Abstract: The present invention relates to a method for marking metallic alloys using laser alloying. Specifically, the present invention is directed toward the use of laser alloying steel or aluminum alloys with a mark that provides protection against wear and corrosion and greater permanency.

Abstract: A desired portion of a stent may be polished by irradiating at least a portion of the surface of the stent substrate with a laser beam from the laser at a wavelength absorbed by the stent substrate to cause a controlled level of melting of the surface of the stent substrate and allowing the substrate material to solidify.

Abstract: A nozzle holding means (13) having a nozzle (19) being free to eject laser beam from its top end is provided being free to move along a guide means among a plurality of machine tools. Nozzle holding means operation control means (6, 33) for controlling hardening operation on a workpiece by the nozzle are provided, and communication control means (6, 33) are provided for exchanging information necessary for hardening operation on a workpiece to be machined with each machine tool between the control means and a control means of each machine tool. The nozzle moves among the machine tools and hardening operation is performed on workpieces (29, 30) in the respective machine tools, thereby it is not necessary to provide a hardening unit for exclusive use every each machine tool, and it is possible to provide a hardening equipment having high working ratio.

Abstract: The invention relates to a device and method for structuring the surface of floor coverings which have already been laid, comprising various floor coverings which may also consist of mineral materials such as natural or artificial stone. The object of the invention is to provide floor coverings which have already been laid with a structure on their surface, which structure makes it possible to at least increase the nonslip properties even in the presence of slippy media, e.g. water. To do this, the invention uses a device with which at least one laser beam can be moved with controlled intensity and in at least one dimension across the surface to be structured, the elements for guiding and shaping the laser beam(s) being accommodated in a mobile part of the device, so that this mobile part is guided intermittently or continuously across the floor surface which is to be structured and, in the process, the structuring can be formed by means of the laser beam.

Abstract: A laser machining device according to the invention is provided with a laser oscillator for generating a laser beam, a main deflecting galvannometer mirror, an F&thgr; lens, and a sub-deflecting means arranged in an optical path between the laser oscillator and the main deflecting galvanometer mirror. A means for splitting a laser beam is provided, and the sub-deflecting means is inserted into the optical path of one of the split laser beams. At the same time, both the split laser beams are incident from the same main deflecting galvannometer mirror to the F&thgr; lens, and a numerical aperture in the optical system constituted by the main deflecting galvannometer mirror, the F&thgr; lens, and an object is set to be not more than 0.08.

Abstract: The present application is directed to an orthopedic implant. More specifically, the orthopedic implant is suitable for arthroplasty procedures where optimized multifunctional behavior of the implant is desired. In some embodiments the implant is suitable for the replacement of a spinal disc. In one embodiment, the present application is directed to an orthopedic implant including a first plate a second plate and a flexible support. The flexible support may have a single connection to the first plate and a single connection to the second plate and may vary in cross section. The first plate, the second plate and the flexible support may be unitarily formed.

Abstract: A galvanometer controller capable of control with stability and with immunity to changes with time and variation in environment temperature and having improved operability and expandability, and a laser machining apparatus having the galvanometer controller. The galvanometer controller comprises a correcting arrangement formed in a digital circuit, the correcting arrangement having a distortion correction section for correcting a working distortion of an optical unit including a lens, an orthogonality correction section for correcting the orthogonality between the two axes of the galvanometer, and a linearity correction section for correcting the linearity on each of the two axes.

Abstract: Laser beam positioners (300, 340) employ a steering mirror (236, 306) that performs small-angle deflection of a laser beam (270) to compensate for cross-axis (110) settling errors of a positioner stage (302). A two-axis mirror is preferred because either axis of the positioner stages may be used for performing work. In one embodiment, the steering mirror is used for error correction only without necessarily requiring coordination with the positioner stage position commands. A fast steering mirror employing a flexure mechanism and piezoelectric actuators to tip and tilt the mirror is preferred in semiconductor link processing (“SLP”) applications. This invention compensates for cross-axis settling time, resulting in increased SLP system throughput and accuracy while simplifying complexity of the positioner stages because the steering mirror corrections relax the positioner stage servo driving requirements.

Abstract: A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.

