Abstract: Disclosed herein is a coil component capable of being protected from static electricity without loss of a main magnetic flux loop. The coil component includes: a magnetic substrate; a coil layer disposed on the magnetic substrate and having conductor patterns installed therein; and an electrostatic discharge (ESD) protecting layer disposed on the coil layer and discharging static electricity introduced into the conductor patterns.

Abstract: A fixing element for components of an assembly, comprising a rod which is formed by a cylindrical shaft and an end, the rod being a metal component which is at least partially surface-treated by means of anode oxidation and coated over at least a portion of the cylindrical shaft with a lubricating coating. Such a fixing element enables the electrical continuity to be ensured with the components during mounting with moderate interference in the assembly.

Abstract: A contact layer for an electrical contact is disclosed having bismuth and being tin-free.

Abstract: A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one corrosion inhibitor, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers.

Abstract: A method of fabricating electrodes having protruding nanofeatures includes growing metal oxide nanofeatures on a metal or metal alloy wire using a heat treatment in an oxidizing environment. An electrically conducting material is deposited on the nanofeatures to form coated nanofeatures. An electrochemically active material (active material) is deposited to form a coating onto the coated nanofeatures to form at least one nanofeatured electrode. An energy storage coaxial cable (ESCC) can be formed from a first nanofeatured electrode and a second nanofeatured electrode, wherein the first nanofeatured electrode is configured as a linear electrode and the second nanofeatured electrode is configured as a tubular electrode, and the ESCC includes an ion porous separator and an electrolyte between the first nanofeatured electrode as an inner electrode and the second nanofeatured electrode as an outer electrode.

Abstract: A suspension substrate of the present invention includes an insulating layer, a spring material layer, and a plurality of wirings, wherein one wiring of the plurality of wirings includes a head-side wiring part and a plurality of division wiring parts, respectively bifurcated from the head-side wiring part. The spring material layer includes a spring-material-layer main body, a first spring-material-layer separated body and a second spring-material-layer separated body. The division wiring parts of the one wiring are respectively connected with the first spring-material-layer separated body, via a pair of conductive connection parts, respectively extending through the insulating layer. The first spring-material-layer separated body is located on one side relative to the longitudinal axis, while the second spring-material-layer separated body is located on the other side relative to the longitudinal axis.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: A photo-resist (21) is applied in a pattern of vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal (22) into the spaces around the columns (21). There is further application of a second photo-resist mask (25) of much larger (wider and taller) columns, encompassing the area of a number of first columns (21). The hole diameter in the second plating layer is chosen according to a desired flow rate.

Abstract: Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.

Abstract: An X-ray mask structure includes a unibody support substrate having at least one thinned portion surrounded by a wall portion, a top layer disposed on the at least one thinned portion of the support substrate, and a plurality of X-ray absorber patterns disposed on the top layer over the at least one thinned portion. The top layer and the at least one thinned portion form a laminated membrane, wherein the at least one thinned portion and the wall portion provide mechanical support for the top layer, and the laminated membrane provides mechanical support for the plurality of X-ray absorber patterns.

Abstract: Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material.

Abstract: A method of fabricating a magnetic recording disk including providing a magnetic recording layer having a pattern of raised areas and recessed areas formed thereon and providing a mask layer on the raised areas of the magnetic recording layer. The method further including electrodepositing a first protection layer on the magnetic recording layer, removing the mask layer, and depositing a second protection layer above the first protection layer.

Abstract: An optical encoder light shielding plate has a plurality of bridge parts provided in parallel, each of the plurality of bridge parts having a metallic layer, and a slit formed between the plurality of bridge parts. The slit is configured to have light incident therefrom. In the metallic layer, a master-side surface on an exposed surface side of a conductive master body is arranged on a light incident direction side. The metallic layer is obtained such that a plurality of cavities are provided in parallel on the exposed surface of the conductive master body. A voltage is applied while the conductive master body is dipped in an electrolytic solution. The metallic layer is electrodeposited on the exposed surface of the conductive master body in the cavities.

Abstract: The embodiments herein relate to methods and apparatus for filling features with copper by a bottom-up fill mechanism without the use of organic plating additives. In some cases, filling occurs directly on a semi-noble metal layer, without the deposition of a copper seed layer. In other cases, the filling occurs on a copper seed layer. Factors such as the polarization of electrolyte, the use of a complexing agent, electrolyte pH, electrolyte temperature, and the waveform used to deposit material may contribute to promoting the bottom-up fill.

