Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means comprising a laser beam oscillation means and a condenser having an objective lens for converging a laser beam oscillated by the laser beam oscillation means to apply it to the workpiece held on the chuck table, wherein a first lens for transmitting a laser beam oscillated by the laser beam oscillation means, a second lens for transmitting a laser beam that has passed through the first lens, and an optical path length changing means for changing the length of the optical path between the first lens and the second lens are interposed between the laser beam oscillation means and the objective lens.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A laser processing machine includes a beam splitter for splitting an incoming laser beam into a first laser beam having a first intensity and a second laser beam having a second intensity, a first focusing mirror for focusing the first laser beam onto a first laser processing site on a workpiece at an angle from a direction directly above the workpiece, a second focusing mirror for focusing the second laser beam onto second laser processing site on the workpiece at an angle from a direction directly above the workpiece, and a supplementary laser processing element for supplementing laser processing of the workpiece, wherein the supplementary laser processing element is disposed directly above the first or second laser processing site.

Abstract: A laser micro machining system includes a laser source positioned to direct a laser pulse through a scan lens to a work piece mounted on a work surface and a mirror positioned between the scan lens and the work piece and tilted with respect to the work surface to reflect the laser pulse toward the work piece. The mirror can be indexed to a number of positions so that only portions of the mirror are used for a number of processing steps, extending the life of the mirror.

Abstract: A method for producing periodic structures at the surface of a sol-gel type, hybrid organic-inorganic or organic material, characterised in that it includes the step of directly illuminating the material with a laser beam having a uniform intensity profile at near-normal incidence, while moving said material and said laser beam relative to each other.

Abstract: A laser beam hardening tool is comprised of an engagement portion for freely engaging with a tool holding portion of a machine tool, a beam guide path which is a passage of supplied laser beam, and a torch portion for radiating laser beam which passed through the beam guide path on a workpiece, thereby executing hardening with laser beam inside the machine tool by installing the laser beam hardening tool in the tool holding portion of the machine tool.

Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.

Abstract: The present invention relates to an apparatus (1) for generating a rotating laser beam (5) which may used for various applications including welding, cutting, drilling or ablation of materials. More particularly, the apparatus (1) according to the present invention is able to produce a fast rotating and accurate laser beam, because the main optical device (100) that is rotated consists of a first reflecting surface (102) rotating about an axis (X1), a second reflecting surface (26) having an annular shape, wherein the first reflecting surface (102) redirects said laser beam in to the direction of the second reflecting surface (26), which reflects said laser beam towards said axis (X1).

Abstract: Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Abstract: A process and system are provided for processing at least one section of each of a plurality of semiconductor film samples. In these process and system, the irradiation beam source is controlled to emit successive irradiation beam pulses at a predetermined repetition rate. Using such emitted beam pulses, at least one section of one of the semiconductor film samples is irradiated using a first sequential lateral solidification (“SLS”) technique and/or a first uniform small grained material (“UGS”) techniques to process the such section(s) of the first sample. Upon the completion of the processing of this section of the first sample, the beam pulses are redirected to impinge at least one section of a second sample of the semiconductor film samples. Then, using the redirected beam pulses, such section(s) of the second sample are irradiated using a second SLS technique and/or a second UGS technique to process the at least one section of the second sample.

Abstract: Processing food with a laser. In one embodiment, the system includes a laser that creates holes in a food item with an output beam, and includes a post processing module that enables a substance to pass through the holes. The substance may include a flavoring, a vitamin, a medicine, a gas, steam, and the like. The holes facilitate cooking, cleaning, flavorizing, medicating, off-gassing, eating, or the like. The laser system may also perforate or score a food item shell to ease cracking and access to interior material. The system may also include one or more mirrors, focus heads, delivery optics, beam scanners, or the like, to control output beam characteristics, such as focus and positioning. In another embodiment, a dynamic control system may add computerized-feedback and control to the laser system. A position system may also control a position, orientation, or other characteristic of a food target.

Abstract: A device for the simultaneous welding of work pieces and containing a plurality of laser light sources. The laser light sources are positioned on at least one circle in such a manner that the partial beams emitted by the laser light sources produce at least one region that lies radially further inwards. The region, in some areas, has a substantially constant luminosity and the work pieces are introduced into the region.

