Abstract: A method of monitoring bonding parameters during a bonding process. The method is based on the object of continuous monitoring of bonding parameters in order to provide adjustment of bonding machines and thereby increase the reliability of the bonded connections. A bonding force is measured by a wire strain gauge attached to a bonding arm and an ultrasound amplitude is measured by a piezo-electric sensor secured to the bonding arm. The method can be used with all bonding machines which work with ultrasound.

Abstract: An ultrasonic welding apparatus adapted to simultaneously weld individual wire ends to individual contacts on a wire connector is disclosed. The apparatus includes an ultrasonic horn having a welding tip attached at one end. An anvil selectively and separately supports the wire ends on the individual wire contacts. A comb is engaged with the anvil for selectively maintaining separation between the adjacent wire ends and the adjacent contacts during ultrasonic welding and for dislodging the wire connector after the wire ends have been welded thereto.

Abstract: Method and apparatus for vertical strip clad overlay welding. The method comprises matching the vertical travel of a special welding shoe to an appropriate amount of strip electrode melt-off necessary to maintain a preset molten pool level within a reservoir trough provided by the shoe. The welding shoe comprises a water cooled copper mold for forming the weld bead and a ceramic insert connected to the mold for providing the reservoir trough. Apparatus for correlating the vertical travel speed of the shoe with the strip electrode melt-off is disclosed. Apparatus for applying a plurality of successive weld beads to a vertical vessel wall is also disclosed.

Abstract: In an apparatus intended especially for connecting electrical conductors by ultrasonic welding, in which a two-part anvil comprising three working surfaces is associated with a sonotrode for defining a compaction chamber on all sides, the two anvil parts are moveable in two different directions relative to each other and the sonotrode and are each driven by a pneumatic cylinder and piston assembly. To achieve an easily handled apparatus, the two pneumatic cylinders are disposed alongside each other axially parallel to each other and to the central axis of the sonotrode in a housing and act upon transmission elements, which deflect the working movements of the pneumatic pistons through a right angle into the anvil parts. As a result the apparatus has a slender external form of small dimensions and enables a pistol grip handle to be fitted, by a trigger of which the functional parts of the apparatus are controlled.

Abstract: An automatic spot soldering machine incorporates apparatus for automatically sequencing through operations for forming soldered joints at a predetermined position. The sequence includes preforming a quantity of solder from a length of solder wire and positioning it on the joint, and lowering a soldering iron into position for a predetermined period of time. The solder wire is advanced and retracted by a reversible clutch incorporating a rotatable disk and a concentric clamping ring.

Abstract: A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder coated pads, melting the solder and vibrating the leads relative to the pads while the solder is molten, so that the surface tension of the molten solder centers the leads on the pads. The molten solder is then cooled until it resolidifies.

Abstract: An ultra-sonic welding machine has independently adjustable front and rear anvils. Each anvil is independently clampable at desired locations. The rear anvil is reciprocable under power to opened and closed positions relative to the front anvil to thereby permit easy insertion and withdrawal of a workpiece. The end positions of the rear anvil are positively controlled by an adjustable and clampable stop block. The invention further comprises a welding tip that has a concave working edge and relief pockets for improving the welded connection and reducing ultra-sonic energy losses.

Abstract: A die bonding apparatus comprising a paste supply section having a needle for supplying paste onto a package to secure a semiconductor pellet, a driving section for moving the paste supply section in the directions of X, Y and Z, respectively, a follow-up mechanism movable up and down for causing the tip of the needle to follow the contour of the paste application surface of the package and a support mechanism for supporting the paste supply section through the follow-up mechanism.

Abstract: The specification sets forth an ultrasonic wire bonding system for bonding wire to an underlying electronic circuit or terminal. The system incorporates a bonding tool connected to a transducer which causes the bonding tool to ultrasonically vibrate and when impressed against a wire lying thereunder, bond said wire to an underlying electronic circuit. The transducer is driven by a generator which generates either a constant current or constant voltage to the transducer while it is bonding. The constant current mode accommodates thick films and stitch bonding which require substantially more force, while the constant voltage mode provides for thin films and ball bonding which requires substantially less ultrasonic force.

