Abstract: The invention relates to a method for manufacturing a surface-alloyed cylindrical, partly cylindrical or hollow cylindrical structural member where in the zone of incidence of the energy beam there is formed a locally bounded melting bath with a heating and melting front, a solution zone and a solidification front. At the side of the energy beam the hard material powder is deposited via a conveyor device in the direction of gravity and is supplied co-ordinated with the feed movement of the workpiece in a width which corresponds to the width of the linear focus and a layer height of 0.3-3 mm is thereby produced. The hard-material powder supplied to the workpiece surface in the heating front of the melting bath is heated by an energy beam at a wavelength of 780-940 nm and in contact with the liquefied matrix alloy the powder is immediately dissolved in the melting bath.

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Abstract: A device-forming region where a semiconductor device is formed is arranged on a substrate in the matrix of 2×2. A linear laser beam has a cross-section having a length longer than the width of the device-forming region. When the irradiation of the laser beam is performed, the region irradiated with the end portions of the linear laser beams overlapped with each other or brought into contact with each other, is made positioned outside the device-forming region.

Abstract: Laser beam positioners (300, 340) employ a steering mirror (236, 306) that performs small-angle deflection of a laser beam (270) to compensate for cross-axis (110) settling errors of a positioner stage (302). A two-axis mirror is preferred because either axis of the positioner stages may be used for performing work. In one embodiment, the steering mirror is used for error correction only without necessarily requiring coordination with the positioner stage position commands. A fast steering mirror employing a flexure mechanism and piezoelectric actuators to tip and tilt the mirror is preferred in semiconductor link processing (“SLP”) applications. This invention compensates for cross-axis settling time, resulting in increased SLP system throughput and accuracy while simplifying complexity of the positioner stages because the steering mirror corrections relax the positioner stage servo driving requirements.

Abstract: A glass cutting apparatus includes a positioning unit that positions a laser beam along a virtual line on a glass to be cut. A laser beam unit irradiates a laser beam onto the glass along the virtual line. The virtual line is divided into at least two portions and at least one of the two portions is divided into a plurality of sub-portions. The energy of the laser beam is maintained constant in each of the plurality of sub-portions. A related glass cutting method is also disclosed.

Abstract: Because of extreme hardness, diamonds have a number of important industrial application. Generally experts work on it. Marking is done by experts after examining each rough diamond to decide how it should be cut to yield the greatest value. But in this process, there can be lots of wastage as it is only an image of the stone in the mind of the person. The present invention comprises Laser planner which scans each and every point of diamond by rotating it 360° and thus gives individual coordinate of that diamond. It shows us the wire frame image on the computer monitor is a machine to scan the stone and to plan and mark for the best-fit diamond from that stone. All the data of the diamond is stored in the computer. It is material saving, time saving, mass processing increase in productivity.

Abstract: During laser beam welding a so-called end crater forms at the end of the weld seam. The end crater is formed by the volume shrinkage of the solidifying melt after the laser beam reaches the seam end and is switched off or repositioned. The end crater acts as a geometric notch and decreases the mechanical characteristics, in particular the operational stability, of the weld seam so that holes or tears in the area of the end crater can occur. The task of the present invention is thus comprised of providing a process for reducing end crater formation. The task is solved in that towards the seam end the focus of the laser beam is distanced from the surface to be welded and/or a transverse movement of the beam occurs.

Abstract: A method for printing on a material is disclosed. The method includes providing a printing system having a laser source for producing a printing beam and directing the printing beam to a plurality of locations on a material. The method also includes adjusting a dwell time of the printing beam at the one or more locations so as to form a spot at each location.

Abstract: In a laser processing apparatus including a laser oscillator for emitting laser light onto a workpiece through an f&thgr; lens for drilling a hole in the workpiece, a wavelength selector for passing only a light ray having a specific wavelength is disposed between the laser oscillator and the workpiece.