Abstract: A method of multi-processing an object using a polygon mirror according to an embodiment of the invention includes setting processing parameters for individual layers of an object having a multilayer structure, performing laser processing on exposed layers in a region to be processed of the object according to the processing parameters using a polygon mirror, determining whether or not all of the layers of the object having a multilayer structure are processed, and if it is determined in the determining that not all of the layers are processed, progressing the performing of laser processing. Therefore, efficiency in processing the object can be increased, and cracks that occur in the object during laser processing using a polygon mirror can be minimized.

Abstract: A laser machining method and a laser machining apparatus by which holes excelling in form accuracy can be machined efficiently are to be provided. A first cylindrical lens and/or a second cylindrical lens to correct any deformation of reflective face of a first mirror and/or a second mirror is arranged on an optical axis of a laser beam, and converging positions of the laser beam for an X-component and for a Y-component are coincident with a point on the optical axis.

Abstract: In a laser processing machine for processing workpieces using a laser beam (2), a telescope (1) for widening the laser beam (2) comprises an ellipsoidal mirror (3) and a paraboloidal mirror (4) whose axes of rotation (6) extend parallel, in particular collinear, to each other. This orientation permits precise production of the reflecting surfaces of the two mirrors through one single clamping (e.g. through diamond lathe) such that later adjustment is not required.

Abstract: Methods and apparatus for truncating an image formed with coherent radiation. The optical relay system is adapted to form a line image at the image plane. The image is truncated by a variable aperture at or near the aperture plane conjugate to the image plane, to block progressively increasing portions of an incident coherent radiation beam used to form the line image. An apodizing pupil filter having a maximum transmission or reflection in the center and a transmission or reflection profile that varies with direction corresponding to long direction of the line image is provided in the pupil plane. The apodization is designed to prevent hot-spots from forming in the truncated image and ensures a relatively smooth, flat intensity profile. Thus, one end or another of a coherent line image scanned over a substrate can be truncated during scanning without substantially changing the image intensity extending into the product area.

Abstract: A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.

Abstract: The invention provides a device for improving the efficiency of operation for aligning the optical axis of mirrors disposed in an optical path for laser transmission in a laser beam machine. The laser beam LB output from a laser oscillator of a laser beam machine is transmitted via multiple mirrors M1, M2 etc. disposed in the optical path thereof to a torch. A mirror for receiving the laser beam LB from the mirror M2 is removed and a laser beam detecting device 100 is attached in replacement thereof. The laser beam LB is passed through a cross-shape target 122, a portion of which is branched and taken as image by a laser beam detecting picture element 180. The data is sent to a personal computer 200 disposed near the mirror M2 being subjected to alignment, and displayed as image data C1. The operator operates adjusting screws 71 and 72 to change the tilt angle of the mirror M2 while watching the image data C1, so as to align the optical axis of the laser beam LB.

Abstract: A laser beam machine can make quality of machining almost constant in such a manner that a first reflecting means in a first beam guide portion is moved and driven so as to maintain a length of an optical path of laser beam to be almost constant in spite of a moved position of a machining head. According to the invention, a second reflecting means for catching laser beam in a second beam guide portion is located at a position facing the first reflecting means, thereby relatively shortening a length of the optical path between the first and second reflecting means and shortening the whole length of the optical path, and maintaining quality of machining with laser beam good.

Abstract: A reflector-mirror drive shaft controller is provided for a laser beam machine which optimizes a beam for workpiece thickness by correcting a control axis of a laser reflector-mirror of a laser beam machine. A laser beam outputted from a laser oscillator device of a laser beam machine is reflected by a reflector-mirror via an output mirror and introduced into a laser machining tool. When a machining head moves along an X axis, the reflector-mirror is moved along a U axis parallel to the X axis to keep optical path length constant. By giving an offset ? to U axis control, the incident beam diameter D to the machining lens is varied to form an optimum machining beam for workpiece thickness.

Abstract: A laser machining system is provided that includes a work-piece and at least one light source that produces a laser light along a first axis. The laser light defines a first portion of laser light and a second portion of laser light radially inward relative to the first portion. An optical element reflects the first portion of laser light at an angle relative to the first axis so that the second portion of laser light passes through the optical element along the first axis. A first optical assembly collimates the first portion of laser light into a first cross-sectional area on the work-piece at a sufficient power density to machine the work-piece.