Abstract: A UV laser beam is used to machine semiconductor. The beams intensity (IB) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing IB. An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_center), for each value of z-integer in the z direction.

Abstract: A method and apparatus for manufacturing patterns on a reticle blank comprising a substrate made from material transparent to UV irradiation and having a first surface and a second opposite surface, the first surface coated with a chrome layer. The method comprises providing ultra-short pulsed laser beams, focusing means, relative displacement facilitator for facilitating relative displacement of the reticle blank relative to said at least one of a plurality of target locations, and a controller for controlling the synchronization and operation of the laser beam source, the focusing means and the relative displacement facilitator. Ultra-short pulsed laser beam is irradiated in a predetermined pattern directed at the second surface and passing through the substrate, focused on the chrome layer or on its proximity.

Abstract: A single pass actuator (70, 200), such as a deformable mirror (70), quickly changes, preferably in less than 1 ms, the focus and hence the spot size of ultraviolet or visible wavelength laser pulses to change the fluence of the laser output (66) at the workpiece surface between at least two different fluence levels to facilitate processing top metallic layers (264) at higher fluences and underlying dielectric layers (266) at lower fluences to protect bottom metallic layers (268). The focus change is accomplished without requiring Z-axis movement of the laser positioning system (62). In addition, the spot size can be changed advantageously during trepanning operations to decrease via taper, reduce lip formation, increase throughput, and/or minimize damage.

Abstract: A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the transparent substrate (18), laser energy being applied separately to each of the contact pairs (37) constructed between two connecting surfaces (19, 20) of the opposing substrates (17, 18).

Abstract: One of objects of the present invention is to provide a method of carrying out a laser annealing with sufficient uniformity and high productivity in a wide thickness range of a non-single crystal semiconductor film. According to one aspect of the present invention, a laser irradiation apparatus for carrying out irradiation while scanning a linear laser beam in a beam width direction is characterized in that the laser beam on an irradiation surface has a first energy density in a first beam width and a second energy density in a second beam width, and the second energy density is higher than the first energy density.

Abstract: There is provided an improvement on homogeneity of annealing performed utilizing radiation of a laser beam on a silicon film having a large area. In a configuration wherein a linear laser beam is applied to a surface to be irradiated, optimization is carried out on the width and number of cylindrical lenses forming homogenizers 103 and 104 for controlling the distribution of radiation energy density in the longitudinal direction of the linear beam. For example, the width of the cylindrical lenses forming the homogenizers 103 and 104 is set in the range from 0.1 mm to 5 mm, and the number of the lenses is chosen such that one lens is provided for every 5 mm-15 mm along the length of the linear laser beam in the longitudinal direction thereof. This makes it possible to improve homogeneity of the radiation energy density of the linear laser in the longitudinal direction thereof.

Abstract: In a laser beam machining method, a liquid, through which a laser beam can be transmitted, is supplied to the target surface of an object to be processed. A laser beam is guided to the target surface through the liquid. The laser beam processes the target surface under the application of ultrasonic vibration.

Abstract: The present invention relates to forming microchannels with smooth bottoms and walls. In one embodiment smooth microchannels are formed by line-scanning a pulsed solid-state laser beam across a substrate such that there is a high degree of both laser pulse overlap and line overlap. In an alternative embodiment such microchannels are made by employing laser pulses whose spatial profiles have been suitably homogenized.

Abstract: A method is disclosed for rapidly removing electrically insulative coating material from a portion of the titanium housing of an implantable cardiac pulse generator. Pulsed excimer laser radiation ablates an organic coating, such as parylene or a similar polymer, to micromachine a conductive window having sharply defined boundaries or edges. An implantable cardiac pulse generator having an electrically conductive window produced according to the method is also disclosed. The method is suitable for high volume automated production of face or edge window pulse generators, and is also applicable for removal of biomolecular films from other medical articles.

Abstract: A method and apparatus for precision laser scanning suitable for precision machining or cleaning using an ultrashort pulsed laser beam are disclosed. The apparatus employs a laser source that emits a pulsed laser beam, a dispersion compensation scanner that scans the pulsed laser beam, and a focusing unit that focuses the pulsed laser beam from the dispersion compensation scanner on a work piece. The dispersion compensation scanner comprises a first scanning device that scans the pulsed laser beam in a first direction and that causes dispersion of the pulsed laser beam. The dispersion compensation scanner further comprises a first dispersion compensation device that compensates for the dispersion caused by the first scanning device. Effects of polarization of the ultrashort pulsed laser beam on the quality of machining are described. Uses of the invention in direct fabrication of photolithographic masks and in work piece cleaning are also described.

