Abstract: A rectification column for multi-component mixture separation with internal heat and mass exchange, which ensures a heat and mass exchange in the film mode with internal reflux generation along the whole length of heat and mass exchange tubes and which allows for an increased efficiency, is proposed. The rectification column includes the rectifying/enriching section with the heat and mass exchange in its tubular and annular spaces being topped by a heat carrier distributor with a distributor chamber (17) on top of the heat carrier distributor in such a way that a higher pressure of fluid heat carrier in the distributor chamber (17) than in the annular space is allowed. The design of the distributor allows to separate an upper outlet for heat carrier vapors and a lower outlet for liquid heat carrier from the annular space completely from the fluid supply of fluid heat carrier in the distributor chamber. A feed-in device allows the multi-component mixture to enter the tubular spaces from below.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: A wheel resurfacing method and system for resurfacing a worn track wheel to its original profile are disclosed. The system comprises a support for maintaining the worn railway wheel, a welding device, a controller, and a surface processing device. The worn railway wheel's circumferential surface defining a flange and a tread surface is reconstituted using a welding material. The welding device and the worn railway wheel rotate one relative to the other at a predetermined rate to adaptively aggregate annular welding beads along the circumferential surface to form a curvilinear profile slanted away from the flange. A surface processing device is then applied to the welded layer to form a substantially uniform surface to reconstitute the worn railway wheel to its original profile.

Abstract: Disclosed is a print technology in which a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate onto which the lower surface of a mask is placed. A forward print process where solder is applied by driving a squeegee in a predetermined forward direction relative to a mask, and a backward print process where the solder is applied by driving the squeegee in a returning direction opposite to the forward direction are switched alternately. When the squeegee passes through the solder pool on the downstream side in a moving direction before switching in the course of switching from any one of the forward and backward print processes to the other one of these processes, the amount of solder in the solder pool is measured. Based on the amount of solder thus measured, the necessity of replenishing solder is determined. The solder pool is supplemented with solder, based on the result of the decision on whether solder replenishment is required.

Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.

Abstract: Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract: Provided is a nozzle unit for use in a bonding device in which bonding between a first member and a second member is effected by providing a bonding member that has been melted by heating at a bonding position where the first member and the second member are to be bonded to each other. The nozzle unit includes: a cylindrical nozzle assembly having an accommodating space accommodating the bonding member, and an opening which allows ejection of the bonding member accommodated in the accommodating space onto the bonding position, which has a diameter larger than the diameter of the bonding member, and which communicates with the accommodating space; and a holding/releasing member for releasably holding the bonding member within the accommodating space.

Abstract: The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body.

Abstract: An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position.

Abstract: In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

Abstract: A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer substrate, and a driving mechanism that moves at least one of the substrate holding section and the discharge nozzle. A control section is provided to control the discharge and driving mechanisms so as to adhere the metal paste to the surface. The semiconductor wafer substrate includes a terminal unit formed from two or more electrically separated terminals connected to a device circuit and an insulation layer having an opening in a formation position of the terminal unit. Further, the control section controls the discharge and driving mechanisms to selectively coat the opening of the semiconductor wafer substrate with the metal paste overlying the terminal unit to be electrically connected.

Abstract: Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

Abstract: A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second leads are in electrical communication with the drive unit. The first lead is positioned in the reservoir so that it electrically communicates with the second lead through the molten solder when the molten solder reaches a triggering level, but so that it does not electrically communicate with the second lead when the level is below the triggering level. The drive unit feeds the solid solder wire into the reservoir based upon a state of electrical communication between the first and second leads.

Abstract: An apparatus for brazing a connecting piece of electrically conducting material such as metal, to a metal surface by means of a new type of temperature-controlled brazing whereby for certain types of material a brazing is obtained that is free of martensite formation underneath the brazed joint in, for example, railway track and/or pipework. The apparatus has an electrode and processing circuitry by which a voltage applied in electrical circuit with the electrode causes an electric arc to be struck between the electrode and an adjacent workpiece to generate the heat necessary for brazing.

Abstract: A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Abstract: In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent plate (56), where an expansion amount of the film carrier (52) is changed according to a condition of the heat bonding. A distance between the measured marks (MA, MB) is then obtained. The condition for the heat bonding is determined based on this distance. The heat bonding is performed under this condition determined.

Abstract: A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Abstract: This method controls a copper density in a dip solder bath holding a molten solder alloy containing at least copper as an essential composition thereof during a dip soldering step of one of a printed circuit board with a surfaced copper foil and a component part having a copper lead attached thereto. The method includes a step of introducing a replenished solder containing no copper at all or a copper content having a density lower than that of the molten solder in the bath prior to the supply of the replenished solder to the bath so that the copper density in the bath is controlled to a predetermined constant density or lower. The molten solder alloy in the bath contains tin, copper and nickel as the major compositions thereof, and the replenished solder contains nickel and balanced tin, for example. Alternatively, the molten solder alloy in the bath contains tin, copper, and silver as the major components thereof, and the replenished solder contains silver and balanced tin.

