Abstract: A bladed rotor wheel of an aero turbine stage includes a portion of a rotor blade with a shank portion and a bottom surface; a portion of a forged rotor disk with a rim portion and an outer surface; and a joining structure provided by an additive manufacturing process configured for integrally merging the portion of a rotor blade with the portion of a forged rotor disk. An aero turbine can include such bladed rotor wheel, and an aircraft can include such aero turbine.

Abstract: A method of determining a bonding status between a wire and at least one bonding location of a workpiece is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) determining a motion profile of the bonding tool for determining if the portion of the wire is bonded to the bonding location, the motion profile being configured to result in the wire being broken during the motion profile if the portion of the wire is not bonded to the bonding location; and (c) moving the bonding tool along the motion profile to determine if the portion of the wire is bonded to the bonding location. Other methods of determining a bonding status between a wire and at least one bonding location of a workpiece are also provided.

Abstract: The present disclosure relates to a concept for checking at least one solder joint between a printed circuit board and a current sensor, including: measuring, by means of the current sensor, an electric current through the solder joint; measuring at least one temperature of the current sensor as a function of the electric current; and ascertaining a quality of the solder joint based on the temperature and the electric current.

Abstract: To provide a fitting member, an annular member, a joined member and a method of manufacturing the joined member, which prevent occurrence of a not-joined portion. A fitting member 10 has a fitting protrusion 10p which is protruded outward on an outside face 10s. An annular member 20 contains a space 20h in which the fitting member 10 is to be fitted. An annular member 20 has an annular protrusion 20p on an inside face 20f. When the fitting member 10 is fitted into the space 20h at a predetermined depth, the fitting protrusion 10p and the annular protrusion 20p fill not-joined portions which may be generated assuming that they are not provided. A joined member 30 is produced by fitting the fitting member 10 into the space 20h at the predetermined depth, so that a contact portion between the fitting member 10 and the annular member 20 is joined in solid phase.

Abstract: The abutment portion touches with a shoulder surface of a joining tool for friction stir welding. The tip portion is freely movable in a first direction connecting a surface of the workpiece and the shoulder surface in a state of contacting the surface of the workpiece. The detector is configured to detect a position of the tip portion in the first direction. The output unit is configured to output a data of the position of the tip portion in the first direction detected by the detector. The controller is configured to calculate a position of the tip portion to the abutment portion from the data of the position output from the output unit, and to calculate a distance between the shoulder surface of the joining tool and the surface of the workpiece.

Abstract: Method of assembly of a first element (I) and a second element (II) each having an assembly surface, at least one of the assembly surfaces comprising recessed metal portions (6, 106) surrounded by dielectric materials (4, 104) comprising: A) a step to bring the two assembly surfaces into contact without application of pressure such that direct bonding is obtained between the assembly surfaces, said first and second assemblies (I, II) forming a stack with a given thickness (e), B) a heat treatment step of said stack during which the back faces (10, 110) of the first (I) and the second (II) elements are held in position so that they are held at a fixed distance (E) between the given stack thickness+/?2 nm.

Abstract: A plurality of test pads are formed on a first substrate or a second substrate. A plurality of first solder joints are reserved on a first surface of the first substrate, and each of the first solder joints is coupled to at least a test pad or to another first solder joint through at least a first trace. A plurality of second solder joints are reserved on a second surface of the second substrate. Each of the second solder joints is coupled to at least a test pad or to another second solder joint through at least a second trace. A plurality of dummy solder balls are formed between the first solder joints and the second solder joints. Probes are coupled to the test pads to measure circuit characteristics between the test pads.

Abstract: Disclosed is a phased array ultrasound total focusing method in which the ultrasound energy is transmitted as plane waves and the response signals are processed as plane waves. The processing is adaptively corrected to account for geometric variations in the probes and the part being inspected. Methods are disclosed for measuring the geometric variations of the probes and the part.

Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Abstract: A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.

Abstract: A system for testing bonded joints that comprises a swing tool, an actuator, pressure measuring device and a first fixing arrangement. The actuator of the system is configured to apply a compression force or a traction force on the swing tool in order to separate two elements, and the pressure measuring device is configured to measure the force applied on the swing tool. A method for testing bonded joints using the system is also provided.

