Abstract: A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

Abstract: A process for producing a light absorption layer of a solar cell is disclosed, in which prior to heat-treatment, at least two of the following steps are performed in combination: (1) electrodeposition of a copper layer including selenium particles, (2) electrodeposition of an indium layer including selenium particles, (3) electrodeposition of a copper layer not including selenium, and (4) electrodeposition of an indium layer not including selenium. Control of copper, indium, and selenium contents becomes easier with this process.

Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.

Abstract: A method for preparing aluminum and aluminum alloys includes the step of simultaneously honing the surface of the aluminum or aluminum alloy in a zincating solution. The honing removes the aluminum oxide layer from the surface of the aluminum or aluminum alloy work piece while the zincating solution deposits a layer of zinc on its surface. The zincate-honing may be followed by electroplating.

Abstract: A plating method for a nickel-titanium alloy member is provided which comprises the steps of: subjecting a nickel-titanium alloy member to an anodic electrolyzing treatment and a cathodic electrolyzing treatment in succession by using an electrolyte containing hydrochloric acid as an essential component thereof, in particular, an electrolyte having a chloride ion concentration of 0.1 mol/l or more and a pH value of 2 or less, or an electrolyte having a chloride ion concentration of 0.4 mol/l or more, or still preferably, an electrolyte having a chlorine ion concentration of 0.3 mol/l or more and a pH value of 2 or less; strike plating the treated nickel-titanium alloy member with a desired metal; and electroplating the struck nickel-titanium alloy member with a desired metal. The adhesion between the nickel-titanium alloy member and a plating layer is very good.

Abstract: A lead frame for a semiconductor device includes a base layer which is coated by a protective coating. The protective coating includes a layer of nickel, over which is coated a layer of copper. The layer of copper is coated by a layer of silver over which is coated a layer of palladium. Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable.

Abstract: A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.

Abstract: Facilitating the distinction among different spring steel products and at the same time improving their surface appearance and corrosion resistance by plating the surface of said different spring steel products before spring-forming with either alternate layers of Cu and Zn or alternate layers of Ni, Cu and Zn, the amount of Cu and Zn differing for steel products differing in size and/or material, to obtain color-developable spring steel products, drawing and taken coil spring-forming the resulting plated spring steel products, and low temperature annealing said resulting plated spring steel products to develop their colors, the colors being different for spring steel products differing in size and/or material, whereby mixing and erroneous assembly of spring steel products differing in size and/or material is prevented.

Abstract: Disclosed is a multi-compartment electroplating tank and a process for using the tank to simultaneously plate dissimilar materials onto a substrate.

Abstract: A copper layer is coated onto an organic polymeric substrate in the presence of a gas containing nitrogen and a noble gas.

Abstract: A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both.

Abstract: A magnetically anisotropic magnet substrate is coated with at least one layer of nickel plating followed by a chromate layer. The chromate top layer improves the corrosion resistance of the coated magnet substrate. In a preferred embodiment, the layer of nickel plating includes a first layer of a non-bright nickel plating followed by a second layer of a semi-bright nickel plating. One embodiment adds a copper under-layer below the nickel plating.

Abstract: A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.

Abstract: A method to electrochemically deposit semiconductors and for the electrochemical formation of epitaxial thin-film, single-crystalline compound semiconductors comprising alternating electrodeposition of atomic layers of selected pairs of elements using underpotential deposition.

Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.

Abstract: A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

Abstract: A process for forming layers on a substrate including irradiating at least part of an aluminum nitride surface with a high power ultraviolet emitter resulting in the elimination of the nitride component to form an aluminum layer. The aluminum layer is then reinforced by a metal.

Abstract: A method for fabricating conductors in dielectric trenches in a self-aligned manner. Interconnect modules with a high conductor density are achieved by using a copper-polyimide system as a versatile packaging approach. A photosensitive polyimide is applied to a substrate and lithographically patterned to form polyimide steps having a characteristic positive slope, between which are defined trenches in which the substrate is exposed. A thin electroplating seed layer is deposited over the polyimide steps and the substrate. Copper is electroplated into trenches, but does not plate onto the tops of the polyimide steps, since the electroplating seed layer at that location is not electrically connected to the electroplating seed layer in the bottom of the trenches. The electroplating seed layer on top of the polyimide steps is then removed by chemical etching, plasma machining, or ion-milling.