Abstract: Systems and methods of collapsing the air lines in the air line-containing region of a nanostructure optical fiber are disclosed. One method includes initiating irradiation of a portion of the nanostructure optical fiber from essentially opposite directions with at least first and second laser beams having substantially equal power and essentially the same mid-infrared wavelength. The method includes continuing the irradiation for an irradiation time t1 so as to bring the optical fiber portion to a softening temperature TS at which the air lines in the optical fiber portion collapse into the adjacent cladding. Exemplary optical systems for carrying out the air- line-collapsing methods of the present invention are also disclosed.

Abstract: A laser anneal apparatus is provided with a laser source; a homogenizing optical system disposed in an optical path of laser light emitted from the laser source to homogenize an intensity distribution of the laser light in a section which is perpendicular to the optical path; a phase shifter disposed in the optical path of the laser light passed through the homogenizing optical system to produce an intensity distribution pattern of the laser light in the section which is perpendicular to the optical path; a photoreceptor device disposed in the optical path of the laser light passed through the phase shifter to intercept a part of the laser light and to measure a quantity of the intercepted laser light; and an image-forming optical system disposed in the optical path of the laser light passed through the photoreceptor device to focus the laser light on a substrate to be treated.

Abstract: A system and method are disclosed for remelting solder balls in the forming of electrical connections between an electrical component being mounted on a printed circuit board (PCB). Vias are formed in the PCB. Underneath the PCB, a laser is directed through the via to remelt the solder ball to make the connection. In one version, the laser is included on a positioning device. The positioning device translates the laser to a location from which it is aimed through the aperture at the solder mass. In other versions, a camera on the positioning device helps position the laser by making reference to a fiducial mark on the PCB. Further, a detector can be used to determine laser intensity by measuring the output after it passes through the via.

Abstract: A laser processing apparatus is provided including: a laser generator generating a light beam; a branching means for branching out the light beam to a plurality of beams arranged at equal intervals; a shifting means for shifting the plurality of beams at a pitch equal to a multiple of natural number of the arranged intervals relatively over a target; and a control means for controlling the intensity of the beam synchronously with the shifting pitch of the plurality of beams.

Abstract: A method, system or the like which may, for example, be exploited as part of known methods, systems and/or apparatii which manipulate (i.e. tune, modify, change, create, etc.) the impedance of (integrated) semiconductor components or devices by exploiting a focused heating source. The method, system or the like exploits in situ optical measurements for the modification of the energy output of a focused heating source, such as for example of a (pulsed) laser heat source. The energy input to the focused heating source may be manipulated as a function of an optical measurement so as to obtain a desired or necessary energy output (e.g. target energy output) from the focused heating source.

Abstract: The invention relates to a method for fixing a miniaturized component, especially comprising a micro-optical element, to a pre-determined fixing section of a baseplate by means of a soldered joint. Said baseplate comprises an upper side and a lower side, and the component comprises a base surface. At least the fixing section of the baseplate is coated on the upper side by a metallic layer which is applied at least in the fixing section in a continuously plane manner and thus without interruptions. Solder material is applied at least to the fixing section coated with the metallic layer. In one step of the method, the component is arranged above the fixing section, the base surface of the component being positioned above the solder material in such a way that they do not touch, are vertically interspaced and form an intermediate region between each other.

Abstract: Methods for repairing a gas turbine engine knife edge seals are provided. A representative method includes: providing a knife edge of a gas turbine component, the component comprising IN-100, the knife edge being degraded; directing a laser beam toward the knife edge; and dispensing IN-100 powder such that the IN-100 powder is melted by the laser beam and is deposited on the knife edge.

Abstract: A marking (7) that indicates inherent information about a stator (2) is formed of recesses inscribed at a predetermined position on the outer circumferential surface of a laminated iron core (21) of the stator (2), by melting a magnetic thin plate by means of a laser beam. The marking (7) is formed of recesses in the outer circumferential surface of the laminated iron core (21), i.e., in the outer circumferential surface, at the laminated side of the magnetic thin plate, of the laminated iron core (21); therefore, friction or the like does not peel off the marking. The inherent information about a stator is information, such as information that in which place of which factory the stator has been manufactured, which is utilized for a product analysis in the case where, after being utilized as a product, the manufacturer obtains the stator.