Abstract: A glass substrate is irradiated with a converged laser beam to thereby form a spherical or nearly spherical convex portion on a surface of the glass substrate. More preferably, there may be used a method including the steps of: sticking a glass substrate to a flat member having a predetermined spherical or aspherical concave portion formed therein; and irradiating a converged laser beam onto a surface of the glass substrate just under the concave portion while making the converged laser beam penetrate through the flat member to thereby form a spherical or aspherical convex portion in the inside of the concave portion in accordance with the shape of the concave portion.

Abstract: A system for delivering energy to a substrate includes a laser energy source providing at least two laser beams, wherein each of the beams is steered to an independently selectable location on a target, and is independently focused onto the target.

Abstract: A novel apparatus for heat treating semiconductor wafers includes a heating device which comprises an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. The tuning devices adjust the overall irradiance distribution of the light energy sources. The tuning devices can either be active sources of light energy or passive sources which reflect, refract, or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Abstract: Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence of the light energy contacting the wafer, using multiple wavelengths of light, and configuring the light energy such that it contacts the wafer in a particular polarized state. In one embodiment, the light energy can be emitted by a laser that is scanned over the surface of the wafer.

Abstract: The invention is an apparatus and a method for drilling holes in a work piece with a laser. A laser beam is received by the optical system and directed along an optical path. The system directs the laser beam through a moveable mask aperture creating a sub-beam, that is reduced in size by a lens system as it is imaged onto a work piece. Multiple features are formed in the work piece by moving the mask.

Abstract: A system for shaping an optical fiber with various geometries while minimizing unwanted artifacts in the core of the optical fiber. The system facilitates control of sag in the region of the core that is exposed to a beam of optical energy. The sag is reduced, if not eliminated, by maintaining the cross-sectional area of the core that is exposed to the beam at thermal equilibrium.

Abstract: A control system (102) operates within a dynamic range, and a follow-up system (104) is commanded to reduce a positional error between the follow-up system and the control system when the dynamic range is exceeded. A linear follow-up command may be initially provided once a dead band value (208) is exceeded. The follow-up system (104) is driven relative to its base mount (103) in a direction to reduce the positional error to within a null value range (214). The follow-up command may also implement a decay function to control the follow-up system (104). A control variable transfer function may also be utilized to gradually subtract the dead band value from the follow-up system position error command as a function of time. The decaying function may include linear as well as non-linear decaying functions. In one embodiment, a figure eight-type hysteresis control function may be implemented to control the inertial position of an inertial element.

Abstract: A device with at least one light source, comprising several individual light sources (3, 3?) and an optical arrangement. At least two individual light sources (3, 3?) comprise a light-emitting surface with different, long axes perpendicular to each other. At least two individual light sources (3, 3?) form at least one individual light source grouping (4, 4?), which is arranged coaxially to the optical axis (5) of an astigmatic optical element (7). Said astigmatic optical element (7) is impinged upon by the emitted bundles (2) from the individual light sources. One axis of the emission surface of an individual light source (3) lies on the meridional plane of the astigmatic optical element (7). Said plane is defined through the mid-point of the emission surface. The other axis of the emission surface lies on the corresponding sagittal plane.

Abstract: A robot is obtained having various functions that are demanded for planetary landing vehicles, extreme operations robots or the like, in particular to provide a leg structure for a robot that is capable of getting up itself when overturned, facilitating take-off and landing on uneven ground, and that has a walking function and that has a hand function capable of three-dimensional operation. A robot comprises a main robot body and at least three legs mounted on this main body for enabling three-dimensional movement of the main robot body such as a self-erecting action or walking action; each leg is constituted by a multi-joint arm having a plurality of said offset rotary joints linked together and has a ground-engaging member mounted at the leading end of the arm, so that each leg is capable of independently controlled three-dimensional movement and drive.

Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F? lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F? lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F? lens, and an object is set to be not more than 0.08.

Abstract: A buckling arm robot for machining workpieces with laser radiation has at least a first axis, a second axis, a third axis, a fourth axis, and a fifth axis. A laser device is arranged in the second axis and configured to emit a laser beam. The laser beam emitted by the laser device is guided within the third, fourth, and fifth axes before striking a workpiece to be machined.

