Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A non-contact glass shearing device and a method are described herein that vertically scribes or cuts a downward moving glass sheet to remove outer edges (beads) from the downward moving glass sheet. In addition, the non-contact glass shearing device and method can horizontally scribe or cut the downward moving glass sheet (without the outer edges) so that it can be separated into distinct glass sheets.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A machine for the surface treatment of a cylinder includes a first operative station for supporting the cylinder and for bringing it into rotation around its longitudinal axis, and at least a second operative station cooperating with the first station for generating and emitting, by means of an optical fiber apparatus, pulsed laser radiations randomly striking the surface of the cylinder and defining a desired roughness on the same surface; the second station being adjustably coupled with the first station in a first direction parallel with respect to the axis of the cylinder and carrying one or more pulsed laser radiation emitting heads, and slidingly assembled with respect to the cylinder in a second direction perpendicular to the axis of the cylinder.

Abstract: An apparatus forms a sheet into a beam having four exterior walls and a common center leg extending between an opposing two of the walls. The apparatus includes a roll former forming the sheet into the beam cross section, a welding station with top and bottom laser welders, and a weld box fixture having inwardly-biased external mandrels (biased by actuators) and outwardly-biased internal split mandrels (biased by springs) that interact to hold a desired shape of the beam in the weld fixture, and also includes a sweeping unit and cutoff device. By this arrangement, the internal and external mandrels, in combination with a bias of the actuators and springs, control a shape of the beam by flexure and movement of material of the sheet when in the weld box fixture during a welding process of the welder.

Abstract: A system and method are provided for marking valuable articles, particularly precious stones and here in particular cut diamonds (brilliants) and uncut diamonds. An identification marking that is invisible to the naked eye is applied to the article, and data associated with the identification marking is stored for subsequent use in determining the authenticity of the marking. The marking is applied by irradiating a surface of the article with laser light having a wavelength of less than 400 nm and applying ultrasonic oscillations during laser irradiation. A further laser light having a wavelength of more than 500 nm may also be applied to the surface. At least two interference images are generated using at least two different sounding radiation wavelengths for storage, along with an incidence angle of the sounding radiation. The stored data may subsequently be compared to authenticity-checking interference images to determine the authenticity of the identification marking.

Abstract: The invention discloses a method and a device of improving crystallization ratio of polysilicon, which is applied to the process that the amorphous silicon layer converts into the polysilicon layer. More specifically, superposing at least two pulse laser beams into a superposed pulse laser beam. The pulse width of the superposed pulse laser beam is larger than each pulse laser beam. Next, utilizing the superposed pulse laser beam to irradiate onto the amorphous silicon layer for transforming the amorphous silicon layer into polysilicon layer. The superposed pulse laser beam irradiates onto the surface of the amorphous silicon layer. The amorphous silicon layer is transformed into the polysilicon layer. Consequently, the crystallization ratio of polysilicon is improved.

Abstract: An laser machining device for laser forming netted dots uses a metal grating to divide a polarized laser beam or an unpolarized laser beam into a penetrating laser beam and a reflected laser beam, and the cooperation of fixed reflecting mirrors and rotatable reflecting mirrors guides the penetrating laser beam and the reflected laser beam onto two or more predetermined positions on a workpiece.

Abstract: An apparatus for manufacturing includes: a build chamber including a build platform; a material dispenser configured to distribute a layer of powdered material over the build platform; a mirror arranged over the build platform and defining a mirrored planar surface; a first laser output optic configured to output a first energy beam toward the mirror; a second laser output optic adjacent the first laser output optic and configured to output a second energy beam toward the mirror; a first actuator configured to maneuver the first laser output optic and the second laser output optic relative to the build platform; a lens arranged between the mirror and the build platform; and a second actuator configured to maneuver the mirror to scan the first and second energy beams across the lens, the lens outputting the first energy beam and the second energy beam toward and substantially normal to the build platform.