Abstract: A method of producing a probe assembly which uses thermal energy of a laser light for bonding a plurality of connection pads provided on a probe board and a probe disposed on each connection pad. In the neighborhood of at least one of the connection pads on the probe board, a dummy connection pad with no probe adhered is formed in order to uniform the thermal energy by irradiation of each bonding portion of each connection pad and the corresponding probe.

Abstract: A battery having a bundle of electrodes and separator which is made by winding a positive-electrode plate and a negative-electrode plate together with a separator therebetween, one of the positive- and negative-electrode plates being electrically connected to a power collecting body, the power collecting body being provided in and welded to an outer package can, wherein a welding portion of the outer package can and the power collecting body comprises a first layer and a second layer which are stacked in a thickness direction of the outer package can at the welding portion, and the second layer is in contact with a surface of the first layer and includes crystal grains that are minuter than crystal grains included in the first layer.

Abstract: A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer.

Abstract: The present invention provides a laser apparatus including a transmission-variable mirror and a method for forming a semiconductor device using the apparatus. For crystallizing an amorphous semiconductor film by irradiation of laser beams, a top surface and a back surface of the amorphous semiconductor film are irradiated with the laser beams. In this case, the transmission-variable mirror is used for dividing a laser light emitted from a laser source.

Abstract: The invention relates to a method for making metallic and/or non-metallic products 2, in particular dental products, by freeform sintering and/or melting, in which the products 2 are fabricated layer by layer from a material 5 that is applied layer by layer by means of a computer-controlled high-energy beam 7, in particular a laser or electron beam. In order to reduce production times, beam 7 irradiates predetermined positions P1 to P6 of a layer of a material 5 a plurality of time, namely m times, where m is a whole integer greater than 1. Each of said positions P1 to P6 is initially heated during the first irradiation to a temperature below the melting point Tmelt of the material 5, and during the mth irradiation to a temperature above said melting point and is completely melted over the entire thickness of the layer in such a way that the material (5) fuses at said position to the layer thereunder. The invention also relates to an apparatus for performing said method.

Abstract: A one step process for fabricating planar optical waveguides comprises using a laser to cut at least two channels in a substantially planar surface of a piece of dielectric material defining a waveguide there between. The shape and size of the resulting guide can be adjusting by selecting an appropriate combination of laser beam spatial profile, of its power and of the exposure time. A combination of heating and writing lasers can also be used to fabricate waveguides in a dielectric substrate, wherein the heating laser heats the substrate with a relatively broad focused spot, the power of the heating laser being controlled to raise the temperature heating the substrate just below the substrate's threshold temperature at which it begins to absorb electro-magnetic radiation, the writing laser, which yields a spot size smaller than the heating laser then melts the substrate within the focal spot of the heating laser.

Abstract: The laser lawn cutting system of the present invention consists of an array or grid of laser heads distributed across a lawn. The laser heads may be permanently fixed above the surface of the lawn, or preferably mounted underneath the surface of the lawn and designed to pop up at the time of cutting. If mounted underneath the surface of the lawn, solenoids may be used to move the laser heads above the surface. Other mechanical devices could also be used to cause the laser heads to move above the surface of the lawn. Preferably, the laser heads will be distributed across the lawn in a grid or matrix, such that the laser light generated by the rotating laser head sweeps across the lawn in overlapping arcs to cut the vegetation. The system may also be used to melt snow or kill insects.

Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.

Abstract: A method of sealing a plurality of frame-like frit walls disposed between two substrates. The frit walls are arranged in rows and columns and divided into groups, each group being sealed by a separate laser beam. Several strategies are disclosed for the order in which the frit walls are heated and sealed by a laser beam to optimize the efficiency of the sealing process.

Abstract: A laser annealing system and apparatus, which includes a laser light source, which emits a laser beam through an a-Si layer on a substrate, an optical unit which forms an optical path along which the laser beam is transmitted through a subject to be annealed, and a first reflecting component, which reflects the laser beam that has been transmitted through the subject so that a direction of the laser beam is reversed along the optical path along which the laser beam is transmitted through the subject, to irradiate the subject. Since an operation in which energy is absorbed is repeated plural times when the laser beam is transmitted through the a-Si layer, input energy of the laser beam can be utilized without waste.