Abstract: A laser annealing apparatus for fabricating a thin film semiconductor device integratedly formed with thin film transistors each of which includes a semiconducting thin film formed on the surface of an insulating substrate spread in longitudinal and lateral directions and then crystallized. A band-shaped pulsed laser beam irradiates the insulating substrate along the longitudinal direction. The laser beam is simultaneously moved in the lateral direction with a specific movement pitch while partially overlapping regions irradiated with the laser beam. The movement pitch of the laser beam is set at a value equal to an arrangement pitch of the thin film transistors or at a value larger by a factor of an integer than the arrangement pitch. The insulating substrate is previously positioned such that the boundaries of the partially overlapped irradiated regions are not overlapped on a channel region of any of the thin film transistors.

Abstract: A method and apparatus for directly forming periodic structures on a substrate by laser irradiation comprises directing a linearly polarized laser beam onto a first location of the substrate; irradiating the substrate for a sustained duration using the linearly polarized laser beam for melting the substrate at the first location to induce a surface wave thereon; the melted substrate having a plurality of ridges corresponding to the wavelengths of the surface wave. The linearly polarized laser beam scans the substrate along a first path to propagate the surface wave on the substrate; and thereafter, substrate is cooled down following scanning of the linearly polarized laser for solidifying the plurality of ridges to form a first group of periodic structure on the substrate. Periodic structures formed according to the invention may be optical gratings such as diffraction or reflective gratings.

Abstract: A laser process in which stripe formation due to laser annealing is prevented and uniform laser annealing is made over the whole surface of a substrate. A laser beam having an energy distribution with an edge which has a nearly vertical shape l used, and when scanning of the laser beam is carried out, the scanning is carried out while the edge having the nearly vertical shape is made the front of the scanning.

Abstract: The present invention is directed to a system for marking objects for their identification which marks survive elevated temperatures of, say, up to 600° to 800° F. or higher, for extended periods of time. The inventive system for marking workpieces for their identification includes a laser that emits a beam select band of radiation and a coating system for application to a workpiece to be marked. The coating system includes two coats of paint, a topcoat and a basecoat which paints have been coated sequentially on the workpiece. The basecoat is an at least partially-cured, laser-blackenable paint which has been marked with fragile product identification indicia by the laser beam, after which a clear topcoat has been applied thereover. The laser generates fragile product identification indicia on the workpiece by its beam being directed onto the basecoat for its blackening to generate the fragile product identification indicia by the selective charring of said basecoat.

Abstract: Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Abstract: A laser scanning method and system for marking articles is provided wherein control is provided by a single central controller. The system includes a conveyor for conveying the articles in a first direction at a marking station. A conveyor controller controls the conveyor in response to conveyor control signals. A laser and an optical subsystem are optically coupled to the laser for generating a focused laser beam in response to laser control signals. A scan head includes a laser beam deflector for steering the focused laser beam along two substantially orthogonal intersecting axes at the marking station to mark a first predetermined region on at least one of the articles in response to deflection control signals.

Abstract: Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.

Abstract: A laser-based cleaning system for cleaning generator and turbine parts. In one aspect, the invention includes a system for cleaning blades of a turbine rotor assembly, comprising: a laser positioned remotely from the turbine rotor assembly for generating a laser signal; a laser workhead that receives the laser signal via an optical fiber, wherein the laser workhead is positionable proximate a blade in the turbine rotor assembly and can deliver a laser beam onto a surface of the blade to cause a cleaning of the blade; and a vacuum system for vacuuming debris created by the cleaning.

Abstract: The transmissivity of an f&thgr; lens which is used as a means for converging laser light differs in the center and in the edge thereof. As a result, when the f&thgr; lens is used as it is with the purpose of crystallizing by laser irradiation, energy distribution of the laser light which is irradiated on the semiconductor film is not uniform so that the whole surface of the semiconductor film could not be irradiated uniformly. Therefore, the present invention provides a laser irradiation apparatus including a galvanometer mirror and an f&thgr; lens that can offset the change of the energy due to the change of transmissivity of the f&thgr; lens and can scan the laser light while controlling the change of the energy on the object to be irradiated. Moreover, the invention provides a manufacturing method of a semiconductor device including the laser irradiation apparatus described above.

