Abstract: A layered manufacturing method for forming a desired three-dimensional object by using a powder as a raw material. The method forms a desired solid body, which is employed in a layered manufacturing device, including a stage member having stage surface; a transparent member having an optical window to cover the stage surface to form an enclosed region together with the stage surface; and an exhaust system for exhausting gasses in the enclosed region. The optical window is positioned at a vertical upper direction when the enclosed region is formed.

Abstract: A method for forming ceramic articles for prototypes that involves the use of metal particles or metal-coated ceramic particles that are formed into ceramic articles using a laser engineered net shaping process. The metal particles or metal coating on the ceramic particles facilitates bonding between the ceramic particles to enable quick manufacture of ceramic articles using the laser engineered net shaping process. The ceramic articles may be ceramic core prototypes and may be used in a variety of different industries.

Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.

Abstract: A laser annealing apparatus carries out an annealing treatment an amorphous silicon film on a TFT substrate. The apparatus includes: a mask having a plurality of apertures; a microlens substrate having a plurality of microlenses arranged on a surface thereof and configured to focus the plurality of laser beams Lb, that have passed through the respective apertures of the mask, onto the TFT substrate to apply a predetermined energy to the amorphous silicon film; a pair of guides each having a semi-cylindrical shape and disposed along both sides across the microlens substrate so that the axes of the guides are parallel to each other and that the tips of the guides protrude from the positions of tips of the microlenses toward the TFT substrate; and a film that is provided in a tensioned state between the pair of guides so as to be movable and that transmits a laser beam.

Abstract: An apparatus for forming electrical solder connections in a disk drive unit includes: a nozzle device for carrying out soldering on two pre-welding surfaces; a solder ball feeding device for transferring a single solder ball to the nozzle device; a gas pump device for supplying pressurized gases to the nozzle device; a laser device for emitting laser beams to the solder ball,; and a control device including at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor. The present invention can easily control the solder ball, the pressurized gases and the laser beams, thereby keeping the pressure of the nozzle device and the laser energy stable and, in turn improving the soldering result.

Abstract: A laser processing apparatus 1 includes a processing light source 3 emitting processing light; an observation light emitting unit 4 emitting observation light; optical fibers 19 conducting light having a plurality of wavelengths generated at an electronic component 2; a detecting unit 5 detecting the light conducted by the optical fibers 19; and a control unit 31 controlling a light emitting state of the processing light emitting unit 3. The optical fibers 19 are categorized into four groups, and disposed so as to surround an optical fiber 18 conducting the processing light. The optical fibers 19 categorized into the four groups are capable of conducting the observation light to the electronic component 2 every group.

Abstract: Disclosed is a method for generatively producing or for repairing at least one area of a component, wherein a zone arranged downstream of a molten bath is post-heated to a post-heating temperature and the component is set to a base temperature, and also a device for carrying out such a method.

Abstract: A laser irradiation apparatus is provided with a laser oscillator, an articulated beam propagator in which a plurality of pipes are connected to each other in an articulated portion, and a course change means of a laser beam in the articulated portion. At least one pipe of the plurality of pipes includes a transfer lens for suppressing stagger of a laser beam in a traveling direction, in each pipe. The articulated portion produces degree of freedom in disposition of a laser oscillator, and the transfer lens enables suppression of change in beam profile.

Abstract: By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.

Abstract: An apparatus for manufacturing a three-dimensional object (3) by applying and solidifying a powdery constituent material (3a) layer by layer at positions corresponding to the respective cross sectional area of the object (3) in the respective layer by exposure to a laser (7) or another energy source comprises a heating or cooling element (22) supplying heat to or removing heat away from the constituent material (3a) applied layer by layer. For smoothing the temperature distribution, an intermediate layer (23) having a highly anisotropic heat conductivity is provided.

Abstract: A system and method to provide a welding or cladding operation is provided which using multiple consumables in a single operation, where the overall heat input is reduced. Each of the consumables can be deposited into a single molten puddle, where the total energy input to the puddle from trailing consumables is less than that of a leading consumable. Further embodiments can use more than one molten puddle, but the energy input by the leading consumable is still higher than that of trailing consumables.