Abstract: A vehicle lamp includes an outer lens and an inner lens disposed inside the outer lens. The inner lens covers an area narrower than the outer lens and is supported with the body by laser welding. The inner lens and the body respectively have joint areas. A laser absorber is contained in an interface between the joint areas. The joint areas are overlapped and laser beam is emitted to the laser absorber from behind the joint area of the inner lens.

Abstract: Chuck methods and apparatus for supporting a semiconductor substrate and maintaining it at a substantially constant background temperature even when subject to a spatially and temporally varying thermal load. Chuck includes a thermal compensating heater module having a sealed chamber containing heater elements, a wick, and an alkali metal liquid/vapor. The chamber employs heat pipe principles to equalize temperature differences in the module. The spatially varying thermal load is quickly made uniform by thermal conductivity of the heater module. Heatsinking a constant amount of heat from the bottom of the heater module accommodates large temporal variations in the thermal heat load. Constant heat loss is preferably made to be at least as large as the maximum variation in the input heat load, less heat lost through radiation and convection, thus requiring a heat input through electrical heating elements. This allows for temperature control of the chuck, and hence the substrate.

Abstract: A sequential lateral solidification device, for enhancing optical characteristics of the device and for preventing damage caused by an ablation of a crystallization thin film, is disclosed. The device includes a laser light source generating a laser beam, a projection lens focusing the laser beam generated from the laser light source onto a substrate, a laser beam splitter between the projection lens and the substrate that passes the laser beam generated from the laser light source to irradiate the substrate and that blocks the laser beam reflected back from the substrate towards the projection lens, and a stage having the substrate mounted thereon.

Abstract: In a semiconductor thin film forming system for modifying a predetermined region of a semiconductor thin film by exposing the semiconductor thin film to a projected light patterned through a pattern formed on a photo mask, the system includes a mechanism (opt20?) for uniformizing the light for exposure in a predetermined area on the photo mask. This system can provide a crystallized silicon film having a trap state density less than 1012 cm?2 and can provide a silicon-insulating film interface exhibiting a low interface state density.

Abstract: A crystallization apparatus according to the present invention includes a first irradiation system which irradiates a predetermined area on a glass substrate having an irradiation target, i.e., an a-Si thin film with light beams having a substantially homogeneous light intensity distribution, and a second irradiation system which irradiates the predetermined area with light beams having a light intensity distribution with an inverse peak pattern that a light intensity is increased toward the periphery from an area in which the light intensity is minimum.

Abstract: Methods and apparatus for truncating an image formed with coherent radiation. The optical relay system is adapted to form a line image at the image plane. The image is truncated by a variable aperture at or near the aperture plane conjugate to the image plane, to block progressively increasing portions of an incident coherent radiation beam used to form the line image. An apodizing pupil filter having a maximum transmission or reflection in the center and a transmission or reflection profile that varies with direction corresponding to long direction of the line image is provided in the pupil plane. The apodization is designed to prevent hot-spots from forming in the truncated image and ensures a relatively smooth, flat intensity profile. Thus, one end or another of a coherent line image scanned over a substrate can be truncated during scanning without substantially changing the image intensity extending into the product area.

Abstract: An excimer laser annealing apparatus and the application of the same for stabilizing the atmosphere surrounding an area irradiated by an excimer laser. The apparatus includes a chamber, a gas diversion nozzle, an excimer laser and a gas supply device. The gas diversion nozzle is positioned inside the chamber. The laser beam produced by the excimer laser passes through the gas diversion nozzle. The gas supply device connects with the gas diversion nozzle for providing a jet of gas to the laser-irradiated area and carrying away any pollutants from the irradiated area.

Abstract: In a laser processing method and a laser processing apparatus which irradiate a processing target body with a laser beam pulse-oscillated from a laser beam source, a processing state is monitored by a photodetector, and the laser beam source is again subjected to oscillation control on the moment when erroneous laser irradiation is detected, thereby performing laser processing. Further, in a laser crystallization method and a laser crystallization apparatus using a pulseoscillated excimer laser, a homogenizing optical system, an optical element and a half mirror are arranged in an optical path, light from the half mirror is detected by a photodetector, and a light intensity insufficient irradiation position is again irradiated with a laser beam to perform crystallization when the detection value does not fall within a range of a predetermined specified value.

