even if the contact resistance between each section of the contact member with the workpiece is variable, it is possible to adjust the plating electric current for each section of the contact member.Type: GrantFiled: January 30, 2002Date of Patent: May 25, 2004Assignee: Tokyo Electron LimitedInventors: Wataru Okase, Takenobu Matsuo
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Publication number: 20040074776Abstract: Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electrolyte is influenced by holding a body between the strip and the anode.Type: ApplicationFiled: January 16, 2003Publication date: April 22, 2004Inventor: Dammes Hans Van Der Weijde
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Publication number: 20040004000Abstract: A method of producing a hollow metal member and an apparatus for producing the same wherein a hollow metal member has uniform thickness of the electrodeposited metal material on the core wires, uniform outer diameter and high accuracy of roundness and coaxiality.Type: ApplicationFiled: July 8, 2002Publication date: January 8, 2004Applicant: O'LINK Technology LLCInventor: Akira Kenjo
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Patent number: 6652725Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.Type: GrantFiled: April 20, 2001Date of Patent: November 25, 2003Assignees: Mitsui Mining, Smelting Co., Ltd.Inventors: Kazuko Taniguchi, Makoto Dobashi, Hisao Sakai, Yasuji Hara
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Patent number: 6641706Abstract: The invention relates to a device to be used in processing of a surface of metal object to be processed which surface is essentially continuously in onwards motion. According to the invention a processing agent (1) is to be directed to the surface (5) to be processed by nozzles (6) in at least one position so that at most 70 per cent of the surface (5) to be processed is under processing in one position of directing processing agent (1).Type: GrantFiled: January 8, 2002Date of Patent: November 4, 2003Assignee: Outokumpu OyjInventors: Reine Johan Thorbjörn Lindwall, Anna Lindwall, Torbjörn Lindwall
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Publication number: 20030188965Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.Type: ApplicationFiled: April 5, 2002Publication date: October 9, 2003Applicant: 3M Innovative Properties CompanyInventors: Gregory F. King, John S. Huizinga, James N. Dobbs, Luther E. Erickson, Daniel H. Carlson, Dale L. Ehnes, Gary A. Shreve
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Patent number: 6607792Abstract: The invention concerns a method for making safety labels which consists in producing a base deposit on the film (100), then in defining a label shape (101). It further consists in producing (102) a printed window preferably by photogravure with cells bordered by a stripe forming the window outline; printing (103) the printing window on the base deposit with a passivation coating, and developing the window (104) by a physico-chemical operation.Type: GrantFiled: February 16, 2001Date of Patent: August 19, 2003Assignee: Breger Emballages S.A.Inventors: Alain Charles Marcel Jaques Breger, Guy Marcel Charles Claude Breger
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Patent number: 6589400Abstract: An apparatus for metal coating of bands by electroplating, with a band running through an acidic electrolyte enriched with a metal, the apparatus including at least one insoluble anode extending parallel to the band and divided, in a running direction of the band, in a plurality of separate anode strips insulated from each other, an arrangement for feeding current to each separate anode strip for precipitating the metal from the electrolyte, with the current flowing from a respective anode strip to the band which forms a cathode, whereby the metal is precipitated onto a band surface, and elements for supplying each anode strip with protective current the voltage of which is so selected that formation of cathode regions on anode strips, which are not supplied with the precipitation current, is prevented.Type: GrantFiled: October 22, 1999Date of Patent: July 8, 2003Assignee: SMS Schloemann-Siemag AGInventors: Werner Schimion, Thomas Folke
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Patent number: 6589399Abstract: In an electrolytic apparatus that passes a strip between paired members of a liquid throttle unit provided on at least one of an inlet side and an outlet side of a treatment cell through which the strip is continuously passed, an electrolytic apparatus with strip non-contacting liquid throttle unit is provided which is characterized in that the spacing between the paired members of the liquid throttle unit is set very slightly larger than the thickness of the passed strip to maintain the surfaces of the strip and the liquid throttle unit members, e.g. a seal roll, nozzle device or wedge-shaped block, in a non-contacting state.Type: GrantFiled: October 20, 1999Date of Patent: July 8, 2003Assignee: Nippon Steel CorporationInventors: Michihiro Shimamura, Masaharu Sanada
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Patent number: 6585875Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.Type: GrantFiled: January 25, 2002Date of Patent: July 1, 2003Assignee: CAP Technologies, LLCInventor: Danila Vitalievich Ryabkov