Abstract: In removal processing using a pulsed laser beam, processing deviation occurs in the depthwise direction to cause a processing error in a predetermined removal shape. A first pulsed laser beam L1 is a pulsed laser beam having a wavelength that exhibits transmittance to a workpiece 6, and a second pulsed laser beam L2 is a pulsed laser beam having a wavelength that exhibits absorption to the workpiece 6. The first pulsed laser beam L1 is focused into the workpiece 6, and a focal point P1 of the first pulsed laser beam L1 is scanned along the outline of a predetermined removal region R1 to form a modified portion 6A along the outline of the predetermined removal region R1. Next, removal processing is performed by scanning the second pulsed laser beam L2 in a region enclosed by the modified portion 6A.

Abstract: A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam.

Abstract: A laser beam irradiation apparatus irradiates a laser beam onto a sealing unit disposed between a first substrate and a second substrate so as to seal the first substrate and the second substrate. A center portion of the laser beam comprises a first beam profile having a beam intensity which increases toward a beam center portion, and a center of each of a plurality of peripheral portions of the laser beam is included in an area onto which the first beam profile is irradiated. The plurality of peripheral portions are symmetrically distributed around the first beam profile, and comprise a plurality of second beam profiles having the same beam intensities. The first beam profile and the plurality of second beam profiles are symmetrically distributed around a center point of the first beam profile and move in synchronization with one another.

Abstract: An apparatus for fabricating patterns using a laser diode is presented. The apparatus includes at least one laser diode, at least one lens and a mask having at least one pin hole, wherein light emitted from the laser diode is emitted through the lens and the pin hole to be focused on a first material layer.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: A laser welding head capable of producing a plurality of beams that are proficient in providing a unique keyhole. The welding head is movable through a plurality of positions relative to substrates that enables the plurality of beams to engage the substrates in a manner that welds the substrates in a variety of stack-up positions. A welding method using the welding head is also provided.

Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam.

Abstract: In a method for scribing fragile material, a laser beam is irradiated onto a work plate of the fragile material. The work plate is heated by absorption of the irradiated laser beam and generating thermal stress by the heating. The laser beam is formed by a plurality of laser beam groups arranged along a beam scanning direction on a same line, and the plurality of laser beam groups are divided into two groups. One takes charge of initial heating and rising up temperature of the work plate, and another takes charge of temperature holding of the work plate. The laser beam intensity corresponding to each of the laser beam groups is adjusted so as to obtain optimum values. By the method, it is possible to remarkably increase scribing speed of the work plate of the fragile materials without increasing heating temperature.

Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.

Abstract: A device for accurately positioning laser scribed lines in a thin top layer of material with respect to lines already scribed in lower layers for the purpose of making solar panels. An alignment detector system is attached to and displaced from an optics unit that generates laser beams by a distance such that the detector measures the position of scribed lines in the lower layers in the area of the panel that will be scribed at a subsequent time. A motion and control system moves the panel such that the detector follows the path of one or more of the lines scribed in one of the lower layers and measures the position of the lines. The system accepts data from the alignment detector and uses the data to correct the relative position of the optics unit.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

Abstract: A switchable compound laser working machine comprises a machine body, a first output module, a second output module, a switch module, and a control module. The first and second output modules are respectively provided with a laser tube. The switch module has at least one lens. It is able to change the output direction of laser beams by moving the lens. The control module is used for controlling the laser tubes of the first and second output modules to perform output operation respectively and used for moving the lens of the switch module into output pathway of the laser beams from the first or the second output module to alter the output direction of the laser beams.

Abstract: A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material.