Abstract: A method for joining materials such as metal alloys that includes a first component, wherein the first component includes a first alloy having a known austenization temperature below which martensite forms when the component is heated and then cooled at a predetermined rate of cooling; a second component, wherein the second component includes a second alloy; and a welding apparatus operative to create a weld between the first and second components without crossing the austenization temperature of the first alloy. The method also includes the steps of validating the characteristics of the weld created between the first and second components in real-time during the welding process; modifying the welding apparatus to prepare the surface of the first component prior to welding to assure proper alignment of the first and second components; and/or physically modifying the second component to enhance the welding characteristics and durability thereof.

Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

Abstract: The invention relates to a surface inspection device; more specifically to the inspection of complex geometry welded joints. There is provided a device suitable for structural health monitoring of a surface said device comprising; a guide rail and a platform comprising at least one sensor, wherein said platform is cooperatively engaged with said guide rail, when said platform traverses along the rail.

Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

Abstract: A method of fabricating a near-net shape erosion shield, a method of forming a shielded article, and a near-net shape erosion shield are provided. The method of fabricating a near-net shape erosion shield includes providing a base, positioning an energy source relative to the base, and depositing at least one wear resistant material over the base with an energy beam from the energy source. The at least one wear resistant material deposited on the base forms the near-net shape erosion shield configured to be positioned on a turbine component. The method of forming a shielded article includes removing the base from the near-net shape erosion shield, and securing the near-net shape erosion shield to a turbine component. The near-net shape erosion shield includes a near-net shape erosion-resistant portion configured to be positioned on a turbine component.

Abstract: Various embodiments provide a semiconductor device, wherein the semiconductor device comprises a semiconductor device chip formed at a substrate, wherein the semiconductor device chip comprises an active region formed in a center of the substrate and a boundary region free of active components of the semiconductor device chip; and a detection wiring arranged in the boundary region of the substrate and at least partially surrounding the active region, wherein the detection wiring and the semiconductor device chip are electrically isolated from each other; and wherein the detection wiring and the substrate are electrically connected with each other via a connection having a high electrical resistance.

Abstract: A fuel injector for a combustor assembly for a gas turbine engine is disclosed. The fuel injector includes a first component, a second component, and a braze layer. The first component has a sidewall. The second component also has a sidewall. The braze layer is formed between the sidewall of the first component and the sidewall of the second component. The braze layer is being formed from a Nickel (Ni) alloy brazing material containing non-metallic constituents. The braze layer also has a eutectic-free region with substantially all of the non-metallic constituents diffused away from a centerline area between the first component and the second component.

Abstract: A fiberscope comprises a scintillator arranged to produce light of a first wavelength upon exposure to radiation; an optical system arranged to receive and direct light of the first wavelength emitted from the scintillator, the light being received at one end of the optical system, and wherein one or more elements of the optical system emits scintillation light of a second wavelength upon exposure to radiation; and an optical filter, disposed at the other end of the optical system, and arranged to transmit light of the first wavelength and block light of the second wavelength. The scintillator is chosen such that the light of the first wavelength is spectrally distinct from the light of the second wavelength.

Abstract: A phased array ultrasonic probe may be mounted to a component to be inspected for wall thickness on an apparatus that includes a split ring adapted to be magnetically held in place on the component. In particular, the probe may be mounted to a carriage connected to the split ring in a manner that allows the carriage to rotate around the split ring while the probe is in operation. Between the probe and the component, a transducer shoe defining, by a flexible membrane, a cavity and an aperture. Conveniently, the construction of the flexible membrane allows wall thickness measurements to be acquired in portions of the component that have complex topography, such as welds. The apparatus is installed on an adaptor assembly for inspection of straight section of pipes. This adaptor assembly is not used in absence of straight section.

Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. If a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.

Abstract: A heat assisted magnetic recording (HAMR) write apparatus coupled with a laser is described. The HAMR write apparatus includes a pole, coil(s), a near-field transducer (NFT), and a dielectric gap. The pole writes to the media. The coil(s) energize the pole. The waveguide is optically coupled with the laser and directs energy toward the ABS. The NFT is optically coupled with the waveguide and includes a metal nose and a metal cap. Part of the metal cap adjoins part of the main pole. The dielectric gap is between a first portion of the NFT and the main pole. The dielectric gap has a media-facing surface and back, top, bottom and side surfaces. The top surface adjoins the main pole. The bottom surface adjoins the first portion of the NFT. The side surfaces adjoin a second portion of the NFT. The back surface adjoins a portion of the metal cap.

