Abstract: A method for inspecting welds between welded tubular ends includes arranging a series electromagnetic acoustic transducer (EMAT) assemblies in circumferential direction adjacent to an inner and/or outer surface of at least one of the welded tubular ends and inducing the EMAT assemblies to transmit sequentially or simultaneously acoustic shear wave signals towards the weld and to detect the shear waves reflected by and/or passing through the weld while the EMAT assemblies are maintained in a substantially fixed position relative to the weld such that at least a substantial part of the weld is scanned by the EMAT assemblies instantly after the weld is made.

Abstract: An apparatus for performing a pull test to determine the resistance of a bonded-wire loop extending between two bond contacts on a substrate to tensile force. The apparatus includes a traction hook controllably inserted under the bonded-wire loop, a drive device connected to the hook and generating a tensile force directed substantially perpendicular to the substrate surface, a force-measurement device associated with the hook to detect the tensile force at each moment, and a recording device connected to the force-measurement device in order to record a breaking force value for the bonded-wire connection. The force-measurement device is disposed substantially coaxially with the vector of the tensile force. The apparatus also includes a detector to detect the highest point of bonded-wire loop and a position controller for the automatic positioning of the traction hook and thus the tensile force vector origin substantially adjacent the highest point of the bonded-wire loop.

Abstract: A method for testing soldering quality is provided for determining the solder quality of pins, leads, a connector or an electronic component mounted on a circuit board. A soldering contact, soldered to the circuit board, is enclosed by melted solder during soldering and generate a different color from that before soldering. The color difference allows the soldering quality of the soldering contact to be determined by visual inspection and prevents inferior products from entering subsequent fabrication processes, thereby improving the soldering reliability.

Abstract: The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasound source (14). During a first welding process (n1), a signal processing (30)) determines a first ultrasonic permeability (Dn1) from a received ultrasonic signal (UE). During at least one subsequent welding process (n2), a second ultrasonic permeability (Dn2) is determined from an ultrasonic signal (UE) that is received during a renewed exposure of the welding area (18, 21, 22) to ultrasonic waves. A display (32) and/or a diagnostic function and/or a correction of control quantities of the welding system is/are carried out as a function of the at least two ultrasonic permeabilities (Dn1, Dn2).

Abstract: Methods for producing toughness-optimized weld joints are provided. A welding procedure that will provide adequate toughness for the center-weld of the weld-joint is developed and used, and a welding procedure that will provide adequate toughness for the surface-weld of the weld-joint is developed and used.

Abstract: A rotary tool (140) is relatively moved against members (30, 30) to be welded so as to perform friction stir welding of said members, while blades (145) mounted on the rotary tool (140) and a rotary brush (220) are used to cut the welded portion, and swarfs on the cut surface are removed through a suction opening (225), before medium liquid is supplied on said cut surface through a supply opening (240). Next, an inspection roller (250) is rotated on the surface of the welded portion for inspection. A probe (251) is provided within the roller (250). Upon detecting a defect, paint is applied to the position of defect by a marking device (270). Thereafter, based on said marking, the joint portion is cut and repaired by welding.

Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.

Abstract: A method for connecting an electronic components to a carrier substrate is described. At least one pad of the component is connected electrically conductively to at least one pad on an upper surface of the carrier substrate. A solder bump is deposited on at least one of the pads to be connected, the component is alignedly mated with the carrier substrate, and the at least one solder bump is soldered in order to wet the contact surfaces. It is provided that during the soldering, the at least one solder bump is deformed within the contacting plane in such a way as to achieve a degree of deformation that permits the two-dimensional analysis of said degree of deformation by a radiograph of the interconnection site.

Abstract: An apparatus for detecting whether bonding wire supplied to an ultrasonic bonding tool of an ultrasonic bonding machine is present in a bore of the tool tip and providing an alarm signal if a wire segment normally within the bore is absent because of inadvertent breakage or misfeeding of the wire includes an electronic switching and detection module connected between a machine ground terminal connected to a wire supply reel and a bonding tool electrically isolated from the machine ground. In response to an enable signal input to the module prior to making the first of a pair of ultrasonic bonds to interconnect a pair of binding sites by a bonding wire, electronic switching means within the module electrically isolate the machine ground from the tool, and electric continuity detection means within the module determines whether the tool has been brought to voltage level near that of the machine ground by electrical conductive contact between the wire segment within the tool bore, and the bore wall.

Abstract: In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 and an indicator 8 for displaying an output signal from the ultrasonic detector 7, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.