Abstract: The disclosure relates to methods and systems for single-scan line-scan crystallization using superimposed scanning elements. In one aspect, the method includes generating a plurality of laser beam pulses from a pulsed laser source, wherein each laser beam pulse has a fluence selected to melt the thin film and, upon cooling, induce crystallization in the thin film; directing a first laser beam pulse onto a thin film using a first beam path; advancing the thin film at a constant first scan velocity in a first direction; and deflecting a second laser beam pulse from the first beam path to a second beam path using an optical scanning element such that the deflection results in the film experiencing a second scan velocity of the laser beam pulses relative to the thin film, wherein the second scan velocity is less than the first scan velocity.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: The present invention, among other things, relates to an apparatus (10) for working a surface (11) of a workpiece, in particular a metal workpiece, by means of laser radiation. The apparatus (10) is characterized by a scanner device (20), which is mounted in a rotationally immovable manner in the working apparatus (10) and is intended for shaping a laser beam that is to be deflected and positioned onto the surface to be worked, a control device for changing the orientation of the scanning direction of the laser beam shaped in the scanner device (20), and an optics element (40), which is movable about an axis of rotation (12), is arranged downstream of the scanner device (20) in the beaming direction of the laser beam and advantageously has a beam splitter device for splitting the laser beam into two or more beam parts (41, 42) and for deflecting and positioning the beam parts (41, 42) onto the surface (11) that is to be worked.

Abstract: Certain example embodiments of this invention relate to apparatuses for sealing the tips of pump-out tubes of vacuum insulating glass (VIG) units, and/or associated methods. In certain example embodiments, a laser source used in sealing the pump-out tube is thermally insulated from the VIG unit and emits a laser beam through one or more windows in an oven towards a mirror located therein. The mirror is located so as to redirect the laser beam onto the pump-out tube to thereby seal it. For instance, a substantially horizontal laser beam emitted from a laser source located outside the oven enters into the oven through one or more windows and is reflected by a mirror towards the pump-out tube to be sealed. The repositioning of the laser source advantageously can change its effective focal length and/or the location of the laser beam, e.g., because of the fixed location of the mirror.

Abstract: A method for repairing a damage site on a surface of an optical material is disclosed. The method may involve focusing an Infrared (IR) laser beam having a predetermined wavelength, with a predetermined beam power, to a predetermined full width (“F/W”) 1/e2 diameter spot on the damage site. The focused IR laser beam is maintained on the damage site for a predetermined exposure period corresponding to a predetermined acceptable level of downstream intensification. The focused IR laser beam heats the damage site to a predetermined peak temperature, which melts and reflows material at the damage site of the optical material to create a mitigated site.

Abstract: To provide a laser irradiation apparatus and a laser irradiation method in which a region formed with microcrystals in a region irradiated with laser beams is decreased by disposing a slit in an optical system using a deflector, and laser processing can be favorably conducted to a semiconductor film. Further to provide a semiconductor manufacturing apparatus using the above-described laser irradiation apparatus and the laser irradiation method. In the optical system, an f-? lens having an image space telecentric characteristic or a slit the shape of which is changed in accordance with the incidence angle of a laser beam, is used. The slit is disposed between the f-? lens and an irradiation surface, and an image at a slit opening portion is projected onto the irradiation surface by a projection lens. By the above-described structure, laser irradiation can be uniformly conducted to a whole region scanned with laser beams.

Abstract: An energy collector is used to assist a laser coupling process by reducing the amount of output power of a laser that is used to modify a device attaching element. The energy collector includes an energy collector tip configured to be placed proximate to a device attaching element during the laser coupling process. The energy collector tip is configured to receive laser energy reflected from the device attaching element during the laser coupling process and is formed from a material that converts this reflected energy to heat. Sufficient thermal coupling is created between the energy collector and a surface to provide a conductive pathway for the energy, which has been converted to heat, between the energy collector and the device attaching element.

