Abstract: A method for forming front contacts on a silicon solar cell which includes texture etching the front surface of the solar cell, forming an antireflective layer over the face, diffusing a doping material into the face to form a heavily doped region in valleys formed during the texture-etching of the face, depositing an electrically conductive material on the heavily doped regions in the valleys and annealing the solar cell.

Abstract: Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

Abstract: A method for making a film having an array of cobalt selenide nanowires including: providing an aluminum substrate; anodizing the aluminum substrate to form anodized aluminum including an aluminum oxide layer having a plurality of pores therein on a surface of the aluminum substrate; preparing an electrodeposition composition including a source of cobalt ions and a source of selenite ions; contacting the anodized aluminum with the electrodeposition composition; and applying AC current to the anodized aluminum for a sufficient duration to electrodeposit cobalt selenide into the pores to form a film having an array of oriented cobalt selenide nanowires. According to a different aspect, a film has an aluminum substrate; an oxide layer having a plurality of pores therein on a surface of the aluminum substrate; and an array of cobalt selenide nanowires disposed in the pores.

Abstract: A method for fabricating multi-component nanowires is disclosed, which can make multi-component nanowires used to realize a nanowire-based memory device by an electroplating process using a multi-component solution. The method for fabricating multi-component nanowires in accordance with the present invention includes the steps of: (a) preparing an anodized aluminum oxide nanotemplate having a plurality of pores; (b) forming an electrode layer on one surface of the anodized aluminum oxide nanotemplate; (c) injecting the anodized aluminum oxide nanotemplate in a predetermined multi-component solution and then growing multi-component nanowires through the pores of the anodized aluminum oxide nanotemplate by an electroplating process in which the anodized aluminum oxide nanotemplate is used as a cathode; and (d) removing the anodized aluminum oxide nanotemplate.

Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

Abstract: A manufacturing process is provided where aggressive (i.e. tight tolerance) stitching offers several advantages for magnetic write heads but at the cost of some losses during pole trimming. This problem has been overcome by replacing the alumina filler layer, that is used to protect the stitched pole during trimming, with a layer of electroplated material. Because of the superior step coverage associated with the plating method of deposition, pole trimming can then proceed without the introduction of stresses to the stitched pole while it is being trimmed.

Abstract: This invention presents microstructures enhanced with nanopillars. The invention also provides a novel way for manufacturing nanopillar-enhanced microstructures, using conventional microfabrication techniques. In some embodiments, the invention also provides methods of use for the nanopillar-enhanced microstructures.

Abstract: Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates.

Abstract: Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable.

Abstract: This invention discloses an electrochemical method for the preparation of single atom tips to replace the traditional vacuum evaporation method. The invented method for preparation of single atom tips includes the following steps: A substrate single crystal metal wire etched electrochemically to form a tip. The surface of the metal tip is cleaned. A small quantity of noble metal is plated on the apex of the tip in low concentration noble metal electrolyte. Annealing in vacuum or in inert gas ambient to diffuse the additional electroplated noble metal atoms and thus a single atom tip is formed on the surface of the substrate. The present invention also discloses the single atom tip so prepared. The single atom tip of this invention has only a very small number of atoms, usually only one atom, at its apex.

Abstract: Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.

Abstract: Methods for electrodeposition of conductive material on a conductive substrate that contains a pattern of a chemisorbed surfactant formed by a stamp having a patterned surface which is pressed onto the surface of the substrate for printing the substrate. Electrodeposition occurs by immersing the patterned substrate in a plating bath upon application of deposition potential or current to the conductive substrate. In embodiment, the chemisorbed surfactant on the surface of the substrate acts as a positive resist so that electrodeposition occurs on regions of the substrate not covered with surfactant. In another embodiment, electrodeposition occurs preferentially in regions of the substrate covered with the chemisorbed surfactant.

Abstract: A manufacture process of a connector includes six steps of: (1) providing an insulating body; (2) providing a shelter with at least one slot; (3) the shelter being covered on the insulating body; (4) a metal pellet passing through the slot being plated with the insulating body to form a metal layer with a specific shape by a method of a physical plating membrane; (5) putting the insulating body into chemical liquid so that the metal layer of the insulating body being plated with at least one metal layer for protecting; and (6) taking the shelter off. Comparing to the prior art, the manufacture process of the connector uses a method of plating membrane to form a metal layer having the same function as a conductive terminal. By the method, the elastic contact portion can be installed on the two ends of the pressing contact connector.