Abstract: The method for bonding a wire of this invention comprises the steps of: positioning a metal ball or a wire on a material (to be bonded); applying a pressing force on the metal ball or the wire against the material (to be bonded) and deforming it; inducing eddy currents in the wire to generate heat energy, whereby elements of the wire and the material (to be bonded) are mutually diffused by means of the heat energy and the pressing force, and bonding is completed. The wire bonding apparatus of this invention comprises: a capillary tip having a through-hole which opens onto a end thereof and through which a wire is passed, the capillary tip pressing the wire against a material to be bonded by the end of the tip (flat face); an electromagnetic coil provided around the end of the capillary tip to surround the through-hole; and a power source for supplying a high-frequency current to the electromagnetic coil.

Abstract: An automatic ultrasonic wire bonder employs a compliant motion servo (17, 119, 239, 200) on its Z axis drive to maintain a known, constant and steady force applied by the bonding tool (13) to the wire. The tool is resiliently mounted to a carriage (15) that is driven by a force control servo (17, 119, 238, 200). During bonding, the tool is pressed against the wire, and effects of variations in tool tip Z axis position caused by vibration, wire deformation during bonding and other factors of the equipment are minimized by a servo that precisely controls and maintains a fixed position of the carriage relative to the wire to thereby maintain a preselected force between the bonding tool tip and the wire.

Abstract: The invention relates to an apparatus and method for ultrasonically welding a conductor wire to an electrical terminal. The terminal has a channel portion for receiving the conductor wire. The electrical terminal with the wire therein is confined adjacent the welding tip whereby movement of the welding tip into the channel portion presses the conductor wire against the electrical terminal and welds it thereto.

Abstract: A fountain-type soldering apparatus is disclosed, which comprises:an outer tank which contains molten solder;a nozzle which is immersed in said molten solder in said outer tank, said nozzle having a longitudinally-extending discharge port which extends above the surface of said molten solder and having two end panels at the opposite ends of said nozzle which form the end walls thereof, each of said end panels having a through opening formed therein;a moving body which is disposed in said discharge port and which extends for the length thereof, the opposite ends of said moving body passing loosely through said through openings in said end plates; andsupport means for supporting each end of said moving body such that said moving body can oscillate vertically therein.

Abstract: A process for using an electroacoustical vibrator device arranged on a support and intended to be used in particular in machining and welding of elements, characterized in that it consists of modifying during use of the electroacoustical vibrator device the position of the latter with respect to its support in order that the fixing area of this device on said support substantially coincides with a vibration node.FIG. 1.

Abstract: Apparatus is provided for ultrasonic welding of wires which include a welding tip of a standard shaped readily machineable cross section with no concave surfaces. The welding tip is rotatable about an ultrasonic horn to present several alternative available worksurfaces. The worksurface in use defines a wall of the compression chamber into which wires to be welded are inserted. An anvil, a support, and a gathering tool each define an additional surface of the compression chamber. The position of each of these elements is adjustable thereby allowing for adjustment in two dimensions of the cross section of the compression chamber. This allows for the welding of various sizes or numbers of wires.

Abstract: The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined axial and radial guiding of the rotatable bonding head, with low overall mass of the vertically movable parts and low moment of inertia around the rotational axis. As a result of the inventive disposition of the microscope objective, the object distance to the component can be set directly via the controllable vertical drive of the bonding head.

Abstract: The invention relates to an apparatus for ultrasonic wire bonding, whereby bonding loci can be interconnected by wire straps, by means of ultrasonic welding; in particular an apparatus in which bonding wire is guided and handled. According to the invention the bar (3) bearing the bonding head (2) has a longitudinal passage (4) in the direction of the ultrasound generator (35), which passage accommodates a guide tube (5) the upper end of which extends vertically upward out of the flange (6), near the rotational axis, and the lower end of which tube exits the bar (3) on an incline, in the outward direction, in the region of the mounting of the bonding head. A deflecting element (24) for the wire (40) is disposed above the upper end of the guide tube (5) and is not coupled with the rotational movement. The fact that the supply reel is mounted at a fixed location enables the employment of all customarily used type of reels, associated mounting means, and auxiliary elements for withdrawing the wire.

Abstract: There is provided a method of controlling a wire bonding apparatus comprising a main arm fluctuated by a drive motor, a sub-arm coupled to the main arm by a coupling force given by a coupling motor, a bonding tool attached to the sub-arm, and ultrasonic wave application means for applying ultrasonic wave to the bonding tool while allowing one end of a wire held by the bonding tool to be in contact with a joining portion of a semiconductor chip to thereby join the wire to the joining portion.