Abstract: A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as to sense that the supply of the wire is insufficient, a wire-end detection sensor disposed on the gas-jet-out side of the tension-applying device so as to sense that the supply of the wire from the spool has stopped, and a control device controls so that the spool motor is rotated by a predetermined fixed amount when the wire is sensed by the wire pay-out sensor.

Abstract: The present invention describes the precise metering of soldering material realized in a preferred desktop preferably portable device designated for hand-soldering in small and medium volume operations. It combines the fully automated process of precise metering of the soldering wire for high accuracy and quality soldering with the freedom of a hand-operated soldering process.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: A plurality of materials are rolled in an upstream stand. While transfer speed of a succeeding material and the front end position thereof are detected, the transfer speed and the rear end position of a preceding material are detected by a measuring roll. The transfer speed of the succeeding material is controlled by adjusting at least the drive speed of the pinch rolls so as the front end of the succeeding material to contact with the rear end of the preceding material at a specified position in a travelling welder. the rear end of the preceding material is joined with the front end of the succeeding material by flash-butt welding using the travelling welder to form a continuous material while letting the travelling welder move at a speed synchronous with the transfer speed of the continuous material. The welded portion on the continuous material is ground and/or cut to remove burr therefrom.

Abstract: A wire bonding method and apparatus, in which after the tail of a wire extends out of a capillary, the capillary moves to a measurement position above a tail length measuring member; the capillary descends so that the end of the tail contacts the tail length measuring member; a position of the capillary or a distance by which the capillary is lowered at the time that electrical continuity is established with the tail length measuring member is detected; and the tail length is calculated based upon a height level of the tail length measuring member, the position of the capillary before being lowered for measuring the tail, and the position of the capillary when the wire contacts the tail length measuring member, or upon the height of the capillary above the tail length measuring member before lowering the capillary for measuring the tail, and a distance the capillary is lowered.

Abstract: Beads or ridges formed by metal work such as knurling provide peaks and valleys on a shaft of a rotary disc, which is part of an abnormal detector of wire solder, so that frictional force between the wire solder is strengthened. Further, the same peaks and valleys mating with those on the shaft are provided on a surface of a feeding roller of the wire solder. The wire solder fed by the feeding roller is provided with the peaks and valleys due to plastic deformation. Both the peaks and valleys on the shaft and on the wire-solder mate with each other so that slipping therebetween can be prevented. Since the shaft is integrated with the rotary disc which is part of the abnormal detector, the accuracy of detecting abnormalities such as clogging wire-solder or crimped wire-solder can be improved. As a result, a feeder of wire solder with better accuracy in abnormality detection can be realized.

Abstract: A micro-manipulator apparatus for precisely positioning the tip of an ultrasonic bonding tool or similar implement relative to a work piece includes a pantograph-like input manipulator mechanism coupled by a downward depending ball joint coupling to the rear end portion of a tool support plate comprising part of a follower mechanism.

Abstract: In a semiconductor device having a radiation plate and a method of boding the radiation plate, a radiation plate is overlaid on a die pad formed at the center portion of a lead frame, the die pad and the radiation plate are clamped from upper and lower sides by clamp members, and then ultrasonic wave are is applied to the interface between the die pad and the radiation plate to bond the radiation plate to the die pad with ultrasonic wave, the depth of scratches formed on the surface of the die pad which are formed by the clamp member are reduced to 15 .mu.m or less at maximum and/or 2.0 .mu.m on the average.

Abstract: Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).

Abstract: A method of welding two tubular members (1, 2) in end to end relationship includes providing the end of each tubular member (1, 2) to be joined with a shaped portion (3, 4). The shaped portion (3, 4) has a surface (10) which is substantially perpendicular to the radius of the tubular member (1, 2) and a second surface (13) at an obtuse angle to the radius of the tubular member (1, 2). Hence, when the ends to be joined are brought into contact with each other, shaped portions (3, 4) define a three-sided channel (13, 10, 13). A ring-shaped member (6) having a quadrilateral cross section is located in the channel. The ring-shaped member (6) has a radius which is greater than the radius of the first surface and less than the radius of the external wall of the tubular member (1, 2).

Abstract: An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.

Abstract: The horn of an ultrasonic transducer is applied with ultrasonic waves from an ultrasonic converter in such a way that standing ultrasonic waves develop in the lengthwise direction of the horn. A flange is arranged on the horn at the location of a node of the ultrasonic waves. The length of the flange is so aptly dimensioned that standing ultrasonic waves develop in the flange, when it can freely oscillate, which also have nodes. Drill holes are attached in this node so that the ultrasonic transducer is attachable to an ultrasonic welding device, in particular a wire bonder, by means of screws.