Abstract: An object of the present invention is to provide a face-down type jet plating device in which deterioration in plating quality due to minute solid foreign matters derived from a black film etc. is prevented without impairing operativity. The plating device is designed such that a partition (7) is provided between a semiconductor wafer (1) and an anode (5) so that the anode (5) and the semiconductor wafer (7) are separated from each other and a plating tank (100) is divided into a substrate-to-be-plated chamber and an anode chamber.

Abstract: Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

Abstract: A method of making electromagnetic wave shielded read and write wires is provided. The method includes forming a bottom insulation layer on a bottom shield layer formed on a substrate. Then, forming electrically conductive wire material into openings in a first forming layer to form first and second read wires and first and second write wires. Forming a top insulation layer on the bottom insulation layer and on the wires. Then, forming a second forming layer on the top insulation layer with first, second, third, fourth and fifth openings down to the top insulation layer. Ion milling portions of the top insulation layer exposed by the openings in the second forming layer down to the bottom shield layer, then removing the second forming layer. Then, forming nonmagnetic electrically conductive middle shield layers in the openings in electrical contact with the bottom shield layer and forming a top shield layer on top of the middle shield layer.

Abstract: Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching Operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching Operations may be separated by intermediate post processing activities, they may be separated by cleaning Operations, or barrier material removal Operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

Abstract: Treatment of substrates, formation of structures, and formation of multilayer structures using contact masks are disclosed where a non-parallel or non-simultaneous mating of various mask contact surfaces to a substrate surface occurs. Some embodiments involve bringing a relative planar mask contact surface and a relative planar substrate surface together at a small angle (but larger than an alignment tolerance associated with the system). Some embodiments involve flexing a mask to make it non-planar and bringing it into contact with a substrate such that progressively more contact between the mask and substrate occur until complete mating is achieved. Some embodiments involve use of gas or liquid pressure to bow a flexible or semi-flexible mask and use a linear actuator to bring the mating surfaces together and to bring the mask into a more planar configuration.

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract: Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

Abstract: Disclosed methods reduce the discontinuities between individual layers of a structure that are formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., limitations that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.

Abstract: The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

Abstract: According to a method for producing a solid body (1) including a microstructure (2), the surface of a substrate (3) is provided with a masking layer (6) that is impermeable to a substance to be applied. The substance is then incorporated into the substrate regions not covered by the masking layer (6). A heat treatment is used to diffuse the substance into a substrate region covered by the masking layer (6) such that a concentration gradient of the substance is created in the substrate region covered by the masking layer (6), proceeding from the edge of the masking layer (6) inward with increasing distance from the edge. The masking layer (6) is then removed to expose the substrate region under this layer, and a near-surface layer of the substrate (3) in the exposed substrate region is converted by a chemical conversion reaction into a coating (9) which has a layer thickness profile corresponding to the concentration gradient of the substance contained in this near-surface layer.

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

Abstract: A method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure. The method uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The method would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.

Abstract: A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material (10) is coated in an electrophoretic coating means (14) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser (40), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas (42) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.

Abstract: The invention provides a coated metal substrate comprising a metal substrate having an outer surface, a maskant film adhered to at least a portion of the outer surface of the metal substrate, the maskant film having a pattern of scribed lines therein, and a line sealant composition applied to the scribed lines in a maskant film. Both the maskant film and the line sealant composition are preferably radiation cured and substantially solvent-free. The invention also provides a method of protecting a metal substrate from chemical exposure by utilizing the radiation-cured maskant film and line sealant composition.

Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.

Abstract: A plate and a substrate are placed to face each other and a treatment liquid is jetted from a treatment liquid jetting portion of the plate, thereby treating the substrate. At this time, bubbles in the treatment liquid are discharged from an opening formed in the plate, thereby enabling reduction in treatment nonuniformity caused by the bubbles. The formation of a slope toward the opening on the plate makes it possible to further promote the removal of the bubbles from the treatment liquid.