Abstract: A blade-shaped high frequency resonator for welding sheet material without a gap, when resonators of this shape are disposed in an array, includes at its output surface a pair of laterally extending ears, each ear terminating in end surfaces configured to interface with the end surfaces of a similarly shaped juxtaposed resonator. Each ear is dimensioned to cause the sum of the moments about the lateral axis of the resonator to be substantially zero. Typically, the lateral end surface of a respective ear is of a zigzag configuration. The end surface intersecting the lateral resonator axis intersects such axis at an angle of less than ninety degrees.

Abstract: Apparatus for ultrasonic welding of wires including a hand-held housing with an ultrasonic wave generator, a welding tip connected to said generator, an anvil for clamping the wires to be welded to said welding tip, and a tool for gathering wires disposed between said anvil and welding tips to prevent the wires from splaying during weldment.

Abstract: A bonding head (10) of a wire bonding machine for bonding wire to electronic or electronical components comprises a bonding tool (18) connected to an ultrasonic transducer (16), a wire spool (22) mounted at the opposite side of the head to the transducer (16), and (optionally) a guide (60) including a tubular member (62) adjustably mounted on the head (10) having an inlet end through which wire (20) from the spool (22) passes and an outlet end (64) adjacent the bonding tip (19), the guide (60) being mounted for angular movement on an arm (70) itself pivotally mounted whereby the angle of the guide (60) can be adjusted while maintaining the outlet end (64) in position adjacent the bonding tip (19). Thus the wire (20) can be supplied to the tool (18) at a variety of different angles according to the component to which the wire is to be bonded.

Abstract: A tool for use in ultrasonically bonding a wire to a metal surface has a tip having a compound curved channel having a central concave surface and a peripheral non-convex surface along each edge of the central surface. The central surface has a cross-sectional shape similar to that of a portion of the wire's cross section. The total cross-sectional area of the channel should be at least 50% and less than 100% of the wire's cross-sectional area. In a preferred embodiment, the cross section of the central surface is an arc of a circle approximately centered on a line drawn between the outer edges of the peripheral surfaces of the channel. The preferred embodiment also has a beveled surface intersecting an end of the channel to provide a gradual transition for the wire shape from the bond to the undistorted wire.The tool when used to bond an appropriate wire by an ultrasonic bonding machine produces a wire whose outer shape in the bond area conforms to the shape of this tool's channel.

Abstract: A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

Abstract: A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing the bonding wire on the pad or electrode. If the fine wire is missing under the working face of the bonding tool, the sensing circuit initiates a signal which is detected by control means so as to initiate an interrupt signal stopping the operation of the wire bonder. Sensing of the presence or absence of a wire under the bonding wedge at a bond may take place at a first or a second wire bond. At the second wire bond, the novel sensing and detecting circuit is actuated to determine the amount of longation that takes place in the bonding wire between the bonding wedge and the wire clamps so as to correct the movement of the wire clamps when supplying a tail under the working face of the bonding tool and to ensure that a uniform tail length is supplied unaffected by the elongation of the bonding wire.

Abstract: Apparatus for the automated feeding, placement and ultrasonic welding of a metal disc, such as a copper heatsink, to a recipient workpiece. A metal disc is automatically fed through the broader end of a chamfered bore cut in a weld location mask. The metal disc is gravity-fed to the narrower end of the bore as the weld location mask is automatically positioned over a recipient workpiece. An ultrasonic welding tip is inserted through the bore to hold the metal disc against the recipient workpiece. Welding of the disc to the recipient workpiece is accomplished by ultrasonically vibrating the tip.

Abstract: A motorless Velcro tape feed and cut assembly acting as a slave unit which cooperates with the horn of an ultrasonic welding machine. When the horn is brought down to carry out a welding action, it then depresses the spring-biased operating block of the assembly, causing it to shift downwardly from its normally raised position above a base plate to a final position adjacent to the base plate, the block returning to its raised position when the horn is retracted. Anchored on the base plate and projecting thereabove is an anvil which telescopes within an open-ended anvil channel in the block, the length of the anvil being such that in the final position of the block its head is then in operative relation to the horn to effect welding of a Velcro component onto a fabric lying on the upper face of the block.

Abstract: Apparatus for the ultrasonic sealing of plastic or metal containers which include a source of ultrasonic wave energy, an ultrasonic welding horn and an anvil. The ultrasonic welding horn is provided with means to adjust and make uniform the amplitude of vibration of the wave energy transmitted by the horn. This is accomplished by attaching weights of varying magnitude to the horn, thus assuring a uniform amplitude of the ultrasonic vibration across the face of the worksurface of the horn, to effect a uniform bond on a workpiece.