Abstract: A roll former for forming a sheet into a continuous multi-tubular reinforcement beam. The roll former includes a first set of rollers that are configured to bend the sheet to form a common center wall in generally perpendicular orientation relative to first and second lateral portions of the sheet that extend in opposing directions from respective first and second radiused ends of the common center wall. The first set of rollers also form radiused edges on the first and second lateral portions. A second set of rollers is configured to form a channel rib longitudinally along each of the first and second lateral portions. A third set of rollers is configured to bend the first and second lateral portions simultaneously and equally to abut the first and second radiused edges with the respective first and second radiused ends of the common center wall to define adjacent tubes of the beam.

Abstract: A system for processing a multi-device panel, comprising a substrate having front and rear surfaces, a first array of device regions located on the front surface and a second array of device regions on the rear surface, by vector direct-write laser ablation, comprising a first processing station comprising a pair of opposedly-mounted processing heads, each processing head comprising a laser beam delivery apparatus comprising a laser beam scanner and a lens unit, and a distance measurement device, mounting device for mounting the panel between the processing heads of the first processing station such that the relative position of the panel and the first processing station can be adjusted so that the processing heads are brought into alignment with selected front-surface and rear-surface device regions to be processed, wherein each processing head is operable to make an estimate of the distance between the lens unit and the surface of the device region to be processed using the distance measurement device, cont

Abstract: Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.

Abstract: The present invention is characterized in that by laser beam being slantly incident to the convex lens, an aberration such as astigmatism or the like is occurred, and the shape of the laser beam is made linear on the irradiation surface or in its neighborhood. Since the present invention has a very simple configuration, the optical adjustment is easier, and the device becomes compact in size. Furthermore, since the beam is slantly incident with respect to the irradiated body, the return beam can be prevented.

Abstract: [Object] To provide a laser processing apparatus and a laser processing method which are capable of reducing roughness of a cut surface in laser cutting using laser beams transmitted through optical fibers. [Solution] A laser processing apparatus according to the present invention includes at least one laser oscillator configured to emit laser beams, a plurality of optical fibers configured to transmit the emitted laser beams, and at least one optical element configured to focus the laser beams emitted from the optical fibers and irradiate a surface of a workpiece with the focused laser beams. At output ends of the optical fibers, the output ends of the plurality of optical fibers are placed in one or a plurality of ring shapes.

Abstract: An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: Methods and systems for forming a scribe line in a thin film stack on an inner surface of a thin film photovoltaic superstrate are provided via the use of a cleaning laser beam and a scribing laser beam. The cleaning laser beam is focused directly onto the exposed surface of the superstrate such that the cleaning laser beam removes debris from the exposed surface of the superstrate, and the scribing laser beam is focused through the exposed surface of the superstrate and onto the thin film stack such that the scribing laser beam passes through the superstrate to form a scribe within the thin film stack on the inner surface of the superstrate. The method and system can further utilize a conveyor to transport the superstrate in a machine direction to move the superstrate past the cleaning laser source and the scribing laser source.

Abstract: There is provided a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece, the precision-machining means being equipped with a replaceable cutting tool selected from the group consisting of a planar tool, a shaper tool, a fly-cutting tool, a diamond-turning tool and a micro-milling tool; a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means; and a control means for controlling the electromagnetic-wave-machining means or the precision-machining means, based on information on the shape of the workpiece, the shape being measured by the shape-measuring means.

Abstract: An integrated laser material processing cell allowing laser-assisted machining to be used in conjunction with directed material deposition in a single setup, achieving greater geometric accuracy and better surface finish than currently possible in existing laser freeform fabrication techniques. The integration of these two processes takes advantage of their common use of laser beam heat to process materials. The cell involves a multi-axis laser-assisted milling machine having a work spindle, a laser emitter, and means for positioning the emitter with respect to the spindle so as to direct a laser beam onto a localized area of a workpiece in proximity to a cutting tool mounted in the spindle. A powder delivery nozzle mounted on the machine and positioned adjacent to the emitter delivers powder to a deposition zone in the path of the beam, such that material deposition and laser-assisted milling may be performed substantially simultaneously in a single workspace.