Abstract: A crystallization apparatus for crystallizing a semiconductor layer formed on a substrate, the crystallization apparatus including: a laser generator, which generates a laser beam, and a stage on which the substrate is mounted, where the semiconductor layer is divided into a plurality of crystallization areas and a plurality of non-crystallization areas, and the laser beam is radiated onto the crystallization areas a plurality of times to crystallize the crystallization areas, where the laser beam is radiated onto different positions of the same crystallization area a plurality of times.

Abstract: A laser irradiation apparatus is disclosed. In one embodiment, the apparatus includes i) an X-axis location control board configured to move a plurality of drivers in an X-axis direction and ii) a plurality of output heads cooperatively arranged with the drivers and configured to move with movement of the drivers, wherein the output heads are configured to receive laser beams. The apparatus may further include a Z-axis location control board cooperatively arranged with the X-axis location control board and configured to move the X-axis location control board in an Z-axis direction, wherein the output heads alternatively protrude with different lengths along an Y-axis direction.

Abstract: A laser crystallization device includes a first light source providing a first light and a second light source providing a second light. The device further includes a first lens set receiving the first light to generate a first transmitted light, the first transmitted light having a first profile, the first profile having a first profile error portion and a first non-error portion. The device further includes a second lens set receiving the second light to generate a second transmitted light, the second transmitted light having a second profile, the second profile having a second profile error portion and a second non-error portion, the second profile error portion corresponding to the first non-error portion, the second non-error portion corresponding to the first profile error portion. The device further includes an optical system combining the first transmitted light with the second transmitted light.

Abstract: A method of repairing damage in an optical element includes providing a laser system including at least one optical element having a coating layer having an incident light surface and directing a laser pulse from the laser system to impinge on the incident light surface. The method also includes sustaining damage to a portion of the incident light surface and melting the damaged portion of the incident light surface and a region adjacent to the damaged portion. The method further includes flowing material from the region adjacent the damaged portion to the damaged portion and solidifying the material in the damaged portion and the region adjacent to the damaged portion.

Abstract: A method of sealing a surface crack in a member is provided includes steps of irradiating a region of the member at which the crack is produced with a heating laser beam so as to heat the region to a temperature lower than a melting point of the member, and then irradiating a region of the member at which the crack is produced with a welding laser beam subsequent to irradiation of the heating laser beam so as to heat the region to a temperature higher than or equal to the melting point of the member, thereby sealing an opening of the surface crack of the member.

Abstract: A high energy, high repetition rate workpiece surface heating apparatus is disclosed which comprise a XeF laser producing a laser output light pulse beam, an optical system narrowing the laser output light pulse beam in the short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of the long axis, the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece.

Abstract: A method of producing an orthopedic implant including the steps of building a flat open model of at least a portion of an implant. The flat open model may be built using a selective laser sinter process. The flat open model preferably includes at least one groove along either a first surface or a second surface of the model. Next a force may be applied to the flat open model at predetermined locations to thereby cause the model to bend and assume a shape similar to a desired result. The now bent model may be resurfaced by either applying additional material such that the bent flat open model assumes the shape of a desired implant or the bent open model may be snap fit to an additional element.

Abstract: Methods and apparatus for the calibration and use of test glide head gimbal assemblies are disclosed. Calibration is performed by pulse laser adjustment of the flexure mounted to the glide head, while the head is flying above a media test disk having asperities of known dimensions. The calibration process normalizes the fly heights of glide heads used to measure defects on both upper and lower surfaces of disk drive media, allowing upper and lower surfaces to be scanned simultaneously.

Abstract: Provided is a laser type soldering apparatus which performs soldering by projecting a laser beam on a to-be-soldered object, one of a plurality of optical lenses is a conical lens, wherein an incident surface or a emitting surface of the conical lens is a conical surface, and a central portion of the conical lens has a central hole having a diameter smaller than that of a circular laser beam that is incident to the conical lens, and the conical lens converts the circular laser beam to a double circular beam having a ring portion with a circular ring shape and a spot portion located at a center of the ring portion, so that the double circular beam is projected on the to-be-soldered object.