Abstract: A laser material processing apparatus for processing a workpiece (22) in such a way as to separate one laser light (26) into two laser beams (26a, 26b) via first polarizing means (25), one laser beam being passed via the mirrors (24), the other laser beam being scanned biaxially by a first galvano scanner (29), and conduct two laser beams (26a, 26b) to second polarizing means (27) for scanning via a second galvano scanner (30), wherein an optical path is constituted such that the laser beam (26b) transmitted through the first polarizing means (25) is reflected by the second polarizing means (27), and the laser beam (26a) reflected by the first polarizing means (25) is transmitted through the second polarizing means (27).

Abstract: A system for laser processing a work piece surface with a laser processing beam includes a processing beam delivery source (205) optics (210, 230) for focusing the processing beam at a surface of the work piece, a viewing camera (250) configured coaxially and coincidently focused with the processing beam (207) at beam impinge point (245) on the work piece (100). The system further includes a computer (510) and processor (512) for displaying an image of the work piece (100) and a cursor (600) superimposed thereon on a monitor (560). One or more movable mirrors (320, 325) are provided movably mounted on galvanometers (335, 340) controlled by the processor (512) to direct the processing beam to selected points on the work surface for processing, (e.g. by laser spot welding). The system further includes an input device such as a mouse (520) for positioning a movable cursor (600) on image points of the work piece image and for selecting the image point for laser processing.

Abstract: A laser cutting or welding device, the device having a laser head (10) and a robot (35), wherein the laser head is attached to the robot (35). The laser head (10) has a housing (12), a focal lens (26) disposed within the housing and a light source (18) in optical communication with the focal lens (26). The housing (12) has a nozzle with a tip (90), the tip having an exit port (17). The laser head (10) has means (33) for adjusting a light path of a light beam directed from the light source onto a focal optic to center a focusing beam formed by the focal optic coaxial with the tip. In one aspect hereof, the laser device has a crash avoidance system.

Abstract: To drill holes in an electric circuit substrate with the help of a laser beam, the drilling being performed by a circular motion of the laser beam within the area of the intended drill hole, the movement of the laser beam is created via two in-line deflection units. The first deflection unit, which preferably contains galvomirrors, triggers the jump of the laser beam from a drill position to the respective next drill position and the centering within the respective drill position. The second deflection unit, which preferable contains piezoelements, modulates a continuous circular motion onto the laser beam. In doing so the laser is only turned on if the first deflection unit is at a standstill.

Abstract: A laser machining system is provided that includes a work-piece and at least one light source that produces a laser light along a first axis. The laser light defines a first portion of laser light and a second portion of laser light radially inward relative to the first portion. An optical element reflects the first portion of laser light at an angle relative to the first axis so that the second portion of laser light passes through the optical element along the first axis. A first optical assembly collimates the first portion of laser light into a first cross-sectional area on the work-piece at a sufficient power density to machine the work-piece.

Abstract: The invention concerns a method for overlapping welding of two coated metal sheets (1, 2) with a beam of high energy density (11), characterized in that it consists in splitting the beam (11) into a first sub-beam (12) passing through both coated metal sheets (1, 2) and forming in said zone a first molten metal bath (18) and into a non-through second sub-beam (13) forming a second molten metal bath (19) whereof the depth is less than the thickness of the upper coated metal sheet (1) and overlapping at least part of the first molten metal bath (18) for promoting evacuation of vapour from the coating material and directing on the second molten metal bath (19) a neutral gas jet with high ejection speed to form at the surface of the second molten metal bath a sink (22).

Abstract: A laser process system with multiple, independently steerable laser beamlets and including a laser and beam shaper for generating a shaped source beam, a splitter stage for generating a plurality of beamlets from the shaped source beam, a beamlet controller including an independently steerable beamlet steering mirror for and corresponding to each beamlet for independently directing the corresponding beamlet, a mirror controller for controlling each beamlet steering mirror, and an optical path including a scanning lens for directing each steered beamlet to a target area of a workpiece. Each beamlet steering mirror is a multi-axis micro-electro-mechanical mirror and the system further includes a beam dump located in the optical path for intercepting a beamlet steered into the beam dump by the corresponding beamlet steering mirror.

