Abstract: A heating device for a cooking field is arranged beneath a cooking field plate, wherein the heating device comprises a temperature sensor and a wire heating element for generating heating power. The temperature sensor is provided between the heating element and the cooking field plate and has a longitudinal and rod-like sensing part. The heating element is arranged directly beneath and aligned with the sensing part such that the sensing part is exposed to heating power from the heating element. The heating power ranges in power from 0.5 W up to 2.5 W per centimeter of length of the sensing part. This serves for a faster activation of a residual heat indicator by the temperature sensor.

Abstract: An energy conservation system to selectively control the operation of the heating elements of a water heater including a water storage tank operable in an automated mode to control the temperature of water within the water storage tank comprising a flow detector such as temperature sensor to sense the inlet or outlet water temperature to detect a change in temperature measured in time and duration and a tank temperature to sense the water temperature within the storage tank and generate corresponding temperature signals and a microprocessor coupled to the flow detector and tank temperature sensor to receive the corresponding signals including means to determine when there is a demand for hot water and means to determine a pattern of hot water usage over a water usage cycle to maintain the water in the water storage tank at a minimum temperature to supply a minimum quantity of hot water and increase the temperature of the water to a maximum temperature to supply a maximum quantity of hot water corresponding to

Abstract: A control panel for controlling the operation of hotplates situated on a cooking appliance. The control panel has a translucent plate that permits the location of operating elements to be visually displayed on a top surface thereof only when lighting elements associated with the operating elements are energized. The lighting elements are selectively energized and/or de-energized so that only the operating elements of a particular hotplate are visible on the top surface of the translucent plate while a user is in the process of selecting or otherwise altering an operating parameter of the particular hot plate.

Abstract: A reaction chamber including a substrate supporting member positioned within the reaction chamber, the reaction chamber having a first region and a second region, a shield positioned within the second chamber and movable with the substrate supporting member, and wherein the shield is adjacent at least a bottom surface of the substrate supporting member.

Abstract: The invention involves a detachable powerplug connector and plug seat connection of an electric griddle. A thermostat is in a plug control box, to which external power input connector is connected. A temperature control knob is fixed on the plug control box, and a socket with plug through-hole is installed at the front end of the plug control box. A heat transfer inserting hole is in the thermostat and received a heat transfer rod extending from the pan body between the plugs in a flexible way, and the end will get in touch with the thermostat, which enables the pan body to transfer heat directly to the thermostat in the plug control box via the heat transfer rod. The plug control box is equipped with an independent adjustable temperature control knob connected to the thermostat, which will facilitate temperature adjustment for the users.

Abstract: The present invention provides systems, methods and apparatus for manufacturing a multi-zone pedestal heater. A multi-zone pedestal heater includes a heater plate which includes a first zone including a first heating element and a first thermocouple for sensing the temperature of the first zone wherein the first zone is disposed in the center of the heater plate; and a second zone including a second heating element and a first embedded thermocouple for sensing the temperature of the second zone wherein the first embedded thermocouple includes a first longitudinal piece that extends from a center of the heater plate to the second zone and the first longitudinal piece is entirely encased within the heater plate. Numerous additional aspects are disclosed.

Abstract: The present invention provides a temperature auto-compensation grill, which includes an upper grilling unit, a lower grilling unit and a heating circuit. The upper grilling unit rotating connects to the lower grilling unit and rotates between a first position and a second position; the grill is in the first status when the upper grilling unit is situated in the first position; the grill is in the second status when the upper grilling unit is situated in the second position; the heating circuit includes: a heater, one end of which attaches to one electrode of the power; a first thermostat, one end of which attaches to the other end of the heater; a second thermostat, one end of which attaches to the other end of the heater; and a change-over switch, which connects to the other electrode of the power and the first thermostat in the first status, the change-over switch connects to the other electrode of the power and the second thermostat in the second status.

Abstract: A method and apparatus for monitoring the temperature of a cook top is provided. Overhead sensors are used for temperature sensing of a heating element, cooking utensil, and/or food located on the cook top. The resulting temperature information is then communicated to the cook top. Features associated with use of the temperature information such as various notifications to the operator and/or regulation of the heating elements can be also provided.