Abstract: A method and apparatus for controlling ultrasonic welding and determining whether the weld is of acceptable quality. Power input to ultrasonic welding apparatus is detected and converted to a signal indicative of energy input. When power input exceeds a power threshold level a timer begins to measure elapsed time and energy input begins to be monitored. Welding power is terminated when both elapsed time and energy level have exceeded predetermined values. If either elapsed time or energy level exceeded reject limit values when the weld was made the weld is rejected as being of unacceptable quality.

Abstract: An apparatus for joining of two electric conductors, preferably strands or the like, with an easy adaptation to different conductor sizes without having to cover the conductors to be joined with a sleeve. The apparatus comprises a sonotrode (58) generating ultrasonic oscillations, as well as at least one serving as an anvil (60, 62), where the sonotrode on its circumferential surface has at least one recess (68, 70 76, 78) being adapted to conductors to be joined, which recess is starting fron a lateral face of the sonotrode along which an area (76, 78) of the anvil can be moved, said area having a projection (72, 74) adapted to the recess, and where in the position of sonotrode and anvil for joining the conductors, the recess and the coordinated projection are defining a hollow space representing a compression chamber, running parallel or almost parallel to the oscillation axis of the sonotrode and being open on its front faces for inserting the conductors.

Abstract: An apparatus and method of the soldering or bonding of conductive leads to corresponding conductive pads of an integrated circuit chip includes a fixed soldering tool having a soleplate shaped to match the configuration of the pads, and a bench for supporting the chip. The bench is supported by a plurality of vertically moveable rods located with respect to the bench such that the longitudinal axes of the rods intersect the surface of the chip at predetermined fixed points which are located within a surface area of the chip bonded by a rectangular or square line long which the conductive pads are positioned. The movement of each of the rods is controlled by a corresponding actuator mechanism which enables each rod to be independently controlled. By appropriately controlling the movement of each rod, the bench can be made to tilt or oscillate with respect to its central point. In operation, the rods are controlled so as to move a chip carried on the bench into engagement with the fixed soleplate.

Abstract: Apparatus for ultrasonically welding a wire to a wire terminal. A stationary anvil forms the lower horizontal wall of a work chamber into which a wire workpiece is inserted. The vertical walls of the work channel are formed by the walls of a slot in a relatively movable horizontal support plate cantilevered from a base. The slot in the support plate fits about the anvil. The horizontal support plate is oscillatable to swing vertically thereby adjusting the size of the work channel. A terminal is seated on the support plate and covers the chamber. An ultrasonic welding tip contacts the terminal and forces down the support plate so as to maintain very tight spot contact between the wire on the anvil and the terminal, against the flexure of the cantilevered arm. Welding of the wire to the terminal is effected by the ultrasonic vibration of the welding tip against the terminal.

Abstract: A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially constrained to a vertical line with a minimum of tip skid. The mounting structure which is all positioned on one side of the tool tip includes a frame (10) of inverted U-shape having a pair of mutually spaced ball-bearing rollers (22, 24, 30, 32) on the end of each frame leg and a transducer support (12) positioned between the frame legs and having fixed roller contacting rods (90, 92, 96, 98) extending fore-and-aft between and partly under each of the respective rollers.

Abstract: The ultrasonic energy applied to a workpiece to be welded in an ultrasonic welding operation, over a predetermined welding time, is measured by processing the output of a load cell beneath the workpiece to produce a signal voltage for comparison with a predetermined reference voltage corresponding to the accumulated ultrasonic energy that should have been applied to the workpiece during said predetermined time to satisfactorily weld the workpiece. A one-shot timer is started at the commencement of the welding operation. If the comparison reveals that signal voltage has reached the reference voltage before the timer has run out, a success signal is generated to indicate the completion of the welding operation.

Abstract: An ultrasonic generator for providing power to a bonding apparatus having a bonding horn which is brought into contact with respective conductive pads and which carries a wire to be dispensed for interconnection therebetween includes a circuit for applying a voltage at an ultrasonic frequency to the bonding horn to produce a bonding current in the horn, and a monitor for monitoring the bonding current applied to the bonding horn. A circuit is provided for maintaining a zero phase difference between the applied voltage and the monitored current. In addition, a circuit is provided for continuously monitoring and controlling the current which is delivered to the bonding horn to produce a current waveform of a predetermined controllable pattern.