Abstract: A printed circuit board comprises plural electronic parts, a printed-wiring board for mounting the plural electronic parts mounted thereon, and soldered portions provided on the printed-wiring board, wherein the soldered portion connects electrically the printed-wiring board and the electronic part by solder, and a soldered portion to be restored is assigned according to a failure data derived in a preliminary reliability test of a printed circuit board, and the assigned soldered portion is subjected to re-soldering. A method for restoring a printed circuit board comprises steps: recovering a printed circuit board used in market having plural electronic parts mounted through solder at soldered portions provided on a printed-wiring board, assigning soldered portions to be restored according to a failure data derived in a preliminary reliability test of a same printed circuit board, and carrying out a re-soldering at the assigned soldered portion.

Abstract: A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.

Abstract: A groove shape and an inspection method capable of securely recognizing existence of a weld flaw of a single butt weld zone by a nondestructive inspection, such as a radiograph test or an ultrasonic test, are provided. A groove shape where a concave portion 5 is formed on a butt surface 1b and a butt surface 2b of pipes 1, 2 which are weldments to be welded is prepared and the weld zone welded by single butt welding is inspected by a nondestructive inspection such as a radiograph test or an ultrasonic test.

Abstract: A method and apparatus for automated, non-destructive evaluation of spot welds includes a device for heating a sample containing a spot weld, an infrared camera for detecting changes in the surface temperature of the weld, and a computer to acquire and analyze data from the camera. In one embodiment, the sample is heated on one side and the time-temperature characteristic is monitored as the heat travels through the sample and the spot weld. The computer generates a histogram that represents the relationship between a particular time-temperature characteristic and the number of pixels exhibiting that characteristic, thereby representing the quality and size of the weld nugget. By generating a histogram corresponding to weld quality, the inventive apparatus and method provides an objective weld quality indicator and allows automation of the evaluation process.

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract: A method and assembly for testing multiple IC packages for solder joint fractures that occur in response to thermal cycling. A test PCB is fabricated with contact pads arranged to match a BGA IC package footprint, wherein pairs of the contact pads are linked by conductive traces (lines) to form a lower portion of a daisy chain. The BGA IC package is modified to link associated pairs of solder balls, e.g., using wire bonding to form an upper portion of the daisy chain. Mounting the BGA IC package on the test PCB completes the daisy chain. By alternating between the test PCB contact pads that are linked by conductive traces and the solder balls that are linked by wire bonding, the daisy chain provides a conductive path that passes through all solder balls of the BGA IC package.

Abstract: A rotary tool 140 is relatively moved against members 30, 30 to be welded so as to perform friction stir welding of said members, while blades 145 mounted on the rotary tool 140 and a rotary brush 220 are used to cut the welded portion, and swarfs on the cut surface are removed through a suction opening 225, before medium liquid is supplied on said cut surface through a supply opening 240. Next, an inspection roller 250 is rotated on the surface of the welded portion for inspection. A probe 251 is provided within the roller 250. Upon detecting defect, paint is applied to the position of defect by a marking device 270. Thereafter, based on said marking, the joint portion is cut and repaired by welding.

Abstract: A liquefiable gas pressure cylinder and method for making the same with the cylinder including a cylindrical shell, and heads fusion welded at opposites ends of the shell. The side ends where the heads are joined to the shell are crimped radially inward to each end to form chimes. The welds are 100% radiographed and heat treated. The heads are dished to have a domed center portion which has a profile and thickness so that the domed center portions will reverse before any other part of the cylinder is stressed beyond a yield limit for such part.

Abstract: A groove shape and an inspection method capable of securely recognizing existence of a weld flaw of a single butt weld zone by a nondestructive inspection, such as a radiograph test or an ultrasonic test, are provided. A groove shape where a concave portion 5 is formed on a butt surface 1b and a butt surface 2b of pipes 1, 2 which are weldments to be welded is prepared and the weld zone welded by single butt welding is inspected by a nondestructive inspection such as a radiograph test or an ultrasonic test.

Abstract: A circuit that senses changes in the electrical characteristics of one or more solder joints, and generates one or more signals based, at least in part, on the electrical characteristics that are sensed, is incorporated into an integrated circuit. In a further aspect of the present invention, the one or more signals generated by the circuit are indicative of the reliability of the solder joints. Embodiments of the present invention provide a warning in advance of system failure, permitting repair or replacement of a failing unit/joint before a failure becomes catastrophic. Embodiments of the present invention include structures and circuitry that can determine whether solder joint failure has occurred, and that can communicate the occurrence of solder joint failure to other components or systems.

Abstract: A groove shape and an inspection method capable of securely recognizing existence of a weld flaw of a single butt weld zone by a nondestructive inspection, such as a radiograph test or an ultrasonic test, are provided. A groove shape where a concave portion 5 is formed on a butt surface 1b and a butt surface 2b of pipes 1, 2 which are weldments to be welded is prepared and the weld zone welded by single butt welding is inspected by a nondestructive inspection such as a radiograph test or an ultrasonic test.

Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detects the emission. An image processor generates output data indicating flux volume according to a relationship between emission intensity and volume over the surface of the flux. Intensity non-uniformity indicates either height non-uniformity or hidden voids, both of which give rise to defects after application of solder paste and reflow. The inspection is particularly effective for pre solder application flux inspection.

Abstract: Detection of flux residue remaining the formation of a device/substrate assembly is carried out by contacting the assembly with a fixed amount of solvent adapted to remove residual flux from the assembly and measuring the conductivity or resistance of the contacted solvent to determine the presence of flux residue in the solvent obtained from the assembly. Embodiments include contacting the assembly with isopropanol by immersing and withdrawing the assembly in a fixed amount of the solvent and measuring the conductivity of the contacted solvent with a volt meter.

Abstract: An apparatus for the concurrent inspection of partially completed welds is described in which is utilized in combination with a moveable welder for forming a partially completed weld, and an ultrasonic generator mounted on a moveable welder in which is reciprocally moveable along a path of travel which is laterally disposed relative to the partially completed weld.

Abstract: In diffusion bonding a metal pipe 112e and a metal pipe 114e via a bonded interface 116e formed at the end parts, a portion that is inclined with respect to the radial direction of metal pipes 112e and 114e is provided at least at part of bonded interface 116. In this case, the inclination angle &phgr; of bonded interface 116e and the tip angle 2&thgr; of a pipe expansion tool 130 are preferably in the relationship, 0<&phgr;≦&thgr;+60°. In performing pipe expansion of such a metal pipe bonded body 110e, the pipe expansion tool 130 is moved from the metal pipe 112e, at which the inclined portion of junction face 116e is formed to have a protruding shape, towards the metal pipe 114e, at which the inclined portion of junction face 116e is formed to have a recessed shape. Furthermore, the inner diameter at the vicinity of the junction face of the metal pipe junction may be made larger than the inner diameter at positions away from the junction face.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: A method of inspecting the H1 weld between the shroud head flange and the upper shroud section utilizing ultrasonic scanning includes the steps of positioning a phased array ultrasonic probe on a top surface of the shroud head flange, emitting an ultrasonic beam from the ultrasonic probe, electronically steering the ultrasonic beam to scan the weld joining the shroud head flange and the upper shroud section with the beam moving from an outer surface of the shroud head flange to an inner surface of the shroud head flange, and acquiring scan data over the length of the scan. The ultrasonic probe is moved circumferentially along the top surface of the shroud head flange in increments of between about 0.05 inch to about 0.5 inch with the H1 weld ultrasonically scanned after each incremental move.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: A quality control method for ultrasonic wire bonding is provided wherein the deformation of the wire to be bonded to a contact surface is substantially constantly monitored. The method includes generating an ultrasonic output table. In the table, the current status of the bonding process is represented as a function of the gradient of deformation of the wire, the impedance of the transducer-bond wedge unit, as well as the currently reached deformation of the wire. The desired gradient of deformation of the wire, a function of the particular status of the process, is specified as the desired value. A correcting variable for the ultrasonic generator is calculated by the addition of correction values formed in the controller to the respective current table values.

Abstract: A method for examining bonded-metal by ultrasonic examination, the method comprising a step of measuring an attenuation amount of an ultrasonic wave, the ultrasonic wave being generated by a sending probe and received by a receiving probe through a bonding interface, the sending probe and the receiving probe being disposed on the bonded-metal with putting the bonding interface therebetween, the bonded-metal being bonded under unknown condition, and a step of examining a bonding property of the bonded-metal based on the attenuation amount, with utilizing a relationship between a bonding property and an attenuation amount for standard metal bonded under known condition measured preliminarily.

Abstract: A method and an arrangement for measuring the cooling rate and thermal gradient between the top and bottom surfaces of a printed circuit board. Moreover, it is intended to facilitate control over the temperature gradient which is encountered between the top and bottom of the PCB so as to prevent warpage thereof during the formation of solder joints in a reflow solder oven.

Abstract: A wire bonding method and apparatus implement the flatly thinner plastic deformation for the joint section of a wire, which has a diameter ranging 100-600 &mgr;m, on its feed side, feed out and position the flatly deformed wire joint section to a target joint surface, and join the wire to it by pressing the positioned wire joint section, with vibration being applied, onto the joint surface with a ultrasonic wire bonder. A high-power semiconductor device fabricated based on this scheme has a long life of wire joints.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.

Abstract: A method of checking a wirebond condition is provided, wherein the wirebond condition results from the bonding of a conductive wire to an object such as a semiconductor chip and a lead. The wire is guided by a bonding tool. According to the checking method, first, a first position of the bonding tool is detected when the bonding of the wire is completed. Then, a pulling force, which is small enough to prevent breakage of the wire, is applied to the wire. In this state, a second position of the bonding tool is detected. Finally, the first and the second positions of the bonding tool are compared with each other.