Abstract: A polycrystalline thin film of good quality is obtained by improving a crystallization process of a semiconductor thin film using laser light. After conducting a film forming step of forming a non-single crystal semiconductor thin film on a surface of a substrate, an annealing step is conducted by irradiating with laser light to convert the non-single crystal semiconductor thin film to a polycrystalline material. The annealing step is conducted by changing and adjusting the cross sectional shape of the laser light to a prescribed region. The semiconductor thin film is irradiated once or more with a pulse of laser light having an emission time width from upstand to downfall of 50 ns or more and having a constant cross sectional area, so as to convert the semiconductor thin film contained in an irradiated region corresponding to the cross sectional area to a polycrystalline material at a time. At this time, the energy intensity of laser light from upstand to downfall is controlled to apply a desired change.

Abstract: An ablatable laminar imaging medium useful in the manufacture of a substantially transparent electrode assembly is disclosed. The laminar imaging medium comprises a substrate, a high-index metal oxide layer, an ablatable metallic conductive layer, a high-index conductive metal oxide layer, and an ablation enhancement layer. The ablation enhancement layer has an IR-absorption greater than the IR-absorption of said high-index conductive metal oxide layer and an IR-reflectivity less than the IR-reflectivity of said high-index conductive metal oxide layer. Presence in the laminar imaging medium of the ablation enhancement layer lowers the exposure threshold of the medium and improves ablation accuracy, both—when occasioned in the manufacture of LCD electrode patterns—resulting collectively and ultimately in a more reliably formed electrical architecture, less susceptible to unwanted “shorting”.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 &mgr;m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths.

Abstract: A computer-controlled apparatus and method for fabricating three-dimensional articles in layerwise fashion is disclosed. Upon dispensing a layer of a fusible powder, a laser irradiates selected locations of that layer to fuse the powder into a cross-section of the article to be formed in that layer, such that the fused cross-sections fuse together into the article. The laser is controlled in a raster scan fashion across the selected locations of the powder layer. The raster scan lines are defined, for each cross-section, to achieve an optimal fill scan time. The optimal fill scan time is determined, by the computer estimating the fill scan time by rotating the cross-section over a plurality of rotational angles, and estimating the fill scan time for each of the rotated cross-sections for at least a sample of the fill scans necessary to form the article.

Abstract: A galvanometer controller capable of control with stability and with immunity to changes with time and variation in environment temperature and having improved operability and expandability, and a laser machining apparatus having the galvanometer controller. The galvanometer controller comprises a correcting arrangement formed in a digital circuit, the correcting arrangement having a distortion correction section for correcting a working distortion of an optical unit including a lens, an orthogonality correction section for correcting the orthogonality between the two axes of the galvanometer, and a linearity correction section for correcting the linearity on each of the two axes.

Abstract: A substrate is initially positioned in the reaction chamber. One or more gases are introduced into the reaction chamber. A predetermined speed for translating a line of radiation is determined. Continuous wave electromagnetic radiation is then emitted from a continuous wave radiation source. The continuous wave electromagnetic radiation is subsequently focused into a line of radiation extending across the surface of the substrate. The line of radiation is then translated relative to the surface at the constant predetermined speed. The combination of the introduced gas/es and heat generated by the line of radiation causes the gas/es to react and deposit a layer on the surface of the substrate. Undesirable byproducts of the reaction are then flushed from the reaction chamber. This process is repeated until a layer having a predetermined thickness is formed on the surface of the substrate.