Abstract: A method of forming a polycrystalline silicon layer. An amorphous silicon layer on a substrate is completely melted using a laser beam passed through a mask so as to form a polycrystalline silicon layer. The upper portion of the polycrystalline silicon layer is then re-melted and re-crystallized using a laser beam passed through a mask. The mask includes a high transmittance region for completely melting the amorphous silicon layer and a low transmittance region for re-melting the upper portion of the polycrystalline silicon layer.

Abstract: The invention relates to a method for adjusting the switch-gap between the overlapping metal tongues of a reed switch contained in a glass envelope, in which a beam of radiation energy is directed through the envelope onto a localised area of at least one of the tongues for a specific period of time, thereby effecting thermally-induced bending of the tongue in question about the irradiated area, wherein a radiation source is used which delivers radiation energy having a wavelength in a range in which the radiation is absorbed by the glass envelope to a considerable extent, and wherein the beam of radiation energy is focussed and measured in such a manner that the proportion between the irradiated glass volume of the envelope and the irradiated metal area of at least one of the tongues that is obtained is such that the temperature of the glass undergoes a temperature increase of less than 100 Kelvin during the time required for heating the metal to the melting point.

Abstract: A heat shield (10) that facilitates thermally processing a substrate (22) with a radiation beam (150) is disclosed. The heat shield is in the form of a cooled plate adapted to allow the radiation beam to communicate with the substrate upper surface (20) over a radiation beam path (BP), either through an aperture or a transparent region. The heat shield has an operating position that forms a relatively small gap (170) between the lower surface (54) of the heat shield and the upper surface of the wafer. The gap is sized such that the formation of convection cells (200) is suppressed during substrate surface irradiation. If convection cells do form, they are kept out of the radiation beam path. This prevents the radiation beam from wandering from the desired radiation beam path, which in turn allows for uniform heating of the substrate during thermal processing.

Abstract: An apparatus for formation of a three dimensional object comprising a sealed container; an electron beam subsystem capable of directing energy within said container; a positioning subsystem contained within said container; a wire feed subsystem contained within said container; an instrumentation subsystem electronically connected to said electron beam subsystem, positioning subsystem, and wire feed subsystem; and a power distribution subsystem electrically connected to said electron beam subsystem, positioning subsystem, wire feed subsystem, and said instrumentation subsystem.

Abstract: Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Abstract: Apparatus and method for performing laser thermal annealing (LTA) of a substrate using an annealing radiation beam that is not substantially absorbed in the substrate at room temperature. The method takes advantage of the fact that the absorption of long wavelength radiation (1 micron or greater) in some substrates, such as undoped silicon substrates, is a strong function of temperature. The method includes heating the substrate to a critical temperature where the absorption of long-wavelength annealing radiation is substantial, and then irradiating the substrate with the annealing radiation to generate a temperature capable of annealing the substrate.

Abstract: Manufacturing tools having a base and a working surface, such as trim steels, flange steels and die inserts, are formed by fabricating or casting a substrate out of a relatively ductile, low wear-resistant metal and forming the working surfaces such as cutting edges, flanging surfaces, die surfaces and die inserts by depositing layers of relatively hard, wear-resistant materials to the substrate by closed-loop direct-metal deposition or laser cladding. A multi-axis numerically controlled robot may be used to position and move a beam and deposition material over large substrates in forming such tooling.

Abstract: Apparatus for thermally processing a semiconductor wafer includes an array of semiconductor laser emitters arranged in plural parallel rows extending along a slow axis, plural respective cylindrical lenses overlying respective ones of the rows of laser emitters for collimating light from the respective rows along a fast axis generally perpendicular to the slow axis, a homogenizing light pipe having an input face at a first end for receiving light from the plural cylindrical lenses and an output face at an opposite end, the light pipe comprising a pair of reflective walls extending between the input and output faces and separated from one another along the direction of the slow axis, and scanning apparatus for scanning light emitted from the homogenizing light pipe across the wafer in a scanning direction parallel to the fast axis.