Abstract: Disclosed herein are a stamper which has anodized alumina formed on the surface thereof and which will not cause macroscopic unevenness or color unevenness on the transcribed surface; a method for producing the same; and a method for producing a molded material without macroscopic unevenness or color unevenness on the transcribed surface thereof by using such a stamper. The stamper includes alumina which has a microasperity structure and which is formed by anodization on the surface of a prototype aluminum mold having an aluminum purity of 99.5% or more, an average crystal-grain diameter of 1 mm or less, and an arithmetic mean surface roughness Ra of 0.05 ?m or less. The use of this stamper enables the production of a molded material which does not have macroscopic unevenness or color unevenness on the transcribed surface thereof and which is suitable for use as an antireflection article and the like.

Abstract: Provided is a method for obtaining a cooking vessel having the following steps: producing a bowl having an outer face made of aluminium and an inner face, carrying out hard anodization of at least the outer face of the bowl. According to the method, at least one colouring step is carried out on the anodized outer face after hard anodization, said colouring step employing at least one water-soluble inorganic pigment.

Abstract: Disclosed herein is an inductor element having an internal electrode in which a first plating layer and a second plating layer having a coil shape are embedded, the inductor element including: a first plating layer formed on a support member; an insulating layer covering the first plating layer and provided with an opening which exposes an upper surface of the first plating layer; and a second plating layer filled in the opening, whereby the inductor element in which the internal electrode having a high aspect ratio is embedded is implemented.

Abstract: A cover for an electronic device may include a metal plate having a first metal region formed of a metal; a through-hole formed in a portion of the first metal region of the metal plate; and an electrical open path extending from the through-hole to an end portion on one side of the first metal region through metal oxidation.

Abstract: A method can be used for producing a fully active stack. A stack has the sides A, B, C and D running along the stacking direction. The method includes combining and temporarily making contact with the internal electrodes that make contact with the respective side on one of the sides B or D, such that the internal electrodes that make contact with the respective side can be electrically driven selectively. The electrically driven internal electrodes are electrochemically coated on the sides A and C. The stack is singulated to form a fully active stack with the electrochemically coated internal electrodes on the sides A? and C?. A method for producing a multilayer component comprising the fully active stack and a fully active multilayer component producible according to the method are furthermore proposed.

Abstract: Matching layers improve the performance of ultrasonic transducers. Such layers have traditionally required significant effort and expense to be added to ultrasonic transducers. The present invention discloses a method of producing ultrasonic transducers with a matching layer, specifically for ultrasonic transducers utilizing piezopolymer transducer materials. Rather than the conventional method of forming the piezopolymer on a substrate and then attaching a matching layer through which the transducer emits its ultrasound energy, we teach depositing the piezopolymer on a substrate that also serves as a matching layer through which the ultrasound is emitted. We also teach depositing an additional shield layer for reducing electromagnetic interference. Methods of how to select materials and modify their ultrasonic characteristics are also discussed.

Abstract: A composite electronic structure comprising at least one feature layer and at least one adjacent via layer, said layers extending in an X-Y plane and having height z, wherein the structure comprises at least one capacitor coupled in series or parallel to at least one inductor to provide at least one filter; the at least one capacitor being sandwiched between the at least one feature layer and at least one via in said at least adjacent via layer, such that the at least one via stands on the at least one capacitor, and the at least one of the first feature layer and the adjacent via layer includes at least one inductor extending in the XY plane.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Abstract: A method is provided for marking a tool. The method includes the steps of providing a dented mark in the tool, providing a first protection layer on the tool except the dented mark, and providing a second protection layer on the first protection layer. The first and second protection layers are made of colors that are selected so that when there is a scratch in the second protection layer, a color shown in the scratch is similar to the color of the second protection layer.

Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate.

Abstract: A near field transducer with a peg region, an enlarged region disposed adjacent the peg region, and a barrier material disposed between the peg region and the enlarged region. The barrier material reduces or eliminates interdiffusion of material between the peg region and the enlarged region.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.

Abstract: [Problem] To provide an anti-virus aluminum member capable of minimizing secondary infection by deactivating viruses in a short period of time even when viruses adhere thereto, regardless of whether a viral envelope is present, and useful for application in door knobs, handrails, air-conditioner fins or the like. [Solution] An anti-virus aluminum member capable of deactivating viruses that adhere thereto is characterized in that an anti-virus inorganic compound is present in the pores of an anodized membrane provided with multiple pores and obtained by anodizing aluminum or an aluminum alloy.

Abstract: A method of reducing the friction between the wall(s) of a mold and the outer wall(s) of a metal container fitting snugly in the mold and containing a metal ammine complex salt which is uniaxially compacted within the container, comprises a) treating or covering the inner wall(s) of the container with a lubricant before the metal ammine salt is filled into the container, or b) mixing a solid lubricant with the metal ammine salt to be filled into the container is, or c) treating or covering a gas-permeable enclosure made of a flexible material and wrapped around the solid metal ammine salt with a lubricant before the solid metal ammine salt wrapped into the envelope is filled into the container, or a combination of a) and b) or a) and c). A lubricated container and a lubricated enclosure each containing a metal ammine salt is also disclosed.