Abstract: A first laser beam is radiated to a first radiation position of a welding object while intersecting a wire, and a second laser beam is radiated to a second radiation position that is spaced a predetermined distance from a target position of the wire. Arc welding is performed between the wire and the welding object while radiating the first laser beam and the second laser beam such that the first radiation position, the second radiation position, and the target position are disposed on a welding line of the welding object. In this way, it is possible to prevent the generation of spatter and perform welding at a high rate, without increasing the size of a molten pool.

Abstract: The invention relates to a method of ablating a surface layer of a wall by sweeping the said layer, comprising: a step of directional control by an optical deflector of a plurality of pulsed laser beams; a step of ablating the layer on impact zones created by the plurality of laser beams, each impact zone being defined by a centre and by a characteristic dimension; the method is characterized in that the impact zones are disjoint, the distance between each centre of the impact zones being equal to at least ten times the largest characteristic dimension of the impact zones. The invention also relates to a corresponding device.

Abstract: An optical device includes: a beam splitter by which a laser beam emitted from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. An energy source for the optical system is typically a plurality of lasers, which are combined to form the energy field.

Abstract: A hybrid welding apparatus, and a system and method for welding at least two adjacent components having a large gap of approximately 3.0 millimeters that results in a full-penetration weld is provided. The welding system includes a hybrid welder having a defocused laser beam, an electric arc welder, and at least one bridge piece adjacent to one or more of the at least two adjacent components. The defocused laser beam and the electric arc welder are arranged and disposed to direct energy onto the at least two adjacent components to create a common molten pool operable to provide a full penetration weld to bridge the gap at a high constant weld speed, thereby joining the two adjacent components with a weld.

Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.

Abstract: In the present invention, each laser light emitted from a plurality of lasers is divided, and laser light including at least one laser light that is emitted from a different laser and that has different energy distribution is synthesized with another such laser light, or laser light including at least one laser light that has different energy distribution is synthesized with another such laser light through a convex lens that is set at an angle to the direction each laser light travels, to form laser light having excellent uniformity in energy distribution.

Abstract: A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.

Abstract: A fusion welding method includes the steps of: generating a hybrid laser beam obtained by mixing a low-intensity laser beam with a first high-intensity laser beam and a second high-intensity laser beam; moving the hybrid laser beam along a gap between a first member and a second member; and melting the first member and the second member in the periphery of the gap with the hybrid laser beam, and filling the gap with the melt of the first member and the melt of the second member to weld the first member and the second member, wherein the first high-intensity laser beam is applied to the area of the first member to which the low-intensity laser beam is applied, and the second high-intensity laser beam is applied to the area of the second member to which the low-intensity laser beam is applied.

Abstract: Embodiments of the present invention relate to methods and apparatus for control of laser devices and safety features related to utilization of laser devices in substrate processing systems. In one embodiment, a system for processing a substrate is provided. The system includes a chamber having a processing volume, a first laser device to emit a beam at a first wavelength into the processing volume, and a second laser device to emit a beam at a second wavelength into the processing volume, wherein the second wavelength is different than the first wavelength, and the second laser device comprises a filter adapted to attenuate one or both of the first wavelength and the second wavelength.

Abstract: An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: Disclosed herein is an irradiation apparatus including: laser light source; a polarization splitting section configured to split laser light emitted from the laser light source into first linearly polarized light and second linearly polarized light different in polarization direction; a light beam dividing section configured to divide the first or second linearly polarized light into a plurality of light beams; a quarter-wave plate array composed of a plurality of first quarter-wave plates for converting some of the light beams into right circularly polarized light and a plurality of second quarter-wave plates for converting the other of the light beams into left circularly polarized light, the first quarter-wave plates and the second quarter-wave plates being alternately arranged in a first direction perpendicular to an optical axis; and a projection optical system for condensing the right circularly polarized light and the left circularly polarized light toward a work surface to be irradiated.