Abstract: The present invention relates to an electric range comprising a body (100) for defining an exterior, an upper plate (400) on a top of the body (100), a working coil (210) provided in the body (100) for generating an electromagnetic force, an upper insulating sheet (240) provided to cover an upper surface of the working coil (210), a temperature sensor (250) secured to the electric part of the upper insulating sheet (240) for sensing a temperature of the upper plate (400) in a close contact with a downside of the upper plate (400), and an elastic part elastically formed in the upper insulating sheet (240) for making the temperature sensor (250) in a close contact with the upper plate (400).

Abstract: Temperature sensor device inserted into a radiant heater (1) that incorporates at least one heating resistance (2) and is adapted to a glass ceramic cooking hob (4), comprising a film-type resistive sensor element (11) with metal wires (12) for its connection to terminals (18) and a support element (13) that passes through the radiant heater (1), at least in part. The sensor element (11) is inserted into the free end of said support element (13) so that the top and bottom faces are exposed in relation to said support element (13), and the sensor device also comprises an insulating element (14) disposed beneath the sensor element (11), separated from the support element (13) at least in the area in which the sensor device passes through the radiant heater (1).

Abstract: A multi-stage cooking method for a counter-top electric oven is provided. The oven may include at least one cooking element and at least one control system coupled to the cooking element, the control system including a processor, a storage device, and an input interface. The multi-stage cooking method may include: receiving the multi-stage cooking recipe for the counter-top electric oven; storing the multi-stage cooking recipe in the storage device of the counter-top electric oven; and executing the multi-stage cooking recipe with the counter-top electric oven.

Abstract: Temperature setting of a thermal plate is performed so that the line width of a resist pattern is uniformly formed within a wafer. The thermal plate of a PEB unit is divided into a plurality of thermal plate regions so that the temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the wafer mounted on the thermal plate is set for each of the thermal plate regions of the thermal plate. The temperature correction value for each of the thermal plate regions of the thermal plate is set after calculation by a calculation model created from a correlation between a line width of the resist pattern formed by thermal processing on the thermal plate and the temperature correction value. The calculation model M calculates the temperature correction value to make the line width uniform within the wafer, based on a line width measured value of the resist pattern.

Abstract: An electrical heating arrangement (2) includes a temperature sensor assembly which comprises a housing member (34) mounted on, and extending partially across, a heater (12). The housing (34) has a first end region (36) in spaced relationship with an electric heating element (20), and a second end region (38) which traverses and extends externally of a peripheral wall (18). A first temperature-sensitive electrical element (52) is provided at the first end region (36) of the housing (34) and first electrical leads (54) extend to the second end region (38) of the housing (34). A layer (58) of thermal insulation material is provided and a second temperature-sensitive electrical element (60) overlies the layer (58). The second element (60) is provided at the first end region (36) of the housing (34) and second electrical leads (62) extend to the second end region (38) of the housing (34).

Abstract: A temperature control method is used for controlling a temperature of a hot plate, so that a measured temperature of the hot plate conforms to a target temperature thereof, in a heat processing apparatus for performing a heat process on a substrate placed on the hot plate, which is used in a coating/developing system for applying a resist coating onto the substrate to form a resist film and then performing development on the resist film after light exposure. The method includes acquiring adjustment data necessary for adjusting a reaching time defined by a time period for increasing the temperature of the substrate from a first temperature around an initial temperature to a second temperature around the target temperature; and adjusting the target temperature by use of the adjustment data thus acquired, after starting the process on the substrate.

Abstract: A sensor for a sensor device on a cooking hob is provided with contacts on a support, an electronic circuit for signal processing and a resistance track for temperature measurement. The sensor is arranged in a tubular metallic housing above a radiant heater of the cooking hob. The metallic housing is operated as an electromagnetic pan recognition sensor. The functions of temperature measurement and pan recognition can be combined in one sensor device as a module. A good transmission of sensor signals can be achieved as a result of the physical proximity of the sensor signal processor to the sensor by placing them on the same support.

Abstract: A fluid heating system configured to regulate a temperature of a fluid within a fluid receptacle having a fluid reservoir includes a processing unit, at least one fluid temperature sensor in electrical communication with the processing unit, and a heating element in electrical communication with the processing unit. The at least one fluid temperature sensor is configured to detect a temperature of one or both of the fluid receptacle and/or fluid retained within the fluid receptacle. The processing unit selectively activates and deactivates the heating element to regulate the temperature of the fluid within the fluid receptacle.

