Abstract: Provided is a planarizing method in which a planarization with high flatness can be performed, without being restricted by the distribution of film thickness in the applied resist film. The planarizing method comprises the steps of: forming a resist film on a film to be planarized formed on a substrate; exposing the resist film with the amounts of exposure light in respective sections into which an area in which the film to be planarized is formed is divided, the amounts of exposure light being determined so as to realize film thicknesses to be left for planarization of the resist film in the respective sections; developing the exposed resist film, to form a resist film pattern with a controlled distribution of film thickness; and etching the resist film pattern and the film to be planarized, until eliminating the thickness amounts to be eliminated of the film to be planarized.

Abstract: A theft deterrent product may be provided. First, a plurality of unique codes may be created. Then a plurality of indicia may be placed periodically and longitudinally on the product. The plurality of indicia may respectively correspond to the plurality of unique codes. The product may have an outer layer and into an portion. Placing the plurality of indicia may comprise etching through the outer layer and into the inner portion. In a database, the plurality of unique codes may be assigned to an organizational entity. The organizational entity may comprise a first enterprise.

Abstract: The present invention provides an etchant composition comprising A) high strength potassium monopersulfate providing from about 0.025% to about 0.8% by weight of active oxygen; B) from about 0.01% to about 30% by weight of the composition of B1) an organic acid, alkali metal salt of an organic acid, ammonium salt of an organic acid, or a homopolymer of an organic acid, or B2) a halogen or nitrate salt of phosphonium, tetrazolium, or benzolium, or B3) a mixture of component B1) and B2); and C) from about 0% to about 97.49% by weight of the composition of water; and a method of etching a substrate using said composition.

Abstract: A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.

Abstract: The invention relates to a method (1) of manufacturing a silicon-metal composite micromechanical component (51) combining DRIE and LIGA processes. The invention also relates to a micromechanical component (51) including a layer wherein one part (53) is made of silicon and another part (41) of metal so as to form a composite micromechanical component (51). The invention concerns the field of timepiece movements.

Abstract: The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).

Abstract: A method for removing a plurality of dielectric films from a supporting substrate by providing a substrate with a dielectric layer overlying another dielectric layer, contacting the substrate at a first temperature with an acid solution exhibiting a positive etch selectivity at the first temperature, and then contacting the substrate at a second temperature with an acid solution exhibiting a positive etch selectivity at the second temperature. The dielectric layers exhibit different etch rates when etched at the first and second temperatures. The first and second acid solutions may contain phosphoric acid. The first dielectric layer may be silicon nitride and the second dielectric layer may be silicon oxide. Under these conditions, the first temperature may be about 175° C. and the second temperature may be about 155° C.

Abstract: The method of manufacturing a nozzle plate comprises the steps of: applying a protective sheet to a first surface of a nozzle plate in which nozzles are to be formed; forming holes which pass through the nozzle plate and have bottoms inside the protective sheet, from a side of a second surface of the nozzle plate reverse to the first surface; filling a filling material into the holes, from the side of the second surface; peeling away the protective sheet after the filling step; forming a liquid-repelling film on the first surface of the nozzle plate after the peeling step; and removing the filling material after the liquid-repelling film forming step.

Abstract: A process for etching a silicon-containing substrate to form structures is provided. In the process, a metal is deposited and patterned onto a silicon-containing substrate (commonly one with a resistivity above 1-10 ohm-cm) in such a way that the metal is present and touches silicon where etching is desired and is blocked from touching silicon or not present elsewhere. The metallized substrate is submerged into an etchant aqueous solution comprising about 4 to about 49 weight percent HF and an oxidizing agent such as about 0.5 to about 30 weight percent H2O2, thus producing a metallized substrate with one or more trenches. A second silicon etch is optionally employed to remove nanowires inside the one or more trenches.

Abstract: A composition for removing a conductive material and a manufacturing method of an array substrate using the composition, wherein the composition may include a nitric acid of about 3 to 15 wt %, a phosphoric acid of about 40 to 70 wt %, an acetic acid of about 5 to 35 wt %. The composition may further include a chlorine compound of about 0.05 to 5 wt %, a chlorine stabilizer of about 0.01 to 5 wt %, a pH stabilizer of about 0.01 to 5 wt %, and water of residual quantity.

Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.

