Abstract: Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by:(a) forming a surface of a conducting polymer on a surface of a substrate;(b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material;(c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; or (iii) increases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and(d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.

Abstract: The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulating substrate such as ceramics by sequentially performing an etching treatment, an activating treatment and an electroless plating treatment to the electrical insulating substrate, an alloy film containing mainly nickel and phosphorus is formed by not an electroless plating process but an electrolytic plating process. By adopting the electrolytic plating process, a film thickness of the formed alloy film of the middle part on the surface of the insulating substrate is thinner than that of the alloy film of the corner or ridge parts on the surface of the insulating substrate, and the thin part of the film thickness serves as a suitable fusing start part when applying an overload.

Abstract: A method of fabricating an emitter plate 12 for use in a field emission device comprising the steps of providing an insulating substrate 18 and forming a first conductive layer 13 on the insulating substrate 18. This is followed by the steps of forming an insulating layer 20 on the first conductive layer 13 and forming a second conductive layer 22 on the insulating layer 20. Then, a plurality of apertures 34 are formed through the second conductive layer 22 and through the insulating layer 20. A lift-off layer 36 is then formed on the second conductive layer 22. The lift-off layer 36 is formed by a plating process wherein the plating bath has a pH between 2.25 and 4.5, and current densities of 1 to 2O mA/cm.sup.2. The method may further comprise depositing conductive material through the plurality of apertures 34 to form a microtip 14 in each of the plurality of apertures 34. The excess deposited conductive material 14' and the lift-off layer 36 are then removed from the second conductive layer 22.

Abstract: This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.

Abstract: A metal-coated film can be produced continuously from a non-conducting film by successive electroless and galvanic metallization in such a way that a film of this kind is subjected, in a continuous "roll-to-roll" process, to the following operations:a) applying a metallizable primer,b) drying the applied primer,c) conditioning the applied primer,d) optionally activating the applied primer,e) treatment with an electroless chemical metallizing bath,f) optional treatment with a first rinsing liquid,g) treatment with a galvanic metallizing bath,h) treatment with a second rinsing liquid, andi) optional heat treatment of the metallized film.

Abstract: Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J.sub.O, to form a conductive metal layer having a surface roughness no greater than the surface roughness of the underlying member. In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.

Abstract: The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulating substrate such as ceramics by sequentially performing an etching treatment, an activating treatment and an electroless plating treatment to the electrical insulating substrate, an alloy film containing mainly nickel and phosphorus is formed by not an electroless plating process but an electrolytic plating process. By adopting the electrolytic plating process, a film thickness of the formed alloy film of the middle part on the surface of the insulating substrate is thinner than that of the alloy film of the corner or ridge parts on the surface of the insulating substrate, and the thin part of the film thickness serves as a suitable fusing start part when applying an overload.

Abstract: An electrodeposition coating method characterized in that in electrodeposition coating of a water soluble composition of a polyimide precursor which is prepared by using 1,2,3,4-butanetetracarboxylic acid or its imide-forming derivative and a diamine and has a percentage of residual acid value of 30 to 3%, there is added previously a water soluble solvent selected from the group consisting of an alcoholic solvent, N-methyl-2-pyrrolidone, dimethylformamide and dimethylacetamide to the above-mentioned composition, and an electrodeposition coating agent used therefor. There can be provided the electrodeposition coating method practicable for the use of a water soluble polyimide composition which is capable of forming a uniform baked coating film having a continuous surface and being excellent in adhesivity to substrate and in toughness.

Abstract: A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium compound, and providing electroplating. The process is characterized by using an aqueous solution comprising 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, 0.01 to 10 wt % of a phosphonic group-containing amine or a salt thereof, and, optionally, 0.1 to 10 wt % of an amine other than the phosphonic group-containing amine, as a microetching agent. This process can ensure highly reliable electroplating to inner walls of printing wiring board through-holes.