Abstract: A housing for an electronic device, including an aluminum layer enclosing a volume that includes a radio-frequency (RF) antenna is provided. The housing includes a window aligned with the RF antenna; the window including a non-conductive material filling a cavity in the aluminum layer; and a thin aluminum oxide layer adjacent to the aluminum layer and to the non-conductive material; wherein the non-conductive material and the thin aluminum oxide layer form an RF-transparent path through the window. A housing for an electronic device including an integrated RF-antenna is also provided. A method of manufacturing a housing for an electronic device as described above is provided.

Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Abstract: An internal combustion engine in which an anodic oxidation coating film is formed on all or a portion of a wall that faces a combustion chamber, wherein the anodic oxidation coating film has a structure that is provided with a bonding region in which each of hollow cells forming the coating film is bonded to the adjacent hollow cells, and a nonbonding region in which three or more adjacent hollow cells are not bonded to each other, and wherein a porosity of the anodic oxidation coating film is determined by a first void present in the hollow cell and a second void that forms the nonbonding region.

Abstract: A method for manufacturing a disk drive head suspension having a plated load point dimple. An aperture is etched into the spring metal member. A photoresist mask having an opening with load point-defining side walls and a load point diameter is formed over a portion of a spring metal member including the aperture. Metal is plated onto the spring metal member and into the aperture in the opening to form a load point having the load point diameter on the spring metal member.

Abstract: The invention relates to a machine (1) adapted to metallise a cavity of a semi-conductive or conductive substrate such as a structure of the through silicon via type, according to a metallisation process comprising the steps consisting of: a) depositing an insulating dielectric layer in the cavity, b) depositing a barrier layer to diffusion of the filling metal, c) filling the cavity by electrodeposition of metal, preferably copper, and d) carrying out annealing of the substrate, characterised in that it comprises a series of wet-processing modules (10-60) configured to conduct steps a), b) and c) by wet-processing in a chemical bath (B) and at least one additional module (70) adapted to conduct annealing step d) of the substrate (S) such that the machine (1) is capable of executing the entire metallisation process of the cavity.

Abstract: Method and apparatus are provided for electroplating a surface area of an internal wall defining a cooling cavity present in a gas turbine engine airfoil component.

Abstract: Solar cells are produced using a method for producing solar cells, wherein silicon containing vitreous substrates is provided, wherein each substrate is provided with an electrically conductive material on at least one side thereof. In the method, at least a portion of each substrate is successively transported through an electrolytic solution that is present in an electrolytic bath, and the electrically conductive material as the cathode is connected during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction.

Abstract: A structure for a chemical sensing device, the structure comprising at least one electrically conductive element located in, and protruding from, at least one recess. A method of manufacturing the structure includes: (a) providing a template comprising at least one recess having a recess depth; (b) providing an electrically conductive material in the at least one recess; and (c) removing part of the template to decrease the recess depth of the at least one recess, thereby forming said protruding at least one electrically conductive element.

Abstract: The invention relates to a coating mask (1) for electrolytically coating the piston ring groove (39) of a piston (38), which is made of an elastically deformable material and has openings (3 to 10) that are arranged axially and are distributed in a uniform manner over the periphery, into which rods (11 to 18) of an expansion device (19) can be introduced, the rods being arranged in a displaceable manner such that the expansion device (19) can increase the radial diameter of the coating mask (1) and also the inner opening (2) so that the piston (38) can be introduced into the inner opening (2). The radial diameter of the coating mask (1) is selected in such a manner that after the reduction of radial diameter of the coating mask (1) and the inner opening, the elastically tensed coating mask (1) presses sealing lips (44, 45) of the coating groove (37) against the piston (38), on both sides of the piston ring groove (39).

Abstract: Various embodiments of undulators, methods of fabricating undulators, and systems incorporating undulators are described. Certain embodiments provide a compact, electromagnetic undulator. The undulator may comprise a substrate and one or more electromagnets, which may be formed on the substrate. Certain embodiments have a period not greater than about 5 mm. The undulator may be operatively coupled with a particle accelerator to provide a free electron laser system.