Abstract: A repair patch for reworking an inconsistent area of a composite structure includes a patch body adapted to cover the inconsistent area and having a first patch region, a second patch region outside the first patch region and a first separation zone between the first patch region and the second patch region, with the first patch region, the first separation zone and the second patch region having increasing interlaminar fracture toughness from a center to an edge of the patch body; and a layer of adhesive for bonding the patch body to the composite structure.

Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.

Abstract: Provided is a wire-bonding apparatus (10) including: a capillary (28) through which a wire (30) is inserted; a nonsticking determination circuit (36) configured to apply a predetermined electrical signal between a bonding target and the wire (30) in a clamped state and to determine whether or not the wire (30) and the bonding target is sticking as well as whether or not the wire (30) is disconnected based on a response of the application of the predetermined electrical signal; an annular projecting length detection ring (40) disposed coaxially with the capillary (28); and a projecting length determination circuit (38) configured to determine whether or not a projecting length of a wire tail projecting from the tip of the capillary (28) is appropriate based on detection on whether or not power is conductive when a predetermined inspection voltage is applied between the wire (30) and the projecting length detection ring (40) as well as a presence of a discharge spark when a predetermined inspection high voltage

Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode under the first semiconductor layer, a reflective electrode layer under the second conductive semiconductor layer, a second electrode under the reflective electrode layer, and a support member under the first semiconductor layer and the reflective electrode layer around the first and second electrodes. A first connection electrode may be provided under the first electrode. At least a part of the first connection electrode is provided in the support member. A second connection electrode may be provided under the second electrode At least a part of the second connection electrode may be provided in the support member.

Abstract: A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

Abstract: An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.

Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract: An efficient, cost-saving system and method of designing, installing, testing, and monitoring a secondary containment system for new and existing Above Ground Storage Tanks (ASTs) that is comprised of a protective steel membrane for the floor of the tank, including the floor-to-wall juncture, and the lower portion of the tank shell such that the steel membrane creates one or more interstitial zones between the steel membrane and the tank shell. The steel membrane may be installed zone by zone such that the secondary containment system can encapsulate existing tank features by molding itself around the existing contours, such as repair plates, corners, sumps, etc. Furthermore, a unique testing method using a simple electronic device is provided for on-site testing of the integrity of the weld seams that may be efficiently used after each zone is installed without requiring that the entire tank be evacuated during the construction of other zones.

Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.

Abstract: A method of manufacturing an article by hot pressing and ultrasonically inspecting the article comprises forming and filling a canister with powder material and evacuating and sealing the canister. Heat and pressure are applied to the canister to consolidate the powder material to form the article. The article within the canister is ultrasonically inspected by moving a transducer over the whole of the canister. The position of an interface between the article and the canister, and the thickness of the canister, at each position on the surface of the canister and if there are defects within the article are determined. The canister is then removed from the article by machining the canister using a machining tool, the movement of the tool is controlled such that at each position of the canister the tool removes the determined thickness of the canister for the corresponding position on the surface of the canister.

Abstract: A method of fabricating a module for an airframe or fuselage structure of an aircraft or spacecraft includes positioning a first member adjacent to a second member at an assembly station; welding the first member to the second member at the assembly station to produce a module having a welded joint between the first and second members; and peening at least one of the first member, the second member, and the welded joint at the assembly station to compensate for or to correct distortion caused by the welding.

Abstract: An aluminum welding system includes a welding machine configured to weld a workpiece with an aluminum nugget and a measurement device configured to measure an attribute of at least one of the aluminum nugget and a welding process. The system further includes a processing device configured to output a weld quality signal representing a quality of an aluminum weld based at least in part on the attribute measured. A method includes measuring an attribute of at least one of an aluminum nugget forming a joint of a workpiece and a welding process, determining a quality of an aluminum weld based at least in part on the attribute measured, and outputting a weld quality signal representing the determined quality.

Abstract: A welding wire formed of a trace boron titanium base alloy is provided, along with welds formed from the wire and articles comprising one or more of such welds. A method may include forming such a weld or welds from such a welding wire, and may also include non-destructively inspecting titanium alloy articles comprising one or more of such welds using ultrasonic waves to detect internal flaws.

Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.

Abstract: Systems and methods for fabricating multi-functional articles comprised of additively formed gradient materials are provided. The fabrication of multi-functional articles using the additive deposition of gradient alloys represents a paradigm shift from the traditional way that metal alloys and metal/metal alloy parts are fabricated. Since a gradient alloy that transitions from one metal to a different metal cannot be fabricated through any conventional metallurgy techniques, the technique presents many applications. Moreover, the embodiments described identify a broad range of properties and applications.

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract: A braze preform is provided that includes a filler metal and a luminescent material that covers at least a portion of the filler metal and that can luminesce when exposed to a black light. The luminescent material may include a luminescent ink and a solvent that are mixed together before being applied to filler metal. Presence of the braze preform may be determined using automated equipment by detecting luminescence of the braze preform with a sensor. A decision may be made on whether to advance a parts assembly for brazing based on the determination of presence or absence of the braze preform on such parts assembly.

Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.

Abstract: A pipeline is a pipeline having plural weld zones in which ends of plural steel pipes are joined by welding, the plural steel pipes are produced from plural charges of molten steel having one or more steel compositions; yield point elongation is not present on a stress-strain curve obtained when stress is applied in a longitudinal direction of each of the steel pipes; a thickness of each of the steel pipes t (mm) and an average pipe outside-diameter D (mm) satisfy t/Dx100?6; and in the plurality of the weld zones, ?YS which is a yield strength difference between one steel pipe and the other steel pipe that are welded to each other (MPa), and YR representing a yield ratio that is a ratio of the yield strength to tensile strength of a pipe having a low yield strength out of the one steel pipe and the other steel pipe, satisfy ?YS??1.75×YR+230.

Abstract: A method of performing a wire bonding operation is provided. The method includes the steps of: (a) performing a wire bonding operation between a portion of wire and a bonding location using a bonding tool; (b) raising the bonding tool to a desired height; (c) performing a test to determine if the portion of wire is sufficiently bonded to the bonding location; and (d) automatically performing another wire bonding operation between the portion of wire and the bonding location using the bonding tool if, during step (c), it is determined that the portion of wire was not sufficiently bonded to the bonding location in step (a).

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. if a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.

Abstract: A housing includes first and second housing elements, each of which is heat conductive. The housing elements are joined by a joining process in which a joining material is configured between the first and second housing elements and at least one of the housing elements is heated such that the joining material is conditioned for the joining of the housing elements. At least one of the housing elements has a localized reduction in the heat conductivity such that the dissipation of heat in the at least one housing element is reduced.

Abstract: A ternary magnetic braze alloy and method for applying the braze alloy in areas having limited access. The magnetic braze alloy is a nickel-based braze alloy from the perminvar region of the Ni, Fe, Co phase diagram. The braze alloy includes, by weight percent 8-45% Fe, 0-78% Co, 2.0-4.0% of an element selected from the group consisting of B and Si and combinations thereof, and the balance Ni. The nickel-based braze alloy is characterized by a brazing temperature in the range of 1850-2100° F. The nickel-based braze alloy is magnetic below its Curie temperature.

Abstract: To provide a bonding apparatus capable of increasing product quality by realizing high-precision control of a pressing force applied upon mounting of an electronic component on a substrate by bonding, and to a bonding method capable of providing high-quality products stably. The bonding apparatus includes: at least a bonding head 100 for pressing an electronic component 6 against a substrate 1 to bond it to the substrate 1; a plurality of load detection mechanisms (e.g., load sensors 5) substantially equally spaced so as to face one another under a substrate stage S supporting the substrate 1 provided with the electronic component 6; and a pressure detection unit 20 for detecting pressing force at the bonding surface between the electronic component 6 and substrate 1 on the basis of the pressure values detected by the individual load detection mechanisms 5.

Abstract: The compressor fittings, both suction and discharge, of a compressor can have braze rings positioned inside of the fittings as part of the compressor assembly. The braze ring can then be used by an installer to connect the compressor to corresponding suction and discharge lines of a system. The installer can insert the system tube or connection into the fitting and apply a torch until braze material can be seen exiting the joint around the system tube, which indicates the tube has been connected.

Abstract: A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again.