Abstract: According to the present invention, a laser annealing apparatus (10) includes a beam splitter (14) composed of first and second beam splitters (21, 22) disposed in parallel to each other to split one laser beam into four laser beams not interfering with each other, and a reflecting mirror (23). Upon the second beam splitter (22), there are incident a transmitted beam from the first beam splitter (21) and a laser beam outgoing from the first beam splitter (21) and then reflected by the reflecting mirror (23). The second beam splitter (22) provides two transmitted beams to outside, and the reflecting mirror (23) reflects the reflected beam from the second beam splitter (22) for traveling to outside. The distance between the two beam splitters (21 and 22), and the distance between the first beam splitter (21) and reflecting mirror (23), is larger than L/(2 cos ?) (where ? is an incident angle and L is a coherence length).

Abstract: An object of the present invention is obtaining a semiconductor film with uniform characteristics by improving irradiation variations of the semiconductor film. The irradiation variations are generated due to scanning while irradiating with a linear laser beam of the pulse emission. At a laser crystallization step of irradiating a semiconductor film with a laser light, a continuous light emission excimer laser emission device is used as a laser light source. For example, in a method of fabricating an active matrix type liquid crystal display device, a continuous light emission excimer laser beam is irradiated to a semiconductor film, which is processed to be a linear shape, while scanning in a vertical direction to the linear direction. Therefore, more uniform crystallization can be performed because irradiation marks can be avoided by a conventional pulse laser.

Abstract: Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.

Abstract: A powder delivery system for a laser-based additive manufacturing process includes a hopper adapted to contain a powder and continuously feed the powder through an output of the hopper, a rotatable disk having a top surface that is substantially flat, the top surface adapted to receive the powder continuously fed through the output of the hopper, the top surface being disposed below the output of the hopper by a prescribed gap, and a vacuum powder removal device operable to remove the powder from the top surface via a vacuum.

Abstract: A hand-held laser welding wand includes one or more removable filler media delivery extension tips. The wand is dimensioned to be grasped with a single hand, thus filler media of various types and forms may be supplied to the weld area on a workpiece using various types of delivery systems and methods, including fully automated, semi-automated, or manually. The filler media may be wholly or partially delivered via the filler media delivery passages. One or more of the extension tips may be inserted into the filler media delivery passages to efficiently, precisely, and robustly supply filler media of various types and forms to the workpiece weld area.

Abstract: A modification of frictional state and surface condition of an electrical contact surface to reduce the insertion forces for establishment of an electrical plug connection and also to achieve protection from oxidation and fretting corrosion is provided. BY controlled melting of a contact surface that is applied onto a support material, a lubricant film applied onto the contact surface is diffused, by using a laser, substantially without modification into the liquefied contact surface and resolidified together with the latter, so that the lubricant film is incorporated into the contact surface.

Abstract: In a method and apparatus for making welded large pipes, a leading end of a hot strip is connected to a trailing end of a leader strip and then subjected to a two-stage leveling for strip flatness in transverse direction and strip flatness in longitudinal direction. The entire surface of the hot strip including strip edges thereof is inspected by ultrasound and the strip edges are prepared in four stages before being pre-bent. The hot strip is then shaped into a slotted tube and the strip edges are welded along the inner and outer sides by laser to produce the pipe. Online process diagnostic is provided for monitoring the welding step and the finished welded pipe diameter is measured through online measurement. Online determination of a profile of a welded seam configuration and computer tomographic determination and evaluation of flaws inside the pipe, as well as ultrasonic inspection of the welded seam are further provided.

Abstract: A high energy, high repetition rate workpiece surface heating method and apparatus are disclosed which may cmprise a pulsed XeF laser operating at or above 4000 Hz and producing a laser output light pulse beam at a center wavelength of about 351 nm; an optical system narrowing the laser output light pulse beam to less than 20 ?m in a short axis of the laser output light pulse beam and expanding the laser output light pulse beam to form in a long axis of the beam a workpiece covering extent of teh long axis; the optical system including a field stop intermediate the laser and the workpiece; the workpiece comprising a layer to be heated; wherein the optical system focuses the laser output light pulse beam at a field stop with a magnification sufficient to maintain an intensity profile that has sufficiently steep sidewalls to allow the field stop to maintain a sufficiently steep beam profile at the workpiece without blocking the beam profile at too high an intensity level. 2.