Abstract: A method for forming a template useful for nanoimprint lithography comprises forming at least one pillar which provides a topographic feature extending from a template base. At least one conformal pattern layer and one conformal spacing layer, and generally a plurality of alternating pattern layers and spacing layers, are formed over the template base and pillar. A planarized filler layer is formed over the pattern and spacing layers, then the filler, the spacing layer and the pattern layer are partially removed, for example using mechanical polishing, to expose the pillar. One or more etches are performed to remove at least a portion of the pillar, the filler, and the spacing layer to result in the pattern layer protruding from the spacing layer and providing the template pattern.

Abstract: Shaped article substrates, e.g., plastics, textiles, extrudates, films, etc., having silicone material coverings adhered thereto, are delaminated by treating same with an aqueous solution containing an alkali metal or alkaline earth metal hydroxide and a phase transfer catalyst; particular such shaped article substrates are airbag type of inflatable protection bags having layers of silicone elastomer adhered thereto and used for the protection of the occupants of a motor vehicle.

Abstract: An object is to provide a method for forming a superior corrosion-resistant plating layer by sealing penetrating pinholes formed in an electroless plating layer. There are provided a first plating step of performing electroless Ni—P plating on a base material (1); an etching step of etching a surface of a first plating layer (3) formed by the first plating step; and a second plating step of performing electroless Ni—P plating to form a second plating layer (5) on the first plating layer (3) processed by the etching step.

Abstract: The present invention provides an etchant composition containing 60 to 75 wt % of phosphoric acid (H3PO4), 0.5 to 15 wt % of nitric acid (HNO3), 2 to 15 wt % of acetic acid (CH3COOH), and 0.1 to 15 wt % of aluminum nitrate (Al(NO3)3).

Abstract: An example tunable cavity resonator for filtering radiation in the optical and IR wavelengths and an example method for fabricating same. The example resonator includes a pair of reflectors, one in fixed relationship to a substrate and the other formed upon a suspended moveable membrane disposed a cavity length from the one reflector. The resonator also includes a pair of spaced apart electrodes either constituted by the reflectors or juxtaposed therewith, which are electrostatically operable to move the membrane and other reflector relative to the one reflector.

Abstract: A method for removing the coating from a gas turbine component, namely for the complete or partial removal of a multilayer wear protection coating from the surface of the gas turbine component, the wear protection coating having at least one relatively hard ceramic layer and at least one relatively soft metallic layer, wherein, in order to remove the multilayer wear protection coating, the gas turbine component is alternately positioned in two different chemical baths, a first bath being used exclusively for the removal of each relatively hard ceramic layer, and a second bath being used exclusively for the removal of each relatively soft metallic layer of the wear protection coating.

Abstract: An embodiment of a method of suspending a graphene membrane across a gap in a support structure includes attaching graphene to a substrate. A pre-fabricated support structure having the gap is attached to the graphene. The graphene and the pre-fabricated support structure are then separated from the substrate which leaves the graphene membrane suspended across the gap in the pre-fabricated support structure. An embodiment of a method of depositing material includes placing a support structure having a graphene membrane suspended across a gap under vacuum. A precursor is adsorbed to a surface of the graphene membrane. A portion of the graphene membrane is exposed to a focused electron beam which deposits a material from the precursor onto the graphene membrane. An embodiment of a graphene-based structure includes a support structure having a gap, a graphene membrane suspended across the gap, and a material deposited in a pattern on the graphene membrane.

Abstract: The chambers (42) and each corresponding ink feeding duct (56), made in a structural layer of photosensitive resin (38), are delimited by a flat bottom wall (36) made of a protective layer (34, 36) of tantalum and gold and an upper wall (44), consisting of a substantially concave surface, including at least one ejection nozzle (46) and joined to the bottom wall along a continuous perimetral line (52), in which the inner shape of each of the chambers (42) and of each of the feeding ducts (56) represents the complementary impression of the outer form of a sacrificial layer (57), obtained from a controlled and non-contained growth of a metal, deposited starting from the dimensions of the layer of gold (36), laid on top of the layer of tantalum (34).

Abstract: An etchant for removing materials with a plurality of selectivities exhibits a first etch selectivity at a first temperature and a second etch selectivity at a second temperature. The etchant may include phosphoric acid, fluoboric acid, or sulfuric acid. The materials that the etchant is configured to remove may include dielectric materials, such as silicon nitride and silicon oxide. The first temperature may be about 175° C. and the second temperature may be about 155° C.

