Abstract: Material test structures having cantilever portions and methods of forming the same are described herein. As an example, a method of forming a material test structure includes forming a number of electrode portions in a first dielectric material, forming a second dielectric material on the first dielectric material, wherein the second dielectric material includes a first cantilever portion and a second cantilever portion, and forming a test material on the number of electrode portions, the first dielectric material, and the second dielectric material.

Abstract: A manufacturing method includes a step of forming a first plating mask on a base metal layer, a step of forming a main conductor layer on the base metal layer exposed from the first plating mask, a step of forming a second plating mask on them, a step of attaching a metal plating layer to an upper surface of the main conductor layer exposed from the second plating mask, a step of removing the first and second plating masks, a step of etching away a portion of the base metal layer to which the main conductor layer is not attached, and a step of forming a solder resist layer.

Abstract: Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.

Abstract: The method for fabricating a lithium microbattery is performed from a stack of layers successively including: a first layer made from a first material, a second layer made from a second material, a solid electrolyte layer and a first electrode. The method further includes etching to form a first pattern made from the first material and a second pattern made from the second material, the second pattern defining a covered area and an uncovered area of the electrolyte layer. The uncovered area is then etched using the second pattern as etching mask. After etching of the first pattern, a lithium-based layer is formed on the second pattern, the lithium-based layer and the second pattern forming a second lithium-based electrode.

Abstract: An apparatus, system, and/or method are described to enable optically transparent reconfigurable integrated electrical components, such as antennas and RF circuits to be integrated into an optically transparent host platform, such as glass. In one embodiment, an Ag NW film may be configured as a transparent conductor for antennas and/or as interconnects for passive circuit components, such as capacitors or resistors. Ag NW may also be used as transmission lines and/or interconnect overlays for devices. A graphene film may also be configured as active channel material for making active RF devices, such as amplifiers and switches.

Abstract: An acoustic wave device includes a piezoelectric substrate, interdigitated electrodes formed on the piezoelectric substrate, and an insulation film that is formed on a surface of the interdigitated electrodes by atomic layer deposition and includes aluminum oxide.

Abstract: A photoresist composition includes a polymer with repeat units having the structure wherein each occurrence of R1 and R2 is independently hydrogen, unsubstituted or substituted C1-18 linear or branched alkyl, unsubstituted or substituted C3-18 cycloalkyl, unsubstituted or substituted C6-18 aryl, or unsubstituted or substituted C3-18 heteroaryl; and R1 and R2 are optionally covalently linked to each other to form a ring that includes —R1—C—R2—; each occurrence of Ar1, Ar2, and Ar3 is independently an unsubstituted or substituted C6-18 arylene, or unsubstituted or substituted C3-18 heteroarylene. In addition to the polymer, the photoresist composition includes a photoactive component selected from photoacid generators, photobase generators, photoinitiators, and combinations thereof.

Abstract: The conductive composition contains at least (a) conductive metal fibers, and (b) at least one compound selected from a compound represented by the following Formula (1) and a compound represented by the following Formula (2). In Formula (1), each of R1 and R2 independently represents an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or a halogen atom, and R3 represents an alkyl group or an aryl group. The compound represented by Formula (1) may include a structure that plural compounds represented by Formula (1) are linked to each other in a single molecule. In Formula (2), each of R4 and R5 independently represents an alkyl group. The compound represented by Formula (2) may include a structure that plural compounds represented by Formula (2) are linked to each other.

Abstract: The conductive composition contains at least (a) conductive metal fibers, and (b) at least one compound selected from a compound represented by the following Formula (1), a compound represented by the following Formula (2), and a compound having a partial structure represented by the following Formula (3). Each of R1 and R2 independently represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an acyl group, an aryloxycarbonyl group, an alkoxycarbonyl group, or a carbamoyl group. Each of R3, R4, R5, R6, R8, R9, R10, and R11 independently represents an alkyl group having 1 to 4 carbon atoms, and R7 represents a hydrogen atom or a substituent. R12 represents an alkyl group, an alkoxy group, an acyl group, or a hydrogen atom. * represents a bond.