Abstract: The thermal flux processing device includes a continuous wave electromagnetic radiation source, a stage, optics, and a translation mechanism. The continuous wave electromagnetic radiation source is preferably a diode/s. The stage is configured to receive a semiconductor substrate thereon. The optics are preferably disposed between the continuous wave electromagnetic radiation source and the stage. Also, the optics are configured to focus continuous wave electromagnetic radiation from the continuous wave electromagnetic radiation source into a line of continuous wave electromagnetic radiation on an upper surface of the semiconductor substrate. A length of the line of continuous wave electromagnetic radiation extends across an entire width of the semiconductor substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another, and preferably includes a chuck for securely grasping the substrate.

Abstract: The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.

Abstract: An assembly for use in a laser wire stripping apparatus that has a single piece channel assembly which has a pathway for allowing a light source to travel through the channel assembly to a cylindrical cavity in the channel assembly. A collet is provided and has a passageway for insertion of a wire. The collet has an opening, which when the collet is properly inserted into the cylindrical cavity, is in alignment with the pathway thereby allowing the light source to travel to the wire in order to remove insulation from the wire. A housing assembly is used for holding the channel assembly and for allowing the channel assembly to rotate within the housing assembly. The housing assembly has an air insertion opening and an exhaust opening for clearing smoke and debris from the channel assembly.

Abstract: A method for manufacturing a slider including a head for recording data into and reproducing data from a record carrier, and a floatation surface that floats above the record carrier includes the steps of setting an orthogonal coordinate system having an origin as a center of the floatation surface, and regulating a shape of the floatation surface by using laser to scan a rear surface of the floatation surface so that a flatness at each of plural positions set by the orthogonal coordinate system.

Abstract: The present invention relates to a method of laser technology using in IC etching process, which uses by controlling the power of laser, repetition rate, timing of operation and modulation of laser beam's focus to apply in IC etching process to ablate the various materials on the surface of a wafer.

Abstract: An fast steering mirror (30), such as a PMN actuated mirror, is positioned in a beam path (18) of a stage-based positioning system (40) to continuously move a laser beam (46) in a high speed prescribed pattern about a nominal target position (60) to spatially separate focused laser spots (48) generated at a high laser repetition rate and thereby create geometric features having dimensions greater than those of the focused laser spot (48). A series of laser spots (48) at a given repetition rate appear as a series of larger diameter laser spots at a lower pulse rate without beam quality problems associated with working out of focus.

Abstract: Glazing panels such as vehicle windscreens bonded to a supporting frame are released by firstly arranging light energy delivery means adjacent the panel and subsequently transmitting light energy from the delivery means through the panel thereby to effect release of the panel from the frame. The light may be pulsed according to a predetermined regime and may be delivered by a discharge lamp having rapidly attenuating intensity, or quasi continuous wave pulsed laser. The mechanism of panel release may be by thermal degradation of the bonding material, cleavage of material at a surface of, or within the body of the panel, or a combination of such mechanisms.

Abstract: The invention relates to a method of producing an aperture (2) in a metallic component (1), in which the aperture (2) comprises, at least in certain portions, a non-cylindrically formed funnel (9), extends from a first surface (5) to a second surface (6) of a component wall (3) and is formed by a laser beam (10), it being attempted to improve the dimensional accuracy and reduce the roughness of the surface of the aperture and/or funnel in that, by appropriate choice of the laser parameters, the metal is predominantly removed by sublimation during the formation of the funnel (9) and the funnel (9) is formed by laser removal of layers (11) of a substantially constant thickness (FIG. 3).

Abstract: An apparatus for marking cigarettes with a mark to terminate operation of a smoking machine includes a jig for holding at least 40 cigarettes and maintaining the cigarettes' position with a seam side of each cigarette facing a given direction. A scannable laser having a laser light output at an intensity and frequency makes a scorch mark on the seam of each cigarette paper without perforating the cigarette paper. A software control system for the scannable laser is programmed to cause the laser to scan over the cigarettes in the jig to etch and make a circumferentially-oriented line segment mark no longer than 1.5 millimeter and no wider than 0.5 millimeter on the cigarettes at a predetermined position along the length of the cigarettes.

Abstract: A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.