Abstract: A method is provided for the fabrication of a protective coating for a crucible with channels being formed in the coating. A material is adhered to the outer wall of the crucible to form a pattern thereon. The outer wall of the crucible along with the pattern of material adhered thereto is next coated with another material. The material used to form the pattern should extend through the outer material coating to define at least one port therein. Next, the crucible with its pattern of material and outer coating material is heated to a temperature of transformation at which the pattern of material is transformed to a fluidic state while the crucible and outer coating material maintain their solid integrity. Such transformation could also be accomplished by using a solvent that causes the pattern of material to dissolve.

Abstract: A method for surface treatment of a metal base includes the steps of: (a) anodizing the base to obtain a first layer of oxidation film on a surface of the base; (b) removing or covering a first area of the oxidation film; and (c) anodizing the base to obtain a second layer of oxidation film. A second area of the oxidation film is thus formed on the base which is different from the first area of the oxidation film. The second area is either higher or lower than the first area, therefore an anaglyphic decorative effect is obtained on the surface of the base.

Abstract: In a method of providing a surface with a protection layer having at least a first surface area (2) and a second surface area (1), which surface areas (1, 2) are distinguishable in that the surface areas (1, 2) differ from each other in at least one visual property, parts of the surface situated outside the first surface area (2) are masked with a mask layer which partially covers the surface, and the surface is subjected to an electrochemical treatment (14, 20), whereby non-masked parts of the surface are treated. As the mask layer provided on the surface is a sol-gel layer forming the protection layer in the second surface area (1), a wear-resistant surface-protection layer having visually distinguishable surface areas is provided in an efficient manner. An object which can be obtained by means of the proposed method is also described.

Abstract: A method of manufacturing a decorative plate (1) includes the steps of: preparing a metal substrate and covering selected areas (11, 16) of the substrate with a protective film; anodizing the substrate; and removing the protective film to expose metallic surfaces in the selected areas of the substrate.

Abstract: Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

Abstract: In a method of providing a surface with a protection layer having at least a first surface area (2) and a second surface area (1), which surface areas (1, 2) are distinguishable in that the surface areas (1, 2) differ from each other in at least one visual property, parts of the surface situated outside the first surface area (2) are masked with a mask layer which partially covers the surface, and the surface is subjected to an electrochemical treatment (14, 20), whereby non-masked parts of the surface are treated. As the mask layer provided on the surface is a sol-gel layer forming the protection layer in the second surface area (1), a wear-resistant surface-protection layer having visually distinguishable surface areas is provided in an efficient manner. An object which can be obtained by the proposed method is also described.

Abstract: Within both a method for forming a patterned photoresist layer and a method for forming an electroplated patterned conductor layer while employing the patterned photoresist layer as a patterned photoresist plating mask layer there is first provided a substrate. There is then formed over the substrate a blanket photoresist layer formed of a negative photoresist material. There is then photoexposed the blanket photoresist layer to form a photoexposed blanket photoresist layer while employing a photoexposure apparatus which employs an annular edge ring exclusion apparatus positioned over an annular edge ring of the blanket photoresist layer and the substrate. Finally, there is then developed the photoexposed blanket photoresist layer to form a patterned photoresist layer having an annular edge ring excluded over the annular edge ring of the substrate.

Abstract: Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEX™) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEX™ process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFAB™.

Abstract: Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEX™) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEX™ process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFAB™.

Abstract: A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: In a method of frame plating, an electrode film for plating is formed on a base layer of a plating layer to be formed. Next, a resist layer is formed on the electrode layer. The resist layer is exposed to beams for exposure through the use of a mask. Next, the resist layer exposed is developed and the portion exposed is removed to form a resist frame, such that the angle &thgr; between an inner wall of the resist frame and the bottom surface thereof exceeds 90 degrees. Next, heat treatment is performed on the resist frame, such that the angle &thgr; becomes 90 degrees or smaller. Next, plating is performed with the electrode film as the seed layer through the use of the resist frame having gone through the heat treatment. The plating layer is thereby formed.