Abstract: Disclosed herein is a power inductor including: an opening part penetrating through the insulating layer; an upper coil electrode pattern formed on an upper surface of the insulating layer and having a form in which it is wound around the opening part; a lower coil electrode pattern formed on a lower surface of the insulating layer and having a form in which it is wound around the opening part; and metal layers plated on a surface of the innermost pattern of the upper coil electrode pattern and a surface of the innermost pattern of the lower coil electrode pattern, wherein the metal layers plated on the surfaces of the innermost patterns of the upper and lower coil electrode patterns are extended to an inner wall of the opening part to thereby be connected to each other.

Abstract: An implantable delivery device and method for utilizing the device to delivery a bioactive agent to a subject in need thereof is described. The device includes a pattern of structures fabricated on a surface of the device to form a nanotopography. A random or non-random pattern of structures may be fabricated such as a complex pattern including structures of differing sizes and/or shapes. The device may be located adjacent tissue such as an endovascular implant or a perivascular implant, and may deliver the bioactive agent without triggering an immune or foreign body response to the bioactive agent.

Abstract: A method for manufacturing a stent includes forming a stent blank from a first material, the stent blank comprising a plurality of struts and a plurality of crowns, each crown connecting at least two struts, and a plurality of slots in at least some of the plurality of struts and/or the plurality of crowns, depositing a second material over outer surfaces of the struts and the crowns and in the slots to encase the stent blank in the second material, creating at least one opening through the second material, and removing the first material to form a stent comprising the second material, the stent having a continuous lumen from one end of the stent to the other end of the stent, the continuous lumen being partitioned in portions corresponding to the locations of the slots in the stent blank. The lumen may then be filled with a therapeutic substance.

Abstract: A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer conforms to a shape of the contacted portion of the replicate. The conductive layer is formed to have a base and a plurality of conductive posts projecting away from the base. Each conductive post is formed to have a post end opposite the base. A dielectric layer is formed to cover the base and to separate adjacent ones of the posts from each other. The posts are for forming vias. Conductive material is removed from the conductive layer to insulate at least one post from at least one other post.

Abstract: A probe structure is disclosed which includes a metal needle, a soft insulative tube and a metal layer. The metal needle has a first end-portion and a second end-portion opposite to each other. The first end-portion has a tip. The soft insulative tube has a through hole in which the metal needle is partially inserted. The tip of the metal needle protrudes from the through hole. The metal layer is coated on the outer surface of the soft insulative tube and is electrically isolated from the metal needle; the thickness of the metal layer has a thickness no larger than 10 micrometers. Therefore, good resilience and signal integrity could coexist in the probe structure. A probe card including several above-mentioned probe structures and a method for manufacturing the above-mentioned probe structure are also disclosed.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.

Abstract: There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.

Abstract: The invention relates to a method for producing an anti-infective coating on implants that contain titanium or are composed of titanium. The aim of the invention is to provide a coating method with which it is possible, for implants made of titanium or that contain titanium, to combine the optimization of the mechanical properties achieved with the anodic oxidation type II with the optimization of the anti-infective properties. According to the invention, the implants are anodically oxidized in an alkaline solution, then metal having anti-infective properties is electrodeposited on said surface, and afterwards the oxide layer containing metal is solidified.

Abstract: A film-forming apparatus (100) includes: a vacuum chamber (30) configured to store a substrate (34B) in which a through-hole is formed and a source of copper emission (35B); a vacuum pump (36) configured to decompress an interior of the vacuum chamber (30) to a predetermined degree of vacuum; a power supply (80) configured to generate electric power applied to the substrate (34B); and a driving mechanism for use in setting a distance between the substrate (34B) and the source of copper emission (35B). When a copper material emitted from the source of copper emission (35B) is deposited on one main surface of the substrate (34B) to block an opening of the through-hole in the one main surface by means of a deposited film formed of the copper material, a blocked state of the opening blocked by the deposited film is adjusted based on the distance and the electric power.

Abstract: An in-situ compressed specimen of copper interconnection micro column, which is a circular metal column formed in a PDMS hole, includes: a specimen part and a fixed end part for fixing the specimen; wherein the fixed end part is a circular or square plate structure, the specimen part is an upper part of the fixed end part; a main body of the present invention is of micron order, a forced direction of the specimen is consistent with a growth direction of the metal column. A method of electroplating copper column by adopting PDMS as template substrate is applied to overcome a problem that TSV is corrosive to the copper column during a silicon etching process so as to affect a mechanical property accuracy test, the method is advanced in shortening test process period, achieving good reproducibility and high yield.

Abstract: Method for manufacturing a metal grating structure, wherein, after a concave part having an insulating layer on an inner surface thereof is formed in a silicon substrate, a portion of the insulating layer formed on a bottom part of the concave part is removed, and the silicon substrate at the bottom part of the concave part is etched to increase the surface area of the bottom part of the concave part as compared with a state before the etching, followed by filling the concave part with metal by an electroforming method.