Abstract: The present invention relates to the method for manufacturing high quality graphene by heating carbon-based self-assembly monolayers, comprising the steps of: forming carbon source layers which are convertible into the graphene layer on the substrate; forming a metal catalyst layer on the carbon source layer; converting the carbon source layers into the graphene layer by heating the first part of the substrate using a local heating source, wherein the carbon source layers and the metal catalyst layers are formed; converting the carbon source layers into graphene by moving the local heating source and then heating the second part which is different from the first part; and removing the metal catalyst layer. The present invention also provides a substrate comprising a graphene layer manufactured by the above method and provides applications in semiconductor devices and electronic materials using the substrate.

Abstract: The present invention relates to methods of making capacitors for use in surveillance/identification tags or devices, and methods of using such surveillance/identification devices. The capacitors manufactured according to the methods of the present invention and used in the surveillance/identification devices described herein comprise printed conductive and dielectric layers. The methods and devices of the present invention improve the manufacturing tolerances associated with conventional metal-plastic-metal capacitor, as well as the deactivation reliability of the capacitor used in a surveillance/identification tag or device.

Abstract: A wiring which is formed using a conductive film containing copper and whose shape is controlled is provided. A transistor including an electrode which is formed in the same layer as the wiring is provided. Further, a semiconductor device including the transistor and the wiring is provided. A resist mask is formed over a second conductive film stacked over a first conductive film; part of the second conductive film and part of the first conductive film are removed with use of the resist mask as a mask so that the first conductive film has a taper angle greater than or equal to 15° and less than or equal to 45°; and the resist mask is removed. The first conductive film contains copper.

Abstract: A method of making an imprinted micro-wire structure includes providing a substrate and first, second, and third different stamps. A curable first layer is provided in relation to a substrate and imprinted with first, second, and third micro-channels using the first stamp. First, second, and third micro-wires are formed in the first, second, and third micro-channels. A curable second layer is provided adjacent to the first layer and imprinted with first and second connecting micro-channels. First and second connecting micro-wires are formed in the first and second connecting micro-channels. A curable third layer is provided and imprinted with a bridge micro-channel and a bridge micro-wire formed in the bridge micro-channel. The first and second micro-wires, the first and second connecting micro-wires, and the bridge micro-wire are electrically connected and electrically isolated from the third micro-wire.

Abstract: A method for manufacturing of a conductive member include forming one of a conductive layer including metal nanowires or a light-scattering layer including insulating light-scattering fine particles on a substrate in a pattern shape; and forming the other of the conductive layer including metal nanowires or the light-scattering layer including insulating light-scattering fine particles on a space of the substrate wherein the one of the conductive layer or the light-scattering layer is not formed.

Abstract: A method and apparatus for modifying low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.

Abstract: An energy storage device includes an electrode made from an active material in which a plurality of channels have been etched. The channels are coated with an electrically functional substance selected from a conductor and an electrolyte.

Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: Provided are a porous silicon-based anode active material including crystalline silicon (Si) particles, and a plurality of pores on surfaces, or the surfaces and inside of the crystalline silicon particles, wherein at least one plane of crystal planes of at least a portion of the plurality of pores includes a (100) plane, and a method of preparing the porous silicon-based anode active material. Since a porous silicon-based anode active material of the present invention may allow volume expansion, which is occurred during charge and discharge of a lithium secondary battery, to be concentrated on pores instead of the outside of the anode active material, the porous silicon-based anode active material may improve life characteristics of the lithium secondary battery by efficiently controlling the volume expansion.