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Publication number: 20030089610Abstract: The invention relates to a method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, whereby the damaged surface is subjected to microgalvanic treatment, In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, according to the invention, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chrome-plating process can be used, whereby the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chrome-plating, because of the electrolyte used.Type: ApplicationFiled: September 27, 2002Publication date: May 15, 2003Inventor: Heinz-Peter Lettmann
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Patent number: 6544402Abstract: A method and an apparatus for manufacturing a wire, particularly a sawtooth wire for all-steel sawtooth wire card clothings, wherein the surface of a wire-shaped intermediate product, such as a wire already provided with sawteeth, is smoothened in an electropolishing process in an electrolyte bath containing an electrolyte. A relative movement is produced between the electrolyte and the intermediate product during the electropolishing process. The apparatus includes a device for producing a relative movement between the electrolyte and the intermediate product contained in the electrolyte bath.Type: GrantFiled: February 14, 2001Date of Patent: April 8, 2003Assignee: Graf + Cie AGInventor: Ralph A. Graf
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Publication number: 20030034252Abstract: Apparatus for use in a continuous electrochemical treating line and a method for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The apparatus includes at least one electrode extending across the surface of the continuous web in combination with at least two rigid, non-conductive, and non-polar bumper devices also extending the continuous web surface. The bumper devices include a slick contact surface positioned against the continuous web surface at spaced apart locations that prevent the continuous web from moving outside a pass-line through the electrolyte solution and arcing against the electrode. The bumper devices may comprise either a bumper strip or a conduit.Type: ApplicationFiled: August 20, 2001Publication date: February 20, 2003Inventor: James L Forand
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Patent number: 6514392Abstract: A conducting roller is used in an electroplating apparatus, and includes a conductive roller body, which has two diameter-reduced end portions that are journalled within two stationary conductive sleeve units. A conductive liquid is filled within two sealed gaps between the end portions of the roller body and the sleeve units, thereby transmitting cathode current from the conductive sleeve units to the end portions of the roller body.Type: GrantFiled: July 2, 2001Date of Patent: February 4, 2003Inventor: Jason Ko
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Patent number: 6514391Abstract: An electroplating apparatus includes a plurality of feeding rollers adapted to advance a sheet-shaped article, and a spraying unit. The spraying unit has a pair of upper and lower casings, each of which includes a casing body defining a chamber, and a net plate disposed to confront with the article. An electrolyte is sprayed from the chamber via meshes in the net plate and onto a side surface of the article. An anode current-conducting assembly includes a conducting net that is disposed fixedly within the chamber and that is superimposed on the net plate so as to cover the meshes in the net plate, and two conducting units respectively in electrical contact with two opposite side portions of the conducting net so as to supply electric current to the conducting net.Type: GrantFiled: June 7, 2001Date of Patent: February 4, 2003Inventor: Jason Ko
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Publication number: 20020189934Abstract: To avoid the formation of undesirable plating on electric supply rollers, there is provided a continuous plating apparatus in which a planar article to be plated is vertically clamped on both sides by electric supply rollers and the article to be plated is moved horizontally in a plating bath by the rotation of the electric supply rollers to plate both surfaces of the article to be plated. The apparatus is characterized in that the electric supply rollers are divided into conductive segments and non-conductive segments in the circumferential direction, with only the conductive segment which is in contact with the article to be plated being negatively charged, and other conductive segments which are at a distance from the article being positively charged.Type: ApplicationFiled: August 21, 2002Publication date: December 19, 2002Inventor: Kazuo Ohba
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Publication number: 20020162749Abstract: A continuous electrocoat apparatus is provided for applying a coating onto a substantially flat substrate, e.g., an electroconductive substrate in coil or blank form. In one embodiment, the apparatus includes a first electrocoat tank having a coating region and a non-conductive conveyor extending at least partially into the first electrocoat tank and defining a conveyor path. A plurality of electrically conductive supports are carried on the conveyor. A connecting system is configured to selectively place at least a portion of the supports in electrical contact with an electrical power source when the selected supports are in the coating region of the first electrocoat tank.Type: ApplicationFiled: March 2, 2001Publication date: November 7, 2002Inventors: Donald D. Emmonds, Catharine A. Palmer