Abstract: An etchant composition, and methods of patterning a conductive layer and manufacturing a flat panel display device using the same are provided. The etchant composition may include phosphoric acid, nitric acid, acetic acid, water and an additive, wherein the additive includes a chlorine-based compound, a nitrate-based compound, and an oxidation regulator. In addition, the flat panel display device may be manufactured by patterning a gate electrode, source/drain electrodes and a pixel electrode using the same etchant composition. The gate electrode, source/drain electrodes and the pixel electrode may be formed of different conductive materials. Accordingly, processes are simplified so that manufacturing costs may be reduced and productivity may be improved.

Abstract: A method for selectively removing a first layer from an engine component including the first layer, a base material and a second layer forming a bond connecting the first layer to the base material is provided. The method includes applying a salt melt to at least one section of the engine component including at least one portion of the second layer so the bond formed by the second layer between the base material and the first layer is at least weakened.

Abstract: An apparatus, system and method for removing a damaged material from a low-k dielectric film layer include identifying a control chemistry, the control chemistry configured to selectively remove the damaged material from the low-k dielectric film layer, the damaged material being in a region where a feature was formed through the low-k dielectric film layer; establishing a plurality of process parameters characterizing aspects of the damaged material to be removed and applying the control chemistry to the low-k dielectric film layer, the application of the control chemistry being defined based on the established process parameters of the damaged material, such that the damaged material is substantially removed from the areas around the feature and the areas around the feature are substantially defined by low-k characteristics of the low-k dielectric film layer.

Abstract: A method for manufacturing a liquid crystal display which employs an active matrix substrate including a plurality of pixels arranged in matrix on a substrate and reflecting electrodes formed in the pixels, respectively. The method comprises (a) a laminated conductive film formation step of sequentially forming a conductive metal film and an amorphous transparent conductive film on a substrate to form a laminated conductive film and (b) a reflecting electrode formation step of patterning the laminated conductive film into a reflecting electrode, wherein the step (b) includes a first etching step of etching the conductive metal film and the amorphous transparent conductive film simultaneously and a second etching step of etching the amorphous transparent conductive film only.

Abstract: A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base substrate, and a piezoelectric drive provided on the movable portion and the fixed portion on a side opposite to the base substrate. The piezoelectric drive has a laminate structure provided by a first electrode film contacting the movable portion and the fixed portion, a second electrode film and a piezoelectric film between the first and the second electrode films. At least one of the movable portion and the fixed portion is provided with a groove extending along the piezoelectric drive.

Abstract: Compositions for preparing a surface which, when applied to a variety of substrates provides improved adhesion performance for applying a coating. The compositions are aqueous mixtures containing an effective amount of an acid, iron, and zinc and methods of making and using same.

Abstract: For mounting on a substrate by using an electroconductive adhesive, an electroconductive paste for forming an external electrode which has improved moisture resistance and which is resistant to occurrence of external-electrode peeling, as well as a ceramic electronic component including the electroconductive paste are provided. The electroconductive paste includes a base-metal electroconductive powder, first glass frit, and an organic vehicle, wherein the first glass frit has a B2O3 content of 10 to 20 percent by mole, a SiO2 content of 50 to 65 percent by mole, an alkali metal oxide content of 10 to 20 percent by mole, a ZnO content of 1 to 5 percent by mole, a TiO2 content of 1 to 5 percent by mole, a ZrO2 content of 1 to 5 percent by mole, and an Al2O3 content of 1 to 5 percent by mole.

Abstract: A wet-etching is conducted with a weak acid or weak base etchant to pattern a display device substrate that has a gas-barrier layer comprising at least one organic region and at least one inorganic region. The wet-etching attains high-precision patterning not having any negative influence on the quality of the processed display device.

Abstract: The present invention relates to a manufacturing method of a fabric with colored stereoscopic patterns which comprises providing a fabric having a man-made fiber layer and a natural fiber layer; analyzing the colors of the desired patterns to be printed through color separation, providing a printing board for each color, and printing the desired colored patterns on the natural fiber layer and printing an etching agent on an area outside the colored patterns on the natural fiber layer via the printing boards; and etching the area on the natural fiber layer that is printed with the etching agent, and then removing the etched area of the natural fiber layer without etching the man-made fiber layer, so as to form the colored stereoscopic patterns woven by the natural fibers on the man-made fiber layer.