Abstract: A head (158) precisely registers an article (10) to a site for operations such as bonding. The article (10) may be an electronic chip (10) containing a plurality of sides (12-15) having top edges for engaging the head (158) and bottom edges for registering to a topside (95) of a pedestal (20). A body (161) has an upper portion adapted for support and a lower portion terminating in a downwardly presented, working face (159). Face 159 includes a cavity (166) formed by walls (167-170) having inwardly and upwardly directed surfaces (171-174) for engaging corresponding top edges of the chip (10). The chip (10) is at least partially disposed within the cavity (166) making it difficult for an operator to see, especially when a fixed microscope is required for viewing. A bore (175) communicates with the cavity (166) and may be connected to a vacuum source for drawing a chip (10) into the cavity and for removably engaging the same to the engaging surfaces (171-174).

Abstract: An assembly for providing support to a component, such as an ultrasonic component, including converters, boosters and horns which are subjected to continuous and repeated impacts and stresses. Such devices generally have integral nodal flanges for support purposes. In this assembly, shock-absorbing means are placed on each side of the nodal flange. A grip ring assembly is then bolted or otherwise removably fastened, together over the shock-absorbing means and nodal flange, compressing the shock-absorbing means. The component is prevented from rotating with respect to the grip ring assembly by pegs which are driven through holes provided in the grip ring assembly and into slots formed lengthwise in the nodal flange. Hence the flange itself, via the shock-absorbing means, absorbs all of the lengthwise force applied to the component by the grip ring assembly, and the pegs are required to absorb none of it.

Abstract: An ultrasonic welding apparatus for electrical conductors comprising strands of wire comprising a sonotrode for generating ultrasonic vibrations and a cooperating anvil having movable side walls to compress the wire strands against the head of the sonotrode. The anvil has two moving parts, one moving back and forth parallel to the fixed sonotrode face, and the other moving up and down normal to the fixed face. The moving parts carry the side walls of the anvil and with the fixed face provide an adjustable space for wires of various sizes, the space having a rectangular cross section. The gap between the moving anvil parts and the adjacent fixed face of the sonotrode are accurately controlled.

Abstract: In a positioning guide for an ultrasonic stylus disposed in a scribing head, a hub surrounds the stylus and is secured to the stylus near its working tip. A surrounding retainer is secured to the housing of the moveable scribing head. Radial spokes secure the hub to the surrounding retainer, thereby providing a high degree of lateral rigidity and longitudinal compliance for the working tip of the stylus.

Abstract: A bonder, comprising a bonding head, a fixed-cycle conveyor for structural elements, and a holder for structural elements comprising a clamping bar coordinated with the bonding head. For purposes of tension-free fixing and positioning of the structural element to be bonded the holder comprises a resilient support face for the structural element, which support face is coordinated with the clamping bar. Preferably also the clamping side of the clamping bar is provided with a resilient layer, e.g. in the form of a rubber bead.

Abstract: Accurate dimensional control in ultrasonic welding or upsetting of plastic parts is accomplished by the method and apparatus for monitoring the ultrasonic head displacement and sensing when a predetermined trigger force is applied to the part or parts, turning on the ultrasonic energy at the trigger point and terminating the ultrasonic energy when head displacement from the trigger point reaches an empirically established value, holding the force for a hold time and measuring the maximum displacement value at the end of the hold time, releasing the force when the force returns to the trigger point, measuring the overall displacement, and determining whether the overall displacement is within allowable tolerance values. Weld time and weld energy as well as the overall head displacement are monitored for comparison with preset tolerance values to determine acceptability of the part being processed.

Abstract: A method and an apparatus for bonding a thin electrically conductive wire, especially an aluminum wire (11), to electrical bonding pads or areas (12, 14) of electric or electronic components (16), especially microchips or semiconductor components. To this end the wire (11) is briefly pressed against the bonding pad (12, 14) by means of an ultrasonically energized bonding wedge (10) and is subsequently severed at a small distance from the side (17) of the wedge (10) that is opposite to the wire feeding side (15) thereof. To prevent the formation of a wire tail (TL) protruding beyond the bonding length (BL), a wire clamping tool (21) is provided on the wire feeding side of the wedge (10) by means of which the wire (11), after having been severed and prior to another bonding operation, is moved back, preferably retracted, at least to such an extent that the free wire end is approximately flush with the side (17) of the wedge (10) which is opposite to the wire feeding side (15 ) thereof.