Abstract: A printing process for printing (P) an ink pattern on a substrate is provided. The ink pattern to be printed is based on an available pattern layout (R). The pattern layout defines a desired layout of the ink pattern to be printed. Based on the pattern layout an input image (rii) for allocating dot positions of the ink pattern is generated. The printing process comprises a step of comparing a scan (S) image (rsi) with the input image to carry out a quality inspection (Q) to detect any print defects in the printed ink pattern. The printing process comprises a step of providing a decision (os) on an approval or a rejection of the printed ink pattern. In case of an approval, the substrate can be supplied to a subsequent processing station (E) to finalise the substrate. In case of a rejection, the substrate including print defects can be recycled (D).

Abstract: Methods for manufacturing an ultra-thin display assembly with integrated touch functionality may include edge bonding a laminate layer to a backlight portion of an LCD module. A display portion of the LCD module may be direct bonded to a cover glass including a transparent conductive electrode layer. The cover glass may be manufactured from a large glass sheet and may have an edge polymer deposited on edges of the cover glass, a conductive polymer layer over the transparent conductive electrode layer, and a smart polymer at the edges of the cover glass.

Abstract: The embodiments of the present invention relate to an optical touch screen, comprising: a substrate; and a transparent first electrode layer, a photosensitive material layer, and a second electrode layer formed on the substrate. The photosensitive material layer is formed in a grid-like structure to isolate the first electrode layer and the second electrode layer and sense light irradiated on the optical touch screen. The embodiments of the present invention also provide a method for manufacturing an optical touch screen. According to the embodiments of the present invention, the position of the light emitted from the light source on the display screen can be determined by sensing the light emitted from the outside light source, so that human-computer interaction for a large-size screen display device can be achieved.

Abstract: A piezoelectric actuator device includes a vibrator and a driver to vibrate the vibrator. The vibrator includes a lower vibration layer configured to vibrate and an upper vibration layer coupled to an upper surface of the lower vibration layer and configured to vibrate together with the lower vibration layer. The driver includes an upper electrode layer on a lower surface of the lower vibration layer, a piezoelectric layer on a lower surface of the upper electrode layer, and a lower electrode layer on a lower surface of the piezoelectric layer. The lower vibration layer of the vibrator is made of organic material. The upper vibration layer is mainly made of inorganic material. The lower vibration layer has a smaller longitudinal elastic modulus than the upper vibration layer. The piezoelectric actuator device has a large resistance to disturbance vibrations and a large warping amount of the vibrator without increasing power consumption.

Abstract: A patch for a device in an electronic housing including an aluminum layer having a threshold thickness, a non-conductive layer on a first side of the aluminum layer, and a radio-frequency (RF) transparent layer on a second side of the aluminum layer is provided. A method for manufacturing an antenna window including a patch as above is also provided, the method including determining a thickness of the aluminum layer adjacent to an anodized aluminum layer. A method for manufacturing an antenna window including coating an aluminum layer having a threshold thickness on a radio-frequency (RF) transparent layer to form an RF transparent laminate is also provided. A method for manufacturing an antenna window including removing a thickness of aluminum is also provided. A method for manufacturing an antenna window including disposing a mask on an aluminum substrate and anodizing the aluminum substrate to a selected thickness is also provided.

Abstract: A method for forming a device having nanopillar and cap structures on a substrate in which the substrate is first coated with a first resist having a first exposure dose to electron beam radiation, and that after coating the first resist with a second resist having a second exposure dose less than the first resist. Electron beam lithography is then used sequentially to form the nanopillars and cap structures or, alternatively, a template for the nanopillar and cap structures.

Abstract: A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a second receiving hole. The second receiving hole and the first receiving hole cooperatively form a receiving cavity. The first adhesive sheet includes a supporting surface. The electronic device is received in the receiving cavity, and includes two electrodes. The second adhesive sheet is adjacent to the second wiring layer, and includes a bottom surface. The third wiring layer is formed on the supporting surface and contacts with the two electrodes. The fourth wiring layer is formed on the bottom surface.