Abstract: A method of fabricating a supported catalyst layer for use in a fuel cell electrode, comprises sequential steps of: combining a fluid ink including a supported catalyst comprising at least one precious metal or alloy supported on particles of a support material, and a solution of at least one ionomeric polymer material, with at least one pore-forming material; forming a layer of the combined ink on a surface of a sheet of support material; hot pressing the layer; and treating the hot-pressed layer to remove pore-forming material to form a supported catalyst layer.

Abstract: A method for manufacturing a thermal interface material includes the following steps: providing a carbon nanotube array formed on a substrate, the carbon nanotube array having a number of carbon nanotubes and a number of interstices between the adjacent carbon nanotubes; filling a liquid state first base material into the interstices; curing the first base material, thereby achieving a carbon nanotube/first base material composite; dripping a liquid state second base material onto the surface of the carbon nanotube/first base material composite, the first base material melting and flowing out of the carbon nanotube/first base material composite, until the carbon nanotube array being substantially submerged in the second base material; and curing the second base material, thereby achieving a thermal interface material.

Abstract: A composite element comprising a thin film that consists of at least two layers of an oxide-ceramic and metallic material, or a metallic material and an essentially flat substrate that supports the thin film. Said substrate is composed of a ceramicizable glass, a glass ceramic, a hybrid form or an intermediate product. To produce the substrate, selected regions are dissolved out of the photostructurable glass substrate. The composite element can be successfully used in a miniaturised electrochemical device, in particular in a solid oxide fuel cell SOFC, a sensor or as a gas separation membrane.

Abstract: A method for forming channels within a dried chromonic layer is described. A coating composition is applied to a substrate, dried, and exposed to a hydrophilic organic solvent forming a channel pattern having a first set of channels, and a second set of channels that are substantially perpendicular to the first set of channels. A deposition material may be disposed within the channels to form a nanostructured pattern. An article having a channel pattern is further described.

Abstract: A method of fabricating printheads each having a plurality of nozzle assemblies positioned on a substrate from a plurality of sets of the nozzle assemblies positioned on the substrate includes the step of applying a guard defining a plurality of recesses to the substrate so that each set is located within a respective recess. The substrate is then segmented.

Abstract: A solar cell is fabricated by etching one or more of its layers without substantially etching another layer of the solar cell. In one embodiment, a copper layer in the solar cell is etched without substantially etching a topmost metallic layer comprising tin. For example, an etchant comprising sulfuric acid and hydrogen peroxide may be employed to etch the copper layer selective to the tin layer. A particular example of the aforementioned etchant is a Co-Bra Etcho® etchant modified to comprise about 1% by volume of sulfuric acid, about 4% by volume of phosphoric acid, and about 2% by volume of stabilized hydrogen peroxide. In one embodiment, an aluminum layer in the solar cell is etched without substantially etching the tin layer. For example, an etchant comprising potassium hydroxide may be employed to etch the aluminum layer without substantially etching the tin layer.

Abstract: Provided is a particle that includes a first porous region and a second porous region that differs from the first porous region. Also provided is a particle that has a wet etched porous region and that does have a nucleation layer associated with wet etching. Methods of making porous particles are also provided.

Abstract: A balloon catheter and a method of making the balloon catheter, having a balloon which is bonded to an elongated shaft, and which has a first layer and a second layer and an improved bond between the balloon and the shaft. One aspect of the invention is directed to a balloon in which the balloon first layer includes eUHMWPE and has at least a section that has been oxidized with a chromic acid solution to provide improved bondability.

Abstract: Multicomponent nanorods having segments with differing electronic and/or chemical properties are disclosed. The nanorods can be tailored with high precision to create controlled gaps within the nanorods or to produce diodes or resistors, based upon the identities of the components-making up the segments of the nanorods. Macrostructural composites of these nanorods also are disclosed.

Abstract: The invention pertains to a process for manufacturing pieces of a foil having an inorganic coating comprising the steps of: (a) providing an etchable temporary substrate foil (1), (b) applying the inorganic coating (2) onto the temporary substrate, (c) applying a permanent carrier (3), (d) optionally, removing part of the temporary substrate (1), (e) cutting the foil along a cutting line into the pieces, wherein the cutting line is positioned at a portion of the foil where the temporary substrate is present and having a width of at least 0.25 mm relative to each side of the cutting line, (f) removing at least part of the temporary substrate.