Abstract: When a timer period reaches an increase-stopping-time during the long-push state of a timer key, increase of the timer period is stopped once. Accordingly, even though a long-push state is continued due to a fault of the timer key, the indication of the timer period is not repeated.

Abstract: The cook top includes a colorless transparent glass ceramic plate, which is provided with an opaque coating extending over its underside, except that in at least one window area a window coating is provided on the underside of the glass ceramic plate area instead of the opaque coating. In order to optimize colored displays arranged under the at least one window area and to facilitate the use of capacitive touch sensors, the window coating is a burned-in noble metal preparation with an electrical surface resistance of 1 M?/? and in the at least one window area the glass ceramic plate coated with the window coating has a transmission in a range from 1.0 to 21.0% and a light scattering in a range of from 0.0 to 1.0% for visible light with wavelengths of from 400 nm to 750 nm.

Abstract: A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal mass in the form of a heater module. The heater module is in thermal communication with the heat sink, but is physically separated therefrom by a thermal insulator layer. The thermal insulator maintains a substantially constant power loss at least equal to the maximum power delivered by the laser, less that lost by radiation and convection. A top plate is arranged atop the heater module, supports the wafer to be processed, and provides a contamination barrier. The heater module is coupled to a power supply that is adapted to provide varying amounts of power to the heater module to maintain the heater module at the constant background temperature even when the wafer experiences a spatially and temporally varying heat load from an LTP laser beam.

Abstract: A stage for a substrate temperature control apparatus having high responsibility at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage for a substrate temperature control apparatus is a stage to be used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.

Abstract: An electric heater (10) incorporates at least one heating element (20), at least one wall member (16) upstanding in the heater, and a device (42) is provided for detecting a cooking utensil (6) supported on an upper surface (4) of a cooking plate (2) overlying the heater. The device (42) includes at least one inductively-operating loop (44) of electrically conductive material having a plurality of portions (50, 52, 54) adapted to extend over and spaced from the at least one electric heating element (20) between fixed supporting regions (56, 58, 60, 62) on the at least one wall member (16). The at least one loop (44) of electrically conductive material is such that the plurality of portions (50, 52, 54) are substantially incapable of self-support as such at normal operating temperatures of the electric heater. The plurality of portions (50, 52, 54) are supported by elongate members (64, 66, 68) of heat-withstanding material.

Abstract: In the present invention, a thermal plate is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the wafer for which the photolithography process has been finished are first measured, and Zernike coefficients of a Zernike polynomial indicating a plurality of in-plane tendency components are calculated from the measured values of the line widths within the wafer. Then, the temperature correction values for the regions of the thermal plate to bring the calculated Zernike coefficients close to 0 are calculated using a calculation model indicating a correlation between change amounts of the Zernike coefficients and the temperature correction values.

Abstract: A temperature control and method of operating the temperature control, for an inductively heated heating element. The heating element is heated by an inductor to which electrical power is supplied via a control circuit, which can also be a control circuit for an induction hob or oven. The temperature control is activated at a first point in time subject to at least one electrical value of the control circuit, which depends on the temperature of the heating element. A reference value is determined at the first point in time and a comparison value and a deviation value from the reference value is determined at least one later point in time. Depending upon the deviation value, the inductor is supplied with power so that the heating element is adjusted to a substantially constant value corresponding to the reference value.

Abstract: A utensil for cooking eggs without shells which has separate egg cooking and steam generation zones, a lid and direct heat in co-ordination with controls so that at least one cooking cycle can be repeated.

Abstract: A temperature sensor assembly (30) is provided for an electrical heating arrangement (2). The temperature sensor assembly (30) includes a substrate (32) located in a heater (12). The substrate (32) has an upper surface (38) in contact with the lower surface (10) of a cooking plate (4). The upper and/or lower surface or surfaces (38, 66) of the substrate (32) is provided with a first temperature-sensitive resistance element (40) at a first region (42) of the substrate (32) proximate a peripheral region (34) of the heater. The upper (38) and/or lower (66) surface or surfaces of the substrate (32) is or are provided with a second temperature-sensitive resistance element (54; 54A; 54B) at a second region (56) of the substrate (32) proximate the central region (36) of the heater.