Abstract: In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: A bonding apparatus such as a die bonding apparatus in which a bonding tool at one end of an ultrasonic horn is given a vibration, the bonding apparatus being equipped with a Y-direction driver which has a Y-direction piezo-electric element that causes the bonding tool to vibrate in a Y-direction which is parallel to an axis of the ultrasonic horn, and an X-direction driver which has an X-direction piezo-electric element that causes the bonding tool to vibrate in an X direction which is on a plane perpendicular to the Y-direction, so that the piezo-electric elements are driven during bonding so that the bonding tool vibrates in the X- and Y-directions on the bonding plane.

Abstract: A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device cna be produced at a low cost.

Abstract: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface.

Abstract: A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an upward inclination in the direction of a second bonding point, further moving the capillary to a position located at an upward inclination in the opposite direction from the second bonding point, then moving the capillary to a position located at an upward inclination in the direction of the second bonding point, and then lowering the capillary so that the wire is bonded to the second bonding point by the capillary, thus producing a stable low-height M-shaped wire loop between the first and second bonding point.

Abstract: In order to realize effective and economical bonding operation even on workpiece whose inside is quite deep, a bonding tool, which has a length equivalent to a whole number of multiples of half the wavelength of the resonance frequency, is secured to an ultrasonic horn by a screw member which can advance or retreat in a direction perpendicular to the vibration direction indicated by an arrow X,thereby causing a front end surface of the bonding tool vibrate in the same direction as the vibration of the ultrasonic horn.

Abstract: A wire bonding machine having a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: In order to achieve reliable welding, by reducing welding scars, of a flat conductor to another bonding member by an ultrasonic welding machine, a curved beveled portion facing a bonding member, a plurality of indented grooves running at a right angle to the direction of vibration of the horn tip and flat surfaces, which come in contact with a bonding member, are formed at either one of or both of the horn tip and the anvil, wherein the curved beveled portions, the indented grooves and the flat surfaces are formed facing opposite a low strength conductive member, and the indented grooves are formed at a width that is smaller than that of the flat surfaces provided between the individual indented grooves and curved beveled portions are formed at the edges where the indented grooves meet the flat surfaces.

Abstract: The invention relates to a process for welding electric conductors employing ultrasound following compaction. The process comprises compaction of the conductors in a compaction area by adjusting height and width up to a preset contact force and ultrasonically welding according to predetermined, stored parameters.

Abstract: A method of forming a ball weld during the fabrication of a semiconductor device wherein a pad (3) and a gold ball (9) to be bonded to the pad is provided over the pad. Ultrasonic energy from an ultrasonic energy source (11) is applied to the ball to soften the ball while concurrently applying a compressive force to the ball to force the ball against the pad. Reflections of the ultrasonic energy are monitored to provides an indication of completion of the bond of the ball to the pad from the application of energy and compressive force to the ball. The application of energy to the ball is terminated responsive to detecting a parameter which provides an indication of completion of the bond. A preferred embodiment of the step of detecting includes providing a piezoelectric device (13) providing a current output responsive to the reflections of said ultrasonic energy and providing a monitor (21) to detect from the current output the indication of completion of the bond.

Abstract: An ultrasonic apparatus useable for welding metal by vibrations in the ultrasonic frequency range, employs a horn dimensioned to be resonant as a full wavelength resonator for vibrations of a predetermined frequency traveling longitudinally therethrough. To increase the energy available, the horn is coupled to a pair of transducers, one transducer coupled to each of the radially disposed end surfaces of the horn. During operation, one transducer must be in its longitudinal expansion mode when the other transducer is in its longitudinal contraction mode and vice versa. In order to accomplish this, two substantially identical transducers are used, but the orientation of the piezoelectric disc or discs in one of the transducers is reversed with respect to the orientation of the disc or discs in the other transducer.

Abstract: A bonding tool for use with an ultrasonic horn comprising an orifice at a first end of the ultrasonic horn and a capillary having a first tapered end coupled, the first tapered end to the orifice of the ultrasonic horn.

Abstract: An ultrasonic welder is provided which automatically recognizes and reliably welds varying weld zone sizes of material The welder comprises a base, a transducer, a tip, an anvil, a gathering tool, and an actuator for moving both the anvil and gathering tool to define a weld zone. An encoder reads movement of the actuator and a microprocessor determines weld zone size to control the transducer for maximizing weld efficiency. Preferably, a horn is mounted between the transducer and tip and the horn is dynamically mounted along an axis of the transducer to transmit the maximum amount of ultrasonic energy to the weld. In another aspect, the invention relates to a method of operating an ultrasonic welder to automatically recognize and reliably weld varying weld zone sizes.