Abstract: A method for interconnecting flat cable is disclosed. The flat cable has a plurality of conductors attached to an insulating layer. The method includes removing an insulation layer from a first and second flat cable portions to expose the plurality of conductors, applying a thermal plate to the exposed plurality of conductors of the first flat cable portion, applying solder to first flat cable portion, placing the plurality of conductors of second flat cable portion over the plurality of conductors of first flat cable portion having applied solder, applying a transparent plate over the first and second flat cable portions, scanning a laser beam through the transparent plate to reflow the solder between the first and second flat cable portions.

Abstract: The thermal flux processing device includes a continuous wave electromagnetic radiation source, a stage, optics, and a translation mechanism. The continuous wave electromagnetic radiation source is preferably a diode/s. The stage is configured to receive a semiconductor substrate thereon. The optics are preferably disposed between the continuous wave electromagnetic radiation source and the stage. Also, the optics are configured to focus continuous wave electromagnetic radiation from the continuous wave electromagnetic radiation source into a line of continuous wave electromagnetic radiation on an upper surface of the semiconductor substrate. A length of the line of continuous wave electromagnetic radiation extends across an entire width of the semiconductor substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another, and preferably includes a chuck for securely grasping the substrate.

Abstract: A laser welding nozzle used as a working tool, a linear movement mechanism of a pressing device, and a servomotor are fixed to a bracket. A roller support frame is fixed on a moving side of the linear movement mechanism. A roller is pivotally mounted at a distal end of the roller support frame. The roller is located in the vicinity of a weld point of the laser welding nozzle. By driving the servomotor in a controlled manner, a portion in the vicinity of the weld point of a plate portion to be welded is pressed by the roller to restrain a floating of the weld portion, by which a gap between the plate portions is regulated, and thus uniform weld can be obtained. The pressing position, speed, and pressing force of roller can be controlled easily, so that the pressing device can be used for various types of workpieces.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: An object of the present invention is obtaining a semiconductor film with uniform characteristics by improving irradiation variations of the semiconductor film. The irradiation variations are generated due to scanning while irradiating with a linear laser beam of the pulse emission. At a laser crystallization step of irradiating a semiconductor film with a laser light, a continuous light emission excimer laser emission device is used as a laser light source. For example, in a method of fabricating an active matrix type liquid crystal display device, a continuous light emission excimer laser beam is irradiated to a semiconductor film, which is processed to be a linear shape, while scanning in a vertical direction to the linear direction. Therefore, more uniform crystallization can be performed because irradiation marks can be avoided by a conventional pulse laser.

Abstract: The semiconductor device according to the present invention has a semiconductor layer having not smaller than two types of crystal grains different in size within a semiconductor circuit on a same substrate.

Abstract: The present invention relates to a generative method of fabrication and an accompanying device with which components can be fabricated from a combination of materials. The device comprises a bottom surface (1) with a lowerable building platform (2), a leveling mechanism (5) for leveling a first material (4) in a processing plane (3) above the building platform (2), a laser beam source for emitting a laser beam (11), a processing unit (6) with a focusing optical system (8) for focusing the laser beam (11) onto the processing plane (3) and a positioning mechanism which can position the processing unit (6) in any desired positions in a plane parallel to the processing plane (3) above the component (14). Furthermore, the device is provided with a suction device (10) for sectioning off the material from the processing plane (3) and an introduction mechanism (9) for a second material (12) with which the latter is brought into the focal range of the laser beam (11).

Abstract: A sequential lateral solidification device, for enhancing optical characteristics of the device and for preventing damage caused by an ablation of a crystallization thin film, is disclosed. The device includes a laser light source generating a laser beam, a projection lens focusing the laser beam generated from the laser light source onto a substrate, a laser beam splitter between the projection lens and the substrate that passes the laser beam generated from the laser light source to irradiate the substrate and that blocks the laser beam reflected back from the substrate towards the projection lens, and a stage having the substrate mounted thereon.

Abstract: An expansion joint for interior or exterior use including a fire barrier comprised of a fire resistant inorganic refractory fiber fabric sheet which supports resilient fire resistant inorganic refractory fibers. The support sheet may be closed to form a sleeve. When used as an exterior expansion joint a weather resistant cover comprising a bellows or a cover plate is employed. When used in an interior application a cover plate may be employed to form a bridge over the expansion joint to provide a continuous flooring or to provide additional fire resistance. The fabric is attached to adjacent structure by mounting flanges in the form of a bifurcated clamp, and one of the fabric-engaging clamp faces may be crimped and pierced to better grip the fabric.