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having an opening therethrough for passage of light only through the opening. Next, a negative photoresist layer is deposited on the masking layer, the negative photoresist layer being capable of photochemically reacting with the light. A light source passes light through the substrate, so that the light also passes only through the opening in the form of a tapered light cone. This tapered light cone will define the tapered contour of a nozzle plate orifice wall to be formed. The negative photoresist layer photochemically reacts with the light only in the light cone to define a light-exposed region of hardened negative photoresist.

Abstract: A method and an apparatus for restricting the areas of contact between components to be plated or coated and liquid solutions containing plating or coating agents, without the use of masking tape. Components made of electrically conductive material are suspended underneath a hood or bell housing which is sized and shaped to receive those portions of the components that should not be plated (or coated). Then the suspended components and the hood or bell housing are fully immersed in a bath of plating (or coating) solution, forming an air pocket under the hood or bell housing. This air pocket surrounds those portions of the components which are not to be plated (or coated) and prevents the liquid solution in the bath from touching those portions. The air acts as a mask that prevents paint or metal from contacting or adhering to surfaces not to be plated (or coated).

Abstract: A system and a method for selective plating processes are disclosed which use directed beams of high intensity acoustic waves to create non-linear effects that alter and improve the plating process. The directed beams are focused on the surface of an object, which in one embodiment is immersed in a plating solution, and in another embodiment is suspended above a plating solution. The plating processes provide precise control of the thickness of the layers of the plating, while at the same time, in at least some incidents, eliminates the need for masking.

Abstract: There is provided a method of patterning a substrate with an atomic mask having a mask substrate and first atoms adsorbed on the mask substrate, the first atoms forming a mask pattern having a one-atomic thickness, including the steps, in sequence, of (a) depositing adatoms over a surface of a substrate to be patterned, the adatoms having low reactivity with second atoms of which the substrate is composed, and (b) putting the atomic mask close to the substrate in such a distance that the first atoms make a chemical bond with the adatoms, so that adatoms located nearest to the first atoms are desorbed out of the substrate to form a pattern on the substrate, the pattern being defined as an area where none of the adatoms exists. In accordance with the above mentioned method, it is possible to form a pattern on the sub-nanometer or nanometer order with high accuracy and in a short period of time, and it is also possible to repeatedly form the same pattern by using the atomic mask.

Abstract: Metallic bumps are formed for electrical interconnection between the charge plate and the charge drive electronics. This is achieved by having improved electrical connection between an ink jet charge plate and associated charge leads is promoted. First, a mask is aligned to permit plating of an etch mask on the charge plate coupon on the side opposite the charge plate circuitry, so as to place masked regions directly across the coupon from the contact pads of the charge plate circuitry. All the copper alloy charge plate coupon is then etched away except the small portions between the termination and the etch mask. The bump thus formed is used to provide a high pressure point electrical connection to the charge plate.

Abstract: A method for providing a partial plating to a lead pin, comprising the steps of plating an entire surface of the lead pin; covering a first part of a plated surface of the lead pin by a gel member; and subjecting a second part of the plated surface of the lead pin, which extends out of the gel member, to a metal-coating removing agent, to remove a metal coating of the second part of the plated surface. The plating step may include providing a composite plating on the entire surface of the lead pin, and the subjecting step may include removing an uppermost metal layer of the composite plating by the metal-coating removing agent. The composite plating may include a nickel base layer and a gold uppermost layer deposited on the nickel base layer. The gel member may be formed from a non-oily clay or paper-mache for handcraft use.

Abstract: An electroplated structure for a field emission display device and method for forming an electroplated structure for a field emission display device. In one embodiment, the present invention forms a molded structure over selected portions of a flat panel display device. Next, the present embodiment deposits an electroplating seed layer over the molded structure. After the deposition of the electroplating seed layer, the present embodiment electroplates material onto portions of the electroplating seed layer such that an electroplated structure is formed at desired regions of the flat panel display device. In such an embodiment, the present invention provides an electroplated structure which contains substantially no polyimide material. As a result, the present embodiment eliminates the cost and production of outgassed contaminants associated with prior art structures.