Abstract: A plurality of feedthrough holes are efficiently formed on the present invention by splitting a laser beam emitted from a laser source into plural laser beams by allowing the beam to pass through a diffraction grating, followed by simultaneously forming a plurality of the feedthrough holes on the ceramic green sheet by irradiating the ceramic green sheet with the split laser beam.

Abstract: Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Abstract: A laser processing apparatus is capable of making an axis of a processed hole vertical and providing flexibility for a location of deflecting means by positioning a laser beam output from a laser oscillator at a designed deflection point of an f&thgr; lens. An optical correction system is provided between a first mirror which is freely rotatable around an axis M, and a second mirror which is freely rotatable around an axis N, so that the laser beam deflected by the first mirror is applied to a center of the second mirror. The correction optical system comprises, for example, two convex lenses having a focal length of f1, the distance between centers of the convex lenses being set to 2f1. The distance between centers of the first and second mirrors is set to 4f1.

Abstract: A method for manufacturing an ink jet recording head, which is provided with a first base plate having energy generating elements, a second base plate having grooves for forming ink flow paths corresponding to the energy generating elements, and a discharge port forming member for forming discharge ports for discharging ink. The method includes the steps of forming the discharge ports by irradiating the discharge port forming member with laser light reflected from the groove wall faces, and direct laser light, and forming the flow paths by bonding the base plate and the second base plate with the grooves inside.

Abstract: For crystallizing an amorphous semiconductor film by means of irradiation of laser beams, a top surface and a back surface of the amorphous semiconductor film are irradiated with the laser beams. In this case, an effective energy intensity Io of the laser beams to be applied onto the top surface and an effective energy intensity Io′ of the laser beams to be applied onto the back surface satisfy the relationship of 0<Io′/Io<1 or 1<Io′/Io. Thus, a laser annealing method capable of providing a crystalline semiconductor film with large grain diameters can be provided.

Abstract: A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Abstract: A tertiary positioner system (80) of this invention employs X- and Y-axis translation stages (86, 88), galvanometer-driven mirrors (64, 66), and a fast steering mirror (“FSM”) (120) to direct a laser beam (90) to target locations (121) on a workpiece (92). A positioning signal is received by a low-pass filter (103) that produces filtered position data for driving the X- and Y-axis translation stages. The actual positions of the X- and Y-axis translation stages are subtracted from the unfiltered positioning data to produce an X-Y position error signal for driving the galvanometer-driven X- and Y-axis mirrors. The actual mirror positions are subtracted from the actual positions of the X- and Y-axis translation stages to generate a positional error signal representing the difference between the commanded and actual positions of the laser beam. The positional error signal drives the FSM to rapidly correct any positional errors.

Abstract: A maskless patterning apparatus allows for laser beam ablation of one or more layers of material while not etching an underlying different material layer. A micromirror array produces the desired complex pattern on the workpiece and a continuous feature and end point detection system provides location and material parameter changes to accurately control the pattern position and depth of etching. End point detection includes monitoring energy reflected from a specially prepared replica of the material to be ablated, whose thickness and consistency match the active workpiece area. The process terminates when the proper amount of material is removed.

Abstract: Cells of a liquid crystal device are switched between transparent and dark states or, alternatively, reflectors of a microelectromechanical system are switched between tilted states, to form a marking pattern and control the transmission of a laser beam to an object to be marked.

Abstract: There is provided a system and method for ablating a surface of a work-piece comprising a radiation source for providing an ablating beam and a plurality of adjustable reflective masks having predetermined mask patterns thereon. The reflective masks are sequentially positioned relative to said radiation source and in the path of said ablating beam for reflecting said ablating beam onto the surface of the work-piece to ablate the work-piece.

Abstract: A laser machining device is capable of simultaneously machining two- or three dimentional patterns on the surface of a workpiece. A micromirror array positioned within a laser cavity generates a patterned plurality of laser beamlets which can be homogenized and deflected by a second micromirror array onto the surface of a workpiece to create a two-dimensional pattern. Alternatively, the second micromirror array can deflect laser beamlets of unequal energy density to produce a three-dimensional pattern.