Abstract: A die bonder for bonding a semiconductor die to a substrate is disclosed. The die bonder comprises a support assembly within a frame, which assembly supports an arm. Attached to said arm is a means for holding a die, e.g. a vacuum collet. A variable electrical scrubbing means comprises a plunger which oscillates reciprocally within an electromagnetic coil and contacts the arm, or a tab integral with said arm. This provides a corresponding uniform scrubbing action, perpendicular to said arm in the plane of the interface between the die and the substrate, between a die held by the holding means and a solder material interposed between the die and substrate.

Abstract: There is disclosed an improved device for bonding wires in electronic components, of the type comprising a member for moving the capillary to a location close to the bonding area or region and an ultrasonic transducer including an arm carrying on one end the capillary, the transducer being pivoted to the approach member and having associated therewith a linear motor controlled by a position transducer.

Abstract: Apparatus and method for determining if a lead bond created by an ultrasonic transducer has the characteristics of a good bond. The current supplied to the transducer is monitored and the envelope of the supplied current is sampled periodically and supplied to a computing means. The computing compares selected characteristics of the sampled signal with characteristics previously determined to create good lead bonding. The results of this comparison are stored in a bond quality control data processing system and supplied to a host data processing system. The host data processing system can take appropriate action. The bond quality control data processing system can control the power supplied to the ultrasonic transducer to provide better characteristics.

Abstract: An arrangements for ultrasonic sealing comprises a sealing jaw which is combined with an ultrasonics source and a counterjaw. During the sealing the parts which are to be sealed to each other are pressed together between working surfaces of the jaws with simultaneous activation of the ultrasonics source as a result of which the parts are welded together. In the sealing of thin material layers it is very difficult to obtain a uniform compression over the whole surface which means that the risk of burning asunder or unsatisfactory sealing increases. In the invention this is prevented with the help of supporting elements which engage with two stop faces located in the nodal plane of the sealing jaw and on the one hand determine the minimum distance between the working surface, and on the other hand orientate the flexibly suspended jaw so that the working surfaces are parallel.

Abstract: A lead wire bonding machine is described for ball bonding the end of a lead wire held in a bonding tool to a die pad of an integrated circuit chip and for wedge bonding a segment of the lead wire spaced from the ball bond to a lead frame finger during successive ball bond wedge bond cycles. The bonding machine includes a variable linear drive such as a solenoid or small linear motor coupled to the bonding head for applying the first bond force to the bonding tool during ball bonding and the second bond force to the bonding tool during wedge bonding. A control circuit coupled to the solenoid or other variable linear drive delivers a first current having a desired profile or amplitude wave envelope for applying the first bond force with a first force profile during ball bonding to die pads and by delivering a second current having a desired profile or amplitude wave form for applying the second bond force with a second force profile during wedge bonding to lead frame fingers.

Abstract: A sonic, lead wire bonding tool has both bonding elements and wire cutting elements formed on its working face and a bail which limits lateral movement of the bonding wire and aids in forming the lead wire as it is payed out between between bonds. The bonding tool applies sonic energy to complete the wire bonds and to sever the wire with the aid of wire pulling force after completion of bonding.

Abstract: In order to compress electric conductors (22) like strands by means of ultrasonics and/or weld them together in a joining knot it is suggested that the sonotrode (10) of an ultrasonic welding device has a surface (18) preferably positioned centrally above or below the longitudinal axis of the sonotrode (14), which surface being coordinated with a surface (20) of an anvil (12) for the upper and lower bounding of a compression chamber (24) for the lodging of the conductors (22). The compression chamber (24) is laterally limited by cheeks of which at least one is movably designed.

Abstract: A hemming machine has a first station with an ultrasonic slitting device for cutting woven material that has enough thermoplastic content to be cut and fused by an ultrasonic device. At a second station, a hemming device folds and sews the material and by providing only two folds, results in a three layer hem which does not fray because the edge has been fused by the ultrasonic slitting device.

Abstract: A contact structure and method of bonding III-V semiconductors which prevents shorting of the edges of the semiconductor chip and also allows the chip to be bonded with either major surface facing upward. Both surfaces include a gold pad surrounded by a material which is immiscible with the preform metal used to bond the chip to an outside surface. During fluxless bonding between the gold pad on one surface of the chip and the preform, the preform metal is prevented from wetting the edges of the chip. The opposite surface of the chip can be electrically contacted by wire bonding to the gold pad on that surface.