Abstract: There is provided an improvement on homogeneity of annealing performed utilizing radiation of a laser beam on a silicon film having a large area. In a configuration wherein a linear laser beam is applied to a surface to be irradiated, optimization is carried out on the width and number of cylindrical lenses forming homogenizers 103 and 104 for controlling the distribution of radiation energy density in the longitudinal direction of the linear beam. For example, the width of the cylindrical lenses forming the homogenizers 103 and 104 is set in the range from 0.1 mm to 5 mm, and the number of the lenses is chosen such that one lens is provided for every 5 mm-15 mm along the length of the linear laser beam in the longitudinal direction thereof. This makes it possible to improve homogeneity of the radiation energy density of the linear laser in the longitudinal direction thereof.

Abstract: An apparatus for forming transitioned edges in patterns formed by a scanning laser in a dyed textile material is disclosed. The transition rate between the untreated material and the treated material is controlled by passing a scanning laser beam through a mask prior to the laser beam reaching a focal point. An apertured mask can be employed to control the transition rate, wherein the location of the aperture relative to the focal point of the laser beam and configuration of the aperture periphery are manipulated to effect the transition rate.

Abstract: The present invention is a method for repairing a TBC ceramic top coat in local regions that have experienced a mechanical or thermally-induced spallation event leaving the underlying bond coat intact. A novel combination of groove design (i.e. spacing, pattern and depth) and laser-surface incident angles fabricated into the remaining bond coat is used to achieve spallation resistance equal to or greater than baseline after applying and maintaining a TBC ceramic patch to the localized areas of spallation. The method is particularly useful, but not limited to, repair of coating systems comprised of physical vapor deposited (PVD) ceramic top coats.

Abstract: A laser processing method includes the steps of irradiating a projection mask having a light transmitting area, for allowing a laser beam to be transmitted therethrough, with the laser beam; and irradiating a processing target with the laser beam transmitted through the light transmitting area. A spot of the laser beam on the projection mask is shaped so as to irradiate a portion in the vicinity of first edges of the light transmitting area, the first edges extending in one direction, and so as not to irradiate a portion in the vicinity of second edges of the light transmitting area, the second edges extending in a second direction which is different from the first direction.

Abstract: A method and apparatus for precision laser scanning suitable for precision machining or cleaning using an ultrashort pulsed laser beam are disclosed. The apparatus employs a laser source that emits a pulsed laser beam, a dispersion compensation scanner that scans the pulsed laser beam, and a focusing unit that focuses the pulsed laser beam from the dispersion compensation scanner on a work piece. The dispersion compensation scanner comprises a first scanning device that scans the pulsed laser beam in a first direction and that causes dispersion of the pulsed laser beam. The dispersion compensation scanner further comprises a first dispersion compensation device that compensates for the dispersion caused by the first scanning device. Effects of polarization of the ultrashort pulsed laser beam on the quality of machining are described. Uses of the invention in direct fabrication of photolithographic masks and in work piece cleaning are also described.

Abstract: A method of manufacturing an antivibration device for motor vehicles, the device comprising at least one metal insert having at least one fixing surface bonded to an elastomer, the method including a cleaning step during which the fixing surface is scanned with a laser beam that is sufficiently powerful to eliminate the impurities present on said surface.

Abstract: An apparatus and method for controlling twist curvature of a disc head slider is provided, where the slider has a bearing surface, a back surface, which is opposite to the bearing surface, a longitudinal axis and a transverse axis. The apparatus obtains a measure of the twist curvature of the bearing surface and selectively alters material stresses in a working surface of the slider. The material stresses are altered asymmetrically with respect to the longitudinal axis and the transverse axis based on the measure of the twist curvature to induce a change in the twist curvature.

Abstract: A method of coating an inner surface of a weapon barrel includes the following steps: directing a laser beam against the inner barrel surface to cause melting of regions thereof; introducing a coating material in one of powder, wire and ribbon form into the laser beam for melting the coating material to produce in the surface regions a molten bath composed of the molten coating material and a material of the weapon barrel; and moving the laser beam inside the weapon barrel axially thereof and relative thereto, whereby the molten substance of the bath becomes rigid as the laser beam moves away therefrom.