Abstract: A method for manufacturing an optical substrate includes: a step for preparing a long film-shaped mold; a step for preparing a sol; a step for forming a coating film of the sol on a substrate; a step for drying the coating film; a step for pressing a pattern surface of the film-shaped mold against the dried coating film with a pressing roll while feeding the film-shaped mold to the pressing roll; a step for releasing the film-shaped mold from the coating film; and a step for baking the coating film to which the concave and convex pattern has been transferred.

Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract: Disclosed are a method of manufacturing an electrode for secondary batteries that includes surface-treating a current collector so as to have a morphology wherein a surface roughness Ra of 0.001 ?m to 10 ?m is formed over the entire surface thereof, wherein the surface-treating is performed by chemical or electrical etching using a wet method or by reactive gas or ion etching using a dry method to enhance adhesion between an electrode active material and the current collector and an electrode for secondary batteries that is manufactured using the method.

Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

Abstract: Disclosed is a method for producing a mesoporous titanium dioxide thin film from a titanium precursor by using a polymer-grafted alumina composite as a support. The porous titanium dioxide thin film is obtained by using the polymer-grafted hybrid alumina composite as a support for sol-gel reaction, and thus it has a mesoporous structure and high surface area, thereby providing a high dye adsorption ratio. Therefore, a dye-sensitized solar cell using the mesoporous titanium dioxide thin film as a photoelectrode material has high energy conversion efficiency. In addition, it is possible to improve the long-term stability of a dye-sensitized solar cell through efficient infiltration of high-viscosity polymer and solid electrolyte as well as liquid electrolyte.

Abstract: The present invention provides a photo-curable composition that requires a small demolding force. The present invention also provides a UV imprint method that requires a small demolding force. The photo-curable composition contains a polymerizable monomer (A), a polymerization initiator (B), and a fluorine-containing surfactant (C). A photo-cured product of the photo-curable composition has a water contact angle of 74 degrees or less.

Abstract: Disclosed is a method for producing ZnO contact layers for solar cells. The layers are etched using hydrofluoric acid so as to generate a texture.

Abstract: Electrode protective films 13a and 13b are formed on the surface of the metal layer using imidazole preflux, as terminal electrodes 35a and 35b of an electronic component. The terminal electrodes of an electronic component on which the protective films are formed are fixed by electroconductive adhesives 33a and 33b supplied to mounting lands 40a and 40b. Thereby an electronic component mounting structure without change in resistance caused by electroconductive adhesives is provided.

Abstract: The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a second conductor, and a third conductor. The insulating layer comprises photosensitive polyimide, and the glass transition temperature of the photosensitive polyimide is lower than about 200° C. The invention also provides a method for manufacturing the vertical conductive unit.

Abstract: In the present invention, a copper electrode having a nanohole structure is prepared by using a polymer substrate in the form of nanopillars in order to avoid fatigue fracture that causes degradation of electrical and mechanical properties of a flexible electrode during repetitive bending of a typical metal electrode. The nanohole structure may annihilate dislocations to suppress the initiation of fracture and may blunt crack tips to delay the propagation of damage. Therefore, the nanohole electrode exhibits very small changes in electrical resistance during a bending fatigue test.

Abstract: A resin is provided so as to cover four side faces of a piezoelectric multilayer body integrally and thus is effectively prevented from peeling from the piezoelectric multilayer body, whereby high adhesion is attained between the piezoelectric multilayer body and the resin. At the same time, the resin covers dicing surfaces in the side faces of the piezoelectric multilayer body, thereby effectively restraining the piezoelectric body and the electrodes from producing particles.

Abstract: A method of forming of MEMS nanostructures includes a portion of a substrate is recessed to form a plurality of mesas in the substrate. Each of the plurality of mesas has a top surface and a sidewall surface. A light reflecting layer is deposited over the substrate thereby covering the top surface and the sidewall surface of each mesa. A protection layer is formed over the light reflecting layer. An ARC layer is formed over the protection layer. An opening in a photo resist layer is formed over the ARC layer over each mesa. A portion of the ARC layer, the protection layer and the light reflecting layer are removed through the opening to expose the top surface of each mesa. The photo resist layer and the ARC layer over the top surface of each mesa are removed.