Abstract: A heating vessel is described that includes a contact plate having a contact surface configured to be in direct thermal communication with the contents located in a heating chamber of the vessel and a heat distribution plate in thermal communication with the contact plate. The heat distribution plate is configured to be remote from the contact plate in at least one region to define a thermally insulating zone. There is a heat source in thermal communication with the heat distribution plate and an electronic temperature sensor located in the thermally insulating zone, in thermal communication with the contact plate. The electronic temperature sensor is thermally insulated from the heat distribution plate by the thermally insulating zone. The measured temperature may be used to control the heating of the kettle to bring the contents lo the boil or to maintain the measured temperature within a specified range.

Abstract: A cooktop is provided. The cooktop includes, a main machine, at least one heater disposed inside the main machine, a temperature sensor for measuring a temperature of the heater, a fixing member formed in the main machine, a top glass disposed on the upper side of the main machine, and a heater support spring for supporting the heater. The heater is provided with a bracket. The heater support spring is fixed to the main machine using the fixing member, caught and supported at the heater by the bracket to seat and elastically support the heater, and limit rotation of the heater.

Abstract: A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.

Abstract: The present invention relates to a tilting heating apparatus in which a heating container is not lowered below the level of a tilting base when the heating container is tilted with its opening faced upward and an on-the-spot heat treatment system for a heating object.

Abstract: A cooking apparatus includes a heating element and a cooking plate arranged and configured to be heated by the heating element, the cooking plate having a first surface facing the heating element and a cooking surface opposite the first surface. A thermostat is located proximate the first surface and associated with a heating element control. An insulating heat shield arrangement partially surrounds the thermostat and shields a shielded portion of the first surface adjacent the thermostat from direct heating by the heating element. The insulating heat shield arrangement is configured to provide a thermal resistance Rh through the cooking plate between the shielded portion of the first surface at the thermostat and a directly heated portion of the first surface outside the shielded portion. The cooking plate is configured such that a thermal resistance Rc through the cooking plate is provided between the shielded portion of the first surface at the thermostat and the cooking surface.

Abstract: A wafer thermometer includes a wafer, a plurality of temperature sensors, a converter, a wafer data transmitter, and a photoelectric conversion element. The wafer has an upper surface divided to a plurality of regions. The plurality of temperature sensors are arranged at the plurality of regions, respectively. The converter is provided on the wafer and configured to convert signals output from the plurality of temperature sensors to temperature data. The wafer data transmitter is provided on the wafer and configured to transmit the temperature data converted by the converter. The photoelectric conversion element is provided on the wafer and configured to supply a current to the converter and the wafer data transmitter in response to light with which the photoelectric conversion element is irradiated.

Abstract: In a cooktop with a cooktop panel, beneath which at least one heating element is disposed for heating up a cooking vessel to be placed on the cooktop panel, and with a temperature sensor for sensing the temperature of the cooktop panel, which temperature sensor is in heat-conducting contact with the underside of the cooktop panel within the heating element and is connected to a control unit for controlling the heating power of the heating element, to simplify assembly/fitting, the invention provides a heat-conducting element within the heating element in heat-conducting contact with the underside of the cooktop panel, and fastens the temperature sensor in this region to the heat-conducting element.

Abstract: A ceramic heater attaining more uniform temperature distribution from the start to the end of cooling is provided. Further, in a cooling module used for cooling the heater, liquid leakage during use is prevented, degradation in cooling capability is prevented and the performance is maintained for a long period of use, and the manufacturing cost of the module is decreased. The ceramic heater includes a ceramic heater body and a cooling module cooling the heater body, and the cooling module has a structure formed by arranging a pipe in a trench formed in a plate-shaped structure.

Abstract: A sensor assembly is disclosed for determining the temperature state in an area of a heating surface heated by a heat source and disposed between the heat source and the heating surface in parallel relationship to the heating surface. The sensor assembly includes a first sensor having a carrier and a temperature-dependent resistor web which is attached to the carrier and confronts the heating surface and which is electrically contacted at a contact zone outside a temperature-measuring zone, and a second sensor having a carrier and a temperature-dependent resistor web which is attached to the carrier and electrically contacted at a contact zone outside the temperature-measuring zone and which confronts the heat source.