Abstract: A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat layer interposed between the transparent film substrate and the transparent conductor layer; wherein: the transparent conductor layer is patterned; and a non-patterned portion not having the transparent conductor layer has the at least one undercoat layer.

Abstract: Disclosed is a method for making flexible circuits in which portions of a tie layer are removed by etching the underlying polymer. Also disclosed are flexible circuits made by this method.

Abstract: A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern.

Abstract: In order to use an etching solution of less complicated composition for recovering used wafers, embodiments of the present invention provide a recovering method, and also provide a kind of wafer, which is used as a process control wafer or dummy wafer, and fabrication methods. In one embodiment, a wafer-recovering method comprises providing a first wafer, wherein the first wafer has a base, a first conductive layer on the base, and a second conductive layer on the first conductive layer. The method further comprises removing the first and second conductive layers with an acidic solution to obtain a second wafer; and washing the second wafer with a liquid. The second conductive layer is formed on the first conductive layer in a deposition process, and the first conductive layer is more easily removed by the acidic solution than the second conductive layer.

Abstract: A substrate processing enables etching of a barrier metal film at around room temperature without application of a mechanical load and without excessive etching of a necessary portion of copper. The substrate processing flattens a copper film and a barrier metal film, both exposed on a surface of a substrate, by using an etching liquid capable of adjusting the etching rate ratio between the copper film and the barrier metal film.

Abstract: A method of manufacturing a nozzle plate 2 is disclosed. The nozzle plate 2 has a plurality of nozzle openings 22 through each of which a droplet is adapted to be ejected. The method includes the steps of: preparing a processing substrate (silicon substrate 10) constituted from silicon as a main material, the processing substrate having two major surfaces; providing a supporting substrate 50 for supporting the processing substrate onto one major surface of the processing substrate 50; and forming the plurality of nozzle openings 22 on the other major surface of the processing substrate by subjecting the other major surface of the processing substrate to an etching process while the processing substrate is supported by the supporting substrate 50.

Abstract: The present invention provides a method of fabricating an imprint mold for molding a structure. The method includes directing a first and a second flux for forming a first material and a second material, respectively, to a substrate to form a layered structure having alternating layers of the first and the second material. The method also includes controlling a thickness of the first and the second layers by controlling the first and the second flux and cleaving the layered structure to form a cleavage face in which sections of the layers are exposed. The method further includes etching the exposed sections of the layers using a etch procedure that predominantly etches one of the first and the second materials to form the mold having an imprinting surface with at least one indentation for molding the structure. At least one of the fluxes is controlled so that at least one of the layers has a thickness that varies along a portion of a length of the at least one layer.

Abstract: A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more types of etching methods are performed in combination, on stacked films containing first and second films being deposited sequentially on a substrate and each having a different film property. The two or more types of wet etching methods include, at least, a first wet etching method in which side-etching on the first film is facilitated more than side-etching on the second film and a second wet etching method in which side-etching on the second film is facilitated more than side-etching on the first film.

Abstract: A method of forming a plurality of bumps over a wafer mainly comprises providing the wafer having a plurality of bonding pads formed thereon, forming an under bump metallurgy (UBM) layer over the bonding pads wherein the UBM layer includes an adhesive layer, for example a titanium (Ti) layer or an aluminum (Al) layer, and at least one electrically conductive layer formed on the adhesive layer, removing the portions of the electrically conductive layer located outside the bonding pads, forming a plurality of bumps over the residual portions of the electrically conductive layer disposed above the bonding pads, etching the adhesive layer located outside the bumps, and then reflowing the bumps.

Abstract: In devices such as flat panel displays, an aluminum oxide layer is provided between an aluminum layer and an ITO layer when such materials would otherwise be in contact to protect the ITO from optical and electrical defects sustained, for instance, during anodic bonding and other fabrication steps. This aluminum oxide barrier layer is preferably formed either by: (1) partially or completely anodizing an aluminum layer formed over the ITO layer, or (2) an in situ process forming aluminum oxide either over the ITO layer or over an aluminum layer formed on the ITO layer. After either of these processes, an aluminum layer is then formed over the aluminum oxide layer.

Abstract: Methods treating razors blade cutting edges having an adherent polyfluorocarbon coated thereon are described. The coated razor blade edges are treated with a solvent, which partially removes the coating from the razor blade edge. Addition of an antioxidant to the solvent improves the effectiveness of the treatment.