Abstract: A device-forming region where a semiconductor device is formed is arranged on a substrate in the matrix of 2×2. A linear laser beam has a cross-section having a length longer than the width of the device-forming region. When the irradiation of the laser beam is performed, the region irradiated with the end portions of the linear laser beams overlapped with each other or brought into contact with each other, is made positioned outside the device-forming region.

Abstract: The present invention relates to a device and a process using a laser beam to scan an area of an object, in particular, for selective laser melting of metal powder for fabrication of a mold. The device is provided with a plotter mechanic with two linear axes (4, 5) over which a carrier element can be positioned and moved, an optical means, which guides the laser beam to the carrier element or provides the laser beam at the carrier element, a scanning means (9) at the carrier element, which guides the laser beam to the area of the object and moves the laser beam back and forth in a presetable angle, a focusing optic (15) for focusing the laser beam (8) onto the area of the object (11).

Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.

Abstract: Radiant energy line source(s) (e.g., laser diode array) and anamorphic relay receiving radiant energy therefrom and directing that energy to a substrate in a relatively uniform line image. The line image is scanned with respect to the substrate for treatment thereof. Good uniformity is provided even when the line source is uneven. Optionally, delimiting aperture(s) located in the anamorphic relay focal plane and a subsequent imaging relay are includeable to permit substrate exposure in strips with boundaries between adjacent strips within scribe lines between circuits. An anamorphic relay focal plane mask with a predetermined pattern can be used to define portions of the substrate to be treated with the substrate and mask scanning motions synchronized with each other. Control of source output, and position/speed of the substrate, with respect to the line image, allows uniform dose and required magnitude over the substrate.

Abstract: A method of manipulating data in a method for forming a three-dimensional object layer by layer from an ink jettable, solidifiable material by providing data corresponding to a plurality of polygons defining the outer surfaces of a plurality of three-demiensional objects and providing sets of x, y, and z coordinates corresponding to each layer and identifying x and y coordinates with each z coordinate such that directional values and counter values are determined for each y coordinate in a first set of coordinates generated. A second set of y coordinates are generated according to a formula that permits the determined layers to be processed to form a three-dimensional object.

Abstract: A laser imaging apparatus for forming an image on a surface of a substrate is provided with a laser source that emits a laser beam, a table mounting the substrate, the table being movable in a first direction within a predetermined plane, a scanning optical system which receives and deflects the laser beam emitted by the laser source to form a scanning beam spot on the substrate, the scanning beam spot scanning in a second direction that is perpendicular to the first direction, and a mechanism that moves the scanning optical system in the second direction.

Abstract: A laser scanning method and system for marking articles is provided wherein control is provided by a single central controller. The system includes a conveyor for conveying the articles in a first direction at a marking station. A conveyor controller controls the conveyor in response to conveyor control signals. A laser and an optical subsystem are optically coupled to the laser for generating a focused laser beam in response to laser control signals. A scan head includes a laser beam deflector for steering the focused laser beam along two substantially orthogonal intersecting axes at the marking station to mark a first predetermined region on at least one of the articles in response to deflection control signals.

Abstract: This invention results from the realization that a laser can remove the protective layer(s) from the glass or fused silica optical fiber core and cladding more effectively and more reliably than chemical or mechanical means. This invention teaches methods of using laser beams to remove the protective layers of fibers without significantly damaging the optical and mechanical properties of the fiber and without leaving an excessive amount of residual ablation debris on the fiber while providing careful control of the laser energy. This method thereby allows users to safely strip protective layers off sensitive fibers, such as fibers used for fiber Bragg gratings (FBG). This method allows stripping of the protective layers from single fibers and from multi-fiber ribbon cables. It also allows stripping of the protective layers at an end section of the cable or in a middle section (mid-span).