Abstract: Apparatuses and methods are provided for processing a substrate having an upper surface that includes a central region, a peripheral region, and an edge adjacent to the peripheral region. An image having an intensity sufficient to effect thermal processing of the substrate is scanned across the upper surface of the substrate. The image scanning geometry allows processing the central region of the substrate at a substantially uniform temperature without damaging the outer edge. In some instances, the image may be formed from a beam traveling over at least a portion of the central region so that no portion thereof directly illuminates any portion of the edge when the image is scanned across the periphery region. The substrate may be rotated 180° or the beam direction may be switched after part of the scanning operation has been completed.

Abstract: The invention relates to a laser spot welding process for executing a spot weld in two successive steps, namely a first step of preparing the surface state of the material to be welded and a second step of welding as such. The luminous energy (BR) reflected by the weld region of the material is measured in real time during the first step and then processed by a controller circuit (37) connected to a control circuit (30) of the laser source (31). In this way, the characteristics (LM) of the laser beam are adjusted in real time as a function of the measurements effected to allow effective control of the quality of the weld obtained, and in particular of its dimensions. The invention also relates to a welding device for implementing this process.

Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.

Abstract: A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser.

Abstract: A joining device for a bonded connection by means of a filler material has a feeding device for a wire as the filler material, which is configured to feed the wire during operation of the joining device at a predetermined speed of advance, and a guiding device for an energy beam with at least two partial beams for the melting of the wire. The joining device has a first measuring sensor for detecting a lateral deflection of the wire and a second measuring sensor for detecting a quantity related to the advancement of the wire, wherein the guiding device for the energy beam is connected to the first and the second measuring sensor and configured such that the energy beam is deflected and/or focused in dependence on the output signals of the first and second measuring sensor.

Abstract: The present invention relates to a laser welding method of welding an electrode and a cable core to each other satisfactory by irradiation of a laser beam, even when the core is thin and the area of the electrode is small. The laser welding method welds on a substrate the electrode and the core of a coaxial cable to each other by irradiation of the laser beam. The core is sandwiched between a pressing member and the electrode, while the electrode and the core are brought into contact with each other at a connection section. The pressing member is a member that is transparent to the processing laser beam. A part of the core is molten by radiating the laser beam from the pressing member side. As a result, the electrode and the core are connected with each other.

Abstract: A soldering device for forming electrical solder connections in a disk drive unit comprises a nozzle device comprising at least two separated movable housings that provides a passage, the upper ends of the housings form an entrance, and the lower ends of the housings form a nozzle; and an actuating device connecting with the nozzle device and arranged for controlling the housings of the nozzle device to move together or apart, thereby controlling the inner diameter size of the nozzle. The present invention provides movable housings of the nozzle device so as to make the size of the nozzle controllable, finally benefits to perform a solder connection.

Abstract: A continuous furnace 4 to which a laser is coupled by conventional optical means that allows the surface treatment of a part, with which it is possible to achieve temperatures of up to 3000° C. on said surface while the remainder of the part is at a substantially lower temperature. The part in the furnace is heated to a temperature of the order of 500° C. and, via an opening 5, a laser-beam bundle is applied to the part, scanning a line perpendicular to the direction of movement of the part such that the entire surface is scanned by means of the mechanical advance of the part. This scanning should extend beyond the lateral ends of the part. This type of laser-beam generator must be made compatible with the various colors with which the surface of the part is decorated. The furnace is divided into different zones, with independent temperature controls, for successfully achieving the desired values, both for heating and for cooling.