Abstract: A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of:1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of adsorbing catalysts;2) catalyzing: immersing the conditioned substrate into a catalyst colloid-containing solution or a catalyst complex-containing solution to let the catalyst be adsorbed onto the substrate;3) accelerating: reducing the catalyst with a suitable acid or basic solution (adapted to the catalyst colloid), or with a reducing agent (adapted to the catalyst complex) to reduce the catalyst being adsorbed onto the substrate;4) enhancing: immersing the substrate after accelerating step into an enhancing agent containing a compound with two ligands;5) electroplating: proceeding with a plating process.

Abstract: The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

Abstract: A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.

Abstract: A mask layer is formed on a conductive layer covering not only a central area assigned to integrated circuits but also a vacant peripheral area of a semiconductor wafer, and an electroplating system allows metallic miniature patterns to grow on the conductive layer over the vacant peripheral area as well as extremely small areas of the conductive layer over the central area so as to make current fluctuation negligible.

Abstract: The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials.

Abstract: A process for plating an electrically nonconductive substrate by the following sequence of steps:(1) a step of treating an electrically nonconductive substrate with a solution containing a silane coupling agent;(2) a step of treating the electrically nonconductive substrate from said step (1) with a solution containing an anionic surfactant;(3) a step of the electrically nonconductive substrate from said step (2) with a solution containing a palladium compound and at least one nitrogen-containing sulfur compound selected from among thiourea and its derivatives;(4) a step of treating the electrically nonconductive substrate from said step (3) with a reducing solution containing at least one member selected from among sodium borohydride, sodium hypophosphite, hydrazine, dimethylaminoborane, hydroxylamine and glyoxylic acid; and(5) a step of forming an electroplating layer on the electrically nonconductive substrate from said step (4).

Abstract: A process for metallizing non-conductive surfaces, by treating the non-conductive surface with a solution containing at least one suspended or solute oxidation agent, contacting the treated non-conductive surface with an acidic solution containing at least one water soluble polymer selected from the group consisting of homopolymers and copolymers, and at least one aromatic compound which chemically polymerizes the water-soluble polymer and the aromatic compound to form a conductive polymer, and electroplating the conductive polymer. Each water-soluble polymer contains uncharged structural elements or is cationic polyelectrolyte. Additionally, each water soluble polymer is capable of protonizing/deprotonizing reactions, formation of hydrogen bridge compounds and van der Waals interactions.

Abstract: Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,R.sub.1 and R.sub.2 mutually independently denote hydrogen or a C.sub.1 -C.sub.4 alkyl group or together form an optionally substituted C.sub.1 -C.sub.4 alkylene residue or a 1,2-cyclohexylene residue,and in that the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive base.

Abstract: The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.

Abstract: A process for forming an electroconductive thin-film coil element uses an InNi alloy film which is heated to a temperature above its melting point and melted off together with an electrode used for electroplating.

Abstract: The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These solutions can be used in applications including printed circuit boards and through-hole plating and enable direct metallization processes on non-conducting substrates. After forming the conductive polymer patterns, a printed wiring board can be formed by sensitizing the polymer with palladium and electrolytically depositing copper.

Abstract: The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

Abstract: A metal catalyst carried on a carrier material is provided, the carrier material being selected from the group consisting of a powder of fine tourmaline crystals possessing polarity and a formed body containing a plurality of fine tourmaline crystals possessing polarity. The catalyst is prepared by immersing the carrier material in an aqueous solution containing at least one metal salt, mixing and stirring the aqueous solution until the at least one metal ion is deposited on poles of the tourmaline crystals of the carrier material, separating the carrier material from the aqueous solution, evaporating off traces of the aqueous solution from the carrier material, and drying the carrier material. The metal catalyst may be prepared by immersing the carrier material in an aqueous solution containing two or more metal ions, wherein the metal ions are deposited on said carrier material in an inverse proportion to the magnitude of the deposition ionization tendencies of the metal ions.