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Publication number: 20020139685Abstract: A continuous nickel plating process for at least one aluminum conductor includes a pre-treatment step P that improves the adherence of a nickel coat, and an electrolytic nickel plating step N, and is characterized in that the contact properties of the conductor after the pre-treatment step P are sufficient to enable a mechanical electrical contact, and in that the nickel plating current (In=I1) is transmitted to the conductor through a mechanical electrical contact on the part of the conductor output from the pre-treatment step (P). The invention is also directed to a device including a nickel plating tank with a receptacle that can contain a nickel plating bath and at least one electrode called the anode, containing nickel, at least one electrical power supply to apply a voltage (V1) between the electrode, or each electrode, and the conductor or each conductor, and means for moving the conductor in the nickel plating bath.Type: ApplicationFiled: January 18, 2002Publication date: October 3, 2002Inventors: Gabriel Colombier, Jean-Sylvestre Safrany, Bernard Loreau, Sandrine Tournier
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Patent number: 6432295Abstract: In a process for the electrolytic polishing of surgical needles, a plurality of unfinished needles, which are arranged side by side and are secured to at least one web (6, 7) in their end-regions lying opposite the needle tips, are moved with the help of the web (6, 7) through an acid-containing polishing bath (22) which is electrically connected to an electrode. The web (6, 7) is guided above the polishing bath (22). The unfinished needles dip at least with the needle tips into the polishing bath (22). Above the polishing bath (22) and alongside the web (6, 7), a metal ribbon (40) connected as a counter-electrode provides an electrical connection with the unfinished needles.Type: GrantFiled: November 22, 2000Date of Patent: August 13, 2002Assignee: Ethicon LimitedInventors: Horst Szameitat, Stephan Gelahr
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Publication number: 20020096434Abstract: A process and apparatus for conducting an electrically independent current through an anodized web to electro-deposit a coloring agent on the web. A preferred process includes the step of providing a continuous web of anodized aluminum; transferring with a charging plate a coloring current to the web with a charging plate in a first treatment cell over an area of the web sufficient to allow the current to pass through an anodic layer of the aluminum and flow through the web; and electro-depositing coloring agents on the web with the coloring current in a second treatment cell. Optionally, the web may be serially passed through additional treatment cells to apply a variety of different coloring currents to the web whereby the web may be colored with multiple coloring agents and consequently exhibit multiple colors and/or refractive properties.Type: ApplicationFiled: January 19, 2001Publication date: July 25, 2002Inventors: Gregory S. Marczak, Rick A. Minner
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Patent number: 6406610Abstract: Electro-plating apparatus 1 has an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 being a planar anode 4 and an arcuate solid anode 5. In use, a continuous web of flexible substrate 6 (onto both side of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8, 9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connectors and have a number of circumferential projections 10 which ensure electrical contact with unconnected or discreet regions on substrate 6. Another electro-plating apparatus 20 has a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement fo the substrate.Type: GrantFiled: March 15, 2000Date of Patent: June 18, 2002Assignee: Technology Development Associate Operations LimitedInventor: John Michael Lowe
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Patent number: 6387227Abstract: An oxidation electrode is formed with a front-surface-side electrode member and a back-surface-side electrode member, and two switches are provided respectively between a power supply and the front-surface-side electrode member and between the power supply and the back-surface-side electrode member. Since the front-surface-side electrode member and the back-surface-side electrode member are separate, an aluminum plate and other structures provided in a anodizing bath do not hinder a replacement of the electrode members, so that the replacement can be carried out easily and at low costs. Since the front-surface-side electrode member and the back-surface-side electrode member can be independently turned on and off for a single side treatment, the energy efficiency can be improved and switching between the single side treatment and the double treatment can be facilitated.Type: GrantFiled: November 13, 2000Date of Patent: May 14, 2002Assignee: Fuji Photo Film Co., Ltd.Inventors: Tatsuya Hamanaka, Hiromitsu Nonaka
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Patent number: 6361673Abstract: An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.Type: GrantFiled: June 27, 2000Date of Patent: March 26, 2002Assignee: GA-TEK Inc.Inventors: Thomas J. Ameen, Barbara J. Kidon, Peter Peckham