Abstract: A sensor element for determining the concentration of gas components in gas mixtures, e.g., for determining the oxygen concentration in exhaust gases of combustion engines, includes: at least one electrochemical measurement cell that encompasses a first and a second electrode in contact with a solid electrolyte material; a heating element for heating the sensor element to operating temperature; and a cavity integrated into the sensor element. The cavity exhibits, in at least one region close to the lateral delimiting surfaces of the cavity, a diameter that is greater than zero and smaller than the diameter in its central region.

Abstract: The electric radiant heater (101) adapted to a cooking hob is attached to the cooking plate (2a) forming with it an air cavity (13) in which the extended heating resistor (105) is housed on an insulating base (104). A peripheral outer wall (3,6) of the heater defines said cavity (13) in which there is a thermal switch (107) positioned, having a bimetal sensor (107c) the compact body (107a) of which rests on a central area (104a) of the insulating base, and its metal heat-receiving base (107b) in a position facing a heating resistor segment (105a) and either very close to or above it making contact. The relative position of the bimetal sensor (107c) enables a switching point (SWC?,SWO?) of the electrical contact (109) to be set in correlation to the hotplate warning light temperature range (TU).

Abstract: A bake station includes a bake plate having a thickness defined by a distance between an upper surface and a lower surface of the bake plate. The bake plate is configured to heat a substrate positioned adjacent the upper surface of the bake plate. The bake station also includes a base plate having a first surface positioned below and opposing the lower surface of the bake plate and a side plate extending between the lower surface of the bake plate and the first surface of the base plate. The side plate, the lower surface of the bake plate, and the first surface of the base plate define a space. The bake station further includes a plurality of nozzles coupled to the base plate. Each of the plurality of nozzles has an inlet configured to receive an input flow of fluid and an exit port configured to expel an exit flow of fluid onto the lower surface of the bake plate.

Abstract: A method of heat-treating resist coated manufacturing wafers in a processing system by establishing a temperature profile for each of a plurality of hotplates in the processing system, heat-treating the resist coated manufacturing wafers on the hotplates, obtaining CD metrology data from test areas on the heat-treated resist coated manufacturing wafers, determining CD variations for each hotplate from the CD metrology data, adjusting the temperature profile of one or more hotplates after determining the CD variations, and heat-treating additional resist coated manufacturing wafers on the hotplates after the adjusting.

Abstract: A cooking range having a motorized stove base (100). Range (100) comprises a cabinet (50) for housing an oven, a range top (54) installed on top of cabinet (50) for providing a cooking platform, at least one stove base (112) installed on top of range top (54) for supporting cooking accessories, a control panel (60) for controlling the operation of range (100), a cooking device (80) disposed on top of range top (54) for cooking food, blending/stirring means (114) installed inside cooking device (80) for blending/stirring food, a motor installed underneath stove base (112) for driving blending/stirring means (114), an adapting member (110) fixedly engaged with cooking device (80) for adapting cooking device (80) to removably stand on stove base (112), a thermostat (122) installed on stove base (112) for detecting and limiting the temperature of the bottom of cooking device (80).

Abstract: A cooking stove that prevents the execution of a process such as ignition of a burner when a touch switch changes from a non-sensing state to a sensing state. In STEP201, when a first touch switch, which is one of the touch switches provided in an operation, is turned on from off, the process advances to STEP202, where a controller provided in a cooking stove main body starts a 1-second timer. The controller executes a loop composed of STEP203 and STEP210. When a second touch switch, which is one of the touch switches and is different from the first touch switch, is turned on from off in STEP210 before the 1-second timer times up in STEP203, the process advances from STEP210 to STEP211. The controller performs “error reporting” by blinking a display portion and activating a buzzer.

Abstract: Temperature sensor device inserted into a radiant heater (1) that incorporates at least one heating resistance (2) and is adapted to a glass ceramic cooking hob (4), comprising a film-type resistive sensor element (11) with metal wires (12) for its connection to terminals (18) and a support element (13) that passes through the radiant heater (1), at least in part. The sensor element (11) is inserted into the free end of said support element (13) so that the top and bottom faces are exposed in relation to said support element (13), and the sensor device also comprises an insulating element (14) disposed beneath the sensor element (11), separated from the support element (13) at least in the area in which the sensor device passes through the radiant heater (1).