Abstract: A method of fabricating a fully dense, three dimensional object by direct laser sintering is disclosed. In a chamber with a partial pressure atmosphere, a beam of directed energy melts metallic powder in order to form a solid layer cross section. Another layer of powder is deposited and melted, along with a portion of the previous layer. The energy beam typically is in the form of a laser, scanning along a path resembling a parametric curve or another, arbitrary piecewise parametric curve. In another embodiment, the previous layer is not remelted, thus creating an oxide film that acts as a clean stop to prevent unwanted downward growth.

Abstract: The present invention relates to a laser annealing apparatus having a plurality of optical systems to generate a plurality of laser beams. A process time is reduced because a laser scanning operation on a large substrate is completed in a shorter time. The present invention includes a laser oscillator generating and supplying a laser, at least one beam splitter separating the laser from the laser oscillator into at least one or more laser beam, a plurality of optical systems processing a laser beam to produce laser having energy and profile sufficient to use directly for sample irradiation. The optical systems arrange each processed laser beam to a length direction.

Abstract: A device for machining a hole or a shape of varying profile in a mechanical workpiece using an excimer laser comprises a screen having an aperture of predetermined shape disposed between the excimer laser and a device for focussing the laser beam, the screen being movable in a plane perpendicular to the laser beam. Control means is provided for automatically controlling displacement of the screen in real time while the hole is being machined in the workpiece, the control being effected as a function of the number of pulses emitted by the excimer laser. As an alternative, the screen may be replaced by a diaphragm comprising variable-aperture shutters.

Abstract: The present invention relates to a method for marking metallic alloys using laser alloying. Specifically, the present invention is directed toward the use of laser alloying steel or aluminum alloys with a mark that provides protection against wear and corrosion and greater permanency.

Abstract: There is provided a deposition system (1) for yielding substantially uniform deposition of an evaporant material onto a substrate. The deposition system (1) comprises: a source (10) for generating a coherent energy beam; a substantially planar target (60) containing the evaporant material and disposed in spaced relation to the substrate; a focusing element (30) optically coupled to the source for focusing the coherent energy beam onto the target (60); and, an actuator (40) coupled to the focusing element (30) for reversibly translating the focusing element (30) along a scanning path directed substantially parallel to a target plane defined by the target (60). The focused coherent energy beam defines an impingement spot (14) on the target (60). The impingement spot (14) is displaced responsive to the translation of the focusing element (30) along the scanning path. The focus of the coherent energy beam on the target (60) thus remains substantially preserved.

Abstract: In a method of forming a cooling bore in a wall of a workpiece, the configuration of a feed section and a diffuser section is selected, a throughbore is produced with a cross-sectional area within the cross-sectional area of the feed section, and the diffuser section is cut out by a beam- or jet-drilling method in such a way that the drilling beam or jet in the region of the feed section remains essentially within the cross-sectional area of the latter.

Abstract: A wavelength switchable laser (10) of this invention is based on a solid-state laser source (12) in which a fourth harmonic UV laser beam (26) is ordinarily used for processing, and a second harmonic “green” laser beam (28) is dumped and wasted. However, this invention uses the ordinarily wasted green laser beam for processing ECB (30) conductor layers (32, 36), which enhances processing throughout because of the higher power of the green energy than of the UV energy. A Pockel cell (16) effects laser beam polarization switching that causes either the green beam or the UV beam to be directed to the ECB for processing different materials. This invention requires only a single rail laser source and is, therefore, simple, cost effective, efficient, inherently aligned, and has high processing throughput.