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract: A traveling wave device includes a slow wave circuit supported by a dielectric membrane. The dielectric membrane can have a thickness substantially smaller than a wavelength of operation of the traveling wave device.

Abstract: A monolithic fabrication method of parallel-plate electrowetting-on-dielectric (EWOD) chips for digital microfluidics of picoliter droplets is disclosed. Instead of assembling a second substrate to form a top plate, the top plate is generated in situ as a thin-film membrane that forms a monolithic cavity having a gap height on the order of micrometers with excellent accuracy and uniformity. The membrane is embedded with EWOD driving electrodes and confines droplets against the device substrate to perform digital microfluidic operations. Two main attributes of the monolithic architecture that distinguish it from tradition methods are: (i) it enables excellent control of droplet dimensions down to the micrometer scale, and (ii) it does not require the typical alignment and assembly steps of the two plates.

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of AB is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract: An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are formed on the same surface having the signal traces. The first height of the signal trace is greater than the second height of the solder pad. Exemplary methods for manufacturing the printed circuit board are also provided.

Abstract: Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for interconnect structures embedded in a package assembly including a bridge. In one embodiment, a package assembly may include a package substrate, a bridge embedded in the package substrate and including a bridge substrate, and an interconnect structure including a via extending through the package substrate into a surface of the bridge substrate and configured to interface with a conductive feature disposed on or beneath the surface of the bridge substrate. The interconnect structure may be configured to route electrical signals between the conductive feature and a die mounted on the package substrate. Other embodiments may be described and/or claimed.

Abstract: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.

Abstract: An apparatus (36) includes a motion amplification structure (52), an actuator (54), and a sense electrode (50) in proximity to the structure (52). The actuator (54) induces an axial force (88) upon the structure (52), which causes a relatively large amount of in-plane motion (108) in one or more beams (58, 60) of the structure (52). When sidewalls (98) of the beams (58, 60) exhibit a skew angle (28), the in-plane motion (108) of the beams (58, 60) produces out-of-plane motion (110) of a paddle element (62) connected to the end of the beams (58, 60). The skew angle (28), which results from an etch process, defines a degree to which the sidewalls (98) of beams (58, 60) are offset or tilted from their design orientation. The out-of-plane motion (110) of element (62) is sensed at the electrode (50), and is utilized to determine an estimated skew angle (126).

Abstract: The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

Abstract: The present invention is primarily related to the composition of an aqueous etchant containing a precursor of oxidant and patterning methods for conductive circuits, in which the chemical structure of the precursor contains chlorine and can produce oxidants through various reactions. And, the patterned conductive circuits can be used for electronic devices, including printed electronics, sensors, displays, organic light emitting diodes (OLED), touch panels, electronic circuit boards, electrodes, electroluminescent (EL) films, antennas, and solar cells.

Abstract: The present invention relates to an additive mixture comprising a polyacrylate salt, an acid ester, and a defoamer agent. A polishing composition and a polishing method used for polishing a glass substrate are also provided.

Abstract: A method of thin printed circuit board wet process consistency on the same carrier, and more particularly to a printed circuit board in the developing, copper plating, stripping, etching and other wet processes uses the same frame as a carrier from the beginning to the end of the wet process, such that the thin printed circuit board is conducted a continuous and automatic wet process to avoid disassembly, storage and transportation between each process. Moreover, when using the flame, the thin printed circuit board is smooth and flattening in the wet process for avoiding “water effect,” the effective area is not exposed to any mechanical members for preventing scratches, and there are point contacts between the thin printed circuit board and the frame for preventing chemical residue. Accordingly, the present invention can not only enhance the yield of the thin printed circuit board but also shorten the production time.