Abstract: A method for manufacturing a substrate useful as a color filter for LCD and having window-shaped coating films and a frame-shaped, functional coating film at the regions not occupied with the window-shaped coating films, which comprises the steps of:(a) forming a functional coating film on a transparent substrate having electrically conductive circuits on a surface thereof,(b) superposing a photomask having a predetermined pattern on the surface of the coating film formed in step (a), and exposing the thus masked coating film to light,(c) subjecting the intermediate product to developing to leave a frame-shaped coating film, and(d) subjecting the resulting substrate formed through steps (a) to (c) to electro-deposition to form electro-deposition coating films on the electrically conductive circuits, enables production of coating films of fine pattern with improved precision.

Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.

Abstract: A process is provided to prepare flexible composite polymer fibers by electrochemically forming a coating of a conductive organic polymer on the outer surface of a polymeric fiber.

Abstract: A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:(a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate;(b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate;(c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension.

Abstract: A composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, is disclosed. A process for producing a composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, which comprises subjecting a conjugated compound to electropolymerization or oxidation polymerization in the presence of a paper, is also disclosed. A process for producing a functional composite, which comprises impregnating a paper with a solution of a precursor polymer of a conjugated electroconducting polymer and heat treating the paper to form a conjugated electroconducting polymer between or on surface of fibers of the paper, is further disclosed.

Abstract: A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a high pressure water spray. The process is useful for the formation of printed circuit boards.

Abstract: The method for making a decorative sticker includes the steps of (a) providing a polyester (trade name: Tetoron) base film which has a top surface and a bottom surface, (b) applying a metal coating on the polyester base film by electroplating so that the top and bottom surfaces of the polyester base film can sparkle in the presence of bright light, (c) applying a hot-melt adhesive layer on the bottom surface of the polyester base film, (d) attaching a release paper to the hot-melt adhesive layer, (e) applying a binder layer with a predetermined figure on a predetermined part of the top surface of the polyester base film, (f) printing a first desired pattern on the remaining part of the top surface of the polyester base film by pressing the remaining part with ink, (g) printing a second desired pattern on the remaining part of the top surface of the polyester base film by pressing the remaining part with gold foil, (h) die-cutting the polyester base film on the top surface thereof so as to form a predetermined

Abstract: Electrodepositable compositions comprising active hydrogen-containing ionic resins, capped polyisocyanate curing agents and triorganotin catalysts are disclosed. The catalysts are liquid, can be easily incorporated into the electrodepositable compositions and surprisingly exhibit good catalytic activity at low levels.

Abstract: Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.

Abstract: A composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, is disclosed. A process for producing a composite comprising a paper and a conjugated electroconducting polymer, the conjugated electroconducting polymer existing between fibers or in close contact with fibers of the paper, which comprises subjecting a conjugated compound to electropolymerization or oxidation polymerization in the presence of a paper, is also disclosed. A process for producing a functional composite, which comprises impregnating a paper with a solution of a precursor polymer of a conjugated electroconducting polymer and heat treating the paper to form a conjugated electroconducting polymer between or on surface of fibers of the paper, is further disclosed.

Abstract: A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser or ion-implantation induced conductivity. The path advantageously can be the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating or electroless plating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate.

Abstract: A method of inlaying metal in non-conductive materials utilizes conventional electroforming or electroplating techniques to build up metal in grooves or channels formed in the surface of the material. An adhesive is deposited in the grooves, and a cathode is positioned in the adhesive. A metallic base is applied onto or into the adhesive in electrical communication with the cathode, and then the material is immersed in an electrolytic solution wherein metal is built up in the grooves by electrolysis using the metallic base as a cathode.

Abstract: A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.