Abstract: A method of forming a groove having a desired cross section easily and rapidly, by making laser beam scan in the longitudinal direction of the groove. In the method, a laser beam 11 is irradiated to a work 15 to form a groove 16. When the longitudinal and the width direction of the groove is the x-axis and the y-axis, respectively, an intensity distribution of the laser beam in an irradiated region Q on the work is expressed by f(x, y). An integral of f(x, y) with respect to x, i.e., g(y), is proportional to a depth distribution of the groove 16, d(y), and the intensity distribution f(x, y) is formed by passing the laser beam 11 through a mask pattern 12a which has an appropriate transmission factor distribution. The groove 16 is formed by moving the region Q in the x-axis direction. The cross section of the groove 16 is determined by the mask pattern 12a. And the groove 16, having a desired cross section, is obtained in one scanning in the x-axis direction.

Abstract: In general, the present invention pertains to an apparatus and control system for working sheet material employs a tilting mechanism which automatically tilts a head about a theoretical point disposed upon the sheet material. In another aspect of the present invention, the head is defined as a laser head and the pivot point corresponds with the laser beam focal point. A further aspect of the present invention provides a seam tracking device and control system which automatically adjust a welding head height relative to the sheet material as a datum rather than relative to a gantry or other structure supporting the welding head. In yet another aspect of the present invention, an optical seam tracking device is employed to automatically tilt the welding head along differing rotational planes. In still another aspect of the present invention, various axial slides are employed in combination with a gantry.

Abstract: A method is for removing residue of plastic from metal parts of plastic packages of semiconductor devices, e.g., heat-sinks and terminals. The surfaces to be treated are subjected to pulsed laser radiation. The wavelength is chosen in such a way that residue of plastic in thin films have good transparency to the radiation, and the metal has a high absorption capacity with respect to the radiation. Moreover, the intensity and duration of application of the radiation causes the formation of plasma at the point of impact of the radiation with the surface to be treated.

Abstract: A fast and smooth scanning for achieving a uniform ablated surface without relying on any synchronization between the laser pulses and the scanner mirror positions. The scanning takes a series of close loops and the scanning speed on each loop is fine-tuned according to the perimeter of the loop. A uniform and close-packed pulse disposition along each loop can be achieved by multiple successive scans along the loop, while the consecutive pulses of a scan can be well separated. The scanning pattern is designed such that the energy distribution is uniform for every layer and the smoothness of the ablated surface remains substantially unchanged as the number of the layer increases.

Abstract: Methods and apparatus for forming three-dimensional objects from a medium solidifiable when subjected to a beam of pulsed radiation wherein the pulses of radiation are made to occur when the beam is directed to desired pulsing locations on a target surface of the medium. Preferred embodiments of the instant invention include a pulsed laser assembly, including a laser and a pulse generation circuit, a control computer, a plurality of mirrors and mirror encoders. The computer controls the movement of the mirrors which guide the laser beam across the surface of the solidifiable medium. The pulsing of the laser beam is correlated to the position of the mirrors and thus, is not dependent upon time. Pulsing linked to position of beam placement allows controlled and repeatable use of a pulsed beam for the formation of objects.

Abstract: There is provided an improvement on homogeneity of annealing performed utilizing radiation of a laser beam on a silicon film having a large area. In a configuration wherein a linear laser beam is applied to a surface to be irradiated, optimization is carried out on the width and number of cylindrical lenses forming homogenizers 103 and 104 for controlling the distribution of radiation energy density in the longitudinal direction of the linear beam. For example, the width of the cylindrical lenses forming the homogenizers 103 and 104 is set in the range from 0.1 mm to 5 mm, and the number of the lenses is chosen such that one lens is provided for every 5 mm-15 mm along the length of the linear laser beam in the longitudinal direction thereof. This makes it possible to improve homogeneity of the radiation energy density of the linear laser in the longitudinal direction thereof.

Abstract: An improved method for operating a steered laser beam system employs selective laser power control. A laser beam is provided having a selectively positionable focal point. A workpiece is provided on which a selected laser beam pattern is used to process the workpiece, and the laser beam focal point is controlled to travel along the selected pattern at varying velocities. A position of the focal point on the workpiece is dynamically determined as the focal point travels along the selected pattern. A velocity of the focal point on the workpiece is dynamically calculated based on multiple determined positions of the focal point. An energy level of the laser beam is controlled based on the calculated velocity of the focal point. In one embodiment, the energy level of the laser beam is adjusted to maintain a constant energy per unit distance traveled by the focal point.