Abstract: A laser beam treatment device capable of solving problem in a conventional technology that any uniform laser anneal cannot be realized since use of a galvano mirror changes the angle of incidence of the laser beam to the substrate and the reflected light from a back side of a transmissive substrate interferes with the reflected light from a surface of a semiconductor film or an interface between the semiconductor film and the substrate. Laser anneal is performed by using the laser beam treatment device comprising a laser, an optical system for shaping the laser beam oscillated from the laser, and a substrate holds to hold a work formed on the transmissive substrate, in which the substrate holder holds a liquid, and the liquid is brought into contact with the surface.

Abstract: An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A method and apparatus for fabricating a foam container by using a laser cutting apparatus to precisely cut and remove portions of foam in order to form custom and predetermined text, indentations and protective compartments in the foam, and more particularly a method of controlling the laser relative to high density foam to create precise cuts completely through the foam without subsequently adjusting the focal point of the laser, the cuts being made according to exterior dimensions of an object to be supported and protected in the high density foam.

Abstract: Alternative designs, materials and manufacturing methods for guidewires. Some embodiments pertain to a composite guidewire having proximal and distal section, and a connector adapted and configured for permanently joining the proximal section to the distal section. In some embodiments, at least one of the sections is made of a linear-elastic nickel-titanium alloy. Several alternative guidewire tip constructions and/or designs including methods and techniques of construction are also disclosed.

Abstract: In a mirror for an automobile, the adoption of resin mirror body to a mirror plate can decrease the weight of the mirror body, and the mirror plate is fixed onto a mirror holder through the welding. Therefore, this eliminates the usage of both-sided adhesive tape or adhesive agent, makes assembly processes less complicated, and thus the reduction in production cost is achieved. Furthermore, since the mirror plate can be fixed onto the mirror holder firmly and strongly even when the mirror plate is not pressed strongly to the mirror holder, excessive load on the mirror holder or the mirror plate becomes avoided. In addition, at the time of the production stage, some dimensional variation in the edge part of the mirror holder or the peripheral edge of the mirror plate becomes easily acceptable.

Abstract: Methods used to perform an annealing process on desired regions of a substrate are disclosed. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

Abstract: A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.

Abstract: A method for manufacturing a semiconductor thin film is provided which can form its crystal grains having a uniform direction of crystal growth and being large in size and a manufacturing equipment using the above method, and a method for manufacturing a thin film transistor. In the above method, by applying an energy beam partially intercepted by a light shielding element, melt and re-crystallization occur with a light-shielded region as a starting point. The irradiation of the beam gives energy to the light-shielded region of the silicon thin film so that melt and re-crystallization occur with the light-shielded region as the starting point and so that a local temperature gradient in the light-shielded region is made to be 1200° C./?m or more. In the manufacturing method, a resolution of an optical system used to apply the energy beam is preferably 4 ?m or less.

Abstract: A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics coupled to the laser and configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser.

Abstract: Provided are apparatuses and method for the thermal processing of a substrate surface, e.g., controlled laser thermal annealing (LTA) of substrates. The invention typically involves irradiating the substrate surface with first and second images to process regions of the substrate surface at a substantially uniform peak processing temperature along a scan path. A first image may serve to effect spike annealing of the substrates while another may be used to provide auxiliary heat treatment to the substrates before and/or after the spike annealing. Control over the temperature profile of the prespike and/or postspike may also reduce stresses and strains generated in the wafers. Also provided are microelectronic devices formed using the inventive apparatuses and methods.

Abstract: A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.

Abstract: Methods and apparatuses are provided for improving the intensity profile of a beam image used to process a semiconductor substrate. At least one photonic beam may be generated and manipulated to form an image having an intensity profile with an extended uniform region useful for thermally processing the surface of the substrate. The image may be scanned across the surface to heat at least a portion of the substrate surface to achieve a desired temperature within a predetermined dwell time. Such processing may achieve a high efficiency due to the large proportion of energy contained in the uniform portion of the beam.

Abstract: A method of retouching metal parts joined by brazing at high temperatures is disclosed. The brazed zones are retouched by a retouching laser. The peak power of the retouching laser is between 1500 and 3000 W. The retouching laser is used in pulsed mode.