Abstract: A process for profiling solder joints of circuit boards including solder bumps is provided using an arrangement with a thin tape element with length and width dimensions generally corresponding to the length and width dimensions of the ball grid array (BGA) and with a registration portion. Thermal couple probes are positioned on the element at locations corresponding, based on the registration portion, to critical locations of the BGA requiring profiling. The element is disposed underneath the BGA and secured in position with the element in registration with the solder bumps on the BGA and with the plurality of thermal couples connected to the element such that the thermal couples are positioned corresponding to the critical locations requiring profiling. The tape element may be kapton tape. The registration may be provided with a portion of the element having holes, each hole being of a size to go over a solder bump on the BGA.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Abstract: A method for detecting the location of an edge, interface, seam or other structure of a workpiece uses one or two electromagnetic acoustic transducers (EMATs) to transmit an ultrasonic wave along the workpiece toward the edge and to receive a reflected wave. The velocity of the wave in the material is used in conjunction with the round trip time-of-flight (TOF) of the transmitted and reflected wave, to calculate the location of the edge. This is done by placing the transducer or transducers at known locations on the workpiece. A surface wave or 90 degree shear wave can be utilized and no contact is needed between the transducer and the surface of the workpiece. Rough and/or dirty surfaces and hostile environments can be accommodated while practicing the invention.

Abstract: An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

Abstract: A method of forming a structural member by connecting end-to-end first and second tubular structures, with each tubular structure having an inner tubular member (1a, 1b) located within a co-extending outer tubular member (3a, 3b) . The inner tubular member (1a, 1b) is longer than the outer tubular member (3a, 3b). The inner and outer tubular members (1b, 3b) of the second tubular structure are movable relative to each other in an axial direction.

Abstract: Disclosed is a weld inspection system that utilizes an automated digital radiographic camera and control system to generate and review digital X-ray images of the weld seam. The weld inspection system is mountable onto the weld fixture, such that the weld inspection system can inspect welds upon completion of welding operations while the barrel panels are still clamped in the weld fixture. The digital radiographic camera includes a fiber optic scintillator x-ray to light conversion screen coupled to a high resolution charged coupled device (CCD) camera to produce digital radiographic images of a portion of the weld between welded barrel panels. An X-ray source is located in a shielded housing which is attached to a carriage that is movably mounted to the vertical weld fixture on the convex side of the barrel weld. The digital radiographic camera is attached to a carriage that is movably mounted to the vertical weld fixture on the concave side of the barrel weld.

Abstract: A method of assembling an igniter (24) for a gas generating composition (18) comprises providing a pair of spaced apart electrodes (40 and 42) and providing a heat ignitable material (46). A heating element (44) is spot electrical resistance welded to the electrodes (40 and 42). The heating element (44) has flattened portions (110 and 112) at the spot welds (102 and 104) and a central portion between the spot welds (102 and 104) adapted for contact with the heat ignitable material (46). A test level of electric current is directed between the electrodes (40 and 42) and through the heating element (44) and the spot welds (102 and 104) at a level effective to heat the heating element (44) and the spot welds (102 and 104). The level infrared radiation emitted by the heating element (44) and the spot welds (102 and 104) is sensed, throughout a scanned field which fully encompasses the heating element and the welds, under the influence of the test level of electric current.

Abstract: Apparatus (2) for measuring the quality of spot welds, comprising a housing (4); a fluid medium (6) in the housing (4); transmitter means (8) for transmitting at least one ultrasonic pulse through the fluid medium (6) to a spot weld (10), the ultrasonic pulse then reverberating in the spot weld (10); and receiver means (16) through which the ultrasonic pulse passes on its way to the spot weld (10), the receiver means (16) being ultrasonically sensitive so that it is able to receive echoes from the spot weld (10) by the reverberation of the ultrasonic pulse in the spot weld (10), the receiver means (16) comprising a plurality of ultrasonically sensitive elements (18), and the receiver means (16) being such that during use of the apparatus (2) the receiver means (16) is located adjacent the spot weld (10).

Abstract: The display screen (11) is made of pixels (P) connected to one edge (11a) of the screen by wires (12) separated by a given pitch (s) so as to be controlled by respective terminals (18) of integrated circuits (16) outside the screen. The terminals (18) of each integrated circuit are disposed in a plurality of parallel rows (19) in which they are separated from one another by a pitch (Sm) equal to several times the pitch of the wires. Each integrated circuit is mounted on a connecting support (10) formed by an insulating film (21) carrying conductive tracks (23) connecting the terminals of the integrated circuit to the corresponding wires of the screen, the tracks extending substantially at the pitch of the wires. The mounting is done simply by collective reflow of bumps between the tracks (23) and the terminals (18), and the support (10) makes it possible to test the integrated circuits before they are mounted on the screen.