Abstract: A thin film magnetic read/write head is manufactured using a multi-layered sacrificial mask in a pole tip alignment process. The sacrificial mask includes a layer of metal deposited upon the magnetic upper pole tip. Subsequent sacrificial mask layers include nickel-iron alloy or photoresist. Following an ion milling alignment process, residual sacrificial mask layers are removed using a process in which the medal layer is selectively chemically etched away from the thin film magnetic head.

Abstract: Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.

Abstract: A thin film magnetic read/write head is manufactured using a multi-layered sacrificial mask in a pole tip alignment process. The sacrificial mask includes a layer of metal deposited upon the magnetic upper pole tip. Subsequent sacrificial mask layers include nickel-iron alloy or photoresist. Following an ion milling alignment process, residual sacrificial mask layers are removed using a process in which the medal layer is selectively chemically etched away from the thin film magnetic head.

Abstract: A process for producing an electrically conductive polymer film which comprises electrically polymerizing a monomer, capable upon polymerization of providing conjugated double bonds, in an electrolytic polymerization solution containing a fluorocarbon surfactant and a dopant electrolyte using a working electrode and a counter-electrode immersed in the electrolytic polymerization solution, with the proviso that for an anodic oxidation electrolytic polymerization a fluorocarbon surfactant except an anionic fluorocarbon surfactant is used, and for a cathodic reduction electrolytc polymerization a fluorocarbon surfactant except a cationic fluorocarbon surfactant is used.

Abstract: A high molecular humidity sensor and manufacturing method thereof in which polypyrrole being of conductive high molecule is electrochemically polymerized and then reduced whereby ionic conductive property is given go that humidity sensibility becomes excellent.The high molecular humidity sensor of the invention is characterized in that it is a structure in which polypyrrole doped with dodecylsulfate anion DS.sup.- is stuck in film form on the surface of fine electrode, and cations Na.sup.+, K.sup.+ are permeated to said polypyrrole whereby salt is formed, and humidity sensibility is exhibited in region of 10.sup.4 -10.sup.6 .OMEGA., and humidity sensing speed becomes within several tens seconds to several minutes.

Abstract: A surface layer of a material containing carbon and/or a carbide is produced on the outer surface of a solid carbon-based substrate (1) by selective application of material, said surface layer adhering strongly to the substrate, having a high specific surface area and having open pores (5) of a depth of at least 1 nm, and a metal material having a strong affinity for carbon, comprising at least one metal chosen from cerium, cobalt, chromium, iron, hafnium, iridium, osmium, palladium, platinum, rhodium, ruthenium, lanthanum, manganese, molybdenum, nickel, silicon, tantalum, thorium, titanium, uranium and tungsten, is deposited on said surface layer, substantially filling said pores.The metal deposit (8) may be rectified and polished without peeling off, in order to produce a mirror of low inertia.

Abstract: A method for fabricating a solid electrolytic capacitor is described, in which a solid electrolyte is made of a conductive polymer layer and is formed on a conductive inorganic layer which is formed on a metallic foil through a dielectric film. For the formation of the conductive polymer layer, while an external electrode is not directly contacted with the conductive inorganic layer, the electrolytic polymerization reaction of a polymerizable monomer in an electrolytic solution is carried out. For this purpose, the external electrode may be covered with a conductive polymer film at the contact portion. Alternatively, the external electrode may be moved from one position to another or may be kept apart from the conductive inorganic layer during the electrolytic polymerization reaction. By this, the mechanical damages of the conductive inorganic layer with the external electrode are suppressed with good electric characteristics of the capacitor.

Abstract: A method of plating a flexible plastic part is disclosed where serrations are provided on a flexible beam where the serrations are sinuous in shape. After molding the serrations onto the flexible beam, the component is electrically dipped to plate the component. The flexible beam can now be flexed without concern of cracking the plating along the length of the beam where the beam is flexed. A second embodiment shows an outlet box including two latch members along the sides which are bow shaped and have grounding surfaces thereon, which latch the outlet box in place to a panel, and simultaneously ground the box to the panel.