Abstract: A cooking stove that prevents a burner from being ignited when a touch switch shifts from a non-sensing to a sensing state. An operation portion having a touch switch is provided on a glass top plate of a cooking stove main body which accommodates burners. The touch switch allowing a user to give instruction on actuation and stoppage of the burners and sensing an object that contacts or approaches the top surface of the glass to plate. Heating control means for determining whether the touch switch is on (a sensing state) or off (a non-sensing state) to control actuation of the heating means. While the burner is at a stop, when the touch switch is turned on and then off again, the heating control means ignites the burner. While the burner is in operation, when the touch switch is turned on, the heating control means extinguishes the burner.

Abstract: A power module to regulate delivery of power to one or more loads is disclosed. The module includes a logic circuit configured to generate one or more control signals indicative of the power level to be applied from an external power supply coupled to the power module to the one or more loads, an electromechanical device configured to electrically connect the external power supply to the one or more loads based on the one or more control signals from the logic circuit, a user-controlled circuit configured to provide a signal indicative of a power level to deliver to the one or more loads, the signal is based on input received from a user-controlled actuator configured to be placed in one of a plurality of positions corresponding to user-provided input, and a housing configured to receive the electromechanical device.

Abstract: A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.

Abstract: Apparatus and methods for achieving uniform heating or cooling of a substrate during a rapid thermal process are disclosed. More particularly, apparatus and methods for controlling the temperature of an edge ring supporting a substrate and/or a reflector plate during a rapid thermal process to improve temperature uniformity across the substrate are disclosed, which include a thermal mass or plate adjacent the edge ring to heat or cool the edge ring.

Abstract: A temperature-limiting device (14) is provided for an electric heater (2), the heater (2) being located behind a heatable surface (4) and comprising a dish-like support (6) having therein at least one electric heating element (12) having first and second terminal regions (12A, 12B). The device comprises thermally responsive bimetallic means (22) provided in a housing (16). The housing (16) is supported at a peripheral region of the heater (2), at least partially externally of the support (6). The bimetallic means (22) is thermally coupled with the heater (2) to sense heat generated therein by the heating element (12) and to respond at a predetermined temperature to operate at least one switch means (18) located in the housing (16).

Abstract: A touch switch which prohibits a child from actuating heating means, while permitting a child to deactivate heating means. A cooking stove including an electrical capacitance operation switch 10 which switches the cooking stove between an operation state in which an ignition instruction is enabled and a standby state in which the ignition instruction is disabled; the operation switch is used to instruct the cooking stove to be extinguished. When the cooking stove is inactive, a switch circuit 63 selects a resistance element 61 offering a higher resistance to set the cooking stove in a “lower sensitivity set state” in which the operation switch 10 has a sensitivity sl. When the cooking stove is active, the switch circuit 63 selects a resistance element 62 offering a lower resistance to set the cooking stove in a “higher sensitivity set state” in which the operation switch 10 has a sensitivity sh (>sl).

Abstract: A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate.

Abstract: A method and processing system for controlling and rapidly lowering the temperature of a hotplate used for supporting and heat-treating wafers. The method includes maintaining the hotplate at a first hotplate temperature by applying a first heating power to the hotplate and heat-treating a wafer on an upper surface of the hotplate, removing the heat-treated wafer from the upper surface, exposing the upper surface to an inert gas stream for rapid cool down of the hotplate from the first hotplate temperature to a second hotplate temperature, and maintaining the hotplate at the second hotplate temperature by applying a second heating power to the hotplate and heat-treating another wafer on the upper surface of the hotplate.

Abstract: Provided is a heating cooker which includes a body constituting an appearance thereof, an upper panel on which a cooking container is laid, a heater positioned under the upper panel to heat the cooking container laid on the upper panel, a fan housing liftably positioned at one side of the body to be raised above the upper panel and having an air intake port and an air discharge port, a blast fan and a fan motor positioned in the fan housing to forcibly blow air toward a surface of the upper panel, a fan housing lifter to raise and lower the fan housing, a temperature sensor to detect the temperature of the upper panel, and a controller to control the heater, the fan motor, and the fan housing lifter. The upper panel heated by the heater can be